JPH01271413A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH01271413A JPH01271413A JP10025288A JP10025288A JPH01271413A JP H01271413 A JPH01271413 A JP H01271413A JP 10025288 A JP10025288 A JP 10025288A JP 10025288 A JP10025288 A JP 10025288A JP H01271413 A JPH01271413 A JP H01271413A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- epichlorohydrin
- curing
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 46
- 229920000647 polyepoxide Polymers 0.000 title claims description 46
- 239000000203 mixture Substances 0.000 title claims description 24
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 16
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims abstract description 14
- 150000001875 compounds Chemical class 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 4
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 12
- 239000003513 alkali Substances 0.000 abstract description 3
- 239000001257 hydrogen Substances 0.000 abstract description 3
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 3
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 abstract description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract description 2
- 239000004845 glycidylamine epoxy resin Substances 0.000 abstract 2
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- -1 laminates Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000012772 electrical insulation material Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- AAMHBRRZYSORSH-UHFFFAOYSA-N 2-octyloxirane Chemical compound CCCCCCCCC1CO1 AAMHBRRZYSORSH-UHFFFAOYSA-N 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 241000792276 Drino Species 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000003733 fiber-reinforced composite Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229960001124 trientine Drugs 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
（！１業上の利用分野）
本発明は新規な特に耐熱性、耐水性および靭性に優れた
エポキシ樹脂組成物に関し、さらに詳細には必須のエポ
キシ樹脂成分として４，４＃−ビス（４−アミノフェノ
キシ）ビフェニルとエビクロルにドリノとからなるエイ
キシ樹脂を用い、耐熱性、耐水性および靭性に優れた積
１品樹脂材料、電気絶縁材料％繊維強化複合材料、簾装
材料、成型材料、接着材料などに極めて有用なエポキシ
樹脂組成物に関する。Detailed Description of the Invention (!1 Field of Industrial Application) The present invention relates to a novel epoxy resin composition particularly excellent in heat resistance, water resistance, and toughness, and more specifically, the present invention relates to a novel epoxy resin composition having particularly excellent heat resistance, water resistance, and toughness, and more specifically, 4, Using Eixy resin consisting of 4#-bis(4-aminophenoxy)biphenyl, Ebichlor, and Drino, it is a one-product resin material with excellent heat resistance, water resistance, and toughness, electrical insulation material% fiber-reinforced composite material, blind screen. This invention relates to epoxy resin compositions that are extremely useful for materials, molding materials, adhesive materials, etc.
（従来の技術）
エポキシ樹脂は１種々の硬化剤で硬化させることＫよシ
、−船釣に機械的性質、耐水性、耐薬品性、耐熱性、電
気的性質などの優れた硬化物となプ、接着剤、塗料、積
層板、成型材料、注型材料等、幅広い分野に使用されて
いる。(Prior art) Epoxy resins can be cured with a variety of curing agents, and can be used for boat fishing as a cured product with excellent mechanical properties, water resistance, chemical resistance, heat resistance, electrical properties, etc. It is used in a wide range of fields, including adhesives, paints, laminates, molding materials, and casting materials.
（発明が解決しようとする課題）
最も代表的なエポキシ樹脂は、ビス７、ノール人にエピ
クロルヒドリンを反応させて得られる液状および固型の
ビスフェノールＡ型エポキシ樹脂が挙げられるが、これ
らは１分子当たシのグリシジル基が２個よりは多くはな
いために硬化時の架橋密度が低く、耐熱性が劣る傾向に
ある。(Problems to be Solved by the Invention) The most typical epoxy resins include liquid and solid bisphenol A type epoxy resins obtained by reacting bis7 and nord with epichlorohydrin, but these Since the number of glycidyl groups in the resin is not more than 2, the crosslinking density during curing is low and the heat resistance tends to be poor.
