JPH01272662A - Polyamide resin composition - Google Patents
Polyamide resin compositionInfo
- Publication number
- JPH01272662A JPH01272662A JP10029388A JP10029388A JPH01272662A JP H01272662 A JPH01272662 A JP H01272662A JP 10029388 A JP10029388 A JP 10029388A JP 10029388 A JP10029388 A JP 10029388A JP H01272662 A JPH01272662 A JP H01272662A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- pts
- parts
- resin
- nylon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006122 polyamide resin Polymers 0.000 title claims abstract description 24
- 239000011342 resin composition Substances 0.000 title claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 20
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 12
- 239000000203 mixture Substances 0.000 claims abstract description 11
- 239000003365 glass fiber Substances 0.000 claims abstract description 10
- 239000002253 acid Substances 0.000 claims abstract description 8
- 239000002245 particle Substances 0.000 claims abstract description 8
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 7
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000004677 Nylon Substances 0.000 claims description 12
- 229920001778 nylon Polymers 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 abstract description 12
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 7
- 229920002302 Nylon 6,6 Polymers 0.000 abstract description 7
- 229920001568 phenolic resin Polymers 0.000 abstract description 7
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 abstract description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 abstract description 4
- 239000008096 xylene Substances 0.000 abstract description 4
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 abstract description 3
- 235000011037 adipic acid Nutrition 0.000 abstract description 2
- 239000001361 adipic acid Substances 0.000 abstract description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 abstract 2
- 239000004952 Polyamide Substances 0.000 abstract 1
- 229920002647 polyamide Polymers 0.000 abstract 1
- 238000003878 thermal aging Methods 0.000 abstract 1
- 230000032683 aging Effects 0.000 description 10
- 238000002156 mixing Methods 0.000 description 10
- 239000012778 molding material Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- JJOJFIHJIRWASH-UHFFFAOYSA-N icosanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCCC(O)=O JJOJFIHJIRWASH-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000005749 Copper compound Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000001880 copper compounds Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- HDNHWROHHSBKJG-UHFFFAOYSA-N formaldehyde;furan-2-ylmethanol Chemical compound O=C.OCC1=CC=CO1 HDNHWROHHSBKJG-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- -1 methylol group Chemical group 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、成形用ポリアミド樹脂組成物に関する。更に
詳しくは、本発明は、熱間強度、耐熱老化性に優れ、更
に機械的性質、電気的性質、寸法安定性に優れた吸水性
の低い成形用ポリアミド樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a polyamide resin composition for molding. More specifically, the present invention relates to a polyamide resin composition for molding that has excellent hot strength, heat aging resistance, mechanical properties, electrical properties, and dimensional stability, and has low water absorption.
[従来の技術]
キシリレンジアミンとα、ω−直釦脂肪族二塩基酸とか
ら得られるポリアミド樹脂(以下、「MXナイロン」と
略記することがある。)は、優れた機械的性質、電気的
性質、寸法安定性および耐薬品性等を有し、更に吸水性
が低いことから種々の成形材料に使用されている。[Prior Art] Polyamide resin (hereinafter sometimes abbreviated as "MX nylon") obtained from xylylene diamine and α,ω-direct button aliphatic dibasic acid has excellent mechanical properties and electrical properties. It has physical properties, dimensional stability, chemical resistance, etc., and has low water absorption, so it is used in various molding materials.
しかし、Mxナイロンを自動車エンジンカバーおよびザ
イレンサー、コネクター等の特に熱間強度および耐熱老
化性の特性が要求される機構材料とし、て使用する場合
には、これらの性能が充分でなく未だ実用には到ってい
ない。However, when Mx nylon is used as a mechanical material such as automobile engine covers, xylencers, and connectors that require particularly high hot strength and heat aging resistance, these properties are insufficient and it is still not suitable for practical use. It hasn't arrived yet.
