JP2625866B2 - Electronic device housing cooling structure - Google Patents
Electronic device housing cooling structureInfo
- Publication number
- JP2625866B2 JP2625866B2 JP10142688A JP10142688A JP2625866B2 JP 2625866 B2 JP2625866 B2 JP 2625866B2 JP 10142688 A JP10142688 A JP 10142688A JP 10142688 A JP10142688 A JP 10142688A JP 2625866 B2 JP2625866 B2 JP 2625866B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- opening
- housing
- power supply
- room
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明な電子機器および電源装置を収納する筐体の冷
却構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a cooling structure for a housing that houses an electronic device and a power supply device according to the present invention.
〔従来の技術〕 従来、この種の筐体は、例えば、集合型光デイスク装
置に使用されている。第２図はこの集合型光デイスク装
置の縦断面図である。これを同図について説明すると、
筐体１の内部は電源室２と収納室３とに隔壁1aによつて
分離されている。電源室２には電源用等の機器4a〜4cが
収納され、また電源室２の上部には冷却フアン８が設け
られ、筐体１の上面には開口1bが設けられている。収納
室３は下部の電子機器収納部と上部の媒体収納部とから
なり、電子機器収納部には各２台のデツキ5aと電子機器
5bとから構成される光デイスクユニツト５が設置され、
媒体収納部には光デイスク媒体７の入つた媒体保管器６
が設置されている。[Related Art] Conventionally, this type of housing is used, for example, in a collective optical disk device. FIG. 2 is a longitudinal sectional view of the collective type optical disc device. This will be described with reference to FIG.
The inside of the housing 1 is separated into a power supply room 2 and a storage room 3 by a partition 1a. The power supply room 2 accommodates devices 4a to 4c for power supply and the like, a cooling fan 8 is provided at an upper portion of the power supply room 2, and an opening 1b is provided at an upper surface of the housing 1. The storage room 3 includes a lower electronic device storage portion and an upper medium storage portion. The electronic device storage portion has two decks 5a and two electronic devices.
5b, an optical disk unit 5 composed of
The medium storage unit has a medium storage device 6 containing an optical disk medium 7.
Is installed.
この集合型光デイスク装置は電源を投入し操作を開始
すると、電源室２の電源用等の機器4a〜4cが発熱する。
この発熱により熱せられた周囲の空気は、矢印で示すよ
うに電源室２の上部へと移動し、冷却フアン８により筐
体１上部に設けた開口1bから筐体外へと排出される。一
方、収納室３においては、下部に配置された上下２台の
光デイスクユニツト５内の電子機器5bの発熱により熱さ
られた空気は矢印の方向へと移動し、収納室３の上部の
媒体保管器６および光デイスク媒体７の周囲を対流する
かまたは収納室３の上部に澱むことになる。When the power is turned on and the operation is started in this collective optical disk device, the devices 4a to 4c for power supply in the power supply room 2 generate heat.
The surrounding air heated by the heat moves to the upper part of the power supply chamber 2 as shown by the arrow, and is discharged by the cooling fan 8 from the opening 1b provided in the upper part of the housing 1 to the outside of the housing. On the other hand, in the storage room 3, the air heated by the heat generated by the electronic devices 5b in the upper and lower two optical disk units 5 arranged in the lower part moves in the direction of the arrow, and the medium storage in the upper part of the storage room 3 is performed. Convection around the container 6 and the optical disk medium 7 or stagnation on the upper part of the storage room 3.
上述した従来の筐体の冷却構造では、収納室３内の熱
は、隔壁によつて電源室と分離されているため、筐体外
へ排出されることがないから、媒体収納部の温度を上昇
させるという不都合があつた。In the conventional cooling structure of the housing described above, since the heat in the storage room 3 is separated from the power supply room by the partition, it is not discharged out of the housing, so that the temperature of the medium storage unit rises. There was an inconvenience of letting them do it.
