KR0127582Y1 - Dambardie for semiconductor device - Google Patents
Dambardie for semiconductor device Download PDFInfo
- Publication number
- KR0127582Y1 KR0127582Y1 KR2019950024897U KR19950024897U KR0127582Y1 KR 0127582 Y1 KR0127582 Y1 KR 0127582Y1 KR 2019950024897 U KR2019950024897 U KR 2019950024897U KR 19950024897 U KR19950024897 U KR 19950024897U KR 0127582 Y1 KR0127582 Y1 KR 0127582Y1
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- pitch block
- lead
- semiconductor manufacturing
- manufacturing equipment
- seating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
본 고안은 상면 일측에는 반도체 칩의 리드를 안착하기 위한 안착부와 리드칩을 배출하기 위한 배출부가 톱니형상으로 나열되어 이루어진 피치블럭이 형성되어 있고, 피치블럭 하단의 측면에는 도피홈이 형성되어 피치블럭의 배출부에서 배출된 리드칩이 원활하게 배출되도록 형성된 반도체 제조장비의 댐바다이에 있어서, 피치블럭의 안착부 하단에 피치블럭을 지지하도록 형성된 보강바를 부가설치하는 것을 특징으로 하는 반도체 제조장비의 댐바다이에 관한 것이다.According to the present invention, a pitch block is formed on one side of the upper surface in which a seating part for seating a lead of a semiconductor chip and a discharge part for discharging the lead chip are arranged in a sawtooth shape, and an escape groove is formed at a side of the bottom of the pitch block. In the dam body of the semiconductor manufacturing equipment formed to smoothly discharge the lead chip discharged from the discharge portion of the block, Reinforcing bar formed to support the pitch block at the bottom of the seating portion of the pitch block, characterized in that the additional installation of the semiconductor manufacturing equipment It is about dam body.
Description
제1도는 종래의 반도체 제조장비의 댐바다이를 설명하기 위한 도면.1 is a view for explaining a dam body of the conventional semiconductor manufacturing equipment.
제2도는 본 고안의 반도체 제조장비의 댐바다이를 설명하기 위한 도면.2 is a view for explaining a dam body of the semiconductor manufacturing equipment of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
11, 21 : 안착부 12, 22 : 배출부11, 21 seating part 12, 22: discharge part
13, 23 : 도피홈 14 : 댐바절단펀치13, 23: escape home 14: dam bar cutting punch
24 : 보강바 15, 25 : 피치블럭24: reinforcing bar 15, 25: pitch block
본 고안은 리드(lead)와 리드를 전기적으로 절연시키기 위하여 리드칩(leadchip)을 컷팅(cutting)하는 장치인 반도체 제조장비의 댐바다이(dambardie)에 관한 것으로써, 특히 리드칩 컷팅시의 충격이나 손상에 의해 파손되는 것을 방지하기에 적당하도록 한 반도체 제조장비의 댐바다이에 관한 것이다.The present invention relates to a dambardie of semiconductor manufacturing equipment, which is a device for cutting a lead chip in order to electrically insulate the lead from the lead. It relates to a dam body of a semiconductor manufacturing equipment adapted to prevent damage by damage.
제1도의 (a)는 종래의 반도체 제조장비의 댐바다이를 설명하기 위한 도면이며, 제1도의 (b)는 종래의 반도체 제조장비의 댐바다이의 동작을 설명하기 위한 도면이다.(A) of FIG. 1 is a figure for explaining the dam body of the conventional semiconductor manufacturing equipment, and (b) of FIG. 1 is a figure for demonstrating operation | movement of the dam body of the conventional semiconductor manufacturing equipment.
종래의 반도체 제조장비의 댐바다이는 제1도와 같이, 상면 일측에는 반도체 칩의 리드를 안착하기 위한 안착부(11)와 리드칩을 배출하기 위한 배출부(12)가 톱니형상으로 나열되어 이루어진 피치블럭(pitch block)(15)이 형성되어 있고, 피치블럭(15) 하단의 측면에는 도피홈(13)이 형성되어 피치블럭의 배출부(12)에서 배출된 리드칩이 원할하게 배출되도록 형성되어 있다.In the dam body of the conventional semiconductor manufacturing equipment, as shown in FIG. 1, a pitch in which a seating part 11 for seating a lead of a semiconductor chip and a discharge part 12 for discharging a lead chip are arranged in a sawtooth shape on one side of an upper surface thereof. A pitch block 15 is formed, and an escape groove 13 is formed at the lower side of the pitch block 15 so that the lead chip discharged from the discharge portion 12 of the pitch block can be smoothly discharged. have.
