JPH01298729A - Manufacture of resin-sealed electronic component - Google Patents
Manufacture of resin-sealed electronic componentInfo
- Publication number
- JPH01298729A JPH01298729A JP63129980A JP12998088A JPH01298729A JP H01298729 A JPH01298729 A JP H01298729A JP 63129980 A JP63129980 A JP 63129980A JP 12998088 A JP12998088 A JP 12998088A JP H01298729 A JPH01298729 A JP H01298729A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- lead frame
- burrs
- wide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000011347 resin Substances 0.000 claims abstract description 72
- 229920005989 resin Polymers 0.000 claims abstract description 72
- 238000007789 sealing Methods 0.000 claims abstract description 16
- 238000000465 moulding Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 19
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000004080 punching Methods 0.000 description 10
- 239000007788 liquid Substances 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、トランジスタ、ダイオード、ＩＣ等の樹脂封
止型電子部品のｉＭＪ造方法に関し、更に詳ａｔ／Ｃは
外部リードの側面の樹脂バリ除去工程を含む電子部品の
製造方法に関する。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to an iMJ manufacturing method for resin-sealed electronic components such as transistors, diodes, and ICs. The present invention relates to a method of manufacturing an electronic component including a removal step.
〔従来の技術及び発明が解決しようとする課題〕樹脂封
止型牛導体装置の樹脂制止体はトランス７アモールド法
により形成されることが多い。トランスファモールド法
は、−度に弗素子分の樹脂制止体を形成できるためｉｔ
産性に優れているといつ長Ｆ９Ｉ娶有する反面、少な（
とも２つに分割した成形金型を使用するため、押圧注入
された封止用樹脂の一部が成形金型の隙間から流れ出し
て硬化し、樹脂バリが形成されるという欠点Ｙ有する。[Prior Art and Problems to be Solved by the Invention] The resin stopper of a resin-sealed cow conductor device is often formed by the transformer 7 amolding method. The transfer molding method makes it possible to form a resin stopper for the fluorine element in one step.
While having a long F9I marriage has excellent productivity, on the other hand it has a small number (
Both methods use a mold that is divided into two parts, so a part of the sealing resin that has been press-injected flows out from the gap between the molds and hardens, resulting in the formation of resin burrs.
なお、樹脂バリは主として、外部リードの主面、側面及
び樹脂封止体の周囲に発生する。Note that resin burrs mainly occur on the main surface and side surfaces of the external leads and around the resin sealing body.
リードフレームを使用する樹脂封止型半導体装置の製造
方法における従来の樹脂バリ除去は、−般にレジンカッ
ト工程と液体ホーニング工程とによって行われている。Conventional resin burr removal in a method of manufacturing a resin-sealed semiconductor device using a lead frame is generally performed by a resin cutting process and a liquid honing process.
レジンカット工程は、ノ（り除去用金型によって外部リ
ードの側面の樹脂バリを切断除去する工程であり、液体
ホーニング工程は外部リードｃＪ主面の樹脂バリとレジ
ンカット工程で除去しきれなかった外部リードの側面の
樹脂バ１７ Ｙ液体ホーニング法で除去する工程である
。The resin cut process is a process in which the resin burrs on the side surfaces of the external leads are cut and removed using a burr removal mold, and the liquid honing process removes the resin burrs on the main surface of the external leads CJ that could not be completely removed in the resin cut process. In this step, the resin bar 17 on the side surface of the external lead is removed using the Y-liquid honing method.
しかし、脣に外部リードの側面に形成された樹脂バリヲ
容易に除去することは困難でｉ、うた。However, it is difficult to easily remove the resin burrs formed on the sides of the external leads.
上記問題音解決するため、例えは特開昭６２−２０６８
４１号公報にはレーザー照射により樹脂バリを除去Ｔる
方法が開示さｒｔている。しかし、上記の方法ではり雑
な高価な装置！ｔを必要とする。In order to solve the above problem, the example is Japanese Patent Application Laid-Open No. 62-2068.
No. 41 discloses a method of removing resin burrs by laser irradiation. However, the above method requires complicated and expensive equipment! t is required.
その他にも種々の方法があるがいずれも実用性では十分
とはいえなかった。There are various other methods, but none of them can be said to be sufficiently practical.
そこで、本発明は外部リードの側面に＃成ｄ ｒｔだ樹
脂バリを容易に除去できる樹脂制止型電子部品の製造方
法を提供することン目的とする。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for manufacturing a resin-retained electronic component that allows easy removal of resin burrs formed on the side surfaces of external leads.
上記目的ン運成するための本発明は４ｒ子素子とリード
フレームとの組立体であって、前記リードフレームが前
記電子素子と電気的に接続された外部リード形成用板状
部分と、該外部リード形成用板状部分を平行に連結する
連結条とを有し、前記外部リード形成用板状部分が幅狭
部とこの幅狭部に連続する幅広部とを有し、前虻幅広部
の両側縁部が触記幅狭部の＠Ｊ縁部の延長線上より外側
に位置するように形成されているリードフレーム組立体
ン準備する工程と、成形空所を有する成形用型に前記リ
ードフレーム組重体ン配置し、前記放形空所内に流動化
した封止用樹Ｂ−を押圧注入して固化して、前記電子素
子を被債するが、前記幅狭部の少なくとも一部及び前記
幅広部はバリは別にして実債的に被覆しないように樹脂
封止体ケ形取する工程と、薊記輪広部の前記幅狭部の側
に部の延長線上から突出する領域の少なくとも一部娶前
記外部リード形成用板状部分の延びる方向に沿って切断
して外部リードを形成すると共に前ＮＣ＠広部の仰１縁
部に形成された樹脂バリを除去する工程と娶備えている
ことン特徴とする樹脂制止型電子部品の製造方法に係わ
るものである。The present invention for achieving the above object is an assembly of a 4R element and a lead frame, wherein the lead frame includes a plate-like part for forming an external lead electrically connected to the electronic element; a connecting strip connecting the lead-forming plate-like parts in parallel; the external lead-forming plate-like part has a narrow part and a wide part continuous to the narrow part; A step of preparing a lead frame assembly in which both side edges are located outside the extension line of the @J edge of the narrow width portion, and placing the lead frame in a mold having a molding cavity. The electronic device is bonded by placing the assembled body and press-injecting the fluidized sealing tree B- into the molded cavity and solidifying it. The part is formed by molding the resin sealing body so as not to actually cover it apart from burrs, and at least part of the area protruding from the extension line of the part on the side of the narrow part of the wide part of the ring. Part 2 includes a step of cutting the external lead forming plate-like part along the extending direction to form the external lead and removing resin burrs formed on the upper edge of the front NC@wide part. The present invention relates to a method for manufacturing a resin-sealed electronic component, which has particular characteristics.
外部リードの幅広部の１４＋１ ｍ ｆｆＬ、に形成ざ
ｆした樹脂バリは幅広Ｓを側縁部に沿って切断１−るこ
とによって容易に、かつ確実に除去される。The resin burr formed at 14+1 m ffL on the wide part of the external lead can be easily and reliably removed by cutting the wide part S along the side edge.
［実施例］
次に、第１図〜第５図を径照して本発明の実施例に係わ
る樹脂掴止型ダイオード装＃Ｌ■與造方法Ｙ説明する。[Embodiment] Next, a resin grip type diode assembly #L and manufacturing method Y according to an embodiment of the present invention will be explained with reference to FIGS. 1 to 5.
第３図は本実施例により伯ら才りる面実装型の樹脂封止
型ダイオード装ｆｊＩｔ（以下、単にダイオードと称丁
）１を示す。第１図のダイオード１は組立段階にあり１
図示の工）に連結条２によって初敬個が平行に連結され
た集合体となっている。以下。FIG. 3 shows a surface-mounted resin-sealed diode device fjIt (hereinafter simply referred to as a diode) 1 developed by this embodiment. Diode 1 in Figure 1 is in the assembly stage 1
It is a set of pieces connected in parallel to the structure shown in the figure by connecting strips 2. below.
これ？ダイオード集合体６と称１３．各々のダイオード
１は樹脂封止体４とその両端から導出された第１及びｍ
２の外部リード５．６を有している。this? Referred to as diode assembly 613. Each diode 1 has a resin molding body 4 and a first and m
It has two external leads 5.6.
最終的には連結条２が除去されて個別化されてダイオー
ド１が完成する。以下、上記のダイオード集合体６０與
造力法について説明する。Finally, the connecting strip 2 is removed and the diode 1 is completed. Hereinafter, the above-mentioned diode assembly 60 construction method will be explained.
樹脂封止体４ントランスフアモールドにて形成するに先
たって、まず、第１囚に示すようなリードフレーム組立
体７を準備する。リードフレーム組立体７は第１Ｅｔび
第２の外部リード群８．９とダイオードチップ（内示せ
ず）とを有している。Prior to forming the resin-sealed body using a four-in-one transfer mold, first, a lead frame assembly 7 as shown in the first frame is prepared. The lead frame assembly 7 includes a first Et and a second outer lead group 8.9 and a diode chip (not shown).
第１の外部リード群８は第６図の第１の外部リード５″
Ｖ形成するための検数の第１の外部リード形成用版状部
分１０とそれを平行に連結する連結条２を有している。The first external lead group 8 is the first external lead 5'' in FIG.
It has a plurality of first external lead forming plate-like portions 10 for forming a V and a connecting strip 2 connecting them in parallel.
第２の外部リード群９は第６図の第２の外部リード６ン
彰成するための複数の第２の外部リード形成用板状部分
１１とそれを平行に連結する連結条２を有している。第
１の外部リード形成用板状部分１０は）！！結条２ＶＣ
，近い側に幅広ｅ１０ａを有し、連結条２から遠い側に
幅狭部１０ｂ’Ｙ有している。又、幅狭部１０ｂの先端
部分にはダイオードチップ馨固層する部分であるタブ部
１０ｃが設けられている。実際には、外部リード形成用
板状部分１０とタブ部１０ ｃは別の構成部分として区
別するべきかもしれないが、本明細省においてはタブ部
１００を外部リード形成用ゝ 板状部分１０の一部とし
ている。第２の外部＋７一ド刑成用孜状部分１１も第１
の外部リード形成用仮状部分１０と同様Ｋａ結条２側か
ら順次幅広部１１ ａ、 ＃Ａ狭部１１ｂ、タブ部Ｃ図
示せず）を有している６幅広部１０ａ及び１ｔａはそれ
ぞれ第１の外部リード５０回路基板に対するボンディン
グ部５ａ及び第２の外ｆｈ ’Ｉ−ドロ０ホンディング
部６ａに対応する。第１図における幅広部１０ａ。The second external lead group 9 has a plurality of second external lead forming plate portions 11 for forming the second external lead 6 shown in FIG. 6, and connecting strips 2 connecting them in parallel. ing. The first external lead forming plate-shaped portion 10 is )! ! Kyujo 2VC
, has a wide width e10a on the near side, and has a narrow width part 10b'Y on the side far from the connecting strip 2. Further, a tab portion 10c, which is a portion on which the diode chip is fixed, is provided at the tip of the narrow portion 10b. In reality, the external lead forming plate-like portion 10 and the tab portion 10c may be distinguished as separate components, but in the present specification, the tab portion 100 is defined as the external lead-forming plate-like portion 10c. It is part of it. The second external + 7-do penetrating part 11 is also the first
Six wide parts 10a and 1ta each have a wide part 11a, #A narrow part 11b, and tab part C (not shown) sequentially from the Ka knot 2 side, similar to the temporary part 10 for forming external leads. The first external lead 50 corresponds to the bonding part 5a to the circuit board and the second external fh'I-DRO bonding part 6a. Wide portion 10a in FIG.
１１ ａｋ工幅輻長第６図におけるホンディング部５ａ
、６ａの部長より大きくなるよＩ′）ＶＣ，形成されて
いる。第１図の点線で示す部分が第６図のボンディング
部５ａ、６ａの何！＃を部に相当する。幅狭部１０ｈ及
び１１ｂはそれぞれ第１の外部リード５の導出部５ｂ及
び第２の外部リード６の導出部６ｂｌｃ対応し、横方向
の輻長もそれに等しく形成されている。第１の外部リー
ド群８と第２の外部リード群９はタブ部のみが異なりそ
れ以外は同一の形状となっている。第４図に示すように
ダイオードチツ７１ａは２つの外部リード形成角取状部
分ＩＱ、１１のタブ部の間に挾持されて手出Ｃ図示せず
）で固着されている。11 ak Construction width convergence length Honing part 5a in Fig. 6
, 6a, is larger than the length of I') VC. What is the part indicated by the dotted line in FIG. 1 of the bonding parts 5a, 6a in FIG. 6? # corresponds to part. The narrow portions 10h and 11b correspond to the lead-out portion 5b of the first external lead 5 and the lead-out portion 6blc of the second external lead 6, respectively, and have the same radial length in the lateral direction. The first external lead group 8 and the second external lead group 9 differ only in the tab portion and have the same shape otherwise. As shown in FIG. 4, the diode chip 71a is held between the tab portions of the two external lead-forming corner-shaped portions IQ and 11, and is fixed by a handle C (not shown).
ダイオード集合体３ｔ−製造する時には、リードフレー
ム組立体７を第４図に示すように下型２１と上型２２と
から成る金型に配置し、成形空所２３に流動棚Ｂ￥１を
押圧注入する。流動樹脂は成形空所２３のみでなく、下
型２１と上型２２との境界の隙間、上下の型２１，２２
と外部リード形成用板状部分１０．１１との隙間にも入
り込み、第２図で斜線馨付して示す樹脂バリ１２が生じ
る。樹脂バリ１２は、外部リード形成用板状部分１０．
１１の両主面及び側面と、樹脂封止体４の周囲に形成で
れる。トランスファモールド時に生じる樹脂バリ１２は
不要なものであるので除去しなければならない。When manufacturing the diode assembly 3t, the lead frame assembly 7 is placed in a mold consisting of a lower mold 21 and an upper mold 22 as shown in FIG. inject. The fluid resin is applied not only to the molding cavity 23 but also to the gap between the lower mold 21 and the upper mold 22, and the upper and lower molds 21, 22.
The resin burr 12 also enters the gap between the external lead forming plate portion 10.11 and the resin burr 12 is shown hatched in FIG. The resin burr 12 is attached to the external lead forming plate-shaped portion 10.
11 and around the resin sealing body 4 . The resin burr 12 generated during transfer molding is unnecessary and must be removed.
なＳ１樹脂鈎止体４はダイオードチップ１ａと第１及び
第２の外部リード形成用板状部分１０゜１１の端部ｙ！
−被覆しているが、幅狭部１０ｂ、１１ｂの大部分と幅
広部１０ａ、１１，１は被接していない。外部リード形
成用板状部分１０．１１の両主面１ｃ形成される樹脂バ
リ１２（図中斜Ｎｓヲ付した部分）は比較的肉薄のレジ
ンフラッシュと称てれるバ＋１であり、両側面に形成さ
れる樹脂バリ１２（図中黒＜ｅｂつぶした部分）は比較
的肉薄のバリでと、る。なお、樹脂封止体４の周囲に形
成場れる樹脂バリ（図示せす）は成形金型のパーティン
グラインに対応する部分に発生てる薄バリで夛、る。The S1 resin hooking body 4 connects the diode chip 1a and the ends y of the first and second external lead forming plate-shaped portions 10°11!
- Most of the narrow parts 10b, 11b and the wide parts 10a, 11, 1 are not in contact with each other. The resin burrs 12 formed on both main surfaces 1c of the external lead forming plate-like portion 10.11 (the portion marked with a diagonal Ns in the figure) are relatively thin resin burrs 1 called resin flashes. The formed resin burr 12 (black part in the figure) is a relatively thin burr. It should be noted that the resin burrs (shown) formed around the resin sealing body 4 are thin burrs generated in the portions corresponding to the parting lines of the molding die.
次に、上記の樹脂バリ１２を除去してダイオード集合体
６を形成する。樹脂バリ１２の除去に先だって、まず第
２図に示す、ようなプレス用金型１６馨用意する。プレ
ス用金型１６は上型１４と下型１５とから捨底されてい
る。上型１４の底面には下刃に突出する会むの打抜き型
１６が設けら力ている。下型１５には中央に長平方向に
延在する平坦部１７が設けらｔ″しており、その１ｌ１
７１側には４数の打抜き型挿入部１８と外部リード形成
用板状部分載置台１９とが長平方向に交互に設けらｒ＋
ている。ブらにその外側には外部リード形成用板状部分
載置台１９と上面を同一高さに位置する連結条載置台２
０が形ｂｙ、されている。Next, the resin burr 12 described above is removed to form the diode assembly 6. Prior to removing the resin burr 12, a press mold 16 as shown in FIG. 2 is first prepared. The press die 16 has an upper die 14 and a lower die 15 with a hollow bottom. A matching punching die 16 is provided on the bottom surface of the upper die 14 and protrudes from the lower blade. The lower mold 15 is provided with a flat part 17 extending in the elongated direction at the center.
On the 71 side, four punching die insertion parts 18 and external lead forming plate-shaped part mounting bases 19 are provided alternately in the longitudinal direction r+
ing. On the outside thereof, there is a plate-shaped part mounting table 19 for forming external leads and a connecting strip mounting table 2 whose upper surface is located at the same height.
0 is in the form by.
次に、リードフレーム組立体７を″′Ｆ型１型上５上ｔ
！１する。このとき、樹脂封止体４、外部リード形成用
板状部分１０．１１、連結条２はそれぞ五平坦部１７．
外部リード形成用板状部分載置台１９、ａＬ結条載置台
２０の上方に配置する。ここで、平坦部１７からの外部
リード形成用板状部分載置台１９の突出高さはリードフ
レーム組立体７の樹脂封止体４の底面と外部リード形成
角取状部分１０％１１の下面との間隔に等しくなってい
るため、リードフレーム組立体７の下面を１下型１５に
確実に当接芒ゼることができる。牙だ、外部リード形成
用板状部分１０．１１は幅狭部１０ｂ、１１ｂの両端馨
外部す−ドル成用叡状部分載誼台１９の両端に一致づせ
、力・つ幅広部１０ａ、１１ａの両端ン外部リード形成
用板状部分載置台１９の両端から左右等しい間隔で突出
はせて位置決めする。Next, the lead frame assembly 7 is
! Do 1. At this time, the resin sealing body 4, the plate-shaped portion 10.11 for forming external leads, and the connecting strip 2 have five flat portions 17.11, respectively.
The external lead forming plate-shaped part mounting table 19 is arranged above the aL knot mounting table 20. Here, the protrusion height of the external lead forming plate-shaped part mounting base 19 from the flat part 17 is the same as the bottom surface of the resin sealing body 4 of the lead frame assembly 7 and the lower surface of the external lead forming cornered part 10% 11. The lower surface of the lead frame assembly 7 can be reliably brought into contact with the lower mold 15. The external lead forming plate-like portions 10.11 are aligned at both ends of the narrow portions 10b and 11b with both ends of the external lead forming guide-shaped portion mounting base 19, and the wide portions 10a, Both ends of the external lead forming plate-like part mounting table 19 are positioned so as to protrude from both ends of the plate-shaped part mounting table 19 at equal intervals on the left and right sides.
即ち第１図の点線部分に外部リード形成用板状部分載置
台１９の両端２合わせる。本実施例では下型１５に設け
られたビン１５ａを連結条２の孔２ａ［４ｉ！入するこ
とによってリードフレーム組立体７の前後と右の正確な
位置決めを行う。That is, both ends 2 of the plate-shaped part mounting table 19 for forming external leads are aligned with the dotted line portion in FIG. In this embodiment, the bottle 15a provided on the lower mold 15 is inserted into the hole 2a [4i!] of the connecting strip 2. By inserting the lead frame assembly 7, the lead frame assembly 7 can be accurately positioned from front to back and to the right.
次に、上型１４を下降させて上型１４の打抜き型１６χ
下型１５の打抜き型挿入用挿入部１８に嵌合ざゼる。打
抜き型挿入部１８の上方の縁部からは外部リード形成用
板状部分１０．１１の幅広部１０ａ、１１ａの両縁部及
びそこに形成された樹脂バリ１２と、輪狭部ＩＤｂ、１
１ｂに形成ばれた樹脂バリ１２が内側に向って突出して
いる。Next, the upper die 14 is lowered and the punching die 16χ of the upper die 14 is
It fits into the insertion part 18 for inserting the punching die of the lower die 15. From the upper edge of the punching die insertion part 18, both edges of the wide parts 10a, 11a of the external lead forming plate-like part 10.11, the resin burrs 12 formed there, and the narrow ring parts IDb, 1 are visible.
A resin burr 12 formed on 1b projects inward.
したがって、この部分は打抜き型１６に打抜穴型挿入部
１８に嵌合させることにより打抜き除去される。これに
より、外部リード形成用板状部分１０．１１の側面に形
成された樹脂バリ１２が除去されるとともに、幅広部１
０ａ、１１ａが点線部分で切断されて横幅が狭められて
ボンディング部５ａ、６ａか得られる。結果として、外
部リード形成用板状部分１０．１１が外部リード５．６
として完成する。Therefore, this portion is punched out and removed by fitting the punching die 16 into the punching hole die insertion portion 18. As a result, the resin burr 12 formed on the side surface of the external lead forming plate-like portion 10.11 is removed, and the wide portion 1
0a and 11a are cut along the dotted line to narrow the width and provide bonding portions 5a and 6a. As a result, the external lead forming plate portion 10.11 becomes the external lead 5.6.
Completed as.
続いて、樹脂バリ１２の打抜と除去が終了したリードフ
レーム組立体７に周知の液体ホーニングを施１ことによ
り、外部リード５．６の導出部５ｂ、６ｂに残存する樹
脂バリと外部リード５、乙の両主面及び樹脂制止体４に
形成された樹脂バリ１２を除去する。Subsequently, the lead frame assembly 7 from which the resin burrs 12 have been punched and removed is subjected to well-known liquid honing to remove the resin burrs remaining on the lead-out portions 5b and 6b of the external leads 5.6 and the external leads 5. , remove the resin burrs 12 formed on both main surfaces of B and the resin stopper 4.
樹脂バリ１２の除去作業が終了したら、外部り一部５．
６に半田被覆層Ｃ図示せす１馨設け、連結条２を切断除
去することによって独立の樹脂制止型ダイオード１を得
る。なお、幅広のボンディング部５ａ、６ａＯ樹脂バリ
１２は良好に除去されているので、牛用が良好に付着す
る。本実施例では、更に、外部リード５．６を第５図に
示Ｔように樹脂封止体４に＠接するように折り曲げてチ
ップ状ダイオード２４ケ完成させる。After the removal work of the resin burr 12 is completed, a part of the outside part 5.
A solder coating layer C (as shown in the figure) is provided on 6, and the connecting strip 2 is cut and removed to obtain an independent resin-blocking diode 1. In addition, since the wide bonding parts 5a, 6aO resin burrs 12 have been removed well, the cow material adheres well. In this embodiment, 24 chip-shaped diodes are completed by bending the external leads 5.6 so as to contact the resin sealing body 4 as shown in FIG. 5.
本実施例は次の効果を有する。This embodiment has the following effects.
（１１従来では除去が困難であった外部リードのボンデ
ィング部として作用する幅広部の倶１１面の樹脂バリを
容易に除去できる。(11) It is possible to easily remove the resin burrs on the 11 surface of the wide portion that acts as the bonding portion of the external lead, which was difficult to remove in the past.
（２）周知のプレス用金型１３の打抜き加工にて目的を
遜成できるため、低コストで樹脂バリのないダイオード
を製造できる。(2) Since the purpose can be achieved by punching using the well-known press mold 13, diodes without resin burrs can be manufactured at low cost.
（３１ブレス用金型１６の打抜き位ｆが樹脂封止体４か
ら離間しているので、樹脂封止体４に損傷を与えること
がない。(Since the punching position f of the 31 press mold 16 is spaced apart from the resin sealing body 4, the resin sealing body 4 will not be damaged.
ｆＪ ＠広部１０ａ、１１ａの両端を幅狭部１０ｂ、
１１ｂｌＤ匍１縁部の延長標上から突出孕せているため
、打抜き位置のズレの自由度が大きい。fJ @ Both ends of the wide parts 10a and 11a are connected to the narrow part 10b,
11blD Since it protrudes from the extension mark of the edge of the 1st barrel, there is a large degree of freedom in shifting the punching position.
（５１外部リード５．６（１）樹脂封止体４からの導出
部分が偏狭となっているため剥離及び外部り−ド５，６
と樹脂封止体４の界面からの水分や不純物の浸入が生じ
にく（化軸性が向上している。(51 External lead 5.6 (1) The lead-out part from the resin sealing body 4 is narrow, so it may peel off and the external lead 5,6
It is difficult for moisture and impurities to enter from the interface between the resin molding body 4 and the resin sealing body 4 (the axial properties are improved).
＋６１ 幅広部１０ａ、１１ａを分離ゼすに、連結条
２の一部として幅狭Ｎ１０ｂ、１１ｂのみが連結条２か
ら導出したＪト状としてもよし・と考えられる。しかし
、第１及び第２の外電＋ ’）−ド群８，９はいずれも
組立前にニッケル等のメツキ馨施丁必要があジ、メツキ
後のこれら外部リード群８，９の切断部は不純物の含有
が多くなるため、再オＩＩ用できない。したがって、メ
ツキ前に幅広１１０ａ。+61 In order to separate the wide portions 10a and 11a, it is considered that only the narrow width portions N10b and 11b may be derived from the connecting strip 2 in a J-shaped shape as part of the connecting strip 2. However, both the first and second external lead groups 8 and 9 must be plated with nickel or the like before assembly, and the cut portions of these external lead groups 8 and 9 after plating are It cannot be used for second use because it contains a lot of impurities. Therefore, it is wide 110a before the matsuki.
１１ ａ’ｒ：形成しておいた万がコスト面で有利であ
る。また１本実施例のように外部リードノ１／敢用板状
部分１０．１１間にナツツを挾んで固着するタイプの半
導体装置では外部リード形厄角取状部分１［Ｊ、１１に
柔軟性が要求される。したがって、外部リード形成用板
状部分１０．１１は所定の長ざに形成しておいた万がチ
ップの固着の面で有利である。11 a'r: Forming it in advance is advantageous in terms of cost. In addition, in a semiconductor device of the type in which a nut is sandwiched between the external lead no. 1 and the active plate-like portion 10 and 11 as in this embodiment, the external lead type troublesome corner portion 1 [J, 11 is flexible. required. Therefore, it is advantageous in terms of chip fixation if the external lead forming plate-like portion 10.11 is formed to have a predetermined length.
本発明は上述の実施例に限定さＩるものでな（、例えは
次のｆｉが可能なものである。The present invention is not limited to the above embodiments (for example, the following fi is possible).
ＩＩＩ 本実施例で＆丁樹脂バリ１２の除去に液体ホ
ーニング法を併用したが、外カン加えて樹脂バリを除去
する他のａ（脂バリ除去方法と組合せてもよ０゜
１２） ダイオード以外の種々ｃＬＪ電子部品又は装
置に適Ａ１ｉ］酢である。III In this example, the liquid honing method was used in conjunction with the removal of the resin burr 12, but other methods for removing the resin burr in addition to the outer ring (may be combined with the greasy burr removal method). A1i] Vinegar suitable for various cLJ electronic parts or devices.
上述のように１本発明によれは樹脂ノクリを容易［除去
Ｔることかできる樹脂制止型重子部品の央造方法を提供
できる。As described above, according to the present invention, it is possible to provide a method for manufacturing a resin-retained heavy weight component in which the resin cutout can be easily removed.
第１図は本発明の実施例に係わるリードフレーム組立体
ン示す平面図、
第２図は第１図の１１−ドフレーム組立体に樹脂個止体
乞設けることによって生じたバリ乞除去するために外部
Ｉｊ−ド形底月板状部分を切断する装置の一部を示１斜
袂図。
第６図はバリ除去後＋ＺＪり゛イオード集合体を示て糾
視図。
第４図は樹脂掴止体ン形敢するための金型とり一ドフレ
ーム和立体を示″ＴＩ！１面図。
第５図はナツツ状に＃厄したタイオードケ示す止面図で
ある。
１・・・タイオード、２・・・連結条、６・・・ダイオ
ード集合体、４・・・樹脂封止体、５．６・・・外部リ
ード。
７・・・リードフレーム組重体、８．９・・・外部リー
ド群、ｉｌｌ、１１・・・外部リード形成用板状部分％
１０ ａ ＊ １１ Ｂ ・＝幅広部、１０ ｂ 、
１ ｌ ｂ ・、幅狭部。
１２・・・樹脂バリ。
代 理 人 高 野 則 次１１１Ｂ
１％％
セ； トFig. 1 is a plan view showing a lead frame assembly according to an embodiment of the present invention, and Fig. 2 is a plan view showing a lead frame assembly according to an embodiment of the present invention. FIG. 1 is an oblique view showing a part of the device for cutting the external IJ-shaped bottom plate-shaped portion. FIG. 6 is a close-up view of the +ZJ diode assembly after removing burrs. Figure 4 is a top view showing the mold and frame for shaping the resin gripping body. Figure 5 is a top view showing the nut-shaped tie. 1 ... diode, 2 ... connection strip, 6 ... diode assembly, 4 ... resin sealing body, 5.6 ... external lead. 7 ... lead frame assembly, 8.9 ... External lead group, ill, 11... Plate-shaped portion for forming external leads %
10 a * 11 B ・= wide part, 10 b,
1 l b ·, narrow part. 12...Resin burr. Agent Noriji Takano 111B
1%%
Claims (1)
前記リードフレームが前記電子素子と電気的に接続され
た外部リード形成用板状部分と、該外部リード形成用板
状部分を平行に連結する連結条とを有し、かつ、前記外
部リード形成用板状部分が幅狭部とこの幅狭部に連続す
る幅広部とを有し、前記幅広部の両側縁部が前記幅狭部
の側縁部の延長線上より外側に位置するように形成され
ているリードフレーム組立体を準備する工程と、成形空
所を有する成形用型に前記リードフレーム組立体を配置
し、前記成形空所内に流動化した封止用樹脂を押圧注入
して固化して、前記電子素子を被覆するが、前記幅狭部
の少なくとも一部及び前記幅広部はバリは別にして実質
的に被覆しないように樹脂封止体を形成する工程と、 前記幅広部の前記幅狭部の側縁部の延長線上から突出す
る領域の少なくとも一部を前記外部リード形成用板状部
分の延びる方向に沿って切断して外部リードを形成する
と共に前記幅広部の側縁部に形成された樹脂バリを除去
する工程と を備えていることを特徴とする樹脂封止型電子部品の製
造方法。[Claims] [1] An assembly of an electronic element and a lead frame,
The lead frame has a plate-like part for forming external leads that is electrically connected to the electronic element, and a connecting strip that connects the plate-like part for forming external leads in parallel, and The plate-like portion has a narrow portion and a wide portion continuous to the narrow portion, and both side edges of the wide portion are located outside an extension line of the side edges of the narrow portion. a step of preparing a lead frame assembly, placing the lead frame assembly in a mold having a molding cavity, press-injecting fluidized sealing resin into the molding cavity and solidifying it; , forming a resin encapsulant to cover the electronic element but not substantially cover at least a portion of the narrow portion and the wide portion, apart from burrs; and the width of the wide portion. At least a part of the area protruding from the extension line of the side edge of the narrow part is cut along the extending direction of the external lead forming plate-like part to form an external lead, and also formed on the side edge of the wide part. A method for manufacturing a resin-sealed electronic component, comprising the step of removing resin burrs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63129980A JPH01298729A (en) | 1988-05-27 | 1988-05-27 | Manufacture of resin-sealed electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63129980A JPH01298729A (en) | 1988-05-27 | 1988-05-27 | Manufacture of resin-sealed electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01298729A true JPH01298729A (en) | 1989-12-01 |
Family
ID=15023188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63129980A Pending JPH01298729A (en) | 1988-05-27 | 1988-05-27 | Manufacture of resin-sealed electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01298729A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6373656A (en) * | 1986-09-17 | 1988-04-04 | Mitsubishi Electric Corp | Semiconductor device and manufacture thereof |
-
1988
- 1988-05-27 JP JP63129980A patent/JPH01298729A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6373656A (en) * | 1986-09-17 | 1988-04-04 | Mitsubishi Electric Corp | Semiconductor device and manufacture thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4987475A (en) | Alignment of leads for ceramic integrated circuit packages | |
| US6114189A (en) | Molded array integrated circuit package | |
| CA1086430A (en) | Method and apparatus for the assembly of semiconductor devices | |
| DE4338432A1 (en) | Plastics encapsulated IC module mfr. - comprises forming external electrodes by photolithography and cleaning by polishing of hardened resin barrier layer | |
| US11081428B2 (en) | Electronic device with three dimensional thermal pad | |
| US11569152B2 (en) | Electronic device with lead pitch gap | |
| US3978516A (en) | Lead frame assembly for a packaged semiconductor microcircuit | |
| JPH01298729A (en) | Manufacture of resin-sealed electronic component | |
| CN216413070U (en) | Lead frame assembly | |
| EP4113601B1 (en) | Method of manufacturing substrates for semiconductor devices, corresponding substrate and semiconductor device | |
| GB2202675A (en) | Semiconductor chip carriers | |
| CA1292326C (en) | Alignment of leads for ceramic integrated circuit packages | |
| JP2731584B2 (en) | Lead frame and method of manufacturing electronic component package using the same | |
| US20230411265A1 (en) | Split semiconductor package | |
| JPH0424865B2 (en) | ||
| JP3315155B2 (en) | Printed circuit board manufacturing method | |
| JP2741787B2 (en) | Lead frame cutting method | |
| DE102023205495A1 (en) | MOLDED POWER SEMICONDUCTOR CASE WITH GATE CONNECTOR FEATURE | |
| JPH0419804Y2 (en) | ||
| JP2522287B2 (en) | Semiconductor device | |
| JPH03245475A (en) | Manufacture of flap type hybridized integrated circuit | |
| JPH0472389B2 (en) | ||
| JPH01111363A (en) | Manufacture of semiconductor device | |
| DE102022131955A1 (en) | FABRICATION OF LEADED SEMICONDUCTOR PACKAGES USING A LEAD FRAME WITH STRUCTURED CENTER PAD | |
| JPH0432774Y2 (en) |