一般的にポリアミド樹脂の耐熱老化性を高めるために、
銅化合物若しくはフェノール系、ホスファイト系の酸化
防止剤を配合する方法、又、熱間強度を向上させるため
に、ガラス繊維や他の無機充填剤等を配合する方法が知
られているが、MXナイロンの場合はこれらの配合によ
っては期待する程性能を改良することはできない。Generally, in order to improve the heat aging resistance of polyamide resin,
Methods of blending copper compounds or phenol-based or phosphite-based antioxidants, and methods of blending glass fibers and other inorganic fillers to improve hot strength are known, but MX In the case of nylon, these formulations do not improve performance as much as expected.
特開昭58−141234号公報、および特開昭58−
152046号公報にポリオレフィン樹脂、ポリスチレ
ン樹脂、アクリル樹脂、ポリアミド樹脂等の熱ijJ塑
性樹脂に粒状ないし粉末状のフェノール・ホルムアルデ
ヒド樹脂を配合した樹脂組成物が開示されている。これ
らの公開公報において、熱可塑性樹脂の中でポリアミド
樹脂として通常のナイロン6、ナイロン66樹脂等のポ
リアミド樹脂を挙げ、熱変形温度、煮沸による体積固有
抵抗値および圧縮強度が改良できることも開示されてい
るが、MXナイロンを含む樹脂組成物の耐熱老化性およ
び熱間強度を改良するための実用的な改良方法はまだ知
られでいない。JP-A-58-141234 and JP-A-58-
Japanese Patent No. 152046 discloses a resin composition in which a granular or powdery phenol/formaldehyde resin is blended with a thermal ijJ plastic resin such as a polyolefin resin, polystyrene resin, acrylic resin, or polyamide resin. In these publications, polyamide resins such as ordinary nylon 6 and nylon 66 resins are listed as polyamide resins among thermoplastic resins, and it is also disclosed that the heat distortion temperature, volume resistivity value by boiling, and compressive strength can be improved. However, a practical method for improving the heat aging resistance and hot strength of resin compositions containing MX nylon is not yet known.
[本発明が解決しようとする間肋点]
本発明はかかる従来技術の問題点を改良し、熱間強度と
耐熱老化性を兼備した優れた耐熱性ポリアミド樹脂組成
物を得ることを目的とする。[Interrib points to be solved by the present invention] The purpose of the present invention is to improve the problems of the prior art and to obtain an excellent heat-resistant polyamide resin composition that has both hot strength and heat aging resistance. .
「問題を解決するための手段」
本発明者らは税、へ検討の結果、MX−jイロンに特定
の粒子径からなるフェノール樹脂等の粉末状熱硬化性樹
脂、及びガラス繊維を配合すると、熱間強度(!:耐耐
熱化化性兼備し7た優れたポリアミド樹脂組成物が得ら
れるこきを見出し2、本発明に到達した。"Means for Solving the Problem" As a result of our research, the present inventors found that when MX-J iron is blended with a powdered thermosetting resin such as a phenolic resin having a specific particle size and glass fiber, We have discovered a method that can yield a polyamide resin composition with excellent hot strength (!: heat resistance), and have arrived at the present invention.
すなわち発明は、キシリレンジアミンとα、ω−直鎮脂
肪族二塩基酸とから得られるポリ゛γミド樹脂20〜9
9重量部とナイロン6680−1重量部とからなるポリ
アミド樹脂混合物100重量部に対し、粒子径が1〜8
00μmの粉末状熱硬化性樹脂5〜85重量部とガラス
繊維5=300重量部とを配合しで成る成形用ボIJ
7 ミド樹脂組成物に関する発明である。That is, the invention provides poly(γ) amide resins 20 to 9 obtained from xylylene diamine and α,ω-direct aliphatic dibasic acid.
For 100 parts by weight of a polyamide resin mixture consisting of 9 parts by weight and 1 part by weight of nylon 6680-1, particles having a particle size of 1 to 8
A molding IJ made by blending 5 to 85 parts by weight of a powdered thermosetting resin with a diameter of 0.00 μm and 5=300 parts by weight of glass fiber.
