JPH01289588A - Laser beam device - Google Patents
Laser beam deviceInfo
- Publication number
- JPH01289588A JPH01289588A JP63117202A JP11720288A JPH01289588A JP H01289588 A JPH01289588 A JP H01289588A JP 63117202 A JP63117202 A JP 63117202A JP 11720288 A JP11720288 A JP 11720288A JP H01289588 A JPH01289588 A JP H01289588A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- optical device
- condensing
- laser beam
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 44
- 238000007493 shaping process Methods 0.000 claims 2
- 238000003754 machining Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003672 processing method Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明はレーザ加工装置に関するものである。[Detailed description of the invention] Industrial applications The present invention relates to a laser processing device.
従来の技術
以下図面を参照しながら、上述した従来のレーザ加工装
置の一例について説明する。2. Description of the Related Art An example of the above-mentioned conventional laser processing apparatus will be described below with reference to the drawings.
第５図は従来のレーザ加工装置のうち、Ｘ−Ｙテーブル
型の構成図である。第６図において、２゜はレーザ発振
器、２１はレーザ・ビーム、２２は反射鏡、２３は集光
レンズ、２４は被加工物、２５はＸ−Ｙテーブルである
。レーザ発振器２０がら出たレーザ・ビーム２１は反射
鏡２２を経由して集光レンズ２３にて被加工物２４に照
射される。FIG. 5 is a configuration diagram of an X-Y table type of conventional laser processing apparatus. In FIG. 6, 2° is a laser oscillator, 21 is a laser beam, 22 is a reflecting mirror, 23 is a condenser lens, 24 is a workpiece, and 25 is an X-Y table. A laser beam 21 emitted from a laser oscillator 20 passes through a reflecting mirror 22 and is irradiated onto a workpiece 24 by a condensing lens 23 .
被加工物２４はＸ−Ｙテーブル２６にて移動され、所定
の加工が施される。The workpiece 24 is moved by an X-Y table 26 and subjected to a predetermined process.
第６図は従来のレーザ加工装置のうち、ガルバノ・メー
タ型ビーム走査装置の構成図である。第６図において、
２６はガルバノ・メータ、２７はガルバノ・ミラーであ
る。レーザ発振器２０から出たレーザ・ビーム２１はガ
ルバノ・メータ２６によって動かされる２枚のガルバノ
・ミラー２７によって平面上を走査されながらｆθレン
ズ２８によって被加工物２４上に集光照射され、所定の
加工が施される。FIG. 6 is a configuration diagram of a galvanometer type beam scanning device among conventional laser processing devices. In Figure 6,
26 is a galvano meter, and 27 is a galvano mirror. A laser beam 21 emitted from a laser oscillator 20 is scanned on a plane by two galvano mirrors 27 moved by a galvano meter 26, and is condensed onto a workpiece 24 by an fθ lens 28 to perform predetermined processing. will be applied.
発明が解決しようとする課題
しかしながら上記のような加工跡を１本のレーザ・ビー
ムで形成する方法では、同一形状の加工を繰シ返し被加
工物に施す場合には加工に時間がかがシ十分な生産能力
が得られない。すなわち、レーザ・ビームをパルス状に
照射する場合には、パルスの繰シ返し数の限界によって
連続加工できる速度が制限されてしまう。また、Ｘ−Ｙ
テーブルの移動速度やガルバノ・ミラー等の走査光学系
の能力によっても制限を受ける。さらに、Ｘ−Ｙテーブ
ルや走査光学系を高速で動かすほど、加工の位置決め精
度が悪くなるという問題点を有していた。Problems to be Solved by the Invention However, with the above-mentioned method of forming machining marks using a single laser beam, the machining process takes a long time when the same shape is repeatedly applied to the workpiece. Insufficient production capacity. That is, when irradiating a laser beam in a pulsed manner, the speed at which continuous processing can be performed is limited by the limit on the number of pulse repetitions. Also, X-Y
It is also limited by the moving speed of the table and the capabilities of scanning optical systems such as galvanometer mirrors. Furthermore, there is a problem in that the faster the X-Y table or scanning optical system is moved, the worse the positioning accuracy during processing becomes.
また上記した加工方法の課題に対して、特公昭５１−２
７９１９号公報には、集光球体を複数個並設した加工光
学装置が用いられている。第７図は、その集光光学装置
を示している。第７図において、２９は集光球体、３０
は被加工物、３１は形成された穴である。レーザ・ビー
ムを集光球体２９の列に照射すると、各々の集光球体２
９において集光され、被加工物３０に対して多点同時加
工することができる。しかしながら、この集光球体を用
いた方法では、集光球体と被加工物の間隔が高々１〜２
ｍｍと短く、加工後の飛散物が集光球体に付着し易い等
の作業性の悪さがある。また集光性が悪く、例えば直径
２ｍｍの集光球体のスポット径は１８０μｍである。従
って、集光点におけるレーザ・ビームのエネルギー密度
が低下し、加工性が低下する。第８図は、スポット径と
エネルギー密度の関係を模式的に示した図である。第８
図において、ａはスポット径大、ｂはスポット径小の場
合である。３２と３３はスポットの外周、３４と３５は
加工跡、３６と３７はエネルギー分布、３８は加工され
るエネルギー密度のしきい値である。同じエネルギーを
与えた場合、スポット径が大きくなるａとエネルギー分
布の高さが低くなる。被加工物が加工されるためには、
エネルギー分布３６が加工のしきい値３８を越えなけれ
ばならず、加工跡の外周３４は小さくなり、周辺の温度
上昇するだけの部分が大きくなる。スポット径が小さい
場合すにはエネルギー分布の高さが高くなシ、加工のし
きい値３８を越えた加工跡は大きくなる。前記した直径
２ｍｍの集光球体を用いて、Ａｌ膜厚１ｏｏｏ人の蒸着
フィルムを、連続発振ＹＡＧレーザをＱスイッチでパル
ス化して照射した場合、２０ｍ／パルスの条件で最大加
工幅５０μｍであった。第９図は、集光球体の大きさと
ビーム光路の関係を模式的に示した図である。ｄは球径
大、ｂは球径小の場合である。第９図において、３９は
集光球体小、４０は集光球体大、４１はビーム光路、４
２と４３はスポット径である。In addition, in response to the above-mentioned problems with the processing method,
No. 7919 uses a processing optical device in which a plurality of condensing spheres are arranged in parallel. FIG. 7 shows the condensing optical device. In FIG. 7, 29 is a condensing sphere, 30
is a workpiece, and 31 is a formed hole. When a laser beam is irradiated onto a row of condensing spheres 29, each condensing sphere 2
The light is focused at 9, and the workpiece 30 can be processed at multiple points simultaneously. However, in this method using a condensing sphere, the distance between the condensing sphere and the workpiece is 1 to 2 at most.
It is short (mm) and has poor workability, such as the fact that scattered objects after processing tend to adhere to the condensing sphere. In addition, the light focusing property is poor, for example, the spot diameter of a condensing sphere with a diameter of 2 mm is 180 μm. Therefore, the energy density of the laser beam at the focal point is reduced, and processability is reduced. FIG. 8 is a diagram schematically showing the relationship between spot diameter and energy density. 8th
In the figure, a shows a case where the spot diameter is large, and b shows a case where the spot diameter is small. 32 and 33 are the outer periphery of the spot, 34 and 35 are machining marks, 36 and 37 are energy distributions, and 38 is a threshold of energy density to be processed. When the same energy is applied, the spot diameter becomes larger and the height of the energy distribution becomes lower. In order for the workpiece to be processed,
The energy distribution 36 must exceed the machining threshold 38, the outer circumference 34 of the machining mark becomes smaller, and the area where the surrounding temperature increases becomes larger. When the spot diameter is small, the height of the energy distribution is high, and the machining mark exceeding the machining threshold 38 becomes large. When a continuous wave YAG laser was pulsed with a Q switch and irradiated on an Al film with a thickness of 100 mm using the above-mentioned condensing sphere with a diameter of 2 mm, the maximum processing width was 50 μm under the condition of 20 m/pulse. . FIG. 9 is a diagram schematically showing the relationship between the size of the condensing sphere and the beam optical path. d is the case where the ball diameter is large, and b is the case where the ball diameter is small. In FIG. 9, 39 is a small condensing sphere, 40 is a large condensing sphere, 41 is a beam optical path, and 4
2 and 43 are spot diameters.
ビーム光路４１は集光球体４０の外周に近づくほど大き
く屈折する。従って第９図に示すように、集光球体の直
径が大きくなるほど、さらに集光性が悪くなる。そのた
め、ピッチ２ｍｍ以上の多点加工の場合に、集光性を考
慮して直径の小さな集光球体を用いると、集光球体間に
隙間が生じ、レーザの利用効率が低くなるという問題点
のあることが判明した。The beam optical path 41 is refracted more as it approaches the outer periphery of the condensing sphere 40. Therefore, as shown in FIG. 9, the larger the diameter of the condensing sphere, the worse the light condensing ability becomes. Therefore, in the case of multi-point processing with a pitch of 2 mm or more, if condensing spheres with a small diameter are used in consideration of light condensing properties, gaps will be created between the condensing spheres, reducing the efficiency of laser use. It turns out that there is something.
本発明は上記問題点に鑑み、多点同時加工することによ
って加工時間を短縮し、また加工のピッチや精度が良好
で、レンズと被加工物の距離を十分にと夛、作業性が易
く、また利用効率の高いレーザ加工装置を提供するもの
である。In view of the above problems, the present invention shortens the processing time by processing multiple points simultaneously, has good processing pitch and accuracy, and maintains a sufficient distance between the lens and the workpiece, making workability easy. It also provides a laser processing device with high utilization efficiency.
課題を解決するための手段
上記問題点を解決するために本発明のレーザ加工装置は
、レーザ発振器と、少なくとも一方の面が平面であるレ
ンズを平面上に一列もしくは複数列に配置し、かつ前記
レーザ発振器からのレーザ・ビームの光路内に設置され
ている集光光学装置を構成として備えたものである。Means for Solving the Problems In order to solve the above-mentioned problems, a laser processing apparatus of the present invention includes a laser oscillator and a lens having at least one plane that is arranged in one or more rows on a plane, and It is equipped with a condensing optical device installed in the optical path of the laser beam from the laser oscillator.
作 用
本発明は上記した構成によって、レーザ発振器から出た
レーザ・ビームを、少なくとも一方の面が平面であるレ
ンズを平面上に一列もしくは複数列に配置し、かつ前記
レーザ発振器からのレーザ・ビームの光路内に設置され
ている集光光学装置に入射させることによシ、多点同時
加工し加工時間の短縮ができる。加工ピッチは集光光学
装置の組立精度で決まるので、加工中に加工位置がずれ
ることもなく、安定した加工形状が得られる。さらに平
凸レンズを用いることによって、レンズと被加工物の距
離を十分にとシ、作業性を向上させることができる。ま
た、凸型円柱レンズを平行にならべ、２段に重ねること
によって、レンズ間の隙間がなく、レーザの利用効率を
高めることができ、スポット形状も円または楕円を選択
することができる。Effects The present invention has the above-described configuration, in which lenses having at least one surface having a flat surface are arranged in one row or in a plurality of rows on a flat surface, and the laser beam emitted from the laser oscillator is By making the light incident on a condensing optical device installed in the optical path of the light source, it is possible to simultaneously process multiple points and shorten the processing time. Since the machining pitch is determined by the assembly accuracy of the condensing optical device, the machining position does not shift during machining, and a stable machined shape can be obtained. Furthermore, by using a plano-convex lens, the distance between the lens and the workpiece can be made sufficiently, and workability can be improved. Further, by arranging the convex cylindrical lenses in parallel and stacking them in two stages, there is no gap between the lenses, and the efficiency of laser use can be increased, and the spot shape can be selected to be circular or elliptical.
実施例
以下本発明の一実施例のレーザ加工装置と加工方法につ
いて、図面を参照しながら説明する。EXAMPLE Hereinafter, a laser processing apparatus and a processing method according to an embodiment of the present invention will be described with reference to the drawings.