제1도의 (b)를 참고로 하여, 종래의 반도체 제조장비의 댐바다이의 동작을 살펴보면 다음과 같다.Referring to (b) of FIG. 1, the operation of the dam body of the conventional semiconductor manufacturing equipment is as follows.
피치블럭의 안착부(11)에 각각의 리드가 놓여지며, 또한 피치블럭의 배출부(12)에는 리드칩이 놓여진다. 이때 리드와 리드 사이의 리드칩을 댐바컷팅펀치(dambar cutting punch)로 컷팅하여 피치블럭의 각각의 배출부(12)에 쌓인 리드칩은 도피홈(13)을 통하여 배출된다.Each lead is placed on the seating portion 11 of the pitch block, and a lead chip is placed on the discharge portion 12 of the pitch block. At this time, the lead chip between the lead and the lead is cut by a dambar cutting punch, and the lead chips accumulated in the respective discharge portions 12 of the pitch block are discharged through the escape grooves 13.
또한, 리드가 안착되는 안착부와 절단부위인 리드칩이 안착이 되어 컷팅되어 배출되는 피치블럭의 배출부(12)로 형성되는 반도체 제조장비의 댐바다이의 피치블럭(15)은 일정간격인 톱니형상의 돌기로 형성되며, 이때 피치블럭(15)은 0.5mm 정도의 미세한 돌기를 이룬다.In addition, the pitch block 15 of the dam body of the semiconductor manufacturing equipment formed of the discharge portion 12 of the pitch block that is cut and discharged is seated and the cutting chip is placed on the cutting portion is a tooth at a constant interval. It is formed as a projection of the shape, the pitch block 15 forms a fine projection of about 0.5mm.
그리고 댐바절단펀치(14)로 리드와 리드사이의 리드칩을 절단하면 피치블럭의 배출부(12)에 리드칩이 쌓이게 된다.When the lead chip between the lead and the lead is cut by the dam bar cutting punch 14, the lead chip is accumulated in the discharge portion 12 of the pitch block.
이러한 과정에서 댐바절단펀치(14)가 수차례의 절단을 행하면 마모가 일어나서 리드칩이 불규칙하게 컷팅되며, 이러한 불규칙한 형상의 리드칩은 피치블럭의 배출부에 억지끼임현상이 일어나고, 그위로 계속 리드칩이 적재가 된다.In this process, when the dam bar cutting punch 14 cuts several times, abrasion occurs and the lead chip is irregularly cut. Such an irregular shape of the lead chip causes interference at the discharge portion of the pitch block, and the lead continues thereon. The chip is loaded.
따라서 피치블럭의 이러한 미세한 돌기는 댐바절단펀치로 수차례의 절단행위로 인하여 발생되는 불규칙한 형상의 리드칩이 피치블럭의 배출부에 억지끼임현상으로 인하여, 피치블럭의 안착부는 하중에 견디지 못하여 쉽게 파손되는 문제점이 있다.Therefore, this fine protrusion of the pitch block is a dam bar cutting punch, which causes the lead chip of irregular shape caused by cutting several times to be jammed at the discharge part of the pitch block, so that the seating part of the pitch block cannot easily withstand the load. There is a problem.
본 고안은 이러한 목적을 해결하고자 안출된 것으로, 반도체제조장비의 댐바다이에 있어서 피치블럭 안착부의 파손을 막기 위한 것이다.The present invention is devised to solve this purpose, and is to prevent the damage of the pitch block seating portion in the dam body of the semiconductor manufacturing equipment.
본 고안은 피치블럭의 배출부 하단에 피치블럭을 지지하도록 형성된 보강바를 부가설치한 반도체제조장비의 댐바다이에 관한 것이다.The present invention relates to a dam body of the semiconductor manufacturing equipment with an additional reinforcing bar formed to support the pitch block at the bottom of the discharge portion of the pitch block.
제2도는 본 고안의 반도체제조장비의 댐바다이를 설명하기 위한 도면이다.2 is a view for explaining the dam body of the semiconductor manufacturing equipment of the present invention.
