JPH01273395A - Cooling structure of elelctronic-equipment case body - Google Patents

Cooling structure of elelctronic-equipment case body

Info

Publication number
JPH01273395A
JPH01273395A JP10142688A JP10142688A JPH01273395A JP H01273395 A JPH01273395 A JP H01273395A JP 10142688 A JP10142688 A JP 10142688A JP 10142688 A JP10142688 A JP 10142688A JP H01273395 A JPH01273395 A JP H01273395A
Authority
JP
Japan
Prior art keywords
electronic
section
power supply
housing
equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10142688A
Other languages
Japanese (ja)
Other versions
JP2625866B2 (en
Inventor
Makoto Endo
誠 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP10142688A priority Critical patent/JP2625866B2/en
Publication of JPH01273395A publication Critical patent/JPH01273395A/en
Application granted granted Critical
Publication of JP2625866B2 publication Critical patent/JP2625866B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To keep the ambient temperatures of a medium storage means and a medium at a temperature stable at all times by discharging the heat of an electronic-equipment housing section to the outside of a box body by directly connecting the electronic- equipment housing section in a housing chamber to a power supply chamber by an air duct. CONSTITUTION:An electronic-equipment box body has a power supply chamber 2 and a housing chamber 3 separated to the left and the right by a partition wall 1a, the housing chamber 3 is divided vertically into a medium housing section and an electronic-equipment housing section by a partition member 1d, and the opening section 1e of the partition member installed to the upper section of the electronic-equipment housing section and the ventilating hole of the partition wall 1a formed to a section upper than the opening section 1e are coupled by an air duct 9. Air heated by an electronic equipment in the electronic-equipment housing section rises, is introduced into the air duct 9 through the opening section 1e of the partition member 1d shaped between the electronic-equipment housing section and the medium housing section, is moved to the power supply chamber 2 through the ventilating hole 1c of the partition wall 1a, and is discharged to the outside of the case body from the opening section 1b of the box body by a cooling fan 8 in the power supply chamber.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電子機器および電源装置を収納する筐体の冷却
構造に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling structure for a housing housing an electronic device and a power supply device.

〔従来の技術〕[Conventional technology]

従来、この種の筐体は、例えば、集合型光デイスク装置
に使用されている。第2図はこの集合型光デイスク装置
の縦断面図である。これを同図について説明すると、笛
体1の内部は電源室2と収納室3とに隔壁11によって
分離されている。電源室2には電源用等の機器4a〜4
cが収納され、また電源室2の上部には冷却ファン8が
設けられ、筐体1の上面には開口1bが設けられている
。収納室3は下部の電子機器収納部と上部の媒体収納部
とからなり、電子機器収納部には各2台のデツキ5&と
電子機器5bとから構成される光デイスクユニット5が
設置され、媒体収納部には光デイスク媒体7の入った媒
体保管器6が設置されている。
Conventionally, this type of casing has been used, for example, in collective optical disk devices. FIG. 2 is a longitudinal sectional view of this collective optical disk device. To explain this with reference to the figure, the inside of the flute body 1 is separated into a power supply chamber 2 and a storage chamber 3 by a partition wall 11. In the power supply room 2, there are devices 4a to 4 for power supply, etc.
A cooling fan 8 is provided in the upper part of the power supply room 2, and an opening 1b is provided in the upper surface of the housing 1. The storage chamber 3 consists of an electronic device storage section at the bottom and a medium storage section at the top. Optical disk units 5 each consisting of two decks 5& and two electronic devices 5b are installed in the electronic device storage sections. A medium storage device 6 containing an optical disk medium 7 is installed in the storage section.

この集合型光デイスク装置は電源を投入し操作を開始す
ると、電源室2の電源用等の機器4a〜4Cが発熱する
。この発熱によシ熱せられた周囲の空気は、矢印で示す
ように電源室2の上部へと移動し、冷却ファン8によシ
筐体1上部に設けた開口1bから筐体外へと排出される
。一方、収納室3においては、下部に配置された上下2
台の光デイスクユニット5内の電子機器5bの発熱によ
シ熱せられた空気は矢印の方向へと移動し、収納室3の
上部の媒体保管手段6および光ディスク媒体7の周囲を
対流するかまたは収納室3の上部に澱むことになる。
When this collective optical disk device is powered on and starts operating, the power supply devices 4a to 4C in the power supply room 2 generate heat. The surrounding air heated by this generation moves to the upper part of the power supply room 2 as shown by the arrow, and is exhausted to the outside of the housing through the opening 1b provided in the upper part of the housing 1 by the cooling fan 8. Ru. On the other hand, in the storage room 3, the upper and lower 2
The air heated by the heat generated by the electronic device 5b in the optical disk unit 5 of the stand moves in the direction of the arrow and convects around the medium storage means 6 and the optical disk medium 7 in the upper part of the storage chamber 3. It will accumulate in the upper part of the storage chamber 3.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の筐体の冷却構造では、収納室3内の熱は
、隔壁によって電源室と分離されているため、筐体外へ
排出されることがないから、媒体収納部の温度を上昇さ
せるという不都合があった。
In the conventional case cooling structure described above, the heat inside the storage chamber 3 is separated from the power supply room by a partition wall, so it is not discharged outside the case, which increases the temperature of the medium storage section. There was an inconvenience.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の電子機器筐体の冷却構造は、隔壁で左右に分離
した電源室と収納室とを有し、この収納室を媒体収納部
と電子機器収納部とに仕切部材で上下に仕切り、前記電
子機器収納部の上方に設けた前記仕切部材の開口部とこ
の開口部よシ上方に設けられた前記隔壁の通風口とをエ
アダクトで連結したものである。
The cooling structure for an electronic device case of the present invention has a power supply chamber and a storage chamber that are separated left and right by a partition wall, and the storage chamber is vertically partitioned into a medium storage section and an electronic device storage section by a partition member, and An air duct connects an opening of the partition member provided above the electronic device storage section and a ventilation port of the partition wall provided above the opening.

〔作用〕[Effect]

電子機器収納部の電子機器によシ熱せられた空気は上昇
し、媒体収納部との間に設けた仕切部材の開口部を通っ
てエアダクトに導入され、隔壁の通風口を経て電源室へ
と移動し、電源室内の冷却ファンで筐体の開口部から筐
体外へ排出される。
The air heated by the electronic devices in the electronic device storage section rises, enters the air duct through the opening in the partition member provided between it and the media storage section, and flows into the power supply room through the ventilation hole in the partition wall. The cooling fan inside the power supply room exhausts the air out of the housing through the opening in the housing.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図は本発明の電子機器筐体の冷却構造の一実施例を
示す集合型光デイスク装置の縦断面図である。筐体1の
内部は電源室2と収納室3とに隔壁1aによシ左右に分
離され、電源室2には電源用等の機器4&〜4cが収納
され、またこの電源室2上部には冷却ファン8が設けら
れ、筐体1の上面には開口1bが設けられている。収納
室3は仕切部材1dによって下部の電子機器収納部と上
部の媒体収納部とに仕切られている。下部の電子機器収
納部には上下2台の光デイスクユニット5が設置され、
この光デイスクユニット5はデツキ5凰と電子機器5b
とで構成されている。上部の媒体収納部には媒体保管器
6を設置し、中に光デイスク媒体7が保管されている。
FIG. 1 is a longitudinal cross-sectional view of a collective optical disk device showing an embodiment of the cooling structure for an electronic device housing according to the present invention. The inside of the casing 1 is divided into a power supply room 2 and a storage room 3 on the left and right sides by a partition wall 1a.The power supply room 2 stores equipment 4&~4c for power supply, and the upper part of the power supply room 2 contains A cooling fan 8 is provided, and an opening 1b is provided on the top surface of the housing 1. The storage chamber 3 is partitioned by a partition member 1d into a lower electronic device storage section and an upper medium storage section. Two optical disk units 5, upper and lower, are installed in the electronic device storage section at the bottom.
This optical disk unit 5 includes a deck 5o and an electronic device 5b.
It is made up of. A medium storage device 6 is installed in the upper medium storage section, and an optical disk medium 7 is stored therein.

前記仕切部材1dには電子機器5bの上方に相当する位
置に開口部1eが設けられ、この開口部1eにエアダク
ト9の一端が接続されている。このエアダクト9の他端
は、前記開口部1・よシ上方位置に設けられた前記隔壁
1aの通風口1cに接続されている。
The partition member 1d is provided with an opening 1e at a position corresponding to above the electronic device 5b, and one end of the air duct 9 is connected to the opening 1e. The other end of the air duct 9 is connected to a ventilation port 1c of the partition wall 1a provided above the opening 1.

したがって、この集合型光デイスク装置に電源を投入し
操作を開始すると、電源用等の機器41〜4cの発熱に
より熱せられた空気は、第1図に矢印で示すように冷却
ファン8の吸気力によシ筐体1の開口1bから筐体外へ
排出される。一方、収納室3においては、下部の上下2
台の光デイスクユニット5内の電子機器5bの発熱によ
シ周辺の熱せられた空気は、下段仕切部材1dの開口1
eを経て上段の電子機器5b周辺の熱せられた空気と合
流し、上段仕切部材1dの開口1eからエアダクト9の
下端に導入される。エアダクト9内の空気は前記隔壁1
aの通風口1cへと導かれ、電源室2内の熱せられた空
気と一緒に冷却ファン8によって筐体1の開口1bから
筐体外へ排出される。
Therefore, when the power is turned on and the operation of this collective optical disk device is started, the air heated by the heat generated by the power supply devices 41 to 4c is heated by the suction force of the cooling fan 8 as shown by the arrow in FIG. The liquid is then discharged from the opening 1b of the housing 1 to the outside of the housing. On the other hand, in the storage room 3, the upper and lower 2
The heated air around the electronic device 5b in the optical disk unit 5 of the stand is discharged through the opening 1 of the lower partition member 1d.
e, it joins with the heated air around the upper electronic device 5b, and is introduced into the lower end of the air duct 9 through the opening 1e of the upper partition member 1d. The air in the air duct 9 flows through the partition wall 1
The air is guided to the ventilation port 1c of the housing 1, and is discharged from the housing 1 through the opening 1b of the housing 1 by the cooling fan 8 together with the heated air inside the power supply room 2.

以上、2室構造の集合型光デイスク装置について説明し
たが、本発明は2室構造以外の筐体にも、また、光デイ
スク以外の媒体を用いる同釉の装置にも適用できること
はいうまでもない。
Although the above description has been made of a collective optical disk device with a two-chamber structure, it goes without saying that the present invention can be applied to cases other than the two-chamber structure, and to devices with the same glaze that use media other than optical disks. do not have.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、収納室内の電子機器収納
部をエアダクトによって電源室と直接連結するという簡
単な構造で電子機器収納部の熱を筐体外へ排出するので
、媒体保管手段および媒体の周囲温度を常に安定した温
度に保つことが可能となシ、温度変化による媒体の損傷
を防止でき、媒体の信頼性を一段と高める効果がある。
As explained above, the present invention has a simple structure in which the electronic device storage section in the storage chamber is directly connected to the power supply room through an air duct, and heat in the electronic device storage section is discharged to the outside of the housing. It is possible to keep the ambient temperature at a stable temperature at all times, prevent damage to the medium due to temperature changes, and further improve the reliability of the medium.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例を示す集合型光デイスク装置
の縦断面図、第2図は従来の筐体の冷却構造をもつ集合
型光デイスク装置の縦断面図である。 1・・・・筐体、1凰・拳・・隔壁、1c・・・・通風
口、1dΦ・・・仕切部材、1@・・・・開口、2・・
・・電源室、3・φ・・収納室、9・・−・エアダクト
。 特許出動人 日本電気株式会社
FIG. 1 is a vertical cross-sectional view of a collective optical disk device showing an embodiment of the present invention, and FIG. 2 is a vertical cross-sectional view of a collective optical disk device having a conventional housing cooling structure. 1...Housing, 1-Fist...Partition, 1c...Ventilation port, 1dΦ...Partition member, 1@...Opening, 2...
・・Power supply room, 3・φ・・Storage room, 9・・・Air duct. Patent applicant NEC Corporation

Claims (1)

【特許請求の範囲】[Claims] 隔壁で左右に分離した電源室と収納室とを有し、この収
納室を媒体収納部と電子機器収納部とに仕切部材で上下
に仕切り、前記電子機器収納部の上方に設けた前記仕切
部材の開口とこの開口より上方に設けられた前記隔壁の
通風口とをエアダクトで連結したことを特徴とする電子
機器筐体の冷却構造。
It has a power supply room and a storage room separated left and right by a partition, the storage room is vertically partitioned into a medium storage part and an electronic equipment storage part by a partition member, and the partition member is provided above the electronic equipment storage part. A cooling structure for an electronic device housing, characterized in that an air duct connects an opening in the partition wall with a ventilation hole provided above the opening in the partition wall.
JP10142688A 1988-04-26 1988-04-26 Electronic device housing cooling structure Expired - Fee Related JP2625866B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10142688A JP2625866B2 (en) 1988-04-26 1988-04-26 Electronic device housing cooling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10142688A JP2625866B2 (en) 1988-04-26 1988-04-26 Electronic device housing cooling structure

Publications (2)

Publication Number Publication Date
JPH01273395A true JPH01273395A (en) 1989-11-01
JP2625866B2 JP2625866B2 (en) 1997-07-02

Family

ID=14300380

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10142688A Expired - Fee Related JP2625866B2 (en) 1988-04-26 1988-04-26 Electronic device housing cooling structure

Country Status (1)

Country Link
JP (1) JP2625866B2 (en)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992019130A1 (en) * 1991-05-07 1992-11-12 Colorado Tech Designs, Inc. Tape cartridge data storage library system
EP0810511A1 (en) * 1996-05-14 1997-12-03 Hewlett-Packard Company Component cooling arrangement in electronic equipment with internal power supply
US6119244A (en) * 1998-08-25 2000-09-12 Network Appliance, Inc. Coordinating persistent status information with multiple file servers
US6279011B1 (en) 1998-06-19 2001-08-21 Network Appliance, Inc. Backup and restore for heterogeneous file server environment
US6289356B1 (en) 1993-06-03 2001-09-11 Network Appliance, Inc. Write anywhere file-system layout
US6343984B1 (en) * 1998-11-30 2002-02-05 Network Appliance, Inc. Laminar flow duct cooling system
US6412292B2 (en) 2000-05-09 2002-07-02 Toc Technology, Llc Computer rack heat extraction device
US6480969B1 (en) 1993-06-04 2002-11-12 Network Appliance, Inc. Providing parity in a RAID sub-system using non-volatile memory
US6494050B2 (en) 2000-02-18 2002-12-17 Toc Technology, Llc Computer rack heat extraction device
US6516351B2 (en) 1997-12-05 2003-02-04 Network Appliance, Inc. Enforcing uniform file-locking for diverse file-locking protocols
US6557357B2 (en) 2000-02-18 2003-05-06 Toc Technology, Llc Computer rack heat extraction device
US6574591B1 (en) 1998-07-31 2003-06-03 Network Appliance, Inc. File systems image transfer between dissimilar file systems
US6574970B2 (en) 2000-02-18 2003-06-10 Toc Technology, Llc Computer room air flow method and apparatus
US6668565B1 (en) 2002-04-12 2003-12-30 American Power Conversion Rack-mounted equipment cooling
US6715034B1 (en) 1999-12-13 2004-03-30 Network Appliance, Inc. Switching file system request in a mass storage system
US6859366B2 (en) 2003-03-19 2005-02-22 American Power Conversion Data center cooling system
US6961749B1 (en) 1999-08-25 2005-11-01 Network Appliance, Inc. Scalable file server with highly available pairs
US7173820B2 (en) 2003-03-19 2007-02-06 American Power Conversion Corporation Data center cooling
US7259963B2 (en) 2004-12-29 2007-08-21 American Power Conversion Corp. Rack height cooling
US7841199B2 (en) 2005-05-17 2010-11-30 American Power Conversion Corporation Cold aisle isolation
JP2015050929A (en) * 2013-08-30 2015-03-16 エルエス産電株式会社Lsis Co., Ltd. Inverter cooling apparatus

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992019130A1 (en) * 1991-05-07 1992-11-12 Colorado Tech Designs, Inc. Tape cartridge data storage library system
US6289356B1 (en) 1993-06-03 2001-09-11 Network Appliance, Inc. Write anywhere file-system layout
US6480969B1 (en) 1993-06-04 2002-11-12 Network Appliance, Inc. Providing parity in a RAID sub-system using non-volatile memory
EP0810511A1 (en) * 1996-05-14 1997-12-03 Hewlett-Packard Company Component cooling arrangement in electronic equipment with internal power supply
US6094345A (en) * 1996-05-14 2000-07-25 Hewlett-Packard Company Component cooling arrangement in electronic equipment with internal power supply
US7293097B2 (en) 1997-12-05 2007-11-06 Network Appliance, Inc. Enforcing uniform file-locking for diverse file-locking protocols
US6516351B2 (en) 1997-12-05 2003-02-04 Network Appliance, Inc. Enforcing uniform file-locking for diverse file-locking protocols
US6279011B1 (en) 1998-06-19 2001-08-21 Network Appliance, Inc. Backup and restore for heterogeneous file server environment
US6574591B1 (en) 1998-07-31 2003-06-03 Network Appliance, Inc. File systems image transfer between dissimilar file systems
US6119244A (en) * 1998-08-25 2000-09-12 Network Appliance, Inc. Coordinating persistent status information with multiple file servers
US6468150B1 (en) * 1998-11-30 2002-10-22 Network Appliance, Inc. Laminar flow duct cooling system
US6343984B1 (en) * 1998-11-30 2002-02-05 Network Appliance, Inc. Laminar flow duct cooling system
US6961749B1 (en) 1999-08-25 2005-11-01 Network Appliance, Inc. Scalable file server with highly available pairs
US6715034B1 (en) 1999-12-13 2004-03-30 Network Appliance, Inc. Switching file system request in a mass storage system
US6557357B2 (en) 2000-02-18 2003-05-06 Toc Technology, Llc Computer rack heat extraction device
US6722151B2 (en) 2000-02-18 2004-04-20 Toc Technology, Llc Computer rack heat extraction device
US6745579B2 (en) 2000-02-18 2004-06-08 Toc Technology, Llc Computer room air flow method and apparatus
US6494050B2 (en) 2000-02-18 2002-12-17 Toc Technology, Llc Computer rack heat extraction device
US6574970B2 (en) 2000-02-18 2003-06-10 Toc Technology, Llc Computer room air flow method and apparatus
US6412292B2 (en) 2000-05-09 2002-07-02 Toc Technology, Llc Computer rack heat extraction device
US6668565B1 (en) 2002-04-12 2003-12-30 American Power Conversion Rack-mounted equipment cooling
US8432690B2 (en) 2003-03-19 2013-04-30 American Power Conversion Corporation Data center cooling
US6859366B2 (en) 2003-03-19 2005-02-22 American Power Conversion Data center cooling system
US7173820B2 (en) 2003-03-19 2007-02-06 American Power Conversion Corporation Data center cooling
US8780555B2 (en) 2003-03-19 2014-07-15 American Power Conversion Corporation Data center cooling
US7881057B2 (en) 2003-03-19 2011-02-01 American Power Conversion Corporation Data center cooling
US7259963B2 (en) 2004-12-29 2007-08-21 American Power Conversion Corp. Rack height cooling
US8156753B2 (en) 2005-05-17 2012-04-17 American Power Conversion Corporation Cold aisle isolation
US7992402B2 (en) 2005-05-17 2011-08-09 American Power Conversion Corporation Cold aisle isolation
US7841199B2 (en) 2005-05-17 2010-11-30 American Power Conversion Corporation Cold aisle isolation
JP2015050929A (en) * 2013-08-30 2015-03-16 エルエス産電株式会社Lsis Co., Ltd. Inverter cooling apparatus
EP2843700A3 (en) * 2013-08-30 2015-06-17 LSIS Co., Ltd. Apparatus for cooling inverter
US9622390B2 (en) 2013-08-30 2017-04-11 Lsis Co., Ltd. Apparatus for cooling inverter

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