本発明に係る電子機器筐体の冷却構造は、筐体内を隔
壁で分離することにより電源室と収納室とを左右に設
け、電源室にこの室内の熱を外部に排出するための開口
を設けるとともに、収納室を仕切部材で上下に仕切るこ
とにより媒体収納部とその下側に位置する電気機器収納
部とを設け、前記電子機器収納部の上方を仕切る仕切部
材に設けた開口とこの開口よりも上方に位置するように
前記隔壁に設けた通風口とをエアダクトで連結したもの
である。In the cooling structure for an electronic device housing according to the present invention, the power supply room and the storage room are provided on the left and right by separating the inside of the housing with a partition wall, and the power supply room is provided with an opening for discharging heat in the room to the outside. In addition, the storage chamber is vertically partitioned by a partition member to provide a medium storage section and an electric device storage section located below the medium storage section, and an opening provided in the partition member that partitions the upper part of the electronic device storage section from the opening and Is connected to a ventilation port provided in the partition wall by an air duct so as to be located above.
電子機器収納部の電子機器により熱せられた空気は上
昇し、媒体収納部との間に設けた仕切部材の開口部を通
つてエアダクトに導入され、隔壁の通風口を経て電源室
へと移動し、電源室内の冷却フアンで筐体の開口部から
筐体外へ排出される。The air heated by the electronic device in the electronic device housing rises, is introduced into the air duct through the opening of the partition member provided between the electronic device housing, and moves to the power supply room through the ventilation opening of the partition. Then, the cooling fan in the power supply chamber discharges the air from the opening of the housing to the outside of the housing.
次に、本発明について図面を参照して説明する。第１
図は本発明の電子機器筐体の冷却構造の一実施例を示す
集合型光デイスク装置の縦断面図である。筐体１の内部
は電源室２と収納部３とに隔壁1aにより左右に分離さ
れ、電源室２には電源用等の機器4a〜4cが収納され、ま
たこの電源室２上部には冷却フアン８が設けられ、筐体
１の上面には開口1bが設けられている。収納室３は仕切
部材1dによつて下部の電子機器収納部と上部の媒体収納
部とに仕切られている。下部の電子機器収納部には上下
２台の光デイスクユニツト５が設置され、この光デイス
クユニツト５はデツキ5aと電子機器5bとで構成されてい
る。上部の媒体収納部には媒体保管器６を設置し、中に
光デイスク媒体７が保管されている。前記仕切部材1dに
は電子機器5bの上方に相当する位置に開口部1eが設けら
れ、この開口部1eにエアダクト９の一端が接続されてい
る。このエアダクト９の他端は、前記開口部1eより上方
位置に設けられた前記隔壁1aの通風口1cに接続されてい
る。Next, the present invention will be described with reference to the drawings. First
FIG. 1 is a longitudinal sectional view of a collective optical disk device showing an embodiment of a cooling structure of an electronic device housing of the present invention. The interior of the housing 1 is separated into a power supply room 2 and a storage unit 3 by a partition wall 1a on the left and right sides. The power supply room 2 accommodates devices 4a to 4c for power supply and the like. 8 is provided, and an opening 1 b is provided on the upper surface of the housing 1. The storage room 3 is partitioned by a partition member 1d into a lower electronic device storage section and an upper medium storage section. The upper and lower two optical disk units 5 are installed in the lower electronic device storage unit, and the optical disk unit 5 is composed of a deck 5a and an electronic device 5b. A medium storage unit 6 is installed in the upper medium storage unit, and an optical disk medium 7 is stored therein. The partition member 1d is provided with an opening 1e at a position above the electronic device 5b, and one end of the air duct 9 is connected to the opening 1e. The other end of the air duct 9 is connected to a ventilation port 1c of the partition wall 1a provided above the opening 1e.
