JPH0130628B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for bonding a heat sink and a head substrate of a thermal recording head used in, for example, a facsimile receiver.

In a facsimile thermal recording head, a head substrate, on which a desired circuit pattern is formed by sputtering or the like, is adhered to a heat sink made of die-cast aluminum. It is preferable that the head board is manufactured as a single board to match the size of the paper used in the receiver (for example, if the paper size is A4 size, use a board with a length of about 220 mm). . However, increasing the size of the substrate has the disadvantage that the yield of the head substrate decreases due to a decrease in reliability due to the increase in the size of manufacturing equipment and a decrease in the accuracy of the processed head substrate. For this reason, usually
The head board is divided into two or three pieces and manufactured.
It is bonded on the heat sink.

When bonding the head substrates onto the heat sink, if there is a step difference of 5 μm or more between the abutted head substrates, printing will not be possible in that area, resulting in white spots and deteriorating printing quality.

For this reason, conventionally, as shown in FIG. 1, adhesive 2 is applied to a heat sink 1 in a uniform thickness, head boards 3A and 3B are placed on the heat sink 1, and the head boards 3A and 3B are positioned. , 3B, the heat sink 1 and the holding plate 4 are clamped and pressed with a clamp jig (not shown), the adhesive 2 is heated and cured, and the heat sink 1 and the head board 3A,
3B and then remove the clamp jig 1 and presser plate 4. By doing so, the variation in thickness of the head substrates 3A and 3B of ±0.1 mm is absorbed.

However, since the head substrates 3A and 3B have warps and undulations, a step δ occurs at the abutting portion of the head substrates 3A and 3B, and it is extremely difficult to suppress this step δ to 5 μm or less. For this reason,
Conventionally, the defect rate after bonding reached several tens of percent or more, which not only resulted in extremely poor workability but also resulted in a large amount of wasted material.

The purpose of the present invention is to eliminate the above-mentioned drawbacks of the prior art, and to ensure that the required quality can be obtained without being affected by variations in thickness, warping, waviness, etc. of the head board bonded to the heat sink. The present invention provides a method for bonding a thermal recording head.

In order to achieve the above object, in the present invention,
A screw hole passing through the heat sink is formed at a position corresponding to the end of the mounted head board, and after the head board is clamped and fixed between the heat sink and the holding plate, a cylindrical rubber piece is inserted through the screw hole. At the same time, the heat sink and the head board were joined together by inserting the heat sink and tightening the screws with a certain torque and pressing the rubber piece to press the edge of the head board against the holding plate, allowing the adhesive to harden. after,
Features include removing screws, rubber pieces, and presser plates.

An embodiment of the present invention will be described below with reference to the drawings.

2 and 3 show an embodiment of the present invention, in which the same parts as in FIG. 1 are designated with the same reference numerals. A screw hole 5 is formed in the heat sink 1 so as to face each end of the head substrates 3A, 3B, and a pair of projections 1A are formed at each end. 6A and 6B are cylindrical rubber pieces and are formed in a size that allows them to be freely inserted into and removed from the screw hole 5. 7A and 7B are screws and are screwed into the screw holes 5. 8 is a hole and presser plate 4
The holes are provided in the holes so as to face the ends of the head substrates 3A and 3B. A glass plate 9 is fixed to the holding plate 4 so as to be in contact with the ends of the head substrates 3A and 3B. Further, the contact surfaces of the glass plate 9 with the head substrates 3A, 3B are guaranteed to have sufficient flatness. Reference numeral 10 denotes a U-shaped clamping jig, which is equipped with a tightening screw 11.

In the above configuration, the adhesive 2 is applied to the heat sink 1 in which the screw holes 5 are formed in a uniform thickness. Next, the head substrates 3A and 3B are placed on the adhesive 2 and aligned. Next, heat sink 1
Using the protrusion 1A as a guide, the presser plate 4 is placed on the head substrates 3A, 3B from a direction perpendicular to the adhesive surface. Next, the clamp jig 10 is fitted, and the screws 11 are tightened with a constant force using a torque wrench, torque driver, etc., and the head boards 3A, 3 are tightened.
Press B with constant pressure. Next, after inserting the rubber pieces 6A and 6B into the screw holes 5 of the heat sink 1, the screws 7A and 7B are screwed together and further tightened using a torque driver. Then screw 7
The rubber pieces 6A, 6B pressed by A, 7B push the head boards 3A, 3B, and
is pressed against the glass plate 9. At this time, if excessive force is applied to the head boards 3A, 3B, the rubber pieces 6A,
6B is deformed to prevent damage to the head substrates 3A and 3B. In this state, put it in a curing oven and use adhesive 2.
heat sink 1 and head board 3.
Join A and 3B. Then, after taking it out of the curing furnace, loosen the screw 11 and remove the clamp jig 10. Furthermore, remove the screws 7A and 7B, and
Extract A and 6B.

In the above embodiment, the case where the glass plate 9 is used has been described, but if the flatness and rigidity of the presser plate 4 are sufficiently guaranteed, the glass plate 9 may not be used. Furthermore, if there is no need to view the substrates 3A, 3B after clamping them with the clamping jig, it is not necessary to drill holes.

In addition, when using the glass plate 9, after carving a reference line on the glass 9 and clamping and fixing the head boards 3A and 3B, it is possible to check if the head boards 3A and 3B are misaligned in the width direction or in the abutting direction. may be corrected to match the reference line.

As described above, according to the present invention, after forming a screw hole in the heat sink and clamping and fixing the head board between the heat sink and the holding plate, a rubber piece is inserted into the screw hole, and the screw is screwed into the screw hole with a constant torque. Since the heat sink and head board are bonded by screwing them together and the head board is pressed against the holding plate by the elastic force of the rubber piece, the adhesive is cured and the heat sink and head board are bonded. It is possible to reduce the level difference and reduce the incidence of defects to 2% or less. Further, workability can be greatly improved. It has extremely large industrial effects, such as being able to significantly reduce material waste.

[Brief explanation of drawings]

FIG. 1 is an enlarged view of the main parts showing an example of the conventional bonding method, FIG. 2 is an enlarged view of the main parts showing an example of the bonding method according to the present invention, and FIG. 3 is an external view showing the state during bonding. be. 1...Heat sink, 2...Adhesive, 3A, 3
B... Head board, 4... Holding plate, 5... Screw hole, 6A, 6B... Rubber piece, 7A, 7B... Screw, 10... Clamp jig, 11... Screw.

Claims (1)

[Claims] 1. Place and position the head board on the adhesive coated with a uniform thickness on the heat sink, place a holding plate on top of the head board, and hold the head board between the heat sink and the holding plate. A method for bonding thermal recording head substrates in which the heat sink and the holding plate are fixed together so that a predetermined pressure is applied, the surface of the head substrate is aligned with the holding plate, and then the adhesive is cured to join the heat sink and the head substrate. In this step, a screw hole passing through the heat sink is formed at a position corresponding to the end of the mounted head board, and after the head board is clamped and fixed between the heat sink and the holding plate, a rubber piece is inserted into the screw hole. At the same time, screw the screw into the screw hole with a certain torque to push up the rubber piece, and use the elastic force of the rubber piece to press the end of the head board to the holding plate. After the adhesive has hardened, attach the heat sink. A method of adhering a thermal recording head substrate, characterized by removing screws and rubber pieces from the substrate.