JPH01302729A - 樹脂封止型半導体装置の製造方法 - Google Patents

樹脂封止型半導体装置の製造方法

Info

Publication number
JPH01302729A
JPH01302729A JP8942289A JP8942289A JPH01302729A JP H01302729 A JPH01302729 A JP H01302729A JP 8942289 A JP8942289 A JP 8942289A JP 8942289 A JP8942289 A JP 8942289A JP H01302729 A JPH01302729 A JP H01302729A
Authority
JP
Japan
Prior art keywords
resin
hole
support plate
chip
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8942289A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0578177B2 (enrdf_load_stackoverflow
Inventor
Minehide Totokawa
都外川　峯秀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP8942289A priority Critical patent/JPH01302729A/ja
Publication of JPH01302729A publication Critical patent/JPH01302729A/ja
Publication of JPH0578177B2 publication Critical patent/JPH0578177B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP8942289A 1989-04-07 1989-04-07 樹脂封止型半導体装置の製造方法 Granted JPH01302729A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8942289A JPH01302729A (ja) 1989-04-07 1989-04-07 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8942289A JPH01302729A (ja) 1989-04-07 1989-04-07 樹脂封止型半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP59114018A Division JPS60257529A (ja) 1984-06-04 1984-06-04 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH01302729A true JPH01302729A (ja) 1989-12-06
JPH0578177B2 JPH0578177B2 (enrdf_load_stackoverflow) 1993-10-28

Family

ID=13970223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8942289A Granted JPH01302729A (ja) 1989-04-07 1989-04-07 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPH01302729A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0578177B2 (enrdf_load_stackoverflow) 1993-10-28

Similar Documents

Publication Publication Date Title
US4507675A (en) Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
JP2509607B2 (ja) 樹脂封止型半導体装置
US4855868A (en) Preformed packaging arrangement for energy dissipating devices
US4829403A (en) Packaging arrangement for energy dissipating devices
JP3362530B2 (ja) 樹脂封止型半導体装置およびその製造方法
US6831352B1 (en) Semiconductor package for high frequency performance
US4503452A (en) Plastic encapsulated semiconductor device and method for manufacturing the same
JPH09260550A (ja) 半導体装置
KR960019676A (ko) 수지 봉지형 반도체 장치 및 그 제조 방법
JP3533159B2 (ja) 半導体装置及びその製造方法
US10790242B2 (en) Method of manufacturing a semiconductor device
TW202005004A (zh) 半導體模組
JPH04306865A (ja) 半導体装置及びその製造方法
JPH01302729A (ja) 樹脂封止型半導体装置の製造方法
US9397033B2 (en) Semiconductor device
JPH05109795A (ja) 樹脂封止型半導体装置の製造方法
JPS60257529A (ja) 樹脂封止型半導体装置の製造方法
JPH0432538B2 (enrdf_load_stackoverflow)
JPH08204099A (ja) 半導体装置の構造及び形成方法
JPH0318741B2 (enrdf_load_stackoverflow)
JP2939094B2 (ja) 電力用半導体装置の製造方法
JPH04277660A (ja) 集積回路パッケージ
JPH0521648A (ja) 半導体装置
KR830002464B1 (ko) 수지 밀봉형 반도체의 제조방법
JPH04192351A (ja) 半導体装置及びその形成方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees