JPH01273394A - Microcircuit device - Google Patents
Microcircuit deviceInfo
- Publication number
- JPH01273394A JPH01273394A JP63101329A JP10132988A JPH01273394A JP H01273394 A JPH01273394 A JP H01273394A JP 63101329 A JP63101329 A JP 63101329A JP 10132988 A JP10132988 A JP 10132988A JP H01273394 A JPH01273394 A JP H01273394A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- substrate
- metallic case
- heat dissipation
- heat dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 18
- 230000005855 radiation Effects 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims description 29
- 238000010438 heat treatment Methods 0.000 abstract description 13
- 239000000758 substrate Substances 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 10
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 230000002459 sustained effect Effects 0.000 abstract 1
- 230000000191 radiation effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、放熱を必要とする部品を金属ケースと直接密
着させ、放熱特性を大幅に向上させることのできる構造
を持つ超小型回路装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a microcircuit device having a structure that allows parts that require heat radiation to be brought into direct contact with a metal case, thereby significantly improving heat radiation characteristics. .
（従来の技術）
従来、超小型回路装置（混成集積回路やマイクロモジュ
ール等）において、放熱を必要とする部品を実装する場
合、第２図に示すように、実装部品の一つである発熱体
３やその他のチップ部品５を基板４に配置し組み立てを
行ない、しかる後、発熱体３の放熱効果を向上させるた
め、発熱体３の上に接着剤９を塗布し、金属性の放熱板
２を取り付ける。そして、外部へのリード線６を取り付
けた後、外装および電磁遮蔽の目的で金属ケース１の中
へ実装された基板を入れて完成品とする。(Prior Art) Conventionally, when mounting components that require heat dissipation in microcircuit devices (hybrid integrated circuits, micromodules, etc.), as shown in Figure 2, a heating element, which is one of the mounted components, is mounted. 3 and other chip parts 5 are placed on the substrate 4 and assembled. Then, in order to improve the heat dissipation effect of the heat generating element 3, an adhesive 9 is applied on the heat generating element 3, and a metal heat sink 2 is attached. Attach. After attaching the lead wires 6 to the outside, the mounted board is put into the metal case 1 for the purpose of exterior packaging and electromagnetic shielding to complete the product.
この時、実装基板４と金属ケース１とを保持、固定する
ために、端子板８および金属ケース１の基板支持部７を
設置する必要がある。At this time, in order to hold and fix the mounting board 4 and the metal case 1, it is necessary to install the terminal plate 8 and the board support part 7 of the metal case 1.
（発明が解決しようとする課題）
このような従来の構成では１発熱体によって生じる熱は
放熱板２に伝わり、金属ケース１内の空気に放射される
。金属ケース１内の熱放射された空気は、金属ケース外
の空気とは金属ケースによって大半が遮断され、熱が金
属ケース内に封じ込められ、金属ケース内の空気はある
一定の温度で飽和する。したがって１発熱体自身の放熱
効果が低下し、超小型回路装置としての使用環境が高温
側では大幅に制限を受ける。(Problems to be Solved by the Invention) In such a conventional configuration, the heat generated by one heating element is transmitted to the heat sink 2 and radiated to the air within the metal case 1. Most of the heat radiated air inside the metal case 1 is isolated from the air outside the metal case by the metal case, the heat is confined within the metal case, and the air inside the metal case is saturated at a certain temperature. Therefore, the heat dissipation effect of the single heating element itself is reduced, and the environment in which it can be used as a microcircuit device is severely restricted at high temperatures.
本発明は、このような問題点を解決するもので、金属ケ
ース内の発熱体の放熱効果を大幅に改善させることを目
的としたものである。The present invention is intended to solve these problems and aims to significantly improve the heat dissipation effect of the heating element within the metal case.
（課題を解決するための手段）
この問題を解決するために、本発明は、実装部品を配置
した基板を収納する金属ケースの一部を放熱部とし、前
記基板上の放熱を必要とする実装部品を前記放熱部に密
着させて超小型回路装置を構成するようにしたもので、
また、実装された基板と金属ケースとの保持、固定は、
金属ケースの放熱部と支持部により行なうようにしたも
のである。(Means for Solving the Problem) In order to solve this problem, the present invention uses a part of a metal case that houses a board on which mounted components are disposed as a heat dissipation part, and provides a mounting device on the board that requires heat dissipation. A microcircuit device is constructed by bringing the components into close contact with the heat dissipation part,
In addition, the holding and fixing of the mounted board and metal case are
This is done by the heat dissipation part and support part of the metal case.
（作 用） 本発明は上記構成により、発熱体からの熱は。(for production) The present invention has the above configuration, so that the heat from the heating element is reduced.
