JPH01295143A - Lead curvature detecting device - Google Patents

Lead curvature detecting device

Info

Publication number
JPH01295143A
JPH01295143A JP63125391A JP12539188A JPH01295143A JP H01295143 A JPH01295143 A JP H01295143A JP 63125391 A JP63125391 A JP 63125391A JP 12539188 A JP12539188 A JP 12539188A JP H01295143 A JPH01295143 A JP H01295143A
Authority
JP
Japan
Prior art keywords
lead
line
sensor camera
line sensor
constant speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63125391A
Other languages
Japanese (ja)
Other versions
JP2759963B2 (en
Inventor
Hideyuki Tsujimura
秀之 辻村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP63125391A priority Critical patent/JP2759963B2/en
Publication of JPH01295143A publication Critical patent/JPH01295143A/en
Application granted granted Critical
Publication of JP2759963B2 publication Critical patent/JP2759963B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95684Patterns showing highly reflecting parts, e.g. metallic elements

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To detect whether or not there is a lead in real time by adding data in a specific area in one line from a line sensor camera which picks up an image of an integrated circuit moving at a constant speed and comparing the sum with an optionally set value. CONSTITUTION:The IC moves right below the line sensor camera LS in a direction DIR at a constant speed. The start point STA and final point STP of the specific area in one line of the line sensor camera LS are set and addition data in this area is stored in a storage circuit MEMO. When the IC moves in the direction DIR at the constant speed and finishes moving, histograms H1...Hi for leads P1...Pi are obtained in the storage circuit MEMO. An optional value HTH is set for the addition result and used to decide whether or not there is a lead. Here, the lead width is Pr1-Pf1...Pri-Pfi, and the lead interval is Pf1-Pr2...Pf(i-1)-Pri. For the purpose, the lead width and lead interval are set previously and compared with certain criteria to make a normal/abnormal decision.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はICの外観検査装置、特にリードのピッチ方向
向りの検査装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC visual inspection device, and particularly to an inspection device in the pitch direction of leads.

〔従来の技術〕[Conventional technology]

従来、この種の検査方法は第3図のように透過形センナ
部FS(紙面の上部を投光器1紙面の下部を受光器の構
成とする)にICのリードを定速でDIR方向に通過さ
せ、リードP1〜P、の無から有に切換る時間(L、1
. L、2.・・・Lr+・・・)、及びリードP1〜
P、の有から無に切換る時間(L =t 、 L +?
、、・・・L fl・・・)を求め、リード間隔(Lr
2 1.rl) 、  (L、−3Lr2) ・・・(
Lr+++++−L□)・・・を求めていた。又エリア
センサを使用し、リード部を撮影し、リード部にウィン
ドウを設け、ウィンドウ内のり−ドデータにより処理を
行っていた。S Tl+は測定ラインを示ず。
Conventionally, this type of inspection method involves passing the IC leads at a constant speed in the DIR direction through a transmission type sensor section FS (the upper part of the page is the emitter and the lower part of the page is the receiver) as shown in Figure 3. , lead P1 to P, switching time (L, 1
.. L, 2. ...Lr+...), and lead P1~
Time to switch from presence to absence of P (L = t, L +?
,,...L fl...) is determined, and the lead spacing (Lr
2 1. rl), (L, -3Lr2)...(
Lr++++++-L□)... was sought. Furthermore, an area sensor is used to photograph the lead part, a window is provided in the lead part, and processing is performed based on the lead data within the window. S Tl+ shows no measurement line.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の透過センサ検査方法は、リードの一点の
みしか検出していないため、第3図のリードP4のよう
にリードの途中で曲っているものに対しては検出できな
いという欠点がある。
The conventional transmission sensor inspection method described above detects only one point on the lead, and therefore has the disadvantage that it cannot detect a lead that is bent in the middle, such as lead P4 in FIG.