この様な欠点を改良するために、いわゆるノ？ラック型
エポキシ樹脂やシアイノ？）フェニルメタン、アミンフ
ェノール等をペースとするグリシジルアミン製およびグ
リシジル７建ンエーテル盟エポキン樹脂等の多官能エポ
キシ樹脂が使用されているが、これらの場合確かに耐熱
性は向上するものの、その向上の度合は充分でなく、シ
かも耐水性は逆に劣るという欠点を有する。In order to improve such shortcomings, so-called No? Rack type epoxy resin or cyano? ) Polyfunctional epoxy resins such as glycidylamine based on phenylmethane, amine phenol, etc. and glycidyl heptane ether epoxy resins are used, but although these do improve heat resistance, the improvement is difficult to achieve. It has the disadvantage that the degree of water resistance is not sufficient and the water resistance is on the contrary inferior.
（課題を解決するための手段）
本発明者らは、こうした実情に鑑みて鋭意研究した結果
、 ４．４’−ビス（４−アミノフェノキシ）ビフェニ
ルにエピクロルヒドリンを反応させて得られる特定のグ
リシゾルアミン型エポキシ樹脂を用いると耐熱性、耐水
性および靭性に優れるエポキシ樹脂組成物が得られるこ
とを見出して、本発明を完成するに至りた。(Means for Solving the Problems) As a result of intensive research in view of these circumstances, the present inventors have developed a specific glycizolamine type obtained by reacting 4,4'-bis(4-aminophenoxy)biphenyl with epichlorohydrin. The present inventors have discovered that an epoxy resin composition with excellent heat resistance, water resistance, and toughness can be obtained by using an epoxy resin, and have completed the present invention.
すなわち、本発明は、ニーキシ樹脂および硬化剤、更に
必要により硬化促進剤から構成されるエポキシ樹脂組成
物において、該エポキシ樹脂成分として、
構造式（１）
で示される化合物にエピクロルヒドリンを反応させて得
られるグリシゾルアミン型エポキシ樹脂を含有すること
を特徴とする工４キシ樹脂組成物。That is, the present invention provides an epoxy resin composition comprising a nixy resin, a curing agent, and, if necessary, a curing accelerator, which is obtained by reacting a compound represented by the structural formula (1) with epichlorohydrin as the epoxy resin component. A glycisolamine type epoxy resin composition characterized in that it contains a glycizolamine type epoxy resin.
あるいは該工４キシ樹脂成分として、
構造式（ＩＦ］
で示されるグリシゾルアミン型エポキシ樹脂を含有する
ことを特徴とするエポキシ樹脂組成物を提供するもので
ある。Alternatively, the present invention provides an epoxy resin composition characterized by containing a glycizolamine type epoxy resin represented by the following structural formula (IF) as the 4-oxy resin component.
本発明で用いる構造式ＣＩりで示されるグリシゾルアミ
ン型エポキシ樹脂は、例えば構造式（１）で示される４
、４′−ビス（４−アミノフェノキシ）ビフェニルにア
ルカリの存在下、エピクロルヒドリンを反応させること
くよシ得られる。The glycizolamine type epoxy resin represented by the structural formula CI used in the present invention is, for example, 4 represented by the structural formula (1).
, can be obtained by reacting 4'-bis(4-aminophenoxy)biphenyl with epichlorohydrin in the presence of an alkali.
この場合の反応条件は従来よシ行なわれているエポキシ
樹脂の製造条件と同じであシ、特に制限されるものでは
ない、即ち、 ４．４’−ビス（４−アンノフエノキシ
）ビフェニルのアミン性活性水素１個に対しエピクロル
ヒドリンを１〜１０モル添加し、水散化ナトリウムのよ
うなアルカリの存在下に２０〜１２０℃でエポキシ化反
応を行なうことが出来、アミン性活性水素に対するエピ
クロルヒドリンの過剰率を調節することにより、得られ
るニーキシ化合物の分子量、エポキシ当量、軟化点を調
整するととができる。エピクロルヒドリンの過剰率を下
げるとエポキシ樹脂の分子量が高くなシ、靭性の高い硬
化物となシ、逆に上げると分子量が低くなシ、耐熱性の
高い硬化物を得ることが出来る。ただし−船釣にはエピ
クロルヒドリンの過剰率が４倍をこえるとあまシ変化し
なくなるので、過剰率は５倍以下が好ましい。The reaction conditions in this case are the same as those conventionally used for producing epoxy resins, and are not particularly limited. By adding 1 to 10 moles of epichlorohydrin per hydrogen, the epoxidation reaction can be carried out at 20 to 120°C in the presence of an alkali such as sodium aqueous dispersion, and the excess ratio of epichlorohydrin to aminic active hydrogen can be reduced. By adjusting, the molecular weight, epoxy equivalent, and softening point of the obtained nixy compound can be adjusted. If the excess ratio of epichlorohydrin is lowered, a cured product with a high molecular weight of the epoxy resin and high toughness can be obtained.On the other hand, when the excess ratio of epichlorohydrin is increased, a cured product with a low molecular weight and high heat resistance can be obtained. However, for boat fishing, if the excess ratio of epichlorohydrin exceeds 4 times, no change will occur, so the excess ratio is preferably 5 times or less.
本発明に使用される硬化剤としては９通常エポキシ樹脂
の硬化剤として常用されている化合物はすべて使用する
ことができ、ジエチレントリア之ン、トリエチレンテト
ラミンなどの脂肪族アミン類、メタフェニレンシア建ン
、ジアミノジフェニルメタン、ジアミノジフェニルスル
ホンなどの芳香族アミン類、ポリアミド樹脂およびこれ
らの変性物、無水！レイン酸、無水７タル酸、無水へキ
サヒドロフタル酸、無水ピロメリット酸などの醗無水物
系硬化剤、ジシアンシアミド、イｔ〆ゾール、ＢＦ、−
ア建ン錯体、ダアニゾン誘導体などの潜在性硬化剤など
があげられる。As the curing agent used in the present invention, all compounds commonly used as curing agents for epoxy resins can be used, including aliphatic amines such as diethylene triamine and triethylene tetramine, metaphenylene cyanide, etc. , aromatic amines such as diaminodiphenylmethane and diaminodiphenylsulfone, polyamide resins and modified products thereof, anhydrous! Anhydride curing agents such as leic acid, 7-talic anhydride, hexahydrophthalic anhydride, pyromellitic anhydride, dicyancyamide, itterizole, BF, -
Examples include latent curing agents such as amine complexes and daanizone derivatives.
止揚された如き各化合物を硬化剤として用いる際は、多
くの場合、さらに硬化促進剤をも使用することが必要と
なるが、そうした場合にはジメチルペンジルアミンなど
の如き三級アミン類、イミダゾール類または各種金属化
合物などをはじめ、例えば垣内弘編エポキシ樹脂（昭晃
堂）Ｐ３３０〜３３１に記載されている公知慣用の硬化
促進剤ナベてを使用できる。When using such compounds as curing agents, it is often necessary to also use curing accelerators, but in such cases, tertiary amines such as dimethylpenzylamine, imidazoles, etc. Alternatively, in addition to various metal compounds, well-known and commonly used curing accelerator pots described in Epoxy Resin (Shokodo), pages 330 to 331 edited by Hiroshi Kakiuchi, can be used.
本発明のエポキシ樹脂組成物には、さらに必要に応じて
充填剤、着色剤などの公知慣用の各種添加剤をも添加配
合せしめることができ、ｔたタール、ピッチ、アミン樹
脂、アルキッド樹脂、７８ノール樹脂なども併用するこ
とができる。The epoxy resin composition of the present invention may further contain various known and commonly used additives such as fillers and colorants, such as tar, pitch, amine resin, alkyd resin, 78 Nor resin etc. can also be used together.
（実施例）
次に本発明を製造例、実施例および比較例により具体的
に説明する。尚、例中において部は特に断シのない限り
すべて重量部である。(Example) Next, the present invention will be specifically explained using manufacturing examples, examples, and comparative examples. In the examples, all parts are by weight unless otherwise specified.
製造例１
４．４′−ビス（４−アミノフェノキシ）ビフェニ／Ｉ
／３６８部をエピクロルヒドリン７４０部に溶解させた
後、攪拌しながら５０〜６０℃で２０チ水酸化ナトリウ
ム水溶液８００部を５時間かけて滴下し、更に１時間反
応させ、次いで水層を棄却した後、過剰のエピクロルヒ
ドリンを蒸留回収して反応組成物を得た。この反応組成
物にトルエン８９０部を加えて均一に溶解させ、水３０
０部を加えて未洗した後、油水分離し、油層からトルエ
ンを留去させるととＫよって、エポキシ当量が１５８な
るエポキシ樹脂（ａ） ５６２部を得た。Production example 1 4.4'-bis(4-aminophenoxy)bipheny/I
After dissolving 368 parts of /368 parts in 740 parts of epichlorohydrin, 800 parts of a 20% sodium hydroxide aqueous solution was added dropwise over 5 hours at 50 to 60°C with stirring, the mixture was reacted for an additional hour, and the aqueous layer was discarded. Then, excess epichlorohydrin was recovered by distillation to obtain a reaction composition. To this reaction composition, 890 parts of toluene was added and dissolved uniformly, and 30 parts of water was added.
After adding 0 parts and leaving the mixture unwashed, oil and water were separated, and toluene was distilled off from the oil layer to obtain 562 parts of epoxy resin (a) having an epoxy equivalent of 158.
製造例２
エピクロルヒドリンの使用量を５５５部とした以外は製
造例１と同様にして工Ｉキシ轟量が１７９なるエポキシ
樹脂（ｂ）５５２部を得た。Production Example 2 552 parts of an epoxy resin (b) having an I-oxygen content of 179 was obtained in the same manner as Production Example 1 except that the amount of epichlorohydrin used was 555 parts.
実施例１〜２および比較例１〜２
エポキシ樹脂として製造例１〜２で得られたエポキシ樹
脂（１）〜（ｂ）％フェノールノゴラックエ４キシ樹脂
エビクロンＮ−７３８（大日本インキ化学工業■製、エ
デキシ当量１８０〕又はジアミノジフェニルメタン製グ
リジノルアミンエポキシ樹脂エビクロン４３０（同社製
、エポキシ当量１２０）を、硬化剤としてエビクロンＢ
−５７０（同社製、メチルテトラヒトはフタル酸無水物
）を、硬化促進剤として２−エチル−４−メチルイζ〆
ゾールをそれぞれ用い、エポキシ樹脂の工Ｉキシ基１個
に対して硬化剤の酸無水物基が１個になる様に表−ＩＫ
示す組成で配合して、本発明および比較対照用のエポキ
シ樹脂組成物を得た。Examples 1-2 and Comparative Examples 1-2 Epoxy resin obtained in Production Examples 1-2 as epoxy resin (1)-(b)% phenol nogolaque 4-oxy resin Ebicuron N-738 (Dainippon Ink & Chemicals [manufactured by the same company, edexy equivalent 180] or diaminodiphenylmethane glycinolamine epoxy resin Evicron 430 (manufactured by the same company, epoxy equivalent 120) as a hardening agent.
-570 (manufactured by the same company, methyltetrahydrogen is phthalic anhydride) and 2-ethyl-4-methylisotazole as a curing accelerator, respectively, and the curing agent was Table-IK so that there is one acid anhydride group
Epoxy resin compositions for the present invention and for comparison were obtained by blending the compositions shown.
とれらのニーキシ樹脂組成物をｉｏｏ℃で２時間、次い
”ｅ１６０℃で２時間、更ＩＣ１８０Ｃ−ｔ’２時間の
条件で硬化せしめて試験片とし、Ｊｌｆｉ Ｋ−６９１
１に準拠して熱変形温度、曲げ強度、曲げ弾性率、引張
シ強度、引張シ伸び率および煮沸吸水率を測定した。結
果を表−ＩＫ示す。Tore's Nixi resin composition was cured under the conditions of 2 hours at IOOO°C, 2 hours at 160°C, and 2 hours further at IC180C-t' to prepare a test piece.Jlfi K-691
The thermal deformation temperature, bending strength, bending modulus, tensile strength, tensile elongation, and boiling water absorption were measured in accordance with 1. The results are shown in Table IK.
