CN100471989C - Sputtering coating method for high-shielding thin-film against electromagnetic interference on plastic matrix - Google Patents
Sputtering coating method for high-shielding thin-film against electromagnetic interference on plastic matrix Download PDFInfo
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- CN100471989C CN100471989C CNB2005101000090A CN200510100009A CN100471989C CN 100471989 C CN100471989 C CN 100471989C CN B2005101000090 A CNB2005101000090 A CN B2005101000090A CN 200510100009 A CN200510100009 A CN 200510100009A CN 100471989 C CN100471989 C CN 100471989C
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Abstract
A kind of sputter method that plating high defilade guarding against electromagnetism disturbance film on the plastic base material, it includes the following steps: Sand blast handle step, gushing in the surface of base material by using the corundum grits; cleaning step, using ultrasonic wash the outside of the base material which has done the sand blast handles; plating step ,plating a layer of cupper film in the surface of the plastic base material with the vacuum sputter method, plating a layer of silver film again, then plating a layer of copper film again to compose of the sandwich plating tier structure that 'copper + silver + copper '. Using the sputtering method in this invention, 'copper + silver + copper ' sandwich plating tier structure is benefit to reducing a unit impedance of the film, strengthening the effect that defending against the interfere of the electromagnetism, it can also form the 'copper/ silver/ copper/ stainless steel ' plating structure at one time in a sputter, whose block effect can reach the efficacy that above 70 dB, it is benefit to improving the production effect.
Description
Technical field
The present invention relates to a kind of method, particularly relate to a kind of with the physical coating method of vacuum splashing and plating method at plastic basis material coating surface high-shielding thin-film against electromagnetic interference at product surface plating film.
Background technology
Plate the plated film of characteristic and strong adhesion on the plastic basis material surface, can reach purposes such as protection base material, decoration, anti-electromagnetic wave, conduction or antireflection.At plastic basis material coating surface electromagnetic interference (EMI; English full name is Electromagnetic Interference) protective film is wherein a kind of common and important enforcement; as shown in Figure 1; the general copper film 2 that plates thick about 2.5 μ m on plastic basis material 1 surface that all adopts; its screening effect can reach more than the 70dB; and, also can plate one deck stainless steel membrane 4 usually for the anticorrosive protection in surface.
Technology at the plastic component surface coating is of long duration, and generally is divided into chemical plating method and physical coating method.
It is low to adopt chemical plating method to have price, processing ease, and the rete tack is advantage preferably, but because a large amount of harmful waste water dischargings is arranged in process of production, very big to the pollution of environment.
Vacuum coating technology, be called physical coating or physical vapor deposition (Physical VaporDeposition again, be called for short PVD) technology, be meant that under vacuum condition the method with physics is vaporized into material atom, molecule or makes it be ionized into ion, and pass through gas phase process, having the technology of the film of some property at material or workpiece surface deposition one deck, is a kind of more advanced film coating method now, as sputter, evaporation, ion plating etc.
Vacuum sputtering coating (Sputter) abbreviates sputter as, its ultimate principle is according to the ion sputtering principle, work as high energy particle, the positive ion that quickens by electric field normally, impact solid surface, the atom of solid surface and molecule are after exchanging kinetic energy with these high energy particles, just fly out from solid surface, this phenomenon is referred to as " sputter ", utilize electric field to make two interpolars produce electronics earlier, these accelerated electrons can collide with the rare gas element that oneself charges in advance in the coating chamber, make its positively charged, it is that target attracts and the bump negative electrode that the particle of these positively chargeds can be subjected to negative electrode, incident ion, usually use argon gas, be subjected to electric field action and obtain momentum, the atom of bump target material surface, the momentum that the collision that these atoms are subjected to carbonium obtains incident ion shifts, the target material surface atom that is clashed into is because of accepting the momentum of incident ion, cause extrusion that it is shifted to atom under the target material surface, the extruding of multilayer atom under this target material surface can produce the reactive force of vertical target material surface and surface atom is collided away, these atoms of being gone out by collision still can collide into positively charged with neutral ar atmo on the way, and being deposited on substrate at last is to form film on the anode.