7 This invention relates to a mido resin composition.
本発明で用いられるMXナイロンは、メタキシリレンジ
アミン単独または、メタキシリレンジアミン60%以上
とバラキシリレンジアミン40%以下とのジアミン混合
物と、一般式が
HOOC(CH2)ユC00H
(riは6から20の範囲の整数である。)で表される
炭素数6から18のα、ω−直鎖脂肪族二塩基酸、例え
ば、アジピン酸、セバシン酸、スペリン酸、ウンデカン
酸、トチ゛カンニ酸、工・イコサンジオン酸等との縮重
合反応によ、−1で合成されるポリアミド樹脂である。The MX nylon used in the present invention is composed of metaxylylene diamine alone or a diamine mixture of 60% or more metaxylylene diamine and 40% or less free xylylene diamine, and the general formula HOOC(CH2)YC00H (ri is 6 α,ω-linear aliphatic dibasic acids having 6 to 18 carbon atoms represented by - It is a polyamide resin synthesized by -1 through a polycondensation reaction with icosanedioic acid, etc.
本発明の樹脂組成物より得られる成形物に関する成形性
、成形物性等のバランスを考慮すると、上記α、ω−直
鎮脂肪族二塩基酸としては、アジピン酸、セバシン酸が
特に好適である。Considering the balance of moldability, molding properties, etc. of the molded product obtained from the resin composition of the present invention, adipic acid and sebacic acid are particularly suitable as the α,ω-straight aliphatic dibasic acid.
本発明で用いられるナイロン66はMXナイロンの成形
性、ずなわち成形サイクル時間の大幅な短縮を可能にす
るものであり、その配合割合はポリアミド樹脂20−9
9重重電に対し、ナイロン661〜80重量部、好まし
くは5へ・75重量部である。Nylon 66 used in the present invention makes it possible to significantly shorten the moldability of MX nylon, that is, the molding cycle time, and its blending ratio is polyamide resin 20-9.
The amount of nylon is 661 to 80 parts by weight, preferably 5 to 75 parts by weight, per 9 heavy electric.
MXナイロン99重量部に対し、ナイロン66の配合割
合が1重量部以下の場合はMXナイロンの成形性改良に
対して効果が小さく、MXナイロン20重量部に対し1
、ナイロン6680重量部以上配合した場合には機械的
強度、剛性等の特徴を損なうこととなる。If the blending ratio of nylon 66 to 99 parts by weight of MX nylon is less than 1 part by weight, the effect on improving the moldability of MX nylon will be small;
If more than 6,680 parts by weight of nylon is blended, characteristics such as mechanical strength and rigidity will be impaired.
本発明で用いられる熱硬化性樹脂としてフェノール樹脂
、キシレン樹脂1、メラミン樹脂、エポキシ樹脂、不飽
和ポリエステル樹脂、尿素樹脂、フラン樹脂、アルキッ
ド樹脂が例示されるが特にこれらに限定されるものでは
ない。Examples of thermosetting resins used in the present invention include, but are not limited to, phenol resins, xylene resins, melamine resins, epoxy resins, unsaturated polyester resins, urea resins, furan resins, and alkyd resins. .
これらの熱硬化性樹脂のうち、好ましいものとしてはフ
ェノール樹脂、キシレン樹脂、メラミン樹脂、エポキシ
樹脂が挙げられるが、このなかでもフェノール樹脂とキ
シレン樹脂が特に好適である。フェノール樹脂としては
、メチロール基を含有するものが好まし、く、この場合
メチITJ−ル基を0.5〜l Qwt%含有するフグ
ノール樹脂が好適である。Among these thermosetting resins, phenol resins, xylene resins, melamine resins, and epoxy resins are preferred, and among these, phenol resins and xylene resins are particularly preferred. As the phenol resin, one containing a methylol group is preferable, and in this case, a fugnol resin containing 0.5 to 1 Qwt% of a methylITJ-l group is preferable.
本発明で用いられる熱硬化性樹脂の粒子径は1〜800
μrn、好ましくは1〜100μtn、特に好ましくは
5〜・50μmである。The particle size of the thermosetting resin used in the present invention is 1 to 800.
μrn, preferably 1 to 100 μtn, particularly preferably 5 to 50 μm.