発熱体との密着部である金属ケースの放熱部より直接金
属ケースに熱放射でき、放熱効果の向上が図れる。また
、金属ケースの放熱部のスプリング効果と基板支持部に
より、実装基板を簡単かつ確実に保持、固定できる。Heat can be radiated directly to the metal case from the heat radiation part of the metal case that is in close contact with the heating element, improving the heat radiation effect. Furthermore, the spring effect of the heat dissipation part of the metal case and the board support part make it possible to easily and reliably hold and fix the mounted board.
（実施例）
第１図（ａ）、（ｂ）は、本発明の一実施例による超小
型回路装置を示したもので（ａ）は断面図、（ｂ）は斜
視図である。同図において、２は金属ケース１の上面部
に切り込みを入れ、その部分を折り曲げて形成した放熱
部であり、基板４に実装された放熱を必要とする発熱体
３は、この放熱部２に密着せしめられる。金属ケース１
と基板４との保持、固定は、金属ケース１の両側部に形
成した基板支持部７，８と放熱部２の金属スプリング効
果により、簡単かつ確実に行なうことが可能である。(Embodiment) FIGS. 1(a) and 1(b) show a microcircuit device according to an embodiment of the present invention, in which FIG. 1(a) is a sectional view and FIG. 1(b) is a perspective view. In the figure, reference numeral 2 denotes a heat dissipation part formed by cutting a cut in the upper surface of the metal case 1 and bending the cut part. Being held in close contact. metal case 1
The substrate 4 can be easily and reliably held and fixed by the metal spring effect of the substrate support parts 7 and 8 formed on both sides of the metal case 1 and the heat dissipation part 2.
（発明の効果）
以上のように本発明によれば、金属ケースの一部を放熱
部としたことで、発熱体の熱放射を直接金属ケースへ伝
えることとなり、発熱体の放熱効果は大幅に向上できる
。また、金属ケースの一部を放熱体として利用している
ため、発熱体の上に放熱板を設置する必要はない。さら
に、金属ケースと基板とを保持、固定するための端子板
も不要となり、部品点数の削減も図れる効果がある。(Effects of the Invention) As described above, according to the present invention, by making a part of the metal case a heat radiating part, the heat radiation of the heating element is directly transmitted to the metal case, and the heat radiation effect of the heating element is greatly improved. You can improve. Furthermore, since a part of the metal case is used as a heat sink, there is no need to install a heat sink on top of the heat generating body. Furthermore, there is no need for a terminal plate for holding and fixing the metal case and the board, which has the effect of reducing the number of parts.
第１図（ａ）は本発明の一実施例による超小型回路装置
を示す断面図、第１図（ｂ）は同実施例の斜視図、第２
図は従来例を示す断面図である。
１・・・金属ケース、 ２・・・放熱部、 ３・・・
発熱体、 ４・・・基板、 ５・・・チップ部品、６・
・・リード線、 ７，８・・・基板支持部。
特許出願人 松下電器産業株式会社
第１図
（ａ）
５′
第２図FIG. 1(a) is a sectional view showing a microcircuit device according to an embodiment of the present invention, FIG. 1(b) is a perspective view of the same embodiment, and FIG. 1(b) is a perspective view of the same embodiment.
The figure is a sectional view showing a conventional example. 1... Metal case, 2... Heat radiation part, 3...
heating element, 4... substrate, 5... chip component, 6...
... Lead wire, 7, 8... Board support part. Patent applicant: Matsushita Electric Industrial Co., Ltd. Figure 1 (a) 5' Figure 2
Claims (2)
一部を放熱部とし、前記基板上の放熱を必要とする実装
部品を前記放熱部に密着させて構成した超小型回路装置
。(1) A microcircuit device in which a part of a metal case that houses a board on which mounted components are arranged is used as a heat dissipation section, and the mounted components on the board that require heat dissipation are brought into close contact with the heat dissipation section.
保持、固定した請求項（１）記載の超小型回路装置。(2) The microcircuit device according to claim (1), wherein the mounting board is held and fixed by the heat radiation part and the support part of the metal case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63101329A JPH01273394A (en) | 1988-04-26 | 1988-04-26 | Microcircuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63101329A JPH01273394A (en) | 1988-04-26 | 1988-04-26 | Microcircuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01273394A true JPH01273394A (en) | 1989-11-01 |
Family
ID=14297791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63101329A Pending JPH01273394A (en) | 1988-04-26 | 1988-04-26 | Microcircuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01273394A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1093208A (en) * | 1996-09-18 | 1998-04-10 | Mitsubishi Cable Ind Ltd | Circuit board for optical communication |
-
1988
- 1988-04-26 JP JP63101329A patent/JPH01273394A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1093208A (en) * | 1996-09-18 | 1998-04-10 | Mitsubishi Cable Ind Ltd | Circuit board for optical communication |
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