JPH01287912A - Electronic parts - Google Patents
Electronic partsInfo
- Publication number
- JPH01287912A JPH01287912A JP11787888A JP11787888A JPH01287912A JP H01287912 A JPH01287912 A JP H01287912A JP 11787888 A JP11787888 A JP 11787888A JP 11787888 A JP11787888 A JP 11787888A JP H01287912 A JPH01287912 A JP H01287912A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- electron beam
- resin material
- irradiation
- sheathing film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 60
- 229920005989 resin Polymers 0.000 claims abstract description 60
- 239000000463 material Substances 0.000 claims abstract description 26
- 238000010894 electron beam technology Methods 0.000 claims abstract description 22
- 238000000576 coating method Methods 0.000 claims description 23
- 239000011248 coating agent Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 abstract description 9
- 239000002184 metal Substances 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract description 6
- 239000003985 ceramic capacitor Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000004040 coloring Methods 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- UPIWXMRIPODGLE-UHFFFAOYSA-N butyl benzenecarboperoxoate Chemical group CCCCOOC(=O)C1=CC=CC=C1 UPIWXMRIPODGLE-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007610 electrostatic coating method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- SRSFOMHQIATOFV-UHFFFAOYSA-N octanoyl octaneperoxoate Chemical group CCCCCCCC(=O)OOC(=O)CCCCCCC SRSFOMHQIATOFV-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical group CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は電子部品に係り、詳しくは、電子部品本体を被
覆する外装被覆に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to electronic components, and more particularly to an exterior covering that covers an electronic component body.
〈従来の技術〉
従来、コンデンサや抵抗器等の電子部品の外装被膜には
、熱硬化性樹脂を用いていた。<Prior Art> Conventionally, thermosetting resins have been used for the exterior coatings of electronic components such as capacitors and resistors.
液状の熱硬化性樹脂では、これを浸漬やロール転写法な
どの方法により、電子部品本体の外周に付着させ、その
のち熱を加えて、付着した樹脂を硬化させる。In the case of liquid thermosetting resin, it is applied to the outer periphery of the electronic component body by a method such as dipping or roll transfer, and then heat is applied to harden the adhered resin.
また、粉末状の熱硬化性樹脂では、これを流動浸漬法や
静電塗装法により本体に付着させたのち、加熱硬化させ
る。Further, in the case of a powdered thermosetting resin, it is applied to the main body by a fluidized dipping method or an electrostatic coating method, and then heated and cured.
〈発明が解決しようとする問題点〉
ところが、上記のように熱硬化性の樹脂を用いた外装方
法では、熱硬化に時間がかかり、生産能率が上がらない
、という問題がある。<Problems to be Solved by the Invention> However, as described above, the packaging method using a thermosetting resin has a problem in that thermosetting takes time and production efficiency cannot be improved.
また、円筒形コンデンサのように、本体内部に空洞があ
る電子部品では、樹脂の付着時に本体内部に空気が封じ
込められることになり、この封入空気が、硬化のための
加熱処理の際に、膨張して樹脂被膜から抜は出し、外装
被膜の表面にピンホールが発生する。Additionally, in electronic components that have a cavity inside the main body, such as cylindrical capacitors, air is trapped inside the main body when resin is attached, and this enclosed air expands during heat treatment for curing. When the resin is removed from the resin coating, pinholes are created on the surface of the exterior coating.
これに対しては、樹脂を付着させる際に、本体を予熱す
ることにより、本体内に閉じ込められる空気量の減少を
図ったり、あるいは、低粘度の樹脂を用い、これを数回
にわたって塗布することにより、本体内部に空気の閉じ
込めが起こらないようにしている。To deal with this, it is possible to reduce the amount of air trapped inside the main body by preheating the main body when applying the resin, or to use a low viscosity resin and apply it several times. This prevents air from becoming trapped inside the body.
しかしながら、これらの方法では、工程が増加し、作業
性、生産性を一段と低下させる。However, these methods increase the number of steps and further reduce workability and productivity.
また、一方では、外装被膜に紫外線硬化性の樹脂を用い
ることが行われているが、紫外線を照射するための水銀
ランプは、赤外線も放出するものであり、水銀ランプの
照射光線には約５８％の赤外線が含まれている。そのた
め、この赤外線で本体や樹脂が加熱され、熱硬化性樹脂
を用いた場合と同様に、被膜表面にピンホールが発生す
る。On the other hand, ultraviolet curable resin is used for the exterior coating, but mercury lamps used to irradiate ultraviolet rays also emit infrared rays, and the irradiation light of mercury lamps has a Contains % infrared radiation. Therefore, the main body and resin are heated by this infrared rays, and pinholes are generated on the coating surface, similar to when thermosetting resin is used.
さらに、紫外線硬化性樹脂を用いた場合、これを着色す
ると、紫外線の樹脂層内部への入射が阻害されるため、
硬化性が低下し、硬化不良が生じることがある。そのた
め、使用する樹脂の色に制限があり、外装被膜の色によ
る種類表示、特性表示に不便である。Furthermore, when using an ultraviolet curable resin, coloring it will inhibit the entry of ultraviolet rays into the resin layer.
Curability may decrease and curing failure may occur. Therefore, there are restrictions on the color of the resin that can be used, and it is inconvenient to indicate the type and characteristics based on the color of the exterior coating.
本発明は、上述の問題点に鑑みてなされた乙のであって
、熱を加えず、短時間で被膜の硬化が行えるようにして
、生産能率の向上を図るとともに、ピンホールの発生を
防止することを目的とする。The present invention has been made in view of the above-mentioned problems, and is capable of curing a film in a short time without applying heat, thereby improving production efficiency and preventing the occurrence of pinholes. The purpose is to
〈問題点を解決するための手段〉
本発明は、上記の目的を達成するために、外装被膜を電
子線硬化性樹脂を主成分とする樹脂材料で構成し、この
外装被膜を電子線照射により硬化させて電子部品を構成
した。<Means for Solving the Problems> In order to achieve the above-mentioned object, the present invention comprises an exterior coating made of a resin material whose main component is an electron beam curable resin, and the exterior coating is cured by electron beam irradiation. It was cured to form electronic components.
〈作用〉
上記の構成によれば、外装工程において、本体に樹脂材
料を付着させたのち、この付着した樹脂材料に電子線を
照射することにより、該樹脂材料が硬化して外装被膜が
形成される。その際、樹脂材料は短時間の電子線照射に
より硬化し、本体や樹脂はほとんど加熱されない。<Function> According to the above configuration, in the exterior process, after the resin material is attached to the main body, the attached resin material is irradiated with an electron beam, so that the resin material is cured and an exterior coating is formed. Ru. At that time, the resin material is cured by short-time electron beam irradiation, and the main body and resin are hardly heated.
〈実施例〉
以下、本発明の詳細を円筒形セラミックコンデンサに実
施した実施例に基づいて説明する。図面は、本発明の一
実施例に係る円筒形セラミックコンデンサの断面図であ
る。<Example> The details of the present invention will be described below based on an example implemented in a cylindrical ceramic capacitor. The drawing is a cross-sectional view of a cylindrical ceramic capacitor according to an embodiment of the present invention.
この実施例のコンデンサは、本体であるセラミック製で
円筒形の素体ｌと、外部端子となる一対の金属キャップ
２．３とを備える。素体ｌには、その外周面に外側電極
４が、また内周面には内側電極５がそれぞれ形成され、
内側電極５には、素体ｌの外周面に回り込んだ延出部５
ａが連続して形成されている。金属キャップ２．３は素
体ｌの両端に嵌着されており、一方の金属キャップ２は
外側電極４に接触し、他方の金属キャップ３は、内側電
極５の延出部５ａに接触している。The capacitor of this embodiment includes a cylindrical ceramic element body l and a pair of metal caps 2.3 that serve as external terminals. The element body l has an outer electrode 4 formed on its outer peripheral surface and an inner electrode 5 formed on its inner peripheral surface,
The inner electrode 5 has an extending portion 5 that wraps around the outer peripheral surface of the element body l.
a are formed continuously. The metal caps 2.3 are fitted to both ends of the element body l, one metal cap 2 is in contact with the outer electrode 4, and the other metal cap 3 is in contact with the extension 5a of the inner electrode 5. There is.
前記両金属キャップ２．３間において素体ｌの外周に外
装被膜６が形成されている。この外装被膜６は、エポキ
シアクリレート樹脂のようなアクリレート系の電子線硬
化性樹脂を主成分とする樹脂材料で構成されており、電
子線の照射により硬化されている。樹脂材料には、加熱
による重合開始剤としてクメンヒドロパーオキサイドが
０．５〜３重量部加えられている。An exterior coating 6 is formed on the outer periphery of the element body 1 between the two metal caps 2.3. The exterior coating 6 is made of a resin material whose main component is an acrylate electron beam curable resin such as an epoxy acrylate resin, and is cured by electron beam irradiation. 0.5 to 3 parts by weight of cumene hydroperoxide is added to the resin material as a polymerization initiator by heating.
アクリレート系の電子線硬化性樹脂としては、ほかに、
ポリウレタンアクリレート樹脂やアルキドアクリレート
樹脂、ポリエステルアクリレート樹脂があり、少なくと
も末端に２個のアクリル基を有するものであればよい。In addition to acrylate-based electron beam curable resins,
Examples include polyurethane acrylate resins, alkyd acrylate resins, and polyester acrylate resins, as long as they have at least two acrylic groups at the ends.
また、加熱による重合開始剤として、ほかに、ターンヤ
ルプチルパーオキシベンゾエード、ターシャルブチルヒ
ドロパーオキサイト、オクタノイルパーオキサイドを用
いてもよい。また、樹脂材料中に、エポキシ樹脂やフェ
ノール樹脂などの熱硬化性樹脂を混入してもよい。In addition, as a polymerization initiator by heating, tertiary butyl peroxybenzoate, tertiary butyl hydroperoxide, and octanoyl peroxide may be used. Further, a thermosetting resin such as an epoxy resin or a phenol resin may be mixed into the resin material.
次に上記外装被膜５の形成方法を説明する。まず、エポ
キシアクリレート樹脂を主成分とし、これに０．５〜３
重量部のクメンヒドロパーオキサイドを加えた樹脂材料
を用意し、この樹脂材料をロール転写法により素体１の
外周面の所要部に付着させる。Next, a method for forming the exterior coating 5 will be explained. First, the main component is epoxy acrylate resin, and 0.5 to 3
A resin material to which a weight part of cumene hydroperoxide is added is prepared, and this resin material is adhered to a desired portion of the outer peripheral surface of the element body 1 by a roll transfer method.
そののち、付着した樹脂材料に対して出力２００ＫＶの
電子線Ｅを１／１００秒間、照射する。電子線Ｅの照射
により、樹脂材料内部では遊離基が発生し、この遊離基
どうしが結合するため、樹脂材料が硬化し、外装被膜６
を形成する。Thereafter, the adhered resin material is irradiated with an electron beam E having an output of 200 KV for 1/100 second. Irradiation with the electron beam E generates free radicals inside the resin material, and these free radicals bond with each other, so the resin material hardens and the exterior coating 6
form.
このとき、金属キャップ２．３内に浸入している樹脂材
料は電子線Ｅか照射されないため、充分に硬化しない。At this time, the resin material that has penetrated into the metal cap 2.3 is not irradiated with the electron beam E, so it is not sufficiently cured.
そこで、３０分間、１５０℃で加熱する。この加熱によ
り熱重合開始剤による重合が進行し、金属キャップ２．
３内の樹脂材料も硬化する。Then, heat at 150° C. for 30 minutes. Due to this heating, polymerization by the thermal polymerization initiator progresses, and the metal cap 2.
