JPH01294875A - Surface treatment for resin film and the like - Google Patents

Surface treatment for resin film and the like

Info

Publication number
JPH01294875A
JPH01294875A JP12343088A JP12343088A JPH01294875A JP H01294875 A JPH01294875 A JP H01294875A JP 12343088 A JP12343088 A JP 12343088A JP 12343088 A JP12343088 A JP 12343088A JP H01294875 A JPH01294875 A JP H01294875A
Authority
JP
Japan
Prior art keywords
metal
thin film
treatment
synthetic resin
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12343088A
Other languages
Japanese (ja)
Inventor
Yasuo Takenoiri
竹野入 康夫
Kazuhiro Yamashita
和宏 山下
Takao Okuhara
隆夫 奥原
Yasuo Izumi
泉 恭夫
Tsukasa Aoki
司 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HITAKE SEIKO KK
Original Assignee
HITAKE SEIKO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HITAKE SEIKO KK filed Critical HITAKE SEIKO KK
Priority to JP12343088A priority Critical patent/JPH01294875A/en
Publication of JPH01294875A publication Critical patent/JPH01294875A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Other Surface Treatments For Metallic Materials (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To improve the adhesive strength of a thin metallic film by previously applying sand blasting treatment to the surface of a member made of synthetic resin or metal to roughen the surface and then carrying out electric discharge treatment at the time of forming a thin metallic film on the surface of the above member. CONSTITUTION:At the time of forming a thin film of a metal, such as Al, Cu, Cr, Ni, and Sn, or a compound, such as ITO, on the surface of a synthetic resin member or a metallic member by a vacuum vapor deposition method, a sputtering method, an ion plating method, etc., the surface of the synthetic resin member or the metallic member is roughened by means of sand blasting treatment. Subsequently, after this material 6 is placed in a hermetically sealed-type reaction vessel 1 and the inside of this vessel 1 is evacuated by means of a vacuum pump 2, Fe-or Si-type chemicals in a vessel 4 is introduced via a needle valve 3 and, successively, an F-or Si-type thin releasing film is formed by the polymerization by plasma discharge by means of a high-frequency electric power source 5, and further, the surface of the releasing thin film is modified by means of plasma treatment. When a thin film layer of metal, etc., is formed on the surface after the above treatment, the adhesive strength of the thin film layer of metal, etc., to a member made of synthetic resin or metal is improved and the peeling of this thin film layer can be prevented.

Description

【発明の詳細な説明】 (産業上の利用分野) この発明は、物理的または化学的堆積処理して積層体を
形成したり、または印刷するときに使用するための樹脂
や金属等材料の表面処理方法に関する。
Detailed Description of the Invention (Industrial Field of Application) This invention relates to the surface treatment of materials such as resins and metals for use in forming laminates or printing by physical or chemical deposition treatment. Regarding processing method.

(従来の技術および課題) ネームプレート、印刷配線板の製作、合成樹脂への金属
板接着等の場合、合成樹脂や金属の材料に、真空蒸着、
スパッター、イオンブレーティング等の方法で堆積処理
しているが、それに使用する合成樹脂フィルムや金属シ
ート等樹脂または金属材料において堆積したメツキ層等
が剥離したり、堆積がアルミニウム、ITo、銅、クロ
ム、ニッケル、錫等の場合には、表面処理の前処理およ
び堆積後の湿式処理で堆積層が溶解したり剥離する問題
がある。特にロールツーロールの加工方式において堆積
層が剥離し易い問題がある。
(Conventional technology and issues) When manufacturing name plates, printed wiring boards, adhering metal plates to synthetic resin, etc., vacuum deposition,
Deposition processing is performed using methods such as sputtering and ion blasting, but the plating layer deposited on resin or metal materials such as synthetic resin films and metal sheets used for this process may peel off, or the deposits may peel off, such as aluminum, ITo, copper, or chromium. , nickel, tin, etc., there is a problem that the deposited layer dissolves or peels off during pre-surface treatment and post-deposition wet treatment. Particularly in the roll-to-roll processing method, there is a problem that the deposited layer is easily peeled off.

また、樹脂、金属の材料に印刷した場合に印刷インキが
剥げ易い問題がある。
Furthermore, there is a problem in that the printing ink tends to peel off when printed on resin or metal materials.

そこで従来、フィルムや有機被膜の接着性を高めるため
に、イオンボバードを5ト一ル前後で行っているが、装
置費や作業時間がかかる上に安全性にも問題がある。ま
た、従来は材料表面に付着したゴミ等を除去するために
酸またはアルカリ処理をしているが、薬品およびその廃
液の処理のための装置を必要とし、乾式および湿式の両
方式を併用しなければならず、作業効率も悪い。
Conventionally, in order to improve the adhesion of films and organic coatings, ion bombardment has been carried out at around 5 torrels, but this requires equipment costs and work time, and is also problematic in terms of safety. In addition, acid or alkali treatment is conventionally used to remove dust and other substances adhering to the surface of materials, but this requires equipment to treat chemicals and their waste liquids, and both dry and wet methods must be used together. Not only that, but the work efficiency is also poor.

この発明は堆積層や印刷インキが剥離しないようにし、
また、装飾性を高めるための樹脂または金属材料の表面
処理を安値で、効率よく安全に行うことのできる方法を
堤供することを目的とするものである。
This invention prevents the deposited layer and printing ink from peeling off,
It is also an object of the present invention to provide a method that can efficiently and safely perform surface treatment of resin or metal materials to improve decorativeness at a low cost.

(課題を解決するための手段) 合成樹脂または金属の材料をサンドブラスト等機械加工
し、プラズマ重合により離形性を付与し、またはプラズ
マ処理によって接着性を高める。
(Means for Solving the Problems) Synthetic resin or metal materials are mechanically processed by sandblasting, etc., and mold releasability is imparted by plasma polymerization, or adhesiveness is enhanced by plasma treatment.

(作用) サンドブラスト等機械加工は材料表面を1次組面化し、
プラズマ重合により材料表面に離形層を形成し、プラズ
マ処理により材料表面を粗面化し接着度を高める。
(Function) Machining such as sandblasting transforms the material surface into a primary textured surface,
Plasma polymerization forms a release layer on the material surface, and plasma treatment roughens the material surface and increases the degree of adhesion.

(実施例) 実施例I PETフィルムに酸化アルミニウムの約180メツシユ
の研削粒で、空気圧3.5kg/cnl、速度7m/分
でサンドブラストをし、13.56MH2でプラズマ処
理をした。サンドブラストは低圧プロワ一方式では空気
圧0.2〜0.3に+r/C[I!でも同様の効果が出
た。
(Example) Example I A PET film was sandblasted with approximately 180 mesh abrasive grains of aluminum oxide at an air pressure of 3.5 kg/cnl and a speed of 7 m/min, and plasma treated at 13.56 MH2. For sandblasting, use one type of low-pressure blower at an air pressure of 0.2 to 0.3 +r/C [I! However, the same effect was obtained.

上記表面処理したPETフィルムは水との接触角度が約
30度となり接着性が高まり、時間が経過しても約60
度までしか戻らない。このフィルムを用いて、イオンブ
レーティングによって銅の薄膜を形成し、ウレタンゴム
系の印刷マスキングを行い、マスキングで覆われていな
い銅薄膜をサンドブラストして研削し、文字、画、線、
等の導電性パターンを製作したところ、銅薄膜およびパ
ターンの接着性が極めて良好であった。
The above-mentioned surface-treated PET film has a contact angle with water of approximately 30 degrees, which increases its adhesion and maintains approximately 60 degrees of adhesion over time.
It only goes back to a certain point. Using this film, a thin copper film is formed by ion blasting, a urethane rubber printing mask is applied, and the copper thin film not covered by the masking is sandblasted and ground to create characters, drawings, lines, etc.
When a conductive pattern was fabricated, the adhesion between the copper thin film and the pattern was extremely good.

また、上記表面処理したフィルムの処理表面全面にクロ
ムの真空蒸着を行い、他の材料にホ・7トブレスして複
合材を得た。
In addition, chromium was vacuum-deposited on the entire surface of the surface-treated film, and then pressed onto another material to obtain a composite material.

クロムに限らずニッケル、銅等を真空蒸着してもよい。Not only chromium, but also nickel, copper, etc. may be vacuum-deposited.

これら複合材は、かなりの折り曲げに耐え、回路やネー
ムプレート用として実用性に優れている。
These composite materials can withstand considerable bending, making them highly practical for use in circuits and nameplates.

実施例2 25μのポリプロピレンフィルムに、研削材として20
0メツシユの酸化鉄で、空気圧4kg/cd、速度10
m/分でサンドブラストをし、コロナ放電して表面処理
をしたところ、水との接触度が約30度以下となった。
Example 2 A 25 μm polypropylene film was coated with 20 μm as an abrasive material.
0 mesh iron oxide, air pressure 4kg/cd, speed 10
When surface treatment was performed by sandblasting at m/min and corona discharge, the degree of contact with water was approximately 30 degrees or less.