熱硬化性樹脂の粒子径が800μm以上になると成形加
工性が低下する。When the particle size of the thermosetting resin is 800 μm or more, moldability decreases.
本発明で用いられる熱硬化性樹脂の配合割合はポリアミ
ド樹脂混合物100重量部に対し5〜85重量部、好ま
しくは10〜50重量部である。The blending ratio of the thermosetting resin used in the present invention is 5 to 85 parts by weight, preferably 10 to 50 parts by weight, based on 100 parts by weight of the polyamide resin mixture.
ポリアミド樹脂混合物100重量部に対し、熱硬化性樹
脂が5重量部以下では熱間強度、耐熱老化性の改良が不
左分であり、熱硬化性樹脂が85重量部以上では機械的
強度、成形外観を損なうので好ましくない。If the thermosetting resin is less than 5 parts by weight per 100 parts by weight of the polyamide resin mixture, the improvement in hot strength and heat aging resistance will be negligible, while if the thermosetting resin is 85 parts by weight or more, the mechanical strength and moldability will be significantly improved. This is not desirable as it spoils the appearance.
本発明で用いられるガラス繊維の配合割合は本発明にお
けるポリアミド樹脂混合物1oo重量部に対して、5〜
300重量部、好ましくは10〜250重量部である。The blending ratio of glass fiber used in the present invention is 5 to 5 parts by weight per 100 parts by weight of the polyamide resin mixture in the present invention.
The amount is 300 parts by weight, preferably 10 to 250 parts by weight.
本発明におけるポリアミド樹脂混合物1oo重量部に対
して、ガラスiJ1維の配合割合が5重量部以下では機
械的強度、熱的性質等の改善効果が充分でなく、又、ガ
ラス繊維の配合割合が300重量部以上では成形性、そ
り特性、表面平滑性を損ない好ましくない。If the blending ratio of glass iJ1 fibers is less than 5 parts by weight with respect to 10 weight parts of the polyamide resin mixture in the present invention, the effect of improving mechanical strength, thermal properties, etc. will not be sufficient; If the amount is more than 1 part by weight, moldability, warpage characteristics, and surface smoothness are impaired, which is not preferable.
本発明のポリアミド樹脂組成物は、一般には押出機中に
でポリ゛γミド樹脂の融点より5〜50t’高い温度で
溶融混練し、た後、ベレットと1.て製造される。The polyamide resin composition of the present invention is generally melt-kneaded in an extruder at a temperature 5 to 50 t' higher than the melting point of the polyamide resin, and then mixed with pellets. Manufactured by
本発明の組成物は、通常用いられる1種もしくは2種以
上の添加剤、例えば酸化、熱、及び紫外線等による老化
に対する安定剤、防止剤、核剤、可塑剤、離形剤、難燃
剤、帯電防止剤、滑剤等を配合1.て使用することがで
きる。The composition of the present invention contains one or more commonly used additives, such as stabilizers against aging due to oxidation, heat, and ultraviolet rays, inhibitors, nucleating agents, plasticizers, mold release agents, flame retardants, Contains antistatic agents, lubricants, etc. 1. can be used.
又、本発明の目的を損なわないで、一般に用いられる炭
酸カルシウム、タルク、ウオラストナイト等の無機フィ
ラーおよびチタン酸カリ、炭化珪素等のウィスカー、炭
素繊維、アルミナ・シリカセラミックファイバー等を配
合して使用することもできる。Moreover, without impairing the purpose of the present invention, commonly used inorganic fillers such as calcium carbonate, talc, and wollastonite, whiskers such as potassium titanate and silicon carbide, carbon fibers, alumina/silica ceramic fibers, etc. may be blended. You can also use
本発明のポリアミド樹脂組成物は、熱間強度と耐熱老化
性に優れた性能を有し、自動車エンジンカバーおよびザ
イレンサー、コネクター、そのイ也耐熱性が要求される
用途に対し、有用なものである。The polyamide resin composition of the present invention has excellent performance in hot strength and heat aging resistance, and is useful for automobile engine covers, xylencers, connectors, and other applications that require heat resistance. .