したがつて、この集合型光デイスク装置に電源を投入
し操作を開始すると、電源用等の機器4a〜4cの発熱によ
り熱せられた空気は、第１図に矢印で示すように冷却フ
アン８の吸気力により筐体１の開口1bから筐体外へ排出
される。一方、収納室３においては、下部の上下２台の
光デイスクユニツト５内の電子機器5bの発熱により周辺
の熱せられた空気は、下段仕切部材1dの開口1eを経て上
段の電子機器5b周辺の熱せられた空気と合流し、上段仕
切部材1dの開口1eからエアダクト９の下端に導入され
る。エアダクト９内の空気は前記隔壁1aの通風口1cへと
導かれ、電源室２内の熱せられた空気と一緒に冷却フア
ン８によつて筐体１の開口1bから筐体外へ排出される。Therefore, when the power is turned on to the collective type optical disk device and the operation is started, the air heated by the heat generated by the devices 4a to 4c for the power supply and the like, as shown by arrows in FIG. The air is discharged from the housing 1 through the opening 1b of the housing 1 by the suction force. On the other hand, in the storage room 3, the air heated around by the heat generated by the electronic devices 5 b in the lower and upper two optical disk units 5 passes through the opening 1 e of the lower partition member 1 d, and the air around the upper electronic device 5 b. The air merges with the heated air and is introduced into the lower end of the air duct 9 through the opening 1e of the upper partition member 1d. The air in the air duct 9 is guided to the ventilation port 1c of the partition wall 1a, and is discharged out of the housing 1 through the opening 1b of the housing 1 by the cooling fan 8 together with the heated air in the power supply chamber 2.
以上、２室構造の集合型光デイスク装置について説明
したが、本発明は２室構造以外の筐体にも、また、光デ
イスク以外の媒体を用いる同種の装置にも適用できるこ
とはいうまでもない。The above description has been given of the collective optical disc device having the two-chamber structure. However, it is needless to say that the present invention can be applied to a case other than the two-chamber structure, and to a similar device using a medium other than the optical disc. .
以上説明したように本発明に係る電子機器筐体の冷却
構造によれば、収納室内で仕切部材の下側に設けた電子
機器収納部を、仕切部材に設けた開口とこの開口よりも
上方に位置するように隔壁に設けた通風口とを連結する
エアダクトによって電源室に直接連結しているから、簡
単な構造であるにもかかわらず、電子機器収納部の熱を
電源室側の開口から筐体外に排出することができる。し
たがって、収納室の上側に仕切部材で仕切られている媒
体保管器および媒体の周囲温度を常に安定した温度に保
つことができ、温度変化による媒体の損傷を防止でき、
媒体の信頼性を一段と高めることができる。As described above, according to the cooling structure of the electronic device housing according to the present invention, the electronic device storage section provided below the partition member in the storage chamber is provided with the opening provided in the partition member and the opening above the opening. Because the air duct is directly connected to the power supply room to connect to the ventilation opening provided in the partition so that it is located, despite the simple structure, the heat of the electronic device storage unit is transferred from the opening on the power supply room side to the housing. Can be discharged outside the body. Therefore, the ambient temperature of the medium storage device and the medium partitioned by the partition member on the upper side of the storage room can always be kept at a stable temperature, and damage to the medium due to a temperature change can be prevented,
The reliability of the medium can be further improved.
第１図は本発明の一実施例を示す集合型光デイスク装置
の縦断面図、第２図は従来の筐体の冷却構造をもつ集合
型光デイスク装置の縦断面図である。 １……筐体、1a……隔壁、1c……通風口、1d……仕切部
材、1e……開口、２……電源室、３……収納室、９……
エアダクト。FIG. 1 is a longitudinal sectional view of a collective optical disk device showing an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of a collective optical disk device having a conventional housing cooling structure. DESCRIPTION OF SYMBOLS 1 ... Housing, 1a ... Partition wall, 1c ... Ventilation opening, 1d ... Partition member, 1e ... Opening 2 ... Power supply room, 3 ... Storage room, 9 ...
Air duct.