The resin material inside 3 is also cured.
上記のように、樹脂材料の硬化には、時間ががからず、
外装被膜６の形成工程は短時間で終了する。As mentioned above, it does not take much time for the resin material to harden.
The process of forming the exterior coating 6 is completed in a short time.
また、樹脂材料の硬化に際しては、樹脂材料や素体ｌに
はほとんど熱が加わらないから、内部の空気が膨張して
、外装被膜６にピンホールをつくるようなことがない。Further, when the resin material is cured, almost no heat is applied to the resin material or the element body 1, so that there is no possibility that the internal air will expand and create pinholes in the exterior coating 6.
上記の外装被膜６は、円筒形セラミックコンデンサに限
らず、外装被膜を必要とする電子部品に設けることがで
きる。The above-mentioned exterior coating 6 can be provided not only on cylindrical ceramic capacitors but also on electronic components that require an exterior coating.
〈発明の効果〉
以上のように、本発明によれば、外装被膜により本体の
内部に空気が封じ込められる電子部品であっても、外装
被膜となる樹脂材料の硬化の際、電子線を短時間照射す
るだけであるから、樹脂材料や本体にはほとんど熱が加
わらず、外装被膜には内部の空気の膨張によるピンホー
ルが発生しない。<Effects of the Invention> As described above, according to the present invention, even in electronic components where air is confined inside the main body by the outer coating, electron beams are applied for a short period of time during curing of the resin material forming the outer coating. Because it is only irradiated, almost no heat is applied to the resin material or the main body, and no pinholes are generated in the exterior coating due to expansion of the air inside.
また、樹脂材料は短時間の電子線照射により硬化するか
ら、外装工程において従来のように時間がかからず、生
産能率が向上する。Furthermore, since the resin material is cured by short-time electron beam irradiation, the packaging process does not take as much time as in the past, improving production efficiency.
さらに、紫外線硬化性の樹脂の場合は、紫外線を深部ま
で入射させるために濃色の樹脂を使用することができな
いが、本発明では、電子線が樹脂の色に関係なく深部ま
で入射するから、着色が自由であり、着色による種類表
示、特性表示に便利である。Furthermore, in the case of ultraviolet curable resin, it is not possible to use a dark colored resin in order to allow ultraviolet rays to penetrate deep into the resin, but in the present invention, the electron beam is incident deep into the resin regardless of the color of the resin. Coloring can be done freely, and coloring is convenient for displaying types and characteristics.
図面は、本発明の一実施例に係る円筒形セラミックコン
デンサの断面図である。
ｌ・・・素体（電子部品本体）、２．３・・・金属キャ
ップ、６・・・外装被膜。The drawing is a cross-sectional view of a cylindrical ceramic capacitor according to an embodiment of the present invention. l...Element body (electronic component main body), 2.3...Metal cap, 6...Exterior coating.
Claims (1)
材料で構成し、この外装被膜を電子線照射により硬化さ
せたことを特徴とする電子部品。(1) An electronic component characterized in that the exterior coating is made of a resin material whose main component is an electron beam curable resin, and the exterior coating is cured by electron beam irradiation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11787888A JPH01287912A (en) | 1988-05-13 | 1988-05-13 | Electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11787888A JPH01287912A (en) | 1988-05-13 | 1988-05-13 | Electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01287912A true JPH01287912A (en) | 1989-11-20 |
Family
ID=14722482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11787888A Pending JPH01287912A (en) | 1988-05-13 | 1988-05-13 | Electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01287912A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007227857A (en) * | 2006-02-27 | 2007-09-06 | Toshiba Corp | Printed board incorporating component, printed board, electronic apparatus, and electronic component |
-
1988
- 1988-05-13 JP JP11787888A patent/JPH01287912A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007227857A (en) * | 2006-02-27 | 2007-09-06 | Toshiba Corp | Printed board incorporating component, printed board, electronic apparatus, and electronic component |
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