上記の表面処理したフィルムに真空蒸着により1.2μ
の銅薄膜を形成し、更に3μの銅メツキを行い、アルカ
リ剥離のレジスト印刷して塩化第二鉄液でニッティング
をして文字、画5、線を形成したところ、フィルムと銅
薄膜、銅メツキの接着が極めて良好であった。
1.2μ by vacuum deposition on the above surface-treated film.
After forming a copper thin film of 3 μm, copper plating with a thickness of 3 μm was performed, and an alkaline peeling resist was printed and knitting was performed with ferric chloride solution to form letters, strokes, and lines. The plating adhesion was extremely good.

実施例3 25μのペット樹脂フィルムの表面を、150.180
、および250メツシユの珪砂でサンドブラスト(低圧
ブロワ一方式では0. 2kg/cri)して梨地粗面
とし、更に、13.56MH2でプラズマ処理をした。
Example 3 The surface of a 25μ PET resin film was
, and 250 mesh silica sand (0.2 kg/cri with one low-pressure blower) to give a matte rough surface, and then plasma treated with 13.56 MH2.

この表面処理をしたフィルムに、水可溶性のマスキング
印刷をし、酸化インジュウムをイオンブレーティングし
、水洗シャワー処理により水可溶性インキを除去し、酸
化インジュウムに銅メツキを8μまで行って回路または
金属模様を形成したところ、酸化インジュウムおよび銅
メツキよりなる回路等パターンとフィルムとの接着が極
めて良好であった。
On this surface-treated film, water-soluble masking printing is performed, indium oxide is ion-blated, the water-soluble ink is removed by washing shower treatment, and copper plating is applied to the indium oxide to a depth of 8 μm to create circuits or metal patterns. When formed, the adhesion between the film and circuit patterns made of indium oxide and copper plating was extremely good.

実施例4 ポリエステルシートの表面を、250メツシユの酸化ア
ルミニウムでサンドブラストして梨地とし、コロナ放電
をして複合粗面化した。
Example 4 The surface of a polyester sheet was sandblasted with 250 mesh aluminum oxide to give it a satin finish, and subjected to corona discharge to give a composite surface roughness.

この表面処理したシ・−トに2μの銅をイオンブレーテ
ィングをしてから、マスキング印刷またはステンシル(
マスキング枠)の載置によりマスキングを設け、2μの
ニッケルメッキを行い、120メツシユの酸化アルミニ
ウムでニッケルメッキで覆われていない部分を研削除去
して文字、画、線等のパターンを形成した。このパター
ンとシートとの接着は極めて良好である。
This surface-treated sheet is then ion-blated with 2μ copper, then masked or stenciled (
Masking was provided by placing a masking frame), 2 μm nickel plating was performed, and the portions not covered with nickel plating were polished off with 120 mesh aluminum oxide to form patterns such as letters, drawings, lines, etc. The adhesion between this pattern and the sheet is extremely good.

実施例5 ステンレス、鉄、銅合金等の箔またはシートに、上記実
施例1乃至4と同様のサンドブラストを行い、続いてモ
リブデン酸アンモンおよびクロム酸処理(1〜2%、1
0〜40秒浸漬)をし、シート上に離形層を形成した。
Example 5 A foil or sheet of stainless steel, iron, copper alloy, etc. was sandblasted in the same manner as in Examples 1 to 4 above, and then treated with ammonium molybdate and chromic acid (1-2%, 1%).
0 to 40 seconds) to form a release layer on the sheet.

この離形層の上にレジストを印刷し、レジストで覆われ
ていない離形層上に全屈メツキを施し、レジストを除去
し、他の材料にホットプレスして接着し、離形層により
剥離してパターンを移転し、ネームプレート、導電性回
路、面板、電磁波防止材等を正確に作り、被接着体に容
易に移転できた。サンドブラストの程度により、パター
ンの表面光沢は調整でき、装飾性効果もあった。
A resist is printed on this release layer, the part of the release layer that is not covered with resist is fully plated, the resist is removed, the material is hot-pressed and bonded to another material, and the release layer peels off. By transferring the pattern, we were able to accurately create name plates, conductive circuits, face plates, electromagnetic shielding materials, etc., and easily transfer them to objects to be adhered. Depending on the degree of sandblasting, the surface gloss of the pattern could be adjusted, and it also had a decorative effect.

