JPH04249512A - Resin composition for encapsulating electronic part and method for encapsulating electronic part - Google Patents
Resin composition for encapsulating electronic part and method for encapsulating electronic partInfo
- Publication number
- JPH04249512A JPH04249512A JP29666490A JP29666490A JPH04249512A JP H04249512 A JPH04249512 A JP H04249512A JP 29666490 A JP29666490 A JP 29666490A JP 29666490 A JP29666490 A JP 29666490A JP H04249512 A JPH04249512 A JP H04249512A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- marking
- active energy
- exterior
- color
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 18
- 239000011342 resin composition Substances 0.000 title claims description 11
- 229920005989 resin Polymers 0.000 claims abstract description 44
- 239000011347 resin Substances 0.000 claims abstract description 44
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 5
- 239000003086 colorant Substances 0.000 claims description 11
- 239000012776 electronic material Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 abstract description 2
- 150000003673 urethanes Chemical class 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 description 8
- 238000010330 laser marking Methods 0.000 description 8
- 239000000976 ink Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000001023 inorganic pigment Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000012860 organic pigment Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- -1 acroyl group Chemical group 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- LFYJSSARVMHQJB-QIXNEVBVSA-N bakuchiol Chemical compound CC(C)=CCC[C@@](C)(C=C)\C=C\C1=CC=C(O)C=C1 LFYJSSARVMHQJB-QIXNEVBVSA-N 0.000 description 1
- 238000012663 cationic photopolymerization Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子部品の外装に用いられる樹脂組成物及び
電子部品の外装形成法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin composition used for the exterior of an electronic component and a method for forming the exterior of an electronic component.
従来より、電子部品の耐湿性及び強度を高めるために、
あるいはつや出しのために、電子部品の外表面に熱硬化
性樹脂を被覆することにより外装が施されている。Traditionally, in order to increase the moisture resistance and strength of electronic components,
Alternatively, for polishing, the outer surface of the electronic component is coated with a thermosetting resin.
また、外装樹脂の表面に製品名・製造者名をマーキング
することも行われている。このマーキングに際しては、
従来、熱硬化性インキや紫外線硬化型インキが用いられ
ている。Additionally, the product name and manufacturer's name are marked on the surface of the exterior resin. When marking this,
Conventionally, thermosetting inks and ultraviolet curable inks have been used.
しかしながら、熱硬化性インキや紫外線硬化型インキで
施されたマーキングは、有機溶剤で比較的容易に消えや
すく、かつ機械的な摩擦等に弱いという問題があった。However, markings applied with thermosetting inks or ultraviolet curable inks have problems in that they are relatively easily erased with organic solvents and are susceptible to mechanical friction and the like.
そこで、上述のような問題を解消し、さらにマーキング
工程を効率よく行うものとして、レーザーマーキング法
が提案されている（例えは、特開昭６１−１９２７３７
号）。Therefore, a laser marking method has been proposed to solve the above-mentioned problems and make the marking process more efficient.
issue).
レーザー光によるマーキング法では、レーザー光を照射
するだけで印字が行われるため、印字工程が効率よく行
われる。In the marking method using laser light, printing is performed simply by irradiating laser light, so the printing process is performed efficiently.
〔発明か解決しようとする課題］
しかしながら、レーザーマーキング法では、主としてレ
ーザー光が照射された部分を白色化させ、周囲とのコン
トラストにより印字するものであるため、印字部分の鮮
明度の点で不十分となりがちであった。[Problem to be solved by the invention] However, the laser marking method mainly whitens the area irradiated with laser light and prints by contrasting with the surrounding area, so there is a problem with the clarity of the printed area. tended to be sufficient.
また、レーザーマーキング法自体は効率よく行い得るが
、外装樹脂として、熱硬化性樹脂を用いていたので、レ
ーザーマーキングに先立つ樹脂の硬化時間に長時間を要
していた。すなわち、マーキング自体はレーザーマーキ
ング法により短時間で行えるが、それに先立つ外装樹脂
の硬化に長時間を要していたため、外装樹脂の塗布−硬
化−マーキングといった一連の工程を実施するのに長時
間を要していた。Further, although the laser marking method itself can be performed efficiently, since a thermosetting resin is used as the exterior resin, it takes a long time to harden the resin prior to laser marking. In other words, although the marking itself can be done in a short time using the laser marking method, it takes a long time to harden the exterior resin before that, so it takes a long time to perform the series of steps such as applying the exterior resin, curing, and marking. It was necessary.
よって、本発明の目的は、外装樹脂の塗布・硬化及びマ
ーキングを短時間で行うことができ、かつ鮮明なマーキ
ングを施すことを可能とする、電子部品の外装用樹脂組
成物及び外装形成法を提供することにある。Therefore, an object of the present invention is to provide a resin composition for the exterior of electronic components and a method for forming the exterior, which enables coating, curing, and marking of the exterior resin in a short time, and enables clear marking. It is about providing.
〔課題を解決するための手段及び作用〕本願の第１の発
明では、上記課題を解決するために、少なくとも一個の
活性二重結合または少なくとも一個のエポキシ基を有す
る活性エネルギ線硬化型樹脂と、レーザー光を照射する
ことにより変色する発色剤とを含有することを特徴とす
る、電子部品外装用樹脂組成物が提供される。[Means and effects for solving the problems] In the first invention of the present application, in order to solve the above problems, an active energy beam-curable resin having at least one active double bond or at least one epoxy group; Provided is a resin composition for the exterior of electronic components, which is characterized by containing a coloring agent that changes color when irradiated with laser light.
また、本願の第２の発明では、上記課題を解決するため
に、上記特定の組成の電子部品外装用樹脂組成物を電子
部品の外表面に被覆し、活性エネルギ線を照射すること
により硬化し、硬化後にレーザー光を照射することによ
りマーキングを施す各工程を備える電子部品の外装形成
法か提供される。In addition, in a second invention of the present application, in order to solve the above problem, the outer surface of an electronic component is coated with a resin composition for the exterior of an electronic component having the above specific composition, and the resin composition is cured by irradiation with active energy rays. , a method for forming an exterior of an electronic component is provided, which includes steps of marking by irradiating laser light after curing.
以下、本願の第１、第２の発明を詳細に説明する。Hereinafter, the first and second inventions of the present application will be explained in detail.
第１の発明
第１の発明の電子部品外装用樹脂組成物において用いら
れる活性二重結合を有する化合物としては、アクリル基
またはアクロイル基等の重合性二重結合を有する変性樹
脂、例えば、変性エポキシ樹脂、変性ウレタン樹脂、変
性シリコン樹脂、変性ポリブタジエンまたは変性不飽和
ポリエステル樹脂等が挙げられ、エポキシ基を有する化
合物としては、ビスフェノールＡ型エポキシ樹脂、グリ
シジルエーテル、脂環式エポキシ樹脂等が挙げられる。First Invention The compound having an active double bond used in the resin composition for the exterior of electronic parts according to the first invention is a modified resin having a polymerizable double bond such as an acrylic group or an acroyl group, such as a modified epoxy resin. Examples of the resin include modified urethane resin, modified silicone resin, modified polybutadiene, and modified unsaturated polyester resin, and examples of the compound having an epoxy group include bisphenol A epoxy resin, glycidyl ether, and alicyclic epoxy resin.
上記のような活性二重結合またはエポキシ基を有する活
性エネルギ線硬化型樹脂は、紫外線または電子線等の活
性エネルギ線を照射することにより硬化されるものであ
る。従って、活性エネルギ線を照射することにより硬化
されるため、従来から用いられてきた熱硬化型樹脂に比
べて、極めて短時間で硬化される。よって、本発明の電
子部品外装用樹脂では、硬化工程を短時間で完了するこ
とができる。The active energy ray-curable resin having an active double bond or an epoxy group as described above is cured by irradiation with active energy rays such as ultraviolet rays or electron beams. Therefore, since it is cured by irradiation with active energy rays, it is cured in an extremely short time compared to conventionally used thermosetting resins. Therefore, with the electronic component exterior resin of the present invention, the curing process can be completed in a short time.
活性エネルギ線硬化型樹脂は、電子部品の外表面に塗布
するに際しては、必要に応じて、適宜の有機溶剤または
反応性希釈剤を添加し、液状とすることにより、電子部
品の外表面に塗布される。When applying the active energy beam-curable resin to the external surface of the electronic component, add an appropriate organic solvent or reactive diluent as necessary to make it liquid, and then apply it to the external surface of the electronic component. be done.
例えば、浸漬法により活性エネルギ線硬化型樹脂を電子
部品表面に塗布する場合には、固形またはペースト状の
活性エネルギ線硬化型樹脂を有機溶剤で希釈する。また
、印刷または転写により塗布する場合には、固形または
ペースト状の活性エネルギ線硬化型樹脂を反応性モノマ
ー及び、または有機溶剤を用いて低粘度化して使用する
。For example, when applying an active energy ray-curable resin to the surface of an electronic component by a dipping method, the active energy ray-curable resin in solid or paste form is diluted with an organic solvent. In addition, when applying by printing or transfer, a solid or paste-like active energy ray-curable resin is used after its viscosity is lowered using a reactive monomer and/or an organic solvent.
また、活性エネルギ線の種類によって、さらに重合開始
剤を添加する必要もある。例えば、高圧水銀炉による紫
外線照射法を用いる場合には、活性二重結合含有樹脂で
は、ラジカル分解型の光重合開始剤を、エポキシ樹脂で
は芳香族オニウム塩等のカチオン光重合開始剤を添加す
る必要がある。Furthermore, depending on the type of active energy ray, it may be necessary to further add a polymerization initiator. For example, when using an ultraviolet irradiation method using a high-pressure mercury furnace, a radical decomposition type photoinitiator is added for active double bond-containing resins, and a cationic photopolymerization initiator such as an aromatic onium salt is added for epoxy resins. There is a need.
もっとも、活性エネルギ線として電子線を用いる場合に
は、活性エネルギ結合含有樹脂の場合には光重合開始剤
を添加する必要はない。However, when an electron beam is used as the active energy beam, it is not necessary to add a photopolymerization initiator in the case of a resin containing an active energy bond.
本願の第１の発明の電子部品外装用樹脂組成物には、上
述のような活性エネルギ線硬化型樹脂に加えて、レーザ
ー光を照射することにより変色する発色剤が含有されて
いる。この発色剤は、後述するレーザーマーキング法に
おいて印字を行うために添加されているものであり、レ
ーザー法により変色し得る有機もしくは無機顔料または
重合体多用性染料からなる。用い得る有機もしくは無機
顔料または重合体可溶性染料としては、レーザー光で変
色し得るものであれば任意のものを用い得る。The electronic component exterior resin composition of the first invention of the present application contains, in addition to the above-mentioned active energy ray-curable resin, a coloring agent that changes color when irradiated with laser light. This coloring agent is added for printing in the laser marking method described below, and is composed of an organic or inorganic pigment or a polymer-compatible dye that can change color by the laser method. Any organic or inorganic pigment or polymer-soluble dye that can be used may be used as long as it can change color with laser light.
もっとも、白色等に発色するものでは、未照射部と照射
部とのコントラストが充分でなく、鮮明な印字が得られ
難い。従って、白以外の色に発色するもの、特に黒色化
するものか好ましい。例えば、雰囲気温度２００℃で変
色せず、２５０〜３５０℃で黒色化するアゾ系顔料が好
適に用いられ、また、染料としては、１５０℃以上の耐
熱性のあるものが適している。これは、部品の耐熱試験
等で変色することは好ましくないからである。However, with those that develop a color such as white, the contrast between the unirradiated area and the irradiated area is insufficient, making it difficult to obtain clear prints. Therefore, it is preferable to use a material that develops a color other than white, especially one that produces a black color. For example, an azo pigment that does not change color at an ambient temperature of 200° C. and turns black at a temperature of 250 to 350° C. is preferably used, and a dye having heat resistance of 150° C. or higher is suitable. This is because it is undesirable for parts to change color during heat resistance tests and the like.
上述した発色剤は、レーザー光によるマーキングを行う
ために添加されているものであり、活性エネルギ線硬化
型樹脂に対し、上記レーザーマーキングが確実に行い得
る量だけ含有される必要がある。また、発色剤の含有量
が多過ぎると、外装樹脂の強度、耐湿性等が低下するお
それがある。The above-mentioned coloring agent is added to perform marking with laser light, and needs to be contained in the active energy beam-curable resin in an amount that allows the above-mentioned laser marking to be performed reliably. Moreover, if the content of the coloring agent is too large, the strength, moisture resistance, etc. of the exterior resin may be reduced.
従って、使用する活性エネルギ線硬化型樹脂及び発色剤
によっても異なるか、通常、上記発色剤は、活性エネル
ギ線硬化型樹脂に対して５重量％〜３０重量％の範囲で
添加される。Therefore, the amount of the color former may vary depending on the active energy ray curable resin and coloring agent used, but usually the color former is added in an amount of 5% to 30% by weight based on the active energy ray curable resin.
第２の発明
本願の第２の発明では、上述した特定の組成の電子部品
外装用樹脂が、まず電子部品の外表面に塗布される。こ
の塗布は、上述したように、浸漬法、あるいは印刷また
は転写等の適宜の方法により行われる。Second Invention In the second invention of the present application, the electronic component exterior resin having the above-mentioned specific composition is first applied to the outer surface of the electronic component. As mentioned above, this application is performed by an appropriate method such as dipping, printing, or transfer.
塗布後、直ちに活性エネルギ線が照射され、それによっ
て上記電子部品外装用樹脂が硬化される。Immediately after application, active energy rays are irradiated to harden the electronic component exterior resin.
この硬化は、活性エネルギ線として、紫外線または電子
線等の活性エネルギ線を数分間程度照射することにより
行われる。従って、従来の熱硬化型樹脂を用いた外装樹
脂の硬化時間に比べて、極めて短時間で硬化を完了する
ことができる。This curing is performed by irradiating active energy rays such as ultraviolet rays or electron beams for several minutes. Therefore, curing can be completed in an extremely short time compared to the curing time of exterior resins using conventional thermosetting resins.
電子部品外装樹脂が硬化された後、レーザー光を照射す
ることにより、上記電子部品外装用樹脂中に含まれてい
る発色剤が変色し、それによってマーキングが行われる
。After the electronic component exterior resin is cured, the coloring agent contained in the electronic component exterior resin changes color by irradiating it with laser light, thereby performing marking.
用い得るレーザー光発生手段としては、特に限定されな
いが、周波長が赤外線領域にあるレーザー光を用いるこ
とが好ましい。例えば１０．６μｍの波長のレーザー光
を放射するＣＯ２ガスレーザーや、１．０６μｍの波長
のレーザー光を放射するＹＡＧレーザー等が好適に用い
られる。The usable laser beam generating means is not particularly limited, but it is preferable to use a laser beam whose wavelength is in the infrared region. For example, a CO2 gas laser that emits a laser beam with a wavelength of 10.6 μm, a YAG laser that emits a laser beam with a wavelength of 1.06 μm, etc. are preferably used.
上記レーザー光は、マーキングに必要な時間、通常、数
秒以下の時間だけ照射される。すなわち、マーキングは
、レーザー光を照射することにより瞬時に行われる。The laser beam is irradiated for a period of time necessary for marking, which is usually several seconds or less. That is, marking is instantaneously performed by irradiating laser light.
以下、比較例及び実施例を説明することにより、本発明
を明らかにする。The present invention will be clarified by explaining comparative examples and examples below.
比較例
クレゾールノボラック型エポキシ樹脂（油化シェルエポ
キシ（株）製：エピコート１８０５）１００重量部、フ
ェノールノボラック硬化剤（郡栄化学工業（株）製：Ｐ
ＳＦ−４２６１）５０重量部、及び硬化促進剤（四国化
成（株）製：Ｃ１１Ｚ）１．５重量部を、メチルエチル
ケトン１００重量部に溶解し、セラミックコンデンサを
構成するための電子部品素子の外表面に浸漬法で被覆し
、８０℃の温度に３０分間維持することにより、溶剤を
乾燥させた。Comparative Example 100 parts by weight of cresol novolac type epoxy resin (manufactured by Yuka Shell Epoxy Co., Ltd.: Epicoat 1805), phenol novolac curing agent (manufactured by Gunei Chemical Industry Co., Ltd.: P
50 parts by weight of SF-4261) and 1.5 parts by weight of a curing accelerator (manufactured by Shikoku Kasei Co., Ltd.: C11Z) were dissolved in 100 parts by weight of methyl ethyl ketone to prepare the outer surface of an electronic component element for constructing a ceramic capacitor. The solvent was dried by coating by dipping and maintaining at a temperature of 80° C. for 30 minutes.
しかる後、１５０℃の恒温槽に入れ５時間放置すること
により、樹脂を硬化させた。Thereafter, the resin was cured by placing it in a constant temperature bath at 150° C. and leaving it for 5 hours.
次に、市販の紫外線硬化型黒色インキ（大日本インキ化
学工業（株）製：Ｒ８５−墨Ｂ）をオフセット印刷によ
り硬化された樹脂表面に印刷し、しかる後高温水銀ラン
プで５００ｍＪ／ｃｍ２の紫外線を照射して印字した。Next, a commercially available ultraviolet curable black ink (manufactured by Dainippon Ink & Chemicals Co., Ltd.: R85-Sumi B) was printed on the hardened resin surface by offset printing, and then a high temperature mercury lamp was used to apply ultraviolet rays of 500 mJ/cm2. It was printed by irradiating it.
実施例
エポキシ変性アクリレート樹脂（昭和高分子（株）製：
ＳＰ−１５０９）を１００重量部、光重合開始剤（メル
ク・ジャパン（株）製：ダロキュア１１７３）を２重量
部、充填物質としてのＡｌ２Ｏ３、３Ｈ２Ｏを１０重量
部、石英粉末を５重量部、及び発色剤（チバガイキ（株
）製：Ｃ．Ｉ．ピグメント、イエロー１３９）を４重量
部を秤量し、これらをアセトン５０重量部に溶解または
分散させて外装樹脂溶液または分散液を得た。つぎに、
この外装樹脂溶液または分散液を、比較例と同様にして
電子部品素子の外表面に浸漬法で塗布し、５０℃の温度
に５分間維持することにより溶剤を乾燥させた。次に、
高圧水銀ランプで１０００ｍＪ／ｃｍ２の紫外線量を照
射し、硬化させた。Example Epoxy modified acrylate resin (manufactured by Showa Kobunshi Co., Ltd.:
100 parts by weight of SP-1509), 2 parts by weight of a photopolymerization initiator (Darocur 1173, manufactured by Merck Japan Co., Ltd.), 10 parts by weight of Al2O3, 3H2O as a filler material, 5 parts by weight of quartz powder, and Four parts by weight of a coloring agent (C.I. Pigment, Yellow 139, manufactured by Chiba Gaiki Co., Ltd.) was weighed and dissolved or dispersed in 50 parts by weight of acetone to obtain an exterior resin solution or dispersion. next,
This exterior resin solution or dispersion was applied to the outer surface of the electronic component element by dipping in the same manner as in the comparative example, and the solvent was dried by maintaining the temperature at 50° C. for 5 minutes. next,
It was cured by irradiating it with ultraviolet light of 1000 mJ/cm2 using a high-pressure mercury lamp.
次に、製造社名模様を有するマスクを通して、硬化され
た樹脂表面に、ＣＯ２ガスレーザー発生装置から１０．
６μｍの波長のレーザービームを照射した。照射時間は
、２０μ秒である。その結果、レーザー光が照射された
部分だけ黒色に変色し、鮮やかな黒色マーキングが施さ
れたセラミックコンデンサを得ることができた。Next, 10.
A laser beam with a wavelength of 6 μm was irradiated. The irradiation time is 20 μsec. As a result, we were able to obtain a ceramic capacitor with bright black markings that turned black only in the areas that were irradiated with the laser light.
