JPH01292845A - Semiconductor case - Google Patents
Semiconductor caseInfo
- Publication number
- JPH01292845A JPH01292845A JP63123216A JP12321688A JPH01292845A JP H01292845 A JPH01292845 A JP H01292845A JP 63123216 A JP63123216 A JP 63123216A JP 12321688 A JP12321688 A JP 12321688A JP H01292845 A JPH01292845 A JP H01292845A
- Authority
- JP
- Japan
- Prior art keywords
- attributes
- external lead
- semiconductor case
- terminal
- lead terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 239000003086 colorant Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 230000000007 visual effect Effects 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は内部に封入したICに接続され外側に露出する
複数の外部リード端子を有する半導体ケースに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor case having a plurality of external lead terminals connected to an IC sealed inside and exposed to the outside.
[従来の技術]
従来、この種の半導体ケースは、第3図に示すように、
内部に封入したICに接続され外側に露出する複数の外
部リード端子2を有していた。[Prior Art] Conventionally, this type of semiconductor case has a structure as shown in FIG.
It had a plurality of external lead terminals 2 connected to an IC sealed inside and exposed to the outside.
外部リード端子2は、全て同一形状であり、半導体ケー
ス内部のICの属性(アース端子、電源端子等)に関係
なく外側に導出されていた。The external lead terminals 2 all have the same shape and are led out to the outside regardless of the attributes of the IC (ground terminal, power terminal, etc.) inside the semiconductor case.
このため、例えば電源端子の属性を有する外部リード端
子2aとアース端子の属性を有する外部リード端子2b
は、同一形状で外側に導出されていた。For this reason, for example, the external lead terminal 2a has the attribute of a power supply terminal, and the external lead terminal 2b has the attribute of a ground terminal.
were derived to the outside with the same shape.
[発明が解決しようとする課題]
上述した従来の半導体ケースは、同一形状の外部リード
端子が、ICの属性に関係なく外側に導出されているの
で、基板に実装した半導体ケースについてICの属性を
識別する場合には、その外観より判断できないという欠
点があった。このため該基板の内層図面をもとにテスタ
ー、を使用して基板上の外部リード端子各々を検索しな
ければならず、識別するのに多大な工数を生じるという
欠点があった。[Problems to be Solved by the Invention] In the conventional semiconductor case described above, external lead terminals of the same shape are led out regardless of the attributes of the IC, so it is difficult to determine the attributes of the IC for the semiconductor case mounted on the board. When identifying it, there is a drawback that it cannot be determined based on its appearance. For this reason, it is necessary to use a tester to search for each external lead terminal on the board based on the drawing of the inner layer of the board, resulting in a drawback that a large number of steps are required for identification.
たとえ、半導体ケース及び外部リード端子との対応位置
の基板上のランドの形状より識別する場合であっても、
■半導体ケースを基板に実装するハンダがランド上に盛
上がって載るためランドの形状が判断できない。■基板
上の半導体ケース等の実装密度が大きいため、基板上の
ランドが半導体ケースの影になりランド形状の確認が困
難である。■ランドの形状はもともとICの属性別に変
えていないため判断が難しい等という欠点があった。Even if the identification is based on the shape of the land on the board at the corresponding position to the semiconductor case and external lead terminal,
■The shape of the land cannot be determined because the solder used to mount the semiconductor case on the board bulges onto the land. ■Due to the high packaging density of semiconductor cases, etc. on the board, the lands on the board are in the shadow of the semiconductor case, making it difficult to confirm the shape of the lands. ■Since the shape of the land was not originally changed depending on the attributes of the IC, it had the disadvantage that it was difficult to judge.
[課題を解決するための手段]
本発明の半導体ケースは、上述した従来の課題を解決す
るために、内部のICの属性を外部から識別できるよう
にしたものであり、具体的には、内部に封入したICに
接続され外側に露出する複数の外部リード端子を有する
半導体ケースにおいて、上記外部リード端子に上記IC
の属性を表わす属性識別用のマークを設けた構成として
いる。[Means for Solving the Problems] In order to solve the above-mentioned conventional problems, the semiconductor case of the present invention makes it possible to identify the attributes of the internal IC from the outside. In a semiconductor case having a plurality of external lead terminals exposed to the outside and connected to an IC sealed in the IC, the external lead terminal is connected to the IC sealed in the semiconductor case.
The configuration is such that a mark for attribute identification is provided to represent the attribute.
[実施例]
次に、本発明の一実施例について図面を参照して説明す
る。[Example] Next, an example of the present invention will be described with reference to the drawings.
第1図は本発明の一実施例の斜視図、第2図は第1図A
−A間の断面図である。Figure 1 is a perspective view of one embodiment of the present invention, and Figure 2 is Figure 1A.
It is a sectional view between -A.
本実施例の半導体ケースは、基本的に半導体ケース本体
1と、外部リード端子2と、外部リード端子2上に設け
られた属性識別用のマーク3とから構成されている。The semiconductor case of this embodiment basically consists of a semiconductor case body 1, an external lead terminal 2, and a mark 3 provided on the external lead terminal 2 for attribute identification.
半導体ケース本体1は内部に封入したICに接続され外
側に露出する複数の外部リード端子2を有し・ている。The semiconductor case body 1 has a plurality of external lead terminals 2 connected to an IC sealed inside and exposed to the outside.
外部リード端子2は、各々ICにより定まる属性を有し
ている。例えば、外部リード端子2c。The external lead terminals 2 each have attributes determined by the IC. For example, the external lead terminal 2c.
2dは各々アース端子、電源端子としての属性を有する
。2d has attributes as a ground terminal and a power supply terminal, respectively.
属性識別用のマーク3は、ICの属性に対応した色を有
しており、例えば電源端子の属性の場合は、赤色、アー
ス端子の属性は青色であり、各々外部リード端子2c、
2dの表面上に設けられている。この属性識別用のマー
ク3は、例えば赤又は青色の塗料の塗布、又は赤、青色
の薄板等を接着させて外部リード端子2c、2dに設け
ている。The mark 3 for attribute identification has a color corresponding to the attribute of the IC. For example, the attribute of the power terminal is red, and the attribute of the earth terminal is blue.
It is provided on the surface of 2d. The mark 3 for attribute identification is provided on the external lead terminals 2c, 2d by applying red or blue paint, or by adhering red or blue thin plates or the like.
なお、属性識別用のマーク3は、色による識別以外に、
外部リード端子2の形状をその属性により変えるように
してもよい。In addition to the color identification, the attribute identification mark 3 is
The shape of the external lead terminal 2 may be changed depending on its attributes.
このように、本実施例によれば、外部リード端子2c、
2d上に青色、赤色の属性識別用のマーク3を各々設け
ることにより、半導体ケースを基板上に実装した場合に
、容易に半導体ケース本体1内部のICの属性を目視で
識別することが可能となる。In this way, according to this embodiment, the external lead terminals 2c,
By providing blue and red attribute identification marks 3 on 2d, it is possible to easily visually identify the attributes of the IC inside the semiconductor case body 1 when the semiconductor case is mounted on a board. Become.
[発明の効果]
以上説明したように本発明は、内部に封入したICに接
続され外側に露出する複数の外部リード端子を有する半
導体ケースにおいて、上記外部リード端子に上記ICの
属性を表わす属性識別用のマークを設けた構成とするこ
とにより、属性識別用のマークからICの属性を判断す
ることができ、このため従来のようなテスターによる識
別又は基板上のランド形状による判断が不要となるので
、ICの属性を識別するだめの工数を大幅に削減するこ
とが可能となる効果がある。[Effects of the Invention] As described above, the present invention provides a semiconductor case having a plurality of external lead terminals connected to an internally sealed IC and exposed to the outside, in which an attribute identification representing an attribute of the IC is provided on the external lead terminal. By having a configuration with a mark for identifying the attribute, it is possible to judge the attributes of the IC from the mark for attribute identification, which eliminates the need for conventional identification using a tester or judgment based on the shape of the land on the board. , it is possible to significantly reduce the number of man-hours required to identify the attributes of an IC.
第1図は本発明の半導体ケースの一実施例を示す斜視図
、第2図は第1図のA−A間の断面図、第3図は従来の
半導体ケースの斜視図である。
l:半導体ケース本体
2:外部リード端子
2c:外部リード端子(電源端子)
2d:外部リード端子(アース端子)
3:属性識別用のマークFIG. 1 is a perspective view showing an embodiment of the semiconductor case of the present invention, FIG. 2 is a sectional view taken along line A--A in FIG. 1, and FIG. 3 is a perspective view of a conventional semiconductor case. l: Semiconductor case body 2: External lead terminal 2c: External lead terminal (power terminal) 2d: External lead terminal (ground terminal) 3: Mark for attribute identification
Claims (1)
外部リード端子を有する半導体ケースにおいて、 上記外部リード端子に上記ICの属性を表わす属性識別
用のマークを設けたことを特徴とする半導体ケース。[Scope of Claims] A semiconductor case having a plurality of external lead terminals connected to an IC sealed inside and exposed to the outside, wherein the external lead terminals are provided with attribute identification marks representing attributes of the IC. Characteristic semiconductor case.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63123216A JPH01292845A (en) | 1988-05-20 | 1988-05-20 | Semiconductor case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63123216A JPH01292845A (en) | 1988-05-20 | 1988-05-20 | Semiconductor case |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01292845A true JPH01292845A (en) | 1989-11-27 |
Family
ID=14855074
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63123216A Pending JPH01292845A (en) | 1988-05-20 | 1988-05-20 | Semiconductor case |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01292845A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6219909B1 (en) | 1990-11-28 | 2001-04-24 | Hitachi, Ltd. | Method of mounting disk drive apparatus |
-
1988
- 1988-05-20 JP JP63123216A patent/JPH01292845A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6219909B1 (en) | 1990-11-28 | 2001-04-24 | Hitachi, Ltd. | Method of mounting disk drive apparatus |
US6856482B2 (en) | 1990-11-28 | 2005-02-15 | Hitachi, Ltd. | Disk drive apparatus and method of mounting same |
US7227712B2 (en) | 1990-11-28 | 2007-06-05 | Hitachi Global Storage Technologies Japan, Ltd. | Disk drive apparatus and method of mounting same |
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