JPH01276657A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPH01276657A JPH01276657A JP10718888A JP10718888A JPH01276657A JP H01276657 A JPH01276657 A JP H01276657A JP 10718888 A JP10718888 A JP 10718888A JP 10718888 A JP10718888 A JP 10718888A JP H01276657 A JPH01276657 A JP H01276657A
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- resin
- lead frame
- air
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims abstract description 49
- 239000011347 resin Substances 0.000 claims abstract description 43
- 229920005989 resin Polymers 0.000 claims abstract description 43
- 239000004065 semiconductor Substances 0.000 claims abstract description 23
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000011068 loading method Methods 0.000 abstract description 11
- 238000002347 injection Methods 0.000 abstract description 8
- 239000007924 injection Substances 0.000 abstract description 8
- 238000000465 moulding Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、主に樹脂封止型半導体装置部品に利用するこ
とのできるリードフレームに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a lead frame that can be used mainly for resin-sealed semiconductor device parts.
従来の技術
第４図は従来のリードフレームの平面図、第５図は同従
来のリードフレームの樹脂封止状態を示す断面図であり
、第４図において、２１は樹脂封止型半導体装置用のリ
ードフレームで、半導体素子２２（第５図参照）を積載
する半導体素子積載部２３と、この半導体素子積載部２
３をそのコーナ部で外枠部２４につないで支持する半導
体素子積載部支持部２５と、内部リード部２６および外
部リード部２７と、これらの内部および外部リード部２
６．２７を隣りどうし、および外枠部２４に結合する結
合部２８とを有する。従来、半導体装置の樹脂封止は、
第５図に示すように前工程を終えたリードフレーム２１
を封止金型２９Ａ、 ２９Ｂによりはさみ、封止樹脂３
０を封止樹脂注入口３１より注入することにより行われ
る。BACKGROUND ART FIG. 4 is a plan view of a conventional lead frame, and FIG. 5 is a cross-sectional view showing a resin-sealed state of the conventional lead frame. In FIG. This lead frame includes a semiconductor element loading section 23 on which semiconductor elements 22 (see FIG. 5) are loaded, and this semiconductor element loading section 2.
3, a semiconductor element loading section supporting section 25 that connects and supports the semiconductor element loading section 3 at its corner portion to the outer frame section 24, an internal lead section 26, an external lead section 27, and these internal and external lead sections 2.
6.27 are adjacent to each other and have a connecting portion 28 that connects them to the outer frame portion 24. Conventionally, resin encapsulation of semiconductor devices is
Lead frame 21 after the previous process as shown in Fig. 5
between the sealing molds 29A and 29B, and the sealing resin 3
This is done by injecting 0 from the sealing resin injection port 31.
発明が解決しようとする課題
ところが、このような樹脂封止工程においては、封止樹
脂３０が成形される部分より外部にはみ出さないように
、リードフレーム２１と封止金型２９Ａ。Problems to be Solved by the Invention However, in such a resin sealing process, the lead frame 21 and the sealing mold 29A must be sealed so that the sealing resin 30 does not protrude beyond the molded portion.
２９Ｂにより樹脂成形部の内部は外部から閉ざされた構
造となっているため、封止樹脂注入中にリードフレーム
２１と封止金型２９Ａ、２９Ｂによって閉ざされた部分
にある空気が外部に十分放出されず、樹脂成形体内に気
泡３２として残ったり、封止樹脂３０の未充填部分３３
を引きおこすという問題がある。Since the inside of the resin molded part is closed from the outside by 29B, the air in the part closed by the lead frame 21 and the sealing molds 29A and 29B is sufficiently released to the outside during injection of the sealing resin. Otherwise, air bubbles 32 may remain in the resin molded product, or unfilled portions 33 of the sealing resin 30 may remain.
The problem is that it causes
このため、従来は封止金型２９Ａ、 ２９Ｂに１１詣成
形部から外部に向かう浅い清であるエアーベンド３４を
１個所ないしそれ以上設けることにより金型内部の空気
を外部に放出していたが、封止樹脂３０が注入されると
ともにエアーベンド３４は順次閉ざされていくため、最
後まで完全に内部の空気を外部に放出できず、樹脂成形
体内の気泡３２や未充填部分３３を完全に防止すること
ができないという問題があった。For this reason, conventionally, the air inside the molds was discharged to the outside by providing one or more shallow air bends 34 extending from the molding part to the outside in the sealing molds 29A and 29B. As the sealing resin 30 is injected and the air bends 34 are closed one after another, the internal air cannot be completely released to the outside until the end, completely preventing air bubbles 32 and unfilled areas 33 in the resin molding. The problem was that I couldn't do it.
本発明はこのような従来の問題点を解消するものであり
、気泡や未充填のない樹脂封止ができるリードフレーム
を提供することを目的とするものである。The present invention solves these conventional problems, and aims to provide a lead frame that can be sealed with resin without bubbles or unfilled parts.