上記比較例及び従来例について、外装樹脂硬化条件及び
マーキング時間を下記の第１表に比較して示す。また、
比較例及び従来例で得られた、外装が形成されたセラミ
ックコンデンサにつき、以下の要領で耐溶剤性を試験し
た。結果を、第１表に併せて示す。Table 1 below shows the exterior resin curing conditions and marking times for the comparative example and conventional example. Also,
Ceramic capacitors with exterior casings obtained in Comparative Examples and Conventional Examples were tested for solvent resistance in the following manner. The results are also shown in Table 1.
耐溶剤性試験方法…印字された部分にアセトンを滴下し
、歯ブラシで１０回擦り、印字が取れた場合に耐溶剤性
不良とし、第１表に×印を付して示し、印字が残存して
いる場合には耐溶剤性良好とし、第１表に〇印を付して
示した。Solvent resistance test method: Drop acetone onto the printed area, rub it 10 times with a toothbrush, and if the print comes off, it is considered poor solvent resistance, and it is indicated by an x in Table 1, indicating that the print remains. If it is, it is considered to have good solvent resistance and is marked with a circle in Table 1.
本発明によれば、上記特定の活性エネルギ線硬化型樹脂
及び発色剤を含有する電子部品の外装用樹脂組成物が提
供される。従って、外装樹脂の硬化が活性エネルギ線を
照射することにより極めて短時間で行われる。また、発
色剤は、レーザー光を照射することにより変色する材料
からなるため、レーザーマーキング法により極めて短時
間でマーキングを施すことができる。According to the present invention, there is provided a resin composition for the exterior of an electronic component, which contains the above-mentioned specific active energy ray-curable resin and a coloring agent. Therefore, the exterior resin can be cured in an extremely short time by irradiating it with active energy rays. Furthermore, since the coloring agent is made of a material that changes color when irradiated with laser light, marking can be applied in an extremely short time using the laser marking method.
よって、本発明によれば、電子部品の外装用樹脂の被覆
−硬化−マーキングといった一連の外装形成工程を、極
めて短時間で行うことが可能となる。Therefore, according to the present invention, it is possible to perform a series of steps for forming the exterior of an electronic component, such as coating, curing, and marking with a resin for the exterior in an extremely short time.
特許出願人 株式会社 村田製作所 代理人 弁理士 宮崎主税Patent applicant Murata Manufacturing Co., Ltd. Agent: Patent attorney: Chikara Miyazaki
Claims (2)
くとも一個のエポキシ基を有する活性エネルギ線硬化型
樹脂と、 レーザー光を照射することにより変色する発色剤とを含
有することを特徴とする、電子部品外装用樹脂組成物。[Claim 1] An electronic material comprising an active energy beam-curable resin having at least one active double bond or at least one epoxy group, and a coloring agent that changes color when irradiated with laser light. Resin composition for parts exterior.
物を電子部品の外表面に被覆し、活性エネルギ線を照射
することにより硬化し、硬化後にレーザー光を照射する
ことによりマーキングを施すことを特徴とする、電子部
品の外装形成法。2. The resin composition for exterior packaging of electronic components according to claim 1 is coated on the outer surface of an electronic component, cured by irradiation with active energy rays, and marked by irradiation with laser light after curing. A method for forming the exterior of electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29666490A JPH04249512A (en) | 1990-11-01 | 1990-11-01 | Resin composition for encapsulating electronic part and method for encapsulating electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29666490A JPH04249512A (en) | 1990-11-01 | 1990-11-01 | Resin composition for encapsulating electronic part and method for encapsulating electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04249512A true JPH04249512A (en) | 1992-09-04 |
Family
ID=17836480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29666490A Pending JPH04249512A (en) | 1990-11-01 | 1990-11-01 | Resin composition for encapsulating electronic part and method for encapsulating electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04249512A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5457299A (en) * | 1993-10-29 | 1995-10-10 | International Business Machines Corporation | Semiconductor chip packaging method which heat cures an encapsulant deposited on a chip using a laser beam to heat the back side of the chip |
-
1990
- 1990-11-01 JP JP29666490A patent/JPH04249512A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5457299A (en) * | 1993-10-29 | 1995-10-10 | International Business Machines Corporation | Semiconductor chip packaging method which heat cures an encapsulant deposited on a chip using a laser beam to heat the back side of the chip |
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