Sputter is a kind of so far physical coating method very commonly used.Compare with traditional plated film technology, but have pollution-free, low-cost, technology simple, can plate advantages such as the many metal cladding kinds of plastics kind are wide.But, the too high meeting of temperature causes plastic deformation during for fear of sputter, usually the sputter temperature should not be provided with higher, because the temperature problem of sputter, so that the thickness of a sputter need be controlled in the 0.7 μ m, with copper+stainless steel then its screening effect can't reach 70dB, for example, once can only plate the copper film of thick about 0.5-0.7 μ m, its screening effect only reaches 57dB, plastic prod must leave and repeat sputter again after vacuum sputtering apparatus cools off in atmosphere, thereby that is to say that need repeat to enter vacuum sputtering apparatus leaves cooling again and can reach the copper film that plates thick about 2 μ m more than at least three times screening effect is reached more than the 70dB, existing technology at plastic component surface jet-plating metallization film exists not enough, will influence equipment yield, and production efficiency is lower.
Summary of the invention
The purpose of this invention is to provide a kind of method that is used for vacuum splashing and plating plating thin-film against electromagnetic interference on plastic basis material, thereby improve the method that processing step is enhanced productivity and strengthened anti-electromagnetic interference effect.
To achieve the above object, technical scheme of the present invention is as follows:
The jet-plating method of plating high-shielding thin-film against electromagnetic interference comprises the steps: on a kind of plastic basis material
The sandblasting step is carried out sandblasting with corundum sand to the plastic basis material surface;
Cleaning step is with the plastic basis material surface of ultrasonic cleaning sandblasting;
The plated film step plates one deck copper film with the vacuum splashing and plating method on the plastic basis material surface, plates one deck silverskin again, plates one deck copper film again, constitutes the sandwich style coating structure of " copper+silver+copper ".
The jet-plating method of plating high-shielding thin-film against electromagnetic interference on the described plastic basis material, wherein, the surface in described sandwich style coating structure in the described plated film step plates one deck stainless steel membrane again.
The jet-plating method of plating high-shielding thin-film against electromagnetic interference on the described plastic basis material, wherein, described stainless steel membrane adopts the SUS316 stainless steel.
The jet-plating method of plating high-shielding thin-film against electromagnetic interference on the described plastic basis material, wherein, in the described sandblasting step, the corundum of employing sand is the brown corundum grains of sand or the white fused alumina grains of sand.
Adopt film sputtering and coating method of the present invention, the coating structure of the sandwich style of " copper+silver+copper " helps reducing the unit impedance of rete, strengthen the anti-electromagnetic interference effect of rete, and can in a sputter, promptly reach the coating structure of " copper/silver/copper/stainless steel ", its screening effect can reach more than the comparatively ideal 70dB, helps enhancing productivity.
Description of drawings
Below in conjunction with accompanying drawing,, will make technical scheme of the present invention and beneficial effect thereof apparent by the specific embodiment of the present invention is described in detail.
Fig. 1 is the profile of the plastic basis material plated film finished product of prior art;
Fig. 2 is the profile of plastic basis material plated film finished product of the present invention.
Embodiment
For further understanding feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet appended graphic only provide with reference to and the explanation usefulness, be not to be used for the present invention is limited.
As shown in Figure 2, the jet-plating method of plating high-shielding thin-film against electromagnetic interference comprises the steps: on the plastic basis material of the present invention
The sandblasting step is carried out sandblasting with the brown corundum grains of sand or the white fused alumina grains of sand to plastic basis material 1 surface;
Cleaning step with plastic basis material 1 surface of ultrasonic cleaning sandblasting, is washed the grains of sand on plastic basis material 1 surface off;
The plated film step plates one deck copper film 21 with the vacuum splashing and plating method on plastic basis material 1 surface, plates one deck silverskin 3 again, plates one deck copper film 22 again, constitutes the sandwich style coating structure of " copper+silver+copper ", plates one deck SUS316 stainless steel membrane 4 at last.
As known by the technical knowledge, the present invention can realize by other the embodiment that does not break away from its spirit or essential feature.Therefore, above-mentioned disclosed embodiment with regard to each side, all just illustrates, and is not only.All within the scope of the present invention or the change in being equal to scope of the present invention all be included in the invention.