課題を解決するための手段
上記問題を解決するために、本発明のリードフレームは
、樹脂封止部内側位置から樹脂封止部外側位置まで貫通
ずる溝部を設けたものである。Means for Solving the Problems In order to solve the above-mentioned problems, the lead frame of the present invention is provided with a groove portion passing through from a position inside the resin sealing part to a position outside the resin sealing part.
作用
上記構成により、樹脂封止工程において封止樹脂体内に
残った空気は溝部を通じて全て樹脂封止部の外側に放出
することができ、成形樹脂体内の気泡や未充填を完全に
防止することができる。Effect With the above configuration, all the air remaining in the sealing resin body during the resin sealing process can be released to the outside of the resin sealing part through the groove, and it is possible to completely prevent air bubbles and unfilling in the molded resin body. can.
実施例
以下、本発明の一実施例について、図面を参照しながら
説明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例におけるリードフレームの斜
視図、第２図は同リードフレームの平面図、第３図は同
リードフレームの樹脂封止状態を示す断面図である。第
１図〜第３図において、１は樹脂封止型半導体装置用の
リードフレームで、半導体素子２を積載する半導体素子
積載部３と、この半導体素子積載部３をそのコーナ部で
外枠部４につないで支持する半導体素子積載部支持部５
と、内部リード部６および外部リード部７と、これらの
内部および外部リード部６，７を隣りどうし、および外
枠部４に結合する結合部８とを有する。さらにリードフ
レーム１には、各半導体素子ＷＩｔ１１部３の少なくと
も１箇所のコーナ部に対応する位置に、半導体素子積載
部３の周囲の空間部９から外枠部４の位置にまで貫通す
る溝部１０が形成されている。また、１１Ａ、１１Ｂは
、リードフレーム１を半導体素子２を配置した半導体素
子積載部３を中央に位置させて上下より挾む封止金型で
、適当箇所に封止樹脂注入口１２が設けられているとと
もに、リードフレーム１の溝部１０に対応する位置にエ
アーベンド１３が形成されている。１４は封止金型１１
Ａ、１１Ｂの間に満たされる封止樹脂である。FIG. 1 is a perspective view of a lead frame according to an embodiment of the present invention, FIG. 2 is a plan view of the lead frame, and FIG. 3 is a sectional view showing the lead frame in a resin-sealed state. 1 to 3, reference numeral 1 denotes a lead frame for a resin-sealed semiconductor device, which includes a semiconductor element loading section 3 on which a semiconductor element 2 is loaded, and an outer frame portion of the semiconductor element loading section 3 at its corner. Semiconductor element loading part support part 5 connected to and supported by 4
, an inner lead portion 6, an outer lead portion 7, and a connecting portion 8 that connects the inner and outer lead portions 6 and 7 to each other and to the outer frame portion 4. Further, in the lead frame 1, a groove portion 10 that penetrates from the space 9 around the semiconductor device mounting portion 3 to the position of the outer frame portion 4 is provided at a position corresponding to at least one corner portion of each semiconductor device WIt11 portion 3. is formed. Further, 11A and 11B are sealing molds in which a lead frame 1 is sandwiched from above and below with a semiconductor element loading section 3 in which a semiconductor element 2 is arranged placed in the center, and a sealing resin injection port 12 is provided at an appropriate location. At the same time, air bends 13 are formed at positions corresponding to the grooves 10 of the lead frame 1. 14 is a sealing mold 11
This is a sealing resin filled between A and 11B.
上記構成において、リードフレーム１は封止金型１１Ａ
、１１Ｂによって上下からはさみ込まれ、封止樹脂注入
口１２より封止樹脂１４を注入することにより樹脂封止
が行われる。このとき封止金型１１Ａ。In the above configuration, the lead frame 1 has a sealing mold 11A.
, 11B from above and below, and resin sealing is performed by injecting the sealing resin 14 from the sealing resin injection port 12. At this time, the sealing mold 11A.
１１Ｂの中に残された空気は封止樹脂１４の注入により
溝部１０およびエアーベンド１３を介して全て外部に放
出され、封止金型１１Ａ、１１Ｂの中は封止樹脂１４で
満たされる。この際に、抜ける空気の通路として、エア
ーベンド１３だけでなく溝部１０も形成されているので
、封止金型１１Ａ、１１Ｂの中に封止樹脂１４で満なさ
れるまでに空気の通路が目づまりすることはなく、内部
の空気を外部に完全に放出でき、樹脂成形部分内に気泡
や未充填箇所が残ることはない。The air remaining in the molds 11B is completely discharged to the outside through the groove portion 10 and the air bend 13 by injection of the sealing resin 14, and the insides of the sealing molds 11A and 11B are filled with the sealing resin 14. At this time, since not only the air bend 13 but also the groove 10 is formed as a passage for the air to escape, the air passage is clearly visible before the sealing molds 11A and 11B are filled with the sealing resin 14. There is no clogging, the internal air can be completely released to the outside, and no air bubbles or unfilled areas remain within the resin molded part.