実施例３〜４および比較例３〜４
エポキシ樹脂として前記と同様にエポキシ樹脂（１）〜
伽）、エビクロンＮ−７３８又はエビクロン４３０を、
硬化剤としてＤＤＭ（ジアミノジフェニルメタン）をそ
れぞれ用い、エポキシ樹脂のエポキシ１１個に対して硬
化剤の活性水素基が１個になるように表−ＩＫ示す組成
で配合して１本発明および比較対照用のエポキシ樹脂組
成物を得た。Examples 3-4 and Comparative Examples 3-4 As the epoxy resin, epoxy resin (1) to
), Ebikuron N-738 or Ebikuron 430,
DDM (diaminodiphenylmethane) was used as a curing agent, and the curing agent was blended with the composition shown in Table IK so that the number of active hydrogen groups in the curing agent was one for every 11 epoxy groups in the epoxy resin. An epoxy resin composition was obtained.
これらの工ｌキシ樹脂組成物を８０℃で５時間、更に１
６０℃で４時間の条件で、硬化せしめて試験片とし、Ｊ
ＩＳ Ｋ−６９１１に準拠して前記例と同様の項目を測
定した。結果を表−１に示す。These synthetic resin compositions were heated at 80°C for 5 hours and then for 1 hour.
Cured at 60°C for 4 hours to prepare a test piece, J
The same items as in the above example were measured in accordance with IS K-6911. The results are shown in Table-1.
（発明の効果）
本発明のエポキシ樹脂組成物から得られた硬化物は、飛
躍的に優れた耐熱性、耐水性および靭性を有するという
特徴がある。(Effects of the Invention) The cured product obtained from the epoxy resin composition of the present invention is characterized by dramatically superior heat resistance, water resistance, and toughness.
従りて本発明のエポキシ樹脂組成物は成製材料。Therefore, the epoxy resin composition of the present invention is a synthetic material.
注型材料、治工具用、積層材料、電気絶縁材料、箪料、
土木・建築材料、接着剤、複合材料などの用途に極めて
有用である。Casting materials, jigs and tools, laminated materials, electrical insulation materials, cabinetry,
Extremely useful for civil engineering/building materials, adhesives, composite materials, etc.
Claims (1)
進剤から構成されるエポキシ樹脂組成物において、該エ
ポキシ樹脂成分として、 構造式〔 I 〕 ▲数式、化学式、表等があります▼…〔 I 〕 で示される化合物にエピクロルヒドリンを反応させて得
られるグリシジルアミン型エポキシ樹脂を含有すること
を特徴とするエポキシ樹脂組成物。 ２、エポキシ樹脂および硬化剤、更に必要により硬化促
進剤から構成されるエポキシ樹脂組成物において、該エ
ポキシ樹脂成分として、 構造式〔II〕 ▲数式、化学式、表等があります▼ …〔II〕 で示されるグリシジルアミン型エポキシ樹脂を含有する
ことを特徴とするエポキシ樹脂組成物。[Claims] 1. In an epoxy resin composition composed of an epoxy resin, a curing agent, and, if necessary, a curing accelerator, the epoxy resin components include the following structural formula [I] ▲ mathematical formula, chemical formula, table, etc. ▼... An epoxy resin composition characterized by containing a glycidylamine type epoxy resin obtained by reacting the compound represented by [I] with epichlorohydrin. 2. In an epoxy resin composition composed of an epoxy resin, a curing agent, and, if necessary, a curing accelerator, the epoxy resin components include the following structural formula [II] ▲ Numerical formula, chemical formula, table, etc. ▼ ... [II] An epoxy resin composition comprising the following glycidylamine type epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10025288A JPH01271413A (en) | 1988-04-25 | 1988-04-25 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10025288A JPH01271413A (en) | 1988-04-25 | 1988-04-25 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01271413A true JPH01271413A (en) | 1989-10-30 |
Family
ID=14269032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10025288A Pending JPH01271413A (en) | 1988-04-25 | 1988-04-25 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01271413A (en) |
-
1988
- 1988-04-25 JP JP10025288A patent/JPH01271413A/en active Pending
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