実施例6 アルミニウム材料の表面を、前記実施例におけると同様
にサンドブラストをして梨地化し、コロナ放電またはプ
ラズマ処理をオゾン雰囲気中で行い表面を酸化して酸化
アルミニウム層を形成し表面硬化する。
Example 6 The surface of an aluminum material is sandblasted to make it matte in the same manner as in the previous example, and corona discharge or plasma treatment is performed in an ozone atmosphere to oxidize the surface to form an aluminum oxide layer and harden the surface.

この表面処理したアルミニウム材料はラミネート用、絶
縁材料用、印刷用として優れた接着性を有する。
This surface-treated aluminum material has excellent adhesive properties for laminating, insulating materials, and printing.

第5および第6実施例においては、サンドブラストの代
わりに、スピン、ダブルスピン、カットヘヤー、表面研
磨(光沢ロール)等の機械加工を行ってもよい。
In the fifth and sixth embodiments, mechanical processing such as spin, double spin, cut hair, and surface polishing (glossy roll) may be performed instead of sandblasting.

プラズマ重合またはプラズマ処理を行う方法としては図
面に示す装置を用いるのが好ましい。
As a method for performing plasma polymerization or plasma treatment, it is preferable to use the apparatus shown in the drawings.

図面に示す装置は、密閉できる反応容器1に、真空ポン
プ2、およびニードルバルブ3を介して薬品容器4をそ
れぞれ連設し、反応容器1内に高周波を放電しうる高周
波電源5を設けたものである。
The device shown in the drawing includes a reaction container 1 that can be sealed, a vacuum pump 2 and a chemical container 4 connected to each other via a needle valve 3, and a high-frequency power source 5 capable of discharging high-frequency waves inside the reaction container 1. It is.

薬品容器4にはフッ素系またはシリコン系(ポリシロキ
サン系を含む)等薬品を収納する。この装置を使用して
プラズマ重合をする場合には、材料6を反応容器1内に
収納し、真空ポンプ2で反応容器1内を約0.5〜1ト
ールとし、ニードルバルブ3を開くと薬品容器4内の薬
品蒸気が反応容器1内に入り、高周波電源5より高周波
を材料6に当てると、材料6の表面に離形性薄膜が形成
される。
The chemical container 4 stores chemicals such as fluorine-based or silicon-based (including polysiloxane-based) chemicals. When performing plasma polymerization using this apparatus, the material 6 is stored in the reaction vessel 1, the inside of the reaction vessel 1 is set to approximately 0.5 to 1 torr using the vacuum pump 2, and the needle valve 3 is opened. When the chemical vapor in the container 4 enters the reaction container 1 and a high frequency wave is applied to the material 6 from the high frequency power source 5, a releasable thin film is formed on the surface of the material 6.

また、プラズマ処理を行う場合には、ニードルバルブ3
を閉じて、真空ポンプ2で反応容器1内を約0.5〜1
トールとし、材料6に高周波を当てると、材料6の表面
が改質されて接着性が高まる。
In addition, when performing plasma treatment, the needle valve 3
Close the chamber, and use the vacuum pump 2 to pump the inside of the reaction vessel 1 to approximately 0.5 to 1
When high frequency is applied to the material 6, the surface of the material 6 is modified and its adhesiveness increases.

上記のようにプラズマ重合およびプラズマ処理を別個に
行ってもよく、また、プラズマ重合をした後にプラズマ
処理をして離形性薄膜の表面を改質してもよい。材料6
が成形品の場合にはプラズマ処理の代わりに針状電極の
コロナ放電処理をするのが好ましい。
Plasma polymerization and plasma treatment may be performed separately as described above, or plasma polymerization may be followed by plasma treatment to modify the surface of the releasable thin film. Material 6
In the case of a molded article, it is preferable to perform corona discharge treatment on the needle electrode instead of plasma treatment.

(効果) この発明は、プリント配線、ネームプレート等形成、装
飾用積層板製造のための接着性の高い優れた材料または
パターン移転し易い離形性の高い優れた材料を形成し、
また、透明の合成樹脂フィルムまたは板をこの発明の方
法で表面処理した場合には優れた装飾性のある材料を得
ることができる。
(Effects) The present invention forms an excellent material with high adhesiveness or an excellent material with high mold releasability and easy pattern transfer for forming printed wiring, name plates, etc., and manufacturing decorative laminates,
Furthermore, when a transparent synthetic resin film or plate is surface-treated by the method of the present invention, a material with excellent decorative properties can be obtained.