発明の効果
以上のように本発明によれば、リードフレームに樹脂封
止部内側位置からｖＩＪ脂對止側止側位置まで貫通する
溝部を設けることにより、気泡や未充填のない優れた樹
脂封止が行われた半導体装置を実現できるものである。Effects of the Invention As described above, according to the present invention, by providing the lead frame with a groove that penetrates from the inside position of the resin sealing part to the vIJ resin sealing side position, excellent resin sealing without air bubbles or unfilled parts can be achieved. Accordingly, it is possible to realize a semiconductor device in which the process is stopped.
第１図は本発明の一実施例における半導体装置用リード
フレームの斜視図、第２図は同リードフレームの平面図
、第３図は同リードフレームの樹脂封止状態を示す断面
図、第４図は従来のリードフレームの平面図、第５図は
同従来のリードフレームの樹脂封止状態を示す断面図で
ある。
１・・・リードフレーム、２・・・半導体素子、３・・
・半導体素子積載部、４・・・外枠部、５・・・半導体
素子積載部支持部、６・・・内部リード部、７・・・外
部リード部、８・・・結合部、１０・・・溝部、ＩＩＡ
、ＩＩＢ・・・封止金型、１２・・・封止樹脂注入口、
１３・・・エアーベンド、１４・・・封止樹脂。
代理人 森 本 義 弘
第１図
！
／
？
ｔ・・−炒Ｙ゛フし−１６、Δ−−ψコ部１）−Ｍ、り
うＳ−半部！）４麟Ｌ＃ｐ／ρ−寺狸
第４図
第ダ図
２ｆ’Ｂ
＼FIG. 1 is a perspective view of a lead frame for a semiconductor device according to an embodiment of the present invention, FIG. 2 is a plan view of the lead frame, FIG. 3 is a sectional view showing the lead frame in a resin-sealed state, and FIG. The figure is a plan view of a conventional lead frame, and FIG. 5 is a sectional view showing the conventional lead frame in a resin-sealed state. 1...Lead frame, 2...Semiconductor element, 3...
- Semiconductor element loading section, 4... Outer frame section, 5... Semiconductor element loading section support section, 6... Internal lead section, 7... External lead section, 8... Coupling section, 10. ...Mizobe, IIA
, IIB... Sealing mold, 12... Sealing resin injection port,
13... Air bend, 14... Sealing resin. Agent Yoshihiro Morimoto Figure 1! / ? t...-Fried Y゛Fushi-16, Δ--ψko part 1)-M, Riu S-half part! )4RinL#p/ρ-Teratanuki Figure 4Da Figure 2f'B \
Claims (1)
よび結合部を有するリードフレームであつて、樹脂封止
部内側位置から樹脂封止部外側位置まで貫通する溝部を
設けたリードフレーム。1. A lead frame having a semiconductor element mounting portion, an internal lead portion, an external lead portion, and a coupling portion, the lead frame having a groove portion penetrating from a position inside the resin sealing portion to a position outside the resin sealing portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10718888A JPH01276657A (en) | 1988-04-27 | 1988-04-27 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10718888A JPH01276657A (en) | 1988-04-27 | 1988-04-27 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01276657A true JPH01276657A (en) | 1989-11-07 |
Family
ID=14452701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10718888A Pending JPH01276657A (en) | 1988-04-27 | 1988-04-27 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01276657A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0536847U (en) * | 1991-10-16 | 1993-05-18 | 株式会社三井ハイテツク | Lead frame |
| US5293065A (en) * | 1992-08-27 | 1994-03-08 | Texas Instruments, Incorporated | Lead frame having an outlet with a larger cross sectional area than the inlet |
| KR100247385B1 (en) * | 1997-10-14 | 2000-03-15 | 김규현 | The top cavity insert of mold for semiconductor package |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6281737A (en) * | 1985-10-07 | 1987-04-15 | Hitachi Ltd | Manufacture of semiconductor and lead frame |
| JPS62108562A (en) * | 1985-11-06 | 1987-05-19 | Hitachi Ltd | Lead frame for semiconductor device |
-
1988
- 1988-04-27 JP JP10718888A patent/JPH01276657A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6281737A (en) * | 1985-10-07 | 1987-04-15 | Hitachi Ltd | Manufacture of semiconductor and lead frame |
| JPS62108562A (en) * | 1985-11-06 | 1987-05-19 | Hitachi Ltd | Lead frame for semiconductor device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0536847U (en) * | 1991-10-16 | 1993-05-18 | 株式会社三井ハイテツク | Lead frame |
| US5293065A (en) * | 1992-08-27 | 1994-03-08 | Texas Instruments, Incorporated | Lead frame having an outlet with a larger cross sectional area than the inlet |
| KR100247385B1 (en) * | 1997-10-14 | 2000-03-15 | 김규현 | The top cavity insert of mold for semiconductor package |
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