JPH01277780A - Probe card - Google Patents

Abstract

PURPOSE:To prevent the reversal of the vertical relation of a contact probe and a non-contact probe and to facilitate maintenance, by a construction wherein the fore end part of the contact probe is supported in contact by a U-folded part of the non-contact probe fitted to the main body of a probe card. CONSTITUTION:A contact probe 1 whose one end is bent downward is supported at the other end by a main body 3 of a probe card. In the main body 3, the opposite ends of a non-contact probe 2 folded in the shape of horizontal U as a whole are supported at positions on the opposite sides of the probe 1 respectively. The probe 1 is supported on a U-shaped part 2a. Even when the probe 1 is moved largely in the horizontal direction, it is always moved along the upper side of the probe 2. Therefore, the probe 1 is not moved onto the lower side of the probe 2 at all. Maintenance is facilitated according to this constitution.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a probe card for testing semiconductor devices formed on a wafer, and particularly to a probe card with an improved edge sensor.

[Conventional technology]

Conventionally, a probe card for inspecting semiconductor devices formed on a wafer is provided with an edge sensor for detecting the edge of the wafer. As shown in FIG. 3, this type of edge sensor includes a contact probe 11 whose tip is bent downward and supported at one end by a probe card body 13, and whose tip is brought into contact with a wafer;
3, and a non-contact probe 12 whose tip is bent horizontally. And contact probe 11
The lower surface and the upper surface of the non-contact probe 12 are brought into contact to establish electrical continuity, and when the contact probe 11 is moved upward such as by touching a wafer, the electrical continuity with the non-contact probe 12 is interrupted. , edge detection is performed.

[Problem to be solved by the invention]

In the conventional edge sensor described above, when the contact probe l comes into contact with a wafer or the like and is moved largely in the horizontal direction, it tends to come off from the upper position of the tip of the non-contact probe 12, and when it returns to the non-contact position as shown in FIG. It may be located below the probe 12. Therefore, in this state, edge detection using both probes 11 and 12 is no longer possible.
Wafer inspection is interrupted. Also, contact probe 1
Even if 1 is returned to its original state, the contact condition between both probes will deteriorate, and the life of the probe card will be shortened. This poses a problem in that maintenance of the probe card becomes troublesome and it is not possible to perform a suitable wafer inspection.

SUMMARY OF THE INVENTION An object of the present invention is to provide a probe card that eliminates the above-mentioned problems, facilitates maintenance, and enables suitable wafer inspection.

[Means to solve the problem]

The probe card of the present invention includes a contact probe that is supported at one end by a probe card body and comes into contact with a wafer, and a non-contact probe that is bent into a U shape and whose both ends are supported by the probe card on both sides of the contact probe. The edge sensor has a contact probe, and the tip of the contact probe is supported in contact with the upper surface of the U-shaped bent portion of the non-contact probe.

[Effect]

With the above configuration, even when the contact probe is moved in the horizontal direction, the contact probe does not come off the support of the non-contact probe, and the contact probe can be prevented from being moved below the non-contact probe.

[Example] Next, the present invention will be explained with reference to the drawings.

FIG. 1 shows an embodiment of the present invention, in which:
A contact probe 1 whose tip is bent downward is supported at one end on the probe card body 3. This contact probe 1 is
The tip is configured to be able to make surface contact with a semiconductor device formed on a wafer, and tungsten is used as the material due to its longevity and elasticity. Further, the probe card main body 3 supports both ends of the non-contact probe 2, which is bent into a horizontal U-shape, at positions on both sides of the contact probe 1. The non-contact probe 2 has a U-shaped bent portion 2a protruding along the contact probe 1 and is disposed below the contact probe 1, and supports the contact probe 1 at the U-shaped bent portion 2a. and maintains electrical continuity.

Therefore, according to this configuration, even if the contact probe 1 is moved largely in the horizontal direction during edge detection, the contact probe l is always moved along the top surface of the non-contact probe 2, so that the contact probe 1 is moved in the non-contact probe 2. contact probe 2
It is never moved below. This allows both probes 1. This makes it possible to detect the edge of the wafer by always maintaining the correct vertical relationship between the two, facilitating maintenance, and realizing suitable wafer inspection.

FIG. 2 shows another embodiment of the present invention, and is a sectional view taken along line A--A in FIG. 1. In this Plant 1, a semicircular recess 4 is formed on the upper surface of the U-shaped bent portion 2a of the non-contact probe 2A.
The recess 4 is configured to contact and support the contact probe 1.

According to this configuration, when both probes 1.2A repeatedly make contact many times, although there is a possibility that contact failure may occur because both probes 1.2 are in point contact in the embodiment of FIG. 1, In this example, since both probes are in surface contact, poor contact hardly occurs. This results in
Probe card life can be extended.

〔Effect of the invention〕

As explained above, in the present invention, the tip of the contact probe is supported in contact with the U-shaped bent portion of the non-contact probe attached to the probe card body at both ends of the contact probe. Even when moved horizontally, the contact probe does not come off the support of the non-contact probe, and this prevents the vertical relationship between the contact probe and the non-contact probe from being reversed, making maintenance easier and enabling suitable wafer inspection. This has the effect of increasing the lifespan of the probe card.

[BRIEF DESCRIPTION OF THE DRAWINGS] FIG. 1 is a perspective view of a main part of one embodiment of the present invention, and FIG. 2 is a cross-sectional view of another embodiment of the present invention, taken along line A-A in FIG. 3 are perspective views of a part of the conventional structure, and FIG. 4 is a perspective view for explaining the problems of the conventional structure. 1.11... Contact probe, 2.2A, 12... Non-contact probe, 2a... U-shaped bent portion, 3, 13...
Probe card body, 4... recess. Fig. 1 2aUaRshu Fig. 2

Claims (1)

[Claims] 1. Consisting of a contact probe that is supported at one end by a probe card body and comes into contact with the wafer, and a non-contact probe that is bent into a U shape and whose both ends are supported by the probe card on both sides of the contact probe. What is claimed is: 1. A probe card comprising: an edge sensor, wherein the contact probe has a tip thereof supported in contact with an upper surface of a U-shaped bent portion of the non-contact probe.