又エリアセンサ検査方法に対しては、検出精度向上のな
め、ウィンドウを大きく取る必要があり、これは検査時
間の増加につながるという欠点がある。
Furthermore, the area sensor inspection method requires a large window in order to improve detection accuracy, which has the disadvantage of increasing inspection time.

本発明の目的は前記課題を解決したリード曲り検出装置
を提供することにある。
An object of the present invention is to provide a lead bending detection device that solves the above problems.

〔発明の従来技術に対する相違点〕[Differences between the invention and the prior art]

上述した従来の検査方式に対し、本発明はリアルタイム
なデータの採取及び処理、さらにリード全体の特徴をつ
かんだ検出方式を実現させるという相違点を有する。
The present invention differs from the conventional inspection method described above in that it enables real-time data collection and processing, and also realizes a detection method that grasps the characteristics of the entire lead.

〔課題を解決するための手段〕[Means to solve the problem]

上記目的を達成するため、本発明のリード曲り検出装置
においては、定速で移動する集積回路を撮像するライン
センサカメラよりの1ライン分の出力を2値化する手段
と、1ライン内の特定エリアを設定する手段と、特定エ
リア内のデータを加算する手段と、加算結果を記憶する
手段と、各ラインの加算結果に対し、任意に設定した値
と比較を行いリードの有無を検出する手段とを有するも
のである。
In order to achieve the above object, the lead bend detection device of the present invention includes means for binarizing one line of output from a line sensor camera that images an integrated circuit moving at a constant speed, and A means for setting an area, a means for adding data in a specific area, a means for storing the addition result, and a means for comparing the addition result of each line with an arbitrarily set value to detect the presence or absence of a lead. It has the following.

〔実施例〕〔Example〕

次に本発明について図を参照して説明す□る。 Next, the present invention will be explained with reference to the drawings.

(実施例1) 第1図は本発明の実方麺例1を示ず構成図である。(Example 1) FIG. 1 is a block diagram, not showing Example 1 of actual noodles of the present invention.

図において、本発明は定速で移動する集積回路パッケー
ジ(以下、ICという)をリードP、〜Plを含めて撮
像するラインセンサカメラL Sと、ラインセンサカメ
ラLSからの1ライン分の出力を2値化する2値化回路
COMPと、ラインセンサカメラLSの出力1ライン分
の特定エリアを制御する制御回路CTRLと、制御口I
?8cTRLの信号により特定エリア内のデータを加算
する加算回路ADDと、その出力を記憶する記憶口Fl
@ M EMOと、各ラインの加算結果に対し、任意に
設定した値と比較を行い、リードの有無を判定する判定
回路JGより構成される。
In the figure, the present invention includes a line sensor camera LS that images an integrated circuit package (hereinafter referred to as IC) that moves at a constant speed, including leads P and ~Pl, and a line sensor camera LS that captures the output of one line from the line sensor camera LS. A binarization circuit COMP that performs binarization, a control circuit CTRL that controls a specific area for one line of output from the line sensor camera LS, and a control port I.
? An adder circuit ADD that adds data in a specific area according to the signal of 8cTRL, and a memory port Fl that stores its output.
@M EMO and a determination circuit JG that compares the addition result of each line with an arbitrarily set value and determines the presence or absence of a lead.

実施例において、今、ラインセンサカメラLSの真下を
ICがDIR方向に定速で移動するものとする。そして
ラインセンサカメラLSかICを検出した時から一定時
間間隔でICが通過し終るまで連続的にデータを収るも
のとする。さらにラインセンサカメラLSの1ライン分
のうちの特定のエリアの開始点STAから最終点STP
を設定し、このエリア内の加算データを記憶回路MEM
Oに蓄える。
In the embodiment, it is assumed that the IC is moving directly below the line sensor camera LS in the DIR direction at a constant speed. It is assumed that data is continuously collected at fixed time intervals from when the line sensor camera LS or IC is detected until the IC finishes passing. Furthermore, from the starting point STA to the final point STP of a specific area of one line of the line sensor camera LS
is set, and the addition data in this area is stored in the memory circuit MEM.
Store in O.