Claims (1)
と収納室とを左右に設け、前記電源室にこの室内の熱を
外部に排出するための開口を設けるとともに、前記収納
室を仕切部材で上下に仕切ることにより媒体収納部とそ
の下側に位置する電子機器収納部とを設け、 前記電子機器収納部の上方を仕切る前記仕切部材に設け
た開口とこの開口よりも上方に位置するように前記隔壁
に設けた通風口とをエアダクトで連結したことを特徴と
する電子機器筐体の冷却構造。A power supply chamber and a storage chamber are provided on the left and right by separating the inside of a housing with a partition wall, an opening for discharging heat in the chamber to the outside is provided in the power supply chamber, and the storage chamber is partitioned. A medium storage portion and an electronic device storage portion located below the medium storage portion are provided by vertically partitioning with a member, and an opening provided in the partition member that partitions above the electronic device storage portion and located above the opening. A cooling structure for an electronic device housing, wherein the ventilation holes provided in the partition wall are connected by an air duct.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10142688A JP2625866B2 (en) | 1988-04-26 | 1988-04-26 | Electronic device housing cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10142688A JP2625866B2 (en) | 1988-04-26 | 1988-04-26 | Electronic device housing cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01273395A JPH01273395A (en) | 1989-11-01 |
| JP2625866B2 true JP2625866B2 (en) | 1997-07-02 |
Family
ID=14300380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10142688A Expired - Fee Related JP2625866B2 (en) | 1988-04-26 | 1988-04-26 | Electronic device housing cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2625866B2 (en) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5236258A (en) * | 1991-05-07 | 1993-08-17 | Cambridge On-Line Storage, Inc. | Tape cartridge data storage library system |
| US5963962A (en) | 1995-05-31 | 1999-10-05 | Network Appliance, Inc. | Write anywhere file-system layout |
| WO1994029795A1 (en) | 1993-06-04 | 1994-12-22 | Network Appliance Corporation | A method for providing parity in a raid sub-system using a non-volatile memory |
| EP0810511B1 (en) * | 1996-05-14 | 2003-11-12 | Hewlett-Packard Company, A Delaware Corporation | Component cooling arrangement in electronic equipment with internal power supply |
| US6516351B2 (en) | 1997-12-05 | 2003-02-04 | Network Appliance, Inc. | Enforcing uniform file-locking for diverse file-locking protocols |
| US6279011B1 (en) | 1998-06-19 | 2001-08-21 | Network Appliance, Inc. | Backup and restore for heterogeneous file server environment |
| US6574591B1 (en) | 1998-07-31 | 2003-06-03 | Network Appliance, Inc. | File systems image transfer between dissimilar file systems |
| US6119244A (en) * | 1998-08-25 | 2000-09-12 | Network Appliance, Inc. | Coordinating persistent status information with multiple file servers |
| US6343984B1 (en) * | 1998-11-30 | 2002-02-05 | Network Appliance, Inc. | Laminar flow duct cooling system |
| US6961749B1 (en) | 1999-08-25 | 2005-11-01 | Network Appliance, Inc. | Scalable file server with highly available pairs |
| US6715034B1 (en) | 1999-12-13 | 2004-03-30 | Network Appliance, Inc. | Switching file system request in a mass storage system |
| US6557357B2 (en) | 2000-02-18 | 2003-05-06 | Toc Technology, Llc | Computer rack heat extraction device |
| US6412292B2 (en) | 2000-05-09 | 2002-07-02 | Toc Technology, Llc | Computer rack heat extraction device |
| US6574970B2 (en) | 2000-02-18 | 2003-06-10 | Toc Technology, Llc | Computer room air flow method and apparatus |
| WO2001062060A1 (en) | 2000-02-18 | 2001-08-23 | Rtkl Associates Inc. | Computer rack heat extraction device |
| US6668565B1 (en) | 2002-04-12 | 2003-12-30 | American Power Conversion | Rack-mounted equipment cooling |
| US7046514B2 (en) | 2003-03-19 | 2006-05-16 | American Power Conversion Corporation | Data center cooling |
| US6859366B2 (en) | 2003-03-19 | 2005-02-22 | American Power Conversion | Data center cooling system |
| US7259963B2 (en) | 2004-12-29 | 2007-08-21 | American Power Conversion Corp. | Rack height cooling |
| US7841199B2 (en) | 2005-05-17 | 2010-11-30 | American Power Conversion Corporation | Cold aisle isolation |
| KR20150025755A (en) | 2013-08-30 | 2015-03-11 | 엘에스산전 주식회사 | Apparatus for cooling inverter |
-
1988
- 1988-04-26 JP JP10142688A patent/JP2625866B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01273395A (en) | 1989-11-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |