JPH01270289A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH01270289A JPH01270289A JP9867788A JP9867788A JPH01270289A JP H01270289 A JPH01270289 A JP H01270289A JP 9867788 A JP9867788 A JP 9867788A JP 9867788 A JP9867788 A JP 9867788A JP H01270289 A JPH01270289 A JP H01270289A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring
- wiring board
- conductors
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 abstract description 5
- 230000005012 migration Effects 0.000 abstract description 4
- 238000013508 migration Methods 0.000 abstract description 4
- 230000003071 parasitic effect Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 238000007650 screen-printing Methods 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 238000005520 cutting process Methods 0.000 abstract description 2
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、小型化、軽量化に適合した、特に、配線導体
の高密度化を実現するプリント配線基板に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a printed wiring board that is suitable for miniaturization and weight reduction, and in particular realizes high density wiring conductors.
従来の技術
近年、電子機器の軽薄短小化に伴い、プリント配線基板
に対して、高密度化が要求されるようになってきた。BACKGROUND OF THE INVENTION In recent years, as electronic devices have become lighter, thinner, shorter and smaller, printed wiring boards have been required to have higher density.
第３図は、これらに用いられるプリント配線基板の斜視
図を示し、第４図は、その断面図を示すものである。こ
のようなプリント配線基板１には、配線導体２ａ、２ｂ
とその一部である半田付導体３が形成され、その上には
導体保護のため絶縁層６が形成されている。その後、半
田付導体３にたとえば半田ペーストをスクリーン印刷方
式によって供給し、電子部品４を搭載し、適切な半田付
温度によってリフローを行い、最終的に回路基板１゜と
なるものである。上記のようなプリント配線基板１に対
する小型化手段としては、配線密度を高めることが第１
であり、一般的には配線導体２ａ。FIG. 3 shows a perspective view of a printed wiring board used in these, and FIG. 4 shows a sectional view thereof. Such a printed wiring board 1 includes wiring conductors 2a, 2b.
A soldered conductor 3, which is a part thereof, is formed, and an insulating layer 6 is formed thereon to protect the conductor. Thereafter, a solder paste, for example, is supplied to the soldering conductor 3 by a screen printing method, an electronic component 4 is mounted, and reflow is performed at an appropriate soldering temperature to finally form a circuit board of 1°. The first means of downsizing the printed wiring board 1 as described above is to increase the wiring density.
, and is generally a wiring conductor 2a.
２ｂの導体幅寸法Ｖｖ’ ａ 、 Ｗ ｂを小さくする
こと、さらには配線導体間隙寸法Ｇを狭くすることが行
なわれている。Efforts have been made to reduce the conductor width dimensions Vv'a and Wb of the wiring conductor 2b, and further to narrow the wiring conductor gap dimension G.
発明が解決しようとする課題
しかしながら、従来のプリント配線基板１では配線導体
２ａ 、２ｂの高密度化を実現するために、配線導体２
ａと配線導体２ｂの間隙Ｇを挟くすると、線間寄生容量
の増大や、配線導体２ａ、２ｂが特にＡｑ系の場合に関
しては、金属マイグレーションが発生し易くなシ、長期
の耐湿寿命に耐えることができないなどの問題点を有し
ているものである。Problems to be Solved by the Invention However, in the conventional printed wiring board 1, in order to realize high density of the wiring conductors 2a and 2b, the wiring conductors 2
By sandwiching the gap G between a and the wiring conductor 2b, the increase in line parasitic capacitance and metal migration, especially when the wiring conductors 2a and 2b are Aq-based, are prevented, and the wiring conductor 2b can withstand a long moisture-resistant life. However, there are problems such as the inability to do so.
課題を解決するための手段
上記の課題を解決するために、プリント配線基板上の配
線導体と配線導体の間隙Ｇに位置する絶縁基材に凹溝を
形成するものである。Means for Solving the Problems In order to solve the above problems, grooves are formed in the insulating base material located in the gap G between the wiring conductors on the printed wiring board.
作 用
本発明はプリント配線基板上の導体間隙に凹溝を形成す
ることによって、誘電体として寄与していた絶縁基材が
なくなシ、寄生容量が低減するとともに、導体間距離が
実質的に長くなシ、金属マイグレーションの発生が防止
できることとなる。Function: By forming grooves in the gaps between conductors on a printed wiring board, the present invention eliminates the insulating base material that functions as a dielectric, reduces parasitic capacitance, and substantially reduces the distance between conductors. For a long time, the occurrence of metal migration can be prevented.