今、ICがDIRの方向に定速に移動し、移動し終ると
、記憶回路MEMOにはリードP1に対しH2のヒスト
グラム、リードP2に対しH2のヒストグラム、・・・
リードP、に対しH、のヒストグラムが得られる。この
様子が第1図のリードP、に対するヒストグラムH3で
あり、H、の縦軸一定時間間隔に対する横軸度数分布を
示している。P r 1+〜p rlはリードの無から
有の点、P、l〜Pf1はリードの有から無の点をそれ
ぞれ示し、)(’rHは任意の設定値を示す。
Now, the IC is moving at a constant speed in the direction of DIR, and when it finishes moving, the memory circuit MEMO contains a histogram of H2 for lead P1, a histogram of H2 for lead P2, etc.
A histogram of lead H for lead P is obtained. This state is the histogram H3 for lead P in FIG. 1, which shows the horizontal axis frequency distribution of H with respect to the vertical axis constant time interval. P r 1+ to p rl indicate the point from no lead to present, P, l to Pf1 indicate the point from presence to no lead, respectively, ) ('rH indicates an arbitrary setting value.

ここで、加算結果に対し任意の値H7,,を設定し、こ
の値を境にリードの有無を決定する。ここではリード幅
はp rl〜p rl、 Pr2〜p 、、 、、、 
p rl〜P2.であり、リード間隔はPf1〜P r
2. P 12〜Pr3+’・・Pf3〜P rll+
l+となる。
Here, an arbitrary value H7, . is set for the addition result, and whether or not to read is determined based on this value. Here, the lead widths are prl~prl, Pr2~p, , , ,
p rl~P2. , and the lead spacing is Pf1 to P r
2. P12~Pr3+'...Pf3~Prll+
It becomes l+.

そこで、リード幅及びリード間隔をあらかじめ設定しで
ある判定基準と比較を行うことにより良否判定を行う。
Therefore, the lead width and lead interval are set in advance and compared with certain criteria to determine the quality.

(実施例2) 第2図は本発明の実施例2を示す原理図である。(Example 2) FIG. 2 is a principle diagram showing a second embodiment of the present invention.

−4一 実施例1ではICの片方のリードに対して説明したが、
ICパッケージの大きさ、ラインセンサカメラの1ライ
ン当りのビット数、及び精度を考慮すると、両リードの
データを同時に検出可能な場合かある6そこで、本実施
例はこの場合ラインセンサカメラLSの特定エリア5T
AI〜5TP1及び5TA1〜5TP2を2種類設け、
ICの左右のリードを独立に管理するようにしたもので
ある。本実施例によれは、ICの左右のリードを一度に
検査できる利点かある。
-4 In Example 1, the explanation was made for one lead of the IC, but
Considering the size of the IC package, the number of bits per line of the line sensor camera, and the accuracy, it may be possible to detect data from both leads simultaneously6. Therefore, in this embodiment, the line sensor camera LS is specified. Area 5T
Two types of AI~5TP1 and 5TA1~5TP2 are provided,
The left and right leads of the IC are managed independently. This embodiment has the advantage that the left and right leads of the IC can be inspected at the same time.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、リアルタイムにデータ収
集か行えることによる検査時間の短縮を実現できるとと
もに、個々のリードの特徴的なリードの曲りを判定でき
、品質の向上か期待できるという効果かある。
As explained above, the present invention can shorten inspection time by collecting data in real time, and can also determine characteristic bends of individual leads, which can be expected to improve quality. .