合成樹脂フィルムまたは金属箔等の場合には、この発明
はロールツーロールで実施できるので作業効率がよい。
In the case of synthetic resin films or metal foils, the present invention can be carried out roll-to-roll, resulting in good working efficiency.

【図面の簡単な説明】[Brief explanation of the drawing]

図面はこの発明実施のための装置の一例を示すものであ
る。 1・・・・反応容器 2・・・・真空ポンプ 3・・・・ニードルバルブ 4・・・・薬品容器 5・・・・高周波電源 6・・・・材料
The drawings show an example of an apparatus for carrying out the invention. 1... Reaction container 2... Vacuum pump 3... Needle valve 4... Chemical container 5... High frequency power source 6... Material

Claims (1)

【特許請求の範囲】[Claims] 1 樹脂または金属等材料をサンドブラスト等機械加工
して表面を粗面化した後に、更に、放電処理して離形性
および/または接着性を高めることを特徴とする樹脂ま
たは金属材料の表面処理方法
1. A method for surface treatment of a resin or metal material, which comprises roughening the surface of the resin or metal material by mechanical processing such as sandblasting, and then further performing electric discharge treatment to improve mold releasability and/or adhesion.
JP12343088A 1988-05-20 1988-05-20 Surface treatment for resin film and the like Pending JPH01294875A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12343088A JPH01294875A (en) 1988-05-20 1988-05-20 Surface treatment for resin film and the like

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12343088A JPH01294875A (en) 1988-05-20 1988-05-20 Surface treatment for resin film and the like

Publications (1)

Publication Number Publication Date
JPH01294875A true JPH01294875A (en) 1989-11-28

Family

ID=14860373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12343088A Pending JPH01294875A (en) 1988-05-20 1988-05-20 Surface treatment for resin film and the like

Country Status (1)

Country Link
JP (1) JPH01294875A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0464643A2 (en) * 1990-06-26 1992-01-08 E.I. Du Pont De Nemours And Company Process for improving the surface of liquid crystal polymers
JPH05222485A (en) * 1992-02-10 1993-08-31 Kobe Steel Ltd Hot rolled steel plate excellent in press formability and affinity for resin and its production
JPH093625A (en) * 1995-06-21 1997-01-07 Nishiyama Stainless Chem Kk Surface treating method
JPH0920992A (en) * 1995-07-05 1997-01-21 Nagoya Mekki Kogyo Kk Method for performing electroplating onto synthetic rubber or synthetic resin
US6214479B1 (en) 1996-10-23 2001-04-10 Kabushiki Kaisha Toyota Chuo Kenkyusho Covered member and method of producing the same
CN102517618A (en) * 2011-12-28 2012-06-27 厦门建霖工业有限公司 Copper drawing and electroplating method for plastic substrate
CN106350843A (en) * 2016-10-11 2017-01-25 上海瑞尔实业有限公司 Pre-treatment method for electroplating plastic

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0464643A2 (en) * 1990-06-26 1992-01-08 E.I. Du Pont De Nemours And Company Process for improving the surface of liquid crystal polymers
US5085015A (en) * 1990-06-26 1992-02-04 E. I. Du Pont De Nemours And Company Process for improving the surface of liquid crystal polymers
JPH05222485A (en) * 1992-02-10 1993-08-31 Kobe Steel Ltd Hot rolled steel plate excellent in press formability and affinity for resin and its production
JPH093625A (en) * 1995-06-21 1997-01-07 Nishiyama Stainless Chem Kk Surface treating method
JPH0920992A (en) * 1995-07-05 1997-01-21 Nagoya Mekki Kogyo Kk Method for performing electroplating onto synthetic rubber or synthetic resin
US6214479B1 (en) 1996-10-23 2001-04-10 Kabushiki Kaisha Toyota Chuo Kenkyusho Covered member and method of producing the same
CN102517618A (en) * 2011-12-28 2012-06-27 厦门建霖工业有限公司 Copper drawing and electroplating method for plastic substrate
CN106350843A (en) * 2016-10-11 2017-01-25 上海瑞尔实业有限公司 Pre-treatment method for electroplating plastic
CN106350843B (en) * 2016-10-11 2018-07-10 上海瑞尔实业有限公司 A kind of pre-treating method for plastic electroplating

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