JPH01277766A - Blade-type probe card - Google Patents
Blade-type probe cardInfo
- Publication number
- JPH01277766A JPH01277766A JP10861988A JP10861988A JPH01277766A JP H01277766 A JPH01277766 A JP H01277766A JP 10861988 A JP10861988 A JP 10861988A JP 10861988 A JP10861988 A JP 10861988A JP H01277766 A JPH01277766 A JP H01277766A
- Authority
- JP
- Japan
- Prior art keywords
- blade
- probe
- probe card
- type probe
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 38
- 239000012779 reinforcing material Substances 0.000 claims abstract description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 4
- 239000010935 stainless steel Substances 0.000 claims abstract description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 4
- 239000010937 tungsten Substances 0.000 claims abstract description 4
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はウェハーに形成された半導体装置のＰ／Ｗチェ
ック工程で使用するブレード型プローブカードのプロー
ブのブレード取り付け部の構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a structure of a blade attachment portion of a probe of a blade type probe card used in a P/W check process of a semiconductor device formed on a wafer.
従来のブレード型プローブカードのプローブのブレード
取り付け部は第３図のように単にブレード２の下部にプ
ローブ１が固定されるという構造となっていた。The blade mounting portion of the probe of a conventional blade-type probe card has a structure in which the probe 1 is simply fixed to the lower part of the blade 2, as shown in FIG.
上述した従来のブレード型プローブカードはプローブと
ウェハーが接触する際、上下方向に力が作用して多数回
繰り返すうちに、プローブのブレードへの取り付け部に
おいて、変形を起こしプローブの位置ズレが起きやすい
という欠点がある。In the conventional blade-type probe card mentioned above, when the probe and wafer come into contact, a force is applied in the vertical direction, which is repeated many times, causing deformation at the part where the probe is attached to the blade, which tends to cause the probe to become misaligned. There is a drawback.
本発明のブレード型プローブカードは、プローブのブレ
ード取り付け部にプローブの変形を防ぐための補強構造
を有している。The blade-type probe card of the present invention has a reinforcing structure at the blade attachment portion of the probe to prevent deformation of the probe.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例である。プローブ１をブレー
ド２に取りつげる部分にプローブ１とブレード２０間に
金属棒３をとりつけた状態を示している。プローブの材
質は寿命２弾性２価格の点からタングステンを用いる。FIG. 1 shows an embodiment of the present invention. A metal rod 3 is shown attached between the probe 1 and the blade 20 at the part where the probe 1 is attached to the blade 2. Tungsten is used as the material for the probe due to its longevity, elasticity, and cost.
ブレードは、金属又は、セラミックが用いられ、プロー
ブのブレードへの取り付けは溶接して行なう。金属棒３
の材質としてはやはりプローブと同じ材質が良い。The blade is made of metal or ceramic, and the probe is attached to the blade by welding. metal rod 3
It is best to use the same material as the probe.
第２図は本発明の他の実施例である。プローブ１とブレ
ード２の間に補強板４をとりつけた状態を示している。FIG. 2 shows another embodiment of the invention. A reinforcing plate 4 is shown attached between the probe 1 and the blade 2.
補強板４の材質は、適度な弾力を持ち、加工しやすいス
テンレスが適当である。この実施例ではブレード２の先
端から出ているプローブ１全体を支えることができ、よ
り上下方向の力に対して変形しにくいという利点がある
。Suitable material for the reinforcing plate 4 is stainless steel, which has appropriate elasticity and is easy to process. This embodiment has the advantage that the entire probe 1 protruding from the tip of the blade 2 can be supported and is less likely to be deformed by vertical forces.
以上説明したように、本発明はブレード型プローブカー
ドのプローブとブレードの取り付け部に補強材を付加す
ることにより、プローブとウェハーとのコンタクト時に
生じる上下方向の力に対して強度を増加することにより
、変形しにくく、長寿命のプローブカードを提供できる
効果がある。As explained above, the present invention adds a reinforcing material to the probe-to-blade attachment portion of a blade-type probe card to increase the strength against the vertical force generated when the probe contacts the wafer. This has the effect of providing a probe card that is resistant to deformation and has a long life.
【図面の簡単な説明】
第１図は、本発明の一実施例を示す側面図である。
第２図は、本発明の他の実施例を示す側面図である。
第３図は、従来のブレード型プローブカードを示す側面
図である。
１・・・・・・プローブ、２・・・・・・ブレード、３
・・・・・・タングステン棒、４・・・・・・ステンレ
ス製板。
代理人 弁理士 内 原 音BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side view showing an embodiment of the present invention. FIG. 2 is a side view showing another embodiment of the invention. FIG. 3 is a side view of a conventional blade-type probe card. 1...Probe, 2...Blade, 3
...Tungsten rod, 4...Stainless steel plate. Agent Patent Attorney Oto Uchihara
Claims (1)
に用いるブレード型プローブカードにおいて、プローブ
のブレード取り付け部にプローブ針に併設してタングス
テンあるいはステンレスから成る補強材をブレードとプ
ローブ間に設けてなることを特徴とするブレード型プロ
ーブカード。In a blade-type probe card used to measure the characteristics of semiconductor devices formed on a wafer, a reinforcing material made of tungsten or stainless steel is provided between the blade and the probe, attached to the probe needle at the blade attachment part of the probe. A blade-type probe card featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10861988A JPH01277766A (en) | 1988-04-28 | 1988-04-28 | Blade-type probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10861988A JPH01277766A (en) | 1988-04-28 | 1988-04-28 | Blade-type probe card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01277766A true JPH01277766A (en) | 1989-11-08 |
Family
ID=14489386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10861988A Pending JPH01277766A (en) | 1988-04-28 | 1988-04-28 | Blade-type probe card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01277766A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008151573A (en) * | 2006-12-15 | 2008-07-03 | Micronics Japan Co Ltd | Electrical connection apparatus and its manufacturing method |
-
1988
- 1988-04-28 JP JP10861988A patent/JPH01277766A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008151573A (en) * | 2006-12-15 | 2008-07-03 | Micronics Japan Co Ltd | Electrical connection apparatus and its manufacturing method |
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