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の実施例1を示す構成図、第2図は本発
明の実施例2を示す原理図、第3図は従来例を示す原理
図である。 LS・・・ラインセンサカメラ COMP・・・2値化回路 CT RL・・・制御回路  ADD・・・加算回路M
’EMO・・・記憶回路  JG・・・判定回路STA
、5TAI、5TA2・・・特定エリアの開始点 STP、5TPI、5TP2・・・特定エリアの最終点 IC・・・集積回路パッケージ DIR・・・ICの移動方向 P+ 、P2 、P3 、P4 、 P+・・・ICの
リードH+ 、H2、H3、H4、H+・・・ヒストグ
ラムP rl+  P r2+  P r3+  P 
r4+  P rl”’リードの無から有の点 p H,P t2. P f3+ P tl、 P t
+・・・リードの有から無の点 H’ro・・・任意の設定値 特許出願人  日本電気株式会社
FIG. 1 is a block diagram showing a first embodiment of the present invention, FIG. 2 is a principle diagram showing a second embodiment of the present invention, and FIG. 3 is a principle diagram showing a conventional example. LS...Line sensor camera COMP...Binarization circuit CT RL...Control circuit ADD...Addition circuit M
'EMO...Memory circuit JG...Judgment circuit STA
, 5TAI, 5TA2...Start point of specific area STP, 5TPI, 5TP2... End point of specific area IC...Integrated circuit package DIR...IC movement direction P+, P2, P3, P4, P+・...IC leads H+, H2, H3, H4, H+...Histogram P rl+ P r2+ P r3+ P
r4+ P rl"'Lead's point from nothing to existence p H, P t2. P f3+ P tl, P t
+...Point from presence to absence of lead H'ro...Arbitrary setting value Patent applicant: NEC Corporation

Claims (1)

【特許請求の範囲】[Claims] (1)定速で移動する集積回路を撮像するラインセンサ
カメラよりの1ライン分の出力を2値化する手段と、1
ライン内の特定エリアを設定する手段と、特定エリア内
のデータを加算する手段と、加算結果を記憶する手段と
、各ラインの加算結果に対し、任意に設定した値と比較
を行いリードの有無を検出する手段とを有することを特
徴とするリード曲り検出装置。
(1) means for binarizing one line of output from a line sensor camera that images an integrated circuit moving at a constant speed;
A means for setting a specific area within a line, a means for adding data in the specific area, a means for storing the addition result, and a means for comparing the addition result of each line with an arbitrarily set value to determine whether or not there is a lead. 1. A lead bending detection device comprising: means for detecting.
JP63125391A 1988-05-23 1988-05-23 Lead bending detection method Expired - Fee Related JP2759963B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63125391A JP2759963B2 (en) 1988-05-23 1988-05-23 Lead bending detection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63125391A JP2759963B2 (en) 1988-05-23 1988-05-23 Lead bending detection method

Publications (2)

Publication Number Publication Date
JPH01295143A true JPH01295143A (en) 1989-11-28
JP2759963B2 JP2759963B2 (en) 1998-05-28

Family

ID=14908978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63125391A Expired - Fee Related JP2759963B2 (en) 1988-05-23 1988-05-23 Lead bending detection method

Country Status (1)

Country Link
JP (1) JP2759963B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102510529B1 (en) * 2018-02-26 2023-03-15 한화정밀기계 주식회사 System and method for inspecting lead

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58171611A (en) * 1982-04-02 1983-10-08 Hitachi Ltd Method and device for detecting shape
JPS61290311A (en) * 1985-06-19 1986-12-20 Hitachi Ltd Apparatus and method for inspecting soldered zone
JPS62133341A (en) * 1985-12-06 1987-06-16 Hitachi Ltd Inspecting device for soldered part

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58171611A (en) * 1982-04-02 1983-10-08 Hitachi Ltd Method and device for detecting shape
JPS61290311A (en) * 1985-06-19 1986-12-20 Hitachi Ltd Apparatus and method for inspecting soldered zone
JPS62133341A (en) * 1985-12-06 1987-06-16 Hitachi Ltd Inspecting device for soldered part

Also Published As

Publication number Publication date
JP2759963B2 (en) 1998-05-28

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