본 고안의 반도체제조장비의 댐바다이는 제2도와 같이, 상면 일측에는 반도체 칩의 리드를 안착하기 위한 안착부와 리드칩을 배출하기 위한 배출부(22)가 톱니형상으로 나열되어 이루어진 피치블럭(25)이 형성되어 있고, 피치블럭 하단의 측면에는 도피홈(23)이 형성되어 피치블럭(25)의 배출부에서 배출된 리드칩이 원활하게 배출되도록 형성된 반도체제조장비의 댐바다이에 있어서, 배출부(22) 하단에 피치블럭(25)을 지지하도록 형성된 보강바(24)를 부가설치하는 것을 특징으로 한다.In the dam body of the semiconductor manufacturing apparatus of the present invention, as shown in FIG. 2, a pitch block in which a seating part for seating a lead of a semiconductor chip and a discharge part 22 for discharging the lead chip is arranged in a sawtooth shape on one side of the upper surface ( 25) is formed, the escape groove 23 is formed on the side of the pitch block lower end in the dam body of the semiconductor manufacturing equipment formed to smoothly discharge the lead chip discharged from the discharge portion of the pitch block 25, Reinforcing bar 24 formed to support the pitch block 25 in the lower portion 22 is characterized in that the additional installation.
반도체 제조장비의 댐바다이의 피치블럭(25)은 리드가 안착되는 안착부(21)와 절단부위인 리드칩이 안착, 컷팅되어 배출되는 배출부(22)로 형성되며, 일정간격으로 배출부(22)와 안착부(21)가 톱니형상의 미세한 돌기를 이룬다.The pitch block 25 of the dam body of the semiconductor manufacturing equipment is formed of a seating portion 21 on which the lead is seated, and a discharge portion 22 on which the lead chip, which is a cutting portion, is seated and cut, is discharged. 22) and the seating portion 21 form a sawtooth minute protrusion.
이때, 피치블럭(25)은 0.5mm 정도의 일정간격을 이룬다. 이러한 피치블럭(25)의 미세한 돌기는 리드칩을 컷팅하는 댐바절단펀치와 피치블럭의 배출부에 적재된 리드칩으로 누르는 하중에 견디도록 피치블럭의 안착부(21) 하부에 돌기를 지지보강할 수 있는 보강바(24)를 형성하는데, 이때 피치블럭이 배출부(22) 하부의 보강바(24)는 피치블럭의 안착부 하면과 도피홈면에 접하여 형성되되, 도피홈면과 접한 면의 반대편의 상부는 도피홈면에 대하여 약 30°의 각도로 기울어지고, 하부는 도피홈면에 대하여 약 20°의 각도로 기울어져서 형성되어 이루어진다.At this time, the pitch block 25 forms a predetermined interval of about 0.5mm. The fine protrusion of the pitch block 25 may support and strengthen the protrusion under the seating portion 21 of the pitch block so as to withstand the load applied by the dam bar cutting punch for cutting the lead chip and the lead chip loaded on the discharge portion of the pitch block. The reinforcement bar 24 may be formed, wherein the pitch block is formed in contact with the bottom surface of the seating portion of the pitch block and the surface of the escape groove, and the opposite side of the surface in contact with the surface of the escape groove. Top Is inclined at an angle of about 30 ° with respect to the escape groove surface, Is inclined at an angle of about 20 ° with respect to the escape groove surface.
그러므로써, 보강바(24)는 미세한 돌기로 형성된 피치블럭(25)을 지지보강하여 주는 역할을 한다.Therefore, the reinforcing bar 24 serves to support and reinforce the pitch block 25 formed with fine projections.
본 고안의 반도체제조장비의 댐바다이는 피치블럭의 하부에 피치블럭의 안착부의 파손을 막을 수 있도록 피치블럭 보강바를 형성하여 피치블럭을 지지할 수 있고 또한, 이로 인하여 장비의 불량율을 감소시켜 생산성을 향상시킬 수 있다.The dam body of the semiconductor manufacturing equipment of the present invention can support the pitch block by forming a pitch block reinforcing bar at the lower portion of the pitch block to prevent the breakage of the seating portion of the pitch block. Can be improved.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950024897U KR0127582Y1 (en) | 1995-09-15 | 1995-09-15 | Dambardie for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950024897U KR0127582Y1 (en) | 1995-09-15 | 1995-09-15 | Dambardie for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970015311U KR970015311U (en) | 1997-04-28 |
| KR0127582Y1 true KR0127582Y1 (en) | 1998-12-01 |
Family
ID=19423380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019950024897U KR0127582Y1 (en) | 1995-09-15 | 1995-09-15 | Dambardie for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0127582Y1 (en) |
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1995
- 1995-09-15 KR KR2019950024897U patent/KR0127582Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR970015311U (en) | 1997-04-28 |
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