実施例
以下本発明のプリント配線基板の一実施例について図面
を参照しながら説明する。第１図は本実施例による斜視
図を示すものであシ、第２図はその断面図である。上記
に示すプリント配線基板１は、従来一般的に用いられて
いるエツチング法を用いて銅張積層板を使用して配線導
体２ａ、２ｂの形成を行なうものである。さらに、配線
導体２ａと配線導体２ｂの間隙Ｇに、たとえば、金型成
型加工や切削加工傘→尋媚吐によって凹溝７を形成する
。そして、配線導体２ａ、２ｂの保護のために、その上
にソルダーレジストを用い、絶縁層５の形成をスクリー
ン印刷法などによシ施す。このようにして得られたプリ
ント配線基板１ば、実質的な、配線導体間隙距離Ｇが長
くなるので、線間寄生容量が低減できるとともに、Ａｑ
系を用いた場合の金属マイグレーションの防止が可能と
なる。EXAMPLE Hereinafter, an example of the printed wiring board of the present invention will be described with reference to the drawings. FIG. 1 shows a perspective view of this embodiment, and FIG. 2 is a sectional view thereof. In the printed wiring board 1 shown above, wiring conductors 2a and 2b are formed using a copper-clad laminate using a conventionally commonly used etching method. Furthermore, a groove 7 is formed in the gap G between the wiring conductor 2a and the wiring conductor 2b by, for example, molding or cutting. Then, in order to protect the wiring conductors 2a and 2b, a solder resist is used thereon, and an insulating layer 5 is formed by screen printing or the like. In the printed wiring board 1 obtained in this way, the actual wiring conductor gap distance G becomes longer, so that line parasitic capacitance can be reduced and Aq
It becomes possible to prevent metal migration when using the system.
よって本発明のプリント配線基板１は配線密度を高める
ことができることとなり、小型で高品質の回路基板が得
られるものである。Therefore, the printed wiring board 1 of the present invention can increase wiring density, and a small, high-quality circuit board can be obtained.
発明の効果
以上のように本発明によれば、プリント配線板を構成す
る配線導体間隙に凹溝を形成したことによシ、電気特性
や、信頼性を損うことなく配線密度を高めることができ
、その結果小型で高品質のプリント配線基板が得られる
こととなシ極めて有益な発明である。Effects of the Invention As described above, according to the present invention, by forming grooves in the gaps between the wiring conductors constituting the printed wiring board, it is possible to increase the wiring density without impairing electrical characteristics or reliability. This is an extremely useful invention as it allows a compact and high quality printed wiring board to be obtained.
第１図は本発明の一実施例のプリント配線基板の斜視図
、第２図は第１図の断面図、第３図は従来のプリント配
線基板の斜視図、第４図は第３図の断面図である。
１・・・・・・プリント配線基板、２ａ、２ｂ・・・・
・・配線導体、３・・・・・・半田付導体、６・・・・
・・絶縁層、７・・・・・・凹溝。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名５
派Fig. 1 is a perspective view of a printed wiring board according to an embodiment of the present invention, Fig. 2 is a sectional view of Fig. 1, Fig. 3 is a perspective view of a conventional printed wiring board, and Fig. 4 is a perspective view of Fig. 3. FIG. 1...Printed wiring board, 2a, 2b...
...Wiring conductor, 3... Soldering conductor, 6...
...Insulating layer, 7... Concave groove. Name of agent: Patent attorney Toshio Nakao and 1 other person5
sect
Claims (1)
する絶縁基材に、凹溝を形成したことを特徴とするプリ
ント配線基板。A printed wiring board characterized in that a groove is formed in an insulating base material located in a gap between two adjacent wiring conductors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9867788A JPH01270289A (en) | 1988-04-21 | 1988-04-21 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9867788A JPH01270289A (en) | 1988-04-21 | 1988-04-21 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01270289A true JPH01270289A (en) | 1989-10-27 |
Family
ID=14226144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9867788A Pending JPH01270289A (en) | 1988-04-21 | 1988-04-21 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01270289A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03265187A (en) * | 1990-03-15 | 1991-11-26 | Matsushita Electric Ind Co Ltd | Electronic device |
| EP0921715A1 (en) * | 1997-11-06 | 1999-06-09 | Samsung Electronics Co., Ltd. | PCB for mounting RF band pass filter and method of manufacture |
-
1988
- 1988-04-21 JP JP9867788A patent/JPH01270289A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03265187A (en) * | 1990-03-15 | 1991-11-26 | Matsushita Electric Ind Co Ltd | Electronic device |
| EP0921715A1 (en) * | 1997-11-06 | 1999-06-09 | Samsung Electronics Co., Ltd. | PCB for mounting RF band pass filter and method of manufacture |
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