以下、実施例および比較例により本発明を更に具体的に
説明する。Hereinafter, the present invention will be explained in more detail with reference to Examples and Comparative Examples.
尚、機械的特性は以下の試験法によった。The mechanical properties were determined by the following test method.
引張m度 :ASTM D638
引張伸び +ASTM 0638
引張弾性率:ASTM 0638
曲げ強度 :ASTM D790
曲げ弾性率:ASTM D790
実施例1
三菱瓦斯化学■製のポリ(メタキシリレンアジパミド)
のベレット(重合体1gを98%硫酸100m1に溶解
し、25℃で測定し、た相対粘度(以下、「相対粘度」
とい’5):2.10のもの)100重量部およびナイ
ロン66のベレッl−(相対粘度:2.25のもの)2
5重量部、粒子状フェノール樹脂(鐘紡側製、商品名:
ベルバール(登録商標)R−800(1次粒子径 1〜
20μm))50重量部、長さ3nnmのガラス繊維チ
ョツプドストランド70重量部とを加え、タンブラ−で
混合し、ベント式押出機ヲ用いて280℃で溶融混練し
た後、ひも状に押出し、水浴で冷却後切断、乾繰してベ
レット状成形材料を製造した。Tensile m degree: ASTM D638 Tensile elongation +ASTM 0638 Tensile modulus: ASTM 0638 Bending strength: ASTM D790 Flexural modulus: ASTM D790 Example 1 Poly(methaxylylene adipamide) manufactured by Mitsubishi Gas Chemical ■
pellet (1 g of polymer dissolved in 100 ml of 98% sulfuric acid, measured at 25°C, and the relative viscosity (hereinafter referred to as "relative viscosity")
100 parts by weight of nylon 66 (relative viscosity: 2.25) 2
5 parts by weight, particulate phenolic resin (manufactured by Kanebo, product name:
Belval (registered trademark) R-800 (primary particle size 1~
20 μm)) and 70 parts by weight of chopped glass fiber strands having a length of 3 nm were added, mixed in a tumbler, melted and kneaded at 280°C using a vented extruder, and then extruded into a string. After cooling in a water bath, it was cut and dried to produce a pellet-shaped molding material.
次に、この成形材料を金型温度130℃で射出成形し″
C成形物を得た。Next, this molding material was injection molded at a mold temperature of 130°C.
A molded product C was obtained.
成形物の耐熱老化性試験結果を第1表に、および熱間強
度の試験結果を第2表に示す。Table 1 shows the heat aging resistance test results of the molded products, and Table 2 shows the hot strength test results.
実施例2
実施例1において、ナイロン66の配合量を38重型部
、粒子状フェノール樹脂を51重量部、ガラス繊維チョ
ツプドストランドを189重量部とした以外は実施例1
と同様lコ配合、溶融混練しベレット状成形材料を製造
した。Example 2 Example 1 except that the blending amount of nylon 66 was 38 parts by weight, the particulate phenol resin was 51 parts by weight, and the chopped glass fiber strand was 189 parts by weight.
A pellet-shaped molding material was produced by blending and melt-kneading in the same manner as above.
次に、実施例1と同様に成形して、成形物を得た。成形
物の耐熱老化性試験結果を第1表に、および熱間強度の
試験結果を第2表に示す。Next, it was molded in the same manner as in Example 1 to obtain a molded product. Table 1 shows the heat aging resistance test results of the molded products, and Table 2 shows the hot strength test results.
比較例1
粒子状フェノール樹脂を配合しなかった以外は実施例1
と同様にして、ベレット状成形材料を得た。Comparative Example 1 Example 1 except that particulate phenolic resin was not blended.
A pellet-shaped molding material was obtained in the same manner as above.
次にこの成形材料を実施例1と同様に成ノ■多しで成形
物を得た。Next, this molding material was grown in the same manner as in Example 1 to obtain a molded product.
この成形物の評価結果を第1表および第2表に示す。The evaluation results of this molded product are shown in Tables 1 and 2.
比較例2
粒子状フェノール樹脂を配合しなかった以外は実施例2
と同様にして、ベレット状成形材料を得た。Comparative Example 2 Example 2 except that particulate phenolic resin was not blended.