第１図は本発明の第１の実施例におけるレーザ加工装置
の構成図を示すものである。第１図において、１はレー
ザ発振器、２ａは発振器１から出たレーザ・ビーム、３
と４はレーザ・ビームの断面形状を変形するための凸レ
ンズ、５と６はレーザ・ビームの断面形状を変形するた
めの凸型円柱レンズ、７は反射ミラー、８は集光光学装
置、９はマスク、１０は被加工物、１１はＸ −Ｙテー
ブル、１２は平凸レンズ、１３は集光ビームである。FIG. 1 shows a configuration diagram of a laser processing apparatus according to a first embodiment of the present invention. In FIG. 1, 1 is a laser oscillator, 2a is a laser beam emitted from oscillator 1, and 3 is a laser beam emitted from oscillator 1.
and 4 are convex lenses for changing the cross-sectional shape of the laser beam, 5 and 6 are convex cylindrical lenses for changing the cross-sectional shape of the laser beam, 7 is a reflecting mirror, 8 is a focusing optical device, and 9 is a condensing optical device. 10 is a mask, 10 is a workpiece, 11 is an X-Y table, 12 is a plano-convex lens, and 13 is a condensed beam.
以上のように構成されたレーザ加工装置について、その
動作を説明する。レーザ発振器１から出たレーザ・ビー
ム２ａは凸レンズ３を通過した後、−旦集光して再び拡
がシ、凸レンズ３よシも焦点距離の長い凸レンズ４によ
って、レーザ・ビーム２ａよシも直径が大きく平行なレ
ーザ・ビーム２ｂとなる。レーザ・ビーム２ｂは凸型円
柱レンズ５によって水平方向が一旦集光して再び拡がり
、凸型円柱レンズ５よシも焦点距離の長い凸型円柱レン
ズ６によって、レーザ・ビーム２ｂよりも水平方向が拡
大された平行なレーザ・ビーム２ｃとなる。レーザ・ビ
ーム２Ｃは、反射ミラー７によって集光光学装置８に入
射され、構成する平凸レンズ１２によって多点スポット
として、集光されない不要なビームがマスク９によって
しゃへいされた後、被加工物１ｏに照射される。平凸レ
ンズの曲率半径は１０ｍｍ以上にすることによって、直
径が２ｍｍ以上でも焦点位置におけるスポット径が１０
０μｍ以下で、レンズと被加工物の距離を１５ｍｍ以上
とることができる。被加工物１０はＸ−Ｙテーブル１１
によって移動され、所定の加工が施される。The operation of the laser processing apparatus configured as described above will be explained. After the laser beam 2a emitted from the laser oscillator 1 passes through the convex lens 3, it is condensed and expanded again. becomes a largely parallel laser beam 2b. The laser beam 2b is focused once in the horizontal direction by the convex cylindrical lens 5 and then expanded again. This results in an expanded parallel laser beam 2c. The laser beam 2C is incident on the condensing optical device 8 by the reflection mirror 7, is converted into a multi-point spot by the constituting plano-convex lens 12, and unnecessary beams that are not condensed are blocked by the mask 9, and then directed to the workpiece 1o. irradiated. By setting the radius of curvature of the plano-convex lens to 10 mm or more, the spot diameter at the focal position can be reduced to 10 mm even if the diameter is 2 mm or more.
When the distance is 0 μm or less, the distance between the lens and the workpiece can be 15 mm or more. The workpiece 10 is an X-Y table 11
is moved and subjected to predetermined processing.
以上のように本実施例によれば、レーザ発振器と曲率半
径が１０ｍｍ以上の平凸レンズを配置した集光光学装置
をレーザ・ビームの光路内に設けることにより、その焦
点が被加工物の表面近傍に位置するように配置すること
によって集光光学装置と被加工物の距離をとった状態で
多点同時加工することができる。また、平凸レンズによ
って集光されないレーザ・ビームが被加工物に対して悪
影響を与えない場合には、マスク９のようなしゃへい装
置を設ける必要は特にない。As described above, according to this embodiment, by providing a condensing optical device in which a laser oscillator and a plano-convex lens with a radius of curvature of 10 mm or more are arranged in the optical path of the laser beam, the focal point is near the surface of the workpiece. By arranging the converging optical device and the workpiece at a distance from each other, it is possible to perform simultaneous multi-point processing with a distance between the condensing optical device and the workpiece. Furthermore, if the laser beam that is not focused by the plano-convex lens does not have any adverse effect on the workpiece, there is no particular need to provide a shielding device such as the mask 9.
第２図は本発明の第２の実施例を示すレーザ加工装置の
集光光学装置と加工状態の構成図である。FIG. 2 is a configuration diagram of a condensing optical device and a processing state of a laser processing apparatus showing a second embodiment of the present invention.
同図において、第１図の構成と異なるのは、集光光学装
置８の平凸レンズ１２の配列を方眼状に設けた点である
。In the figure, the difference from the configuration in FIG. 1 is that the plano-convex lenses 12 of the condensing optical device 8 are arranged in a grid pattern.
以上のように平凸レンズ１２を方眼状に設けることによ
シ、被加工物１０に対して、−度に方眼状の加工を行う
ことができる。By providing the plano-convex lenses 12 in a grid shape as described above, it is possible to process the workpiece 10 in a grid shape at a -degree angle.
第３図は本発明の第３の実施例を示すレーザ加工装置の
集光光学装置と加工状態を上面から見た図である。同図
において、１４は加工跡である。FIG. 3 is a top view of the condensing optical device and processing state of a laser processing apparatus showing a third embodiment of the present invention. In the figure, 14 is a machining mark.
第１図あるいは第２図の構成と異なるのは、平凸レンズ
１２の列をｘ−Ｙテーブル１１の移動方向（矢印）に対
し、横方向に所定の間隔だけずらせて設けた点である。The difference from the configuration in FIG. 1 or FIG. 2 is that the rows of plano-convex lenses 12 are provided so as to be shifted by a predetermined interval in the lateral direction with respect to the moving direction (arrow) of the x-y table 11.
上記のように構成されたレーザ加工装置について、以下
その動作を説明する。平凸レンズ１２の列が、整形され
たレーザ・ビームの光路内に入るようにビームを入射さ
せる。ｘ−Ｙテーブル１１を矢印方向に移動させると、
図中に示すように、平凸レンズ１２の列を横にずらした
長さに相轟してピッチのあいた加工跡１４が形成される
。The operation of the laser processing apparatus configured as described above will be described below. An array of plano-convex lenses 12 directs the beam into the optical path of the shaped laser beam. When the x-y table 11 is moved in the direction of the arrow,
As shown in the figure, the rows of plano-convex lenses 12 are laterally shifted to form machining marks 14 with a gap in pitch.
以上のように平凸レンズの列を所定の間隔だけずらせて
設けることによシ、任意のピッチ間隔で加工跡を形成す
ることができる。By providing the rows of plano-convex lenses shifted by a predetermined interval as described above, it is possible to form processing marks at arbitrary pitch intervals.
第４図は本発明の第４の実施例を示すレーザ加工装置の
集光光学装置の構成図である。第１〜３図の構成と異な
るのは、複数の凸型円柱レンズを平行にならべたものを
、上段１６の方が下段１６よシも焦点距離が長く、かつ
直交するように間隔１７で設けた点である。FIG. 4 is a configuration diagram of a condensing optical device of a laser processing apparatus showing a fourth embodiment of the present invention. What is different from the configuration shown in FIGS. 1 to 3 is that a plurality of convex cylindrical lenses are arranged in parallel, and the upper stage 16 has a longer focal length than the lower stage 16, and they are arranged at intervals of 17 so that they are perpendicular to each other. This is the point.
上記のように構成されたレーザ加工装置について、以下
その動作を説明する。円柱レンズの列１６が全部レーザ
・ビームの光路内に納まるように整形して照射する。集
光に用いられるビームは、円柱レンズの列１５によって
５分割され、図面上の横方向に集光される１８ｏさらに
、このビームは、円柱レンズの列１６によって４分割さ
れ、横方向に集光されながら同時に直角方向にも集光さ
れる１９゜間隔１７を上下段のレンズの焦点距離が一致
するように設置すれば被加工物１０上で、２゜点のスポ
ットとして集光され加工される。また、間隔１７を変化
させると、上段１５と下段１６の集光位置が一致しない
ので、被加工物１Ｑ上で楕円状スポットとして集光され
る。The operation of the laser processing apparatus configured as described above will be described below. The array 16 of cylindrical lenses is shaped and irradiated so that they all fall within the optical path of the laser beam. The beam used for condensing is divided into five parts by a row 15 of cylindrical lenses, and is focused laterally on the drawing 18o.Furthermore, this beam is divided into four parts by a row 16 of cylindrical lenses, and is focused laterally. If the 19° interval 17 is set so that the focal lengths of the upper and lower lenses are the same, the light will be focused as a 2° spot on the workpiece 10 and processed. . Furthermore, when the interval 17 is changed, the light focusing positions of the upper stage 15 and the lower stage 16 do not match, so that the light is focused as an elliptical spot on the workpiece 1Q.
以上のように、集光光学装置を、複数の凸型円柱レンズ
を平行にならべたもの２段で構成し、上下段の間隔を変
化させることにより、１度に方眼状にスポットを集光で
き、形状も円形だけでなく楕円状にも変化させることが
できる。また、各段の円柱レンズ間に隙間がないので、
レーザ・ビームの利用効率が高い。As described above, the condensing optical device is composed of two stages in which multiple convex cylindrical lenses are arranged in parallel, and by changing the interval between the upper and lower stages, a spot can be focused in a grid shape at one time. , the shape can be changed not only to a circle but also to an ellipse. Also, since there is no gap between the cylindrical lenses of each stage,
High efficiency in laser beam usage.
発明の効果
以上のように本発明は、レーザ発振器と、少なくとも一
方の面が平面であるレンズを平面上に一列もしくは複数
列に配置し、かつ前記レーザ発振器からのレーザ・ビー
ムの光路内に設置されている集光光学装置とを設けるこ
とにより、多点同時加工することによって加工時間を短
縮し、また加工のピッチや精度が良好で、レンズと被加
工物の距離を十分にとり、作業性が良く、またレーザ・
ビームの利用効率も高くすることができる。Effects of the Invention As described above, the present invention provides a method in which a laser oscillator and a lens whose at least one surface is flat are arranged in one or more rows on a plane, and are placed in the optical path of the laser beam from the laser oscillator. By installing a condensing optical device, the machining time can be shortened by simultaneously machining multiple points, and the machining pitch and precision are good, with a sufficient distance between the lens and the workpiece, and work efficiency is improved. Okay, laser again.
Beam utilization efficiency can also be increased.
第１図は本発明の第１の実施例におけるレーザ加工装置
の構成図、第２図は本発明の第２の実施例を示すレーザ
加工装置の集光光学装置と加工状態の構成図、第３図は
本発明の第３の実施例を示すレーザ加工装置の集光光学
装置と加工状態の上面図、第４図は本発明の第４の実施
例を示すレーザ加工装置の集光光学装置の構成図、第５
図は従来のレーザ加工装置のうちＸ−Ｙテーブル型の構
成図、第６図は従来のレーザ加工装置のうちガルバノ・
メータ型ビーム走査装置の構成図、第７図は集光球体を
用いた集光光学装置、第８図はスポット径とエネルギー
密度の模式的関係を示す図、第９図は集光球体の大きさ
とビーム光路の関係の模式図である。
１・・・・・レーザ発振器、３，４・・・・・・レンズ
、５゜６・・・・・・円柱レンズ、８・・・・・・集光
光学装置、９・・・・・・マスク、１２・・・・・・平
凸レンズ、１５．１６・・・・・・凸型円柱レンズ、１
７・・・・・・円柱レンズの間隔。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名（−
＋、−ｆそ仮巻
３．４−−−レ′Ｊ人′
５．６−−−＠不ｔレコス“
ｆ２−一平イコレシで
イ
第５図
第８（
（ＣＬり
’Ｊ９ 図
（α）FIG. 1 is a block diagram of a laser processing apparatus according to a first embodiment of the present invention, and FIG. 2 is a block diagram of a focusing optical device and processing state of a laser processing apparatus according to a second embodiment of the present invention. 3 is a top view of a condensing optical device of a laser processing device and a processing state showing a third embodiment of the present invention, and FIG. 4 is a condensing optical device of a laser processing device showing a fourth embodiment of the present invention. Configuration diagram, 5th
The figure shows the configuration of an X-Y table type of conventional laser processing equipment, and Figure 6 shows the configuration of a galvano type of conventional laser processing equipment.
A configuration diagram of a meter-type beam scanning device, Fig. 7 is a condensing optical device using a condensing sphere, Fig. 8 is a diagram showing the schematic relationship between spot diameter and energy density, and Fig. 9 is a diagram showing the size of the condensing sphere. FIG. 1... Laser oscillator, 3, 4... Lens, 5°6... Cylindrical lens, 8... Condensing optical device, 9...・Mask, 12...Plano-convex lens, 15.16...Convex cylindrical lens, 1
7... Distance between cylindrical lenses. Name of agent: Patent attorney Toshio Nakao and one other person (-
+, -f Sokari Volume 3.4--Re'Jjin'5.6---@Notrecos'
Claims (6)
るレンズを平面上に一列もしくは複数列に配置し、かつ
前記レーザ発振器からのレーザ・ビームの光路内に設置
されている集光光学装置とを備えていることを特徴とす
るレーザ加工装置。(1) A condensing optical device comprising a laser oscillator and a lens whose at least one surface is flat, arranged in one or more rows on a plane, and installed in the optical path of the laser beam from the laser oscillator. A laser processing device characterized by comprising:
レンズで構成された特許請求の範囲第１項記載のレーザ
加工装置。(2) The laser processing apparatus according to claim 1, wherein the condensing optical device is constituted by a plano-convex lens having a radius of curvature of 10 mm or more.
配置したもの２段で構成され、上段の凸型円柱レンズの
方が焦点距離が長く、２段の集光方向は異なり、また、
間隔が可変である特許請求の範囲第１項記載のレーザ加
工装置。(3) The condensing optical device is composed of two stages in which a plurality of convex cylindrical lenses are arranged in parallel, the convex cylindrical lens in the upper stage has a longer focal length, and the condensing directions of the two stages are different. Also,
The laser processing apparatus according to claim 1, wherein the interval is variable.
ズを両者の焦点距離の和もしくは差の間隔で設置したレ
ンズの組み合わせを１組以上有し、前記レーザ発振器の
発生するレーザ・ビームを所定の断面形状とする整形光
学装置を備えている特許請求の範囲第１項記載のレーザ
加工装置。(4) It has one or more combinations of two lenses or cylindrical lenses with different focal lengths installed at an interval equal to the sum or difference of their focal lengths, and the laser beam generated by the laser oscillator is directed to a predetermined direction. The laser processing apparatus according to claim 1, further comprising a shaping optical device for shaping the cross-sectional shape.
ないしゃへい装置とを備えている特許請求の範囲第１項
記載のレーザ加工装置。The laser processing apparatus according to claim 1, further comprising: (5) a shielding device that prevents the workpiece from being irradiated with unnecessary unfocused beams.
に位置するよう配置された特許請求の範囲第１項記載の
レーザ加工装置。(6) The laser processing apparatus according to claim 1, wherein the condensing optical device is arranged so that its focal point is located near the surface of the workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63117202A JPH01289588A (en) | 1988-05-13 | 1988-05-13 | Laser beam device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63117202A JPH01289588A (en) | 1988-05-13 | 1988-05-13 | Laser beam device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01289588A true JPH01289588A (en) | 1989-11-21 |
Family
ID=14705917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63117202A Pending JPH01289588A (en) | 1988-05-13 | 1988-05-13 | Laser beam device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01289588A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998030317A1 (en) * | 1997-01-10 | 1998-07-16 | Morphometrix Technologies Inc. | Membrane microfilter manufacturing process |
| JP2010269371A (en) | 2009-05-20 | 2010-12-02 | Samsung Mobile Display Co Ltd | Light radiating device and method of fabricating organic light emitting diode display using the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56500529A (en) * | 1979-05-07 | 1981-04-23 | Baasel Carl Lasertech | |
| JPS62107890A (en) * | 1985-11-07 | 1987-05-19 | Toshiba Corp | Laser beam machine |
-
1988
- 1988-05-13 JP JP63117202A patent/JPH01289588A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56500529A (en) * | 1979-05-07 | 1981-04-23 | Baasel Carl Lasertech | |
| JPS62107890A (en) * | 1985-11-07 | 1987-05-19 | Toshiba Corp | Laser beam machine |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998030317A1 (en) * | 1997-01-10 | 1998-07-16 | Morphometrix Technologies Inc. | Membrane microfilter manufacturing process |
| JP2010269371A (en) | 2009-05-20 | 2010-12-02 | Samsung Mobile Display Co Ltd | Light radiating device and method of fabricating organic light emitting diode display using the same |
| US8848749B2 (en) | 2009-05-20 | 2014-09-30 | Samsung Display Co., Ltd. | Light radiating device and method of fabricating organic light emitting diode display device using the same |
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