Claims (4)
1, the jet-plating method of plating high-shielding thin-film against electromagnetic interference on a kind of plastic basis material, screening effect can reach more than the 70dB, it is characterized in that, in turn includes the following steps:
The sandblasting step is carried out sandblasting with corundum sand to the plastic basis material surface;
Cleaning step is with the plastic basis material surface of ultrasonic cleaning sandblasting;
The plated film step plates one deck copper film with the vacuum splashing and plating method on the plastic basis material surface, plates one deck silverskin again, plates one deck copper film again, constitutes the sandwich style coating structure of " copper+silver+copper ".
2, the jet-plating method of plating high-shielding thin-film against electromagnetic interference on the plastic basis material according to claim 1 is characterized in that, the surface in described sandwich style coating structure in the described plated film step plates one deck stainless steel membrane again.
3, the jet-plating method of plating high-shielding thin-film against electromagnetic interference on the plastic basis material according to claim 2 is characterized in that, described stainless steel membrane adopts the SUS316 stainless steel.
4, the jet-plating method of plating high-shielding thin-film against electromagnetic interference on the plastic basis material according to claim 1 is characterized in that, in the described sandblasting step, the corundum of employing sand is the brown corundum grains of sand or the white fused alumina grains of sand.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101000090A CN100471989C (en) | 2005-09-30 | 2005-09-30 | Sputtering coating method for high-shielding thin-film against electromagnetic interference on plastic matrix |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101000090A CN100471989C (en) | 2005-09-30 | 2005-09-30 | Sputtering coating method for high-shielding thin-film against electromagnetic interference on plastic matrix |
Publications (2)
| Publication Number | Publication Date |
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| CN1940126A CN1940126A (en) | 2007-04-04 |
| CN100471989C true CN100471989C (en) | 2009-03-25 |
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| CNB2005101000090A Expired - Fee Related CN100471989C (en) | 2005-09-30 | 2005-09-30 | Sputtering coating method for high-shielding thin-film against electromagnetic interference on plastic matrix |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101376972B (en) * | 2007-08-28 | 2011-09-21 | 汉达精密电子(昆山)有限公司 | Vacuum sputtering EMI film and electrophoresis combined coating technology for plastic workpiece surface |
| CN101376975B (en) * | 2007-08-29 | 2012-01-04 | 汉达精密电子(昆山)有限公司 | Preparation of plastic workpiece surface having EMI suppression and antibacterial effects |
| CN101572996B (en) * | 2008-04-29 | 2011-12-07 | 汉达精密电子(昆山)有限公司 | Method for forming conducting wire on insulated heat-conducting metal substrate in a vacuum sputtering way |
| CN105568222B (en) * | 2016-03-02 | 2018-07-27 | 黄玉春 | Vacuum-coated piece and its manufacturing method |
| CN112251725A (en) * | 2020-09-22 | 2021-01-22 | 安徽英力电子科技股份有限公司 | Sputtering process for double-layer electromagnetic shielding layer of computer plastic shell |
| CN112663007A (en) * | 2020-11-23 | 2021-04-16 | 安徽胜利精密制造科技有限公司 | Vacuum sputtering method for notebook shell |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4910090A (en) * | 1987-10-21 | 1990-03-20 | Southwall Technologies, Inc. | EMI/RFI shield for visual display terminals |
-
2005
- 2005-09-30 CN CNB2005101000090A patent/CN100471989C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4910090A (en) * | 1987-10-21 | 1990-03-20 | Southwall Technologies, Inc. | EMI/RFI shield for visual display terminals |
Non-Patent Citations (4)
| Title |
|---|
| 热塑性导电塑料在屏蔽电磁波干扰中的应用. 陈永生，杨桂生.现代塑料加工应用，第14卷第5期. 2002 |
| 热塑性导电塑料在屏蔽电磁波干扰中的应用. 陈永生，杨桂生.现代塑料加工应用，第14卷第5期. 2002 * |
| 电子设备电磁屏蔽用真空蒸镀和导电涂料加工技术. 应世杰.电子机械工程，第2期. 1985 |
| 电子设备电磁屏蔽用真空蒸镀和导电涂料加工技术. 应世杰.电子机械工程，第2期. 1985 * |
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