A pellet-shaped molding material was obtained in the same manner as above.
次にこの成形材料を実施例1と同様に成形して成形物を
得た。Next, this molding material was molded in the same manner as in Example 1 to obtain a molded product.
この成形物の評価結果を第1表および第2表に示す。The evaluation results of this molded product are shown in Tables 1 and 2.
比較例3
ナイロン6のベレット(相対粘度82.30のもの)1
00重量部及び粒子状フェノール樹脂(実施例1で使用
したと同様のもの)40重量部、ガラス繊維(長さ:3
rnmのチョツプドストランド)60重量部を加え、タ
ンブラ−で混合し、ベント式押出機を用いて、260℃
で溶融混練した後、ひも状に押出し、水浴で冷却後、切
断、乾燃して、ベレット状成形材料を製造した。Comparative Example 3 Nylon 6 pellet (relative viscosity 82.30) 1
00 parts by weight, 40 parts by weight of particulate phenolic resin (same as used in Example 1), glass fiber (length: 3
rnm chopped strand) was added, mixed in a tumbler, and heated at 260°C using a vented extruder.
After melt-kneading, the mixture was extruded into a string shape, cooled in a water bath, cut, and dry-burned to produce a pellet-shaped molding material.
次に、この成形材料を成形金型温度80℃で射出成形し
て成形物を得た。Next, this molding material was injection molded at a mold temperature of 80° C. to obtain a molded product.
成形物の評価結果を第1表及び第2表に示す。The evaluation results of the molded products are shown in Tables 1 and 2.
第 1 表 の比較値を保持率とした。Table 1 The comparison value was taken as the retention rate.
第2表 特許出願人 三菱瓦斯化学株式会社 代理人 弁理士 小 堀 貞 文Table 2 Patent applicant: Mitsubishi Gas Chemical Co., Ltd. Agent: Patent Attorney Sadafumi Kohori
Claims (1)
酸とから得られるポリアミド樹脂20〜99重量部とナ
イロン6680〜1重量部とからなるポリアミド樹脂混
合物100重量部に対し、粒子径が1〜800μmの粉
末状熱硬化性樹脂5〜85重量部とガラス繊維5〜30
0重量部とを配合して成る成形用ポリアミド樹脂組成物
。(1) Particle size for 100 parts by weight of a polyamide resin mixture consisting of 20 to 99 parts by weight of a polyamide resin obtained from xylylene diamine and an α,ω-linear aliphatic dibasic acid and 6680 to 1 part by weight of nylon. 5 to 85 parts by weight of a powdered thermosetting resin with a diameter of 1 to 800 μm and 5 to 30 parts of glass fiber
0 parts by weight of a polyamide resin composition for molding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10029388A JPH01272662A (en) | 1988-04-25 | 1988-04-25 | Polyamide resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10029388A JPH01272662A (en) | 1988-04-25 | 1988-04-25 | Polyamide resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01272662A true JPH01272662A (en) | 1989-10-31 |
Family
ID=14270129
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10029388A Pending JPH01272662A (en) | 1988-04-25 | 1988-04-25 | Polyamide resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01272662A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5011873A (en) * | 1989-10-24 | 1991-04-30 | Mitsubishi Gas Chemical Company, Inc. | Molding polyamide resin composition |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5163860A (en) * | 1974-11-26 | 1976-06-02 | Mitsubishi Gas Chemical Co | |
JPS61250055A (en) * | 1985-04-30 | 1986-11-07 | Toray Ind Inc | Injection molding resin composition |
-
1988
- 1988-04-25 JP JP10029388A patent/JPH01272662A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5163860A (en) * | 1974-11-26 | 1976-06-02 | Mitsubishi Gas Chemical Co | |
JPS61250055A (en) * | 1985-04-30 | 1986-11-07 | Toray Ind Inc | Injection molding resin composition |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5011873A (en) * | 1989-10-24 | 1991-04-30 | Mitsubishi Gas Chemical Company, Inc. | Molding polyamide resin composition |
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