JPH01270245A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To make enlargement ratio optionally variable in both the X and Y directions of a wafer by sticking at least two sheets of strips of third self-adhesive sheets to both sides of first and second self-adhesive sheets and enlarging the first adhesive sheet by enlarging the second and the third adhesive sheets. CONSTITUTION:To widen slits 5 of a wafer, the enlargement ratio in the X direction must be raised. For this reason, four sheets of strip-shaped third self-adhesive sheets 10 are moved to the X axis and sticked almost symmetrically and radially with regard to the X axis and Y axis. And when the overlapping part of the second the third self-adhesive sheets 6 and 10 are pressed and enlarged with an enlarging jig, the enlargement of the first adhesive sheet 2 becomes larger in the X direction than in the Y direction and the wafer is enlarged in ellipse. The enlargement ratio in the X and Y directions can be changed optionally by the sticking position or the number of the third adhesive sheets 10. Hereby, the enlargement ratio in the X and Y directions of the wafer can be changed optionally.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a so-called pelletizing method for separating a semiconductor wafer into individual elements.

[Conventional technology]

In conventional bulletizing, a semiconductor wafer (hereinafter referred to simply as a wafer) 3 is placed on the surface of a first adhesive sheet 2 attached to a flat ring 1, as shown in FIGS. 4(a) to 4(d). Paste (Figure a), then thickness 20-50μ
Using a blade 4 of approximately m length, cut 5 into the wafer 3 in the shape of a substrate to a depth that reaches the first adhesive sheet 2 to form semiconductor elements (hereinafter referred to as pellets) 3' (Figure b).
Next, the back side of the first adhesive sheet 2, that is, the pellet 3'
A second adhesive sheet 6 larger than the first adhesive sheet 2 is pasted on the surface opposite to the pasted surface (Fig. 0), and placed on an enlarging ring 8 set on a stand 7. The above-mentioned sheet is placed on the second adhesive sheet 6, and the ends of the second adhesive sheet 6 are held between the enlarging jig 9 and pushed down to enlarge the second adhesive sheet, and the first enlarged sheet 2 is expanded accordingly. This was done by increasing the distance between the pellets 3' (Fig. d).

The reason why the distance between the pellets 3' is widened is that when the pellets 3' are pushed up from the back side of the first and second adhesive sheets with a needle to start up the pellets 3', adjacent pellets may collide with each other or pick up. This is done to prevent the up jig from contacting adjacent pellets and damaging them.

[Problem to be solved by the invention]

In the conventional bulletizing method described above, the first adhesive sheet is expanded indirectly by expanding the second adhesive sheet, so while the peripheral part of the second adhesive sheet is easy to stretch,
The area where the first and second adhesive sheets overlap is difficult to stretch.
There was a drawback that the mutual spacing between the pellets 3' could not be obtained sufficiently. In particular, in semiconductor devices where the pellet size is around 1 mm, the number of notches increases, and in order to obtain the minimum interval between pellets (0.4 to 0.5 mm), the expansion ratio of the first adhesive sheet must be increased. Must. For that purpose,
Although it is necessary to increase the magnification ratio of the second adhesive sheet, the second adhesive sheet may be torn before that, and the above-mentioned required interval between pellets may not be obtained.

[Differences between the invention and the prior art]

This method differs from the conventional pelletizing method described above in that it is not only possible to efficiently enlarge the overlapped portion of the first and second adhesive sheets, but also to have directionality in the enlargement rate. .

[Means to solve the problem]

The bulletizing method of the present invention includes attaching at least two pieces of the third adhesive sheet across both the first and second adhesive sheets, and enlarging the second and third adhesive sheets. It has the feature of enlarging the adhesive sheet of No. 1.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 shows a plan view (a) and a cross-sectional view (b) of an embodiment in which the present invention is applied to pelletizing a linear sensor. A linear sensor is an optical sensor in which 100 to 10,000 photodiodes are lined up in a row, and the pellet size is quite long, measuring 1 mm x 5 to 100 mm. In the case of such pellets, the number of cuts in the wafer 3 is 100 or more in the X direction and 3 to 5 in the X direction, as shown in FIG. In order to widen the notches 5 of this wafer to a minimum interval of 0.4 to 0.5 m, it is naturally necessary to increase the magnification ratio in the X direction. In order to realize this, a third adhesive sheet 10 in the form of a strip is used.
It is effective to paste four sheets as shown in Figure (a). That is, a strip-shaped adhesive sheet having a width of about 25 mm and a length of about 50 mm is brought to the Y axis and pasted radially and approximately symmetrically with respect to the Y axis.

The overlapping width of the first and third adhesive sheets is approximately 10 mm,
The expansion jig is pressed so that the second and third adhesive sheets overlap. As a result, when the first pressure-sensitive adhesive sheet is enlarged using the method shown in FIG. 4, the first pressure-sensitive adhesive sheet is enlarged in the X direction more than in the X direction, and is enlarged into an elliptical shape as shown in FIG. 1(c).

The enlargement ratio in the X direction and the X direction can be arbitrarily changed depending on the attachment position and number of third adhesive sheets.

For example, in the case of a linear sensor in which 5,000 to 10,000 photodiodes are arranged in a row, the pellet size is approximately 0.5 mm x 70 mm, and as shown in Figure 2, the effective pellet is located in the center of the wafer - in the row. I can only collect it. In such a case, it is necessary to maximize the magnification in the X direction of the figure, and it is sufficient to attach two third adhesive sheets 10 in the X direction. Of course, the size of the sheet 10 can be selected in various ways depending on the materials and thicknesses of the first and second sheets, or the characteristics of the device for enlarging the sheets.

In this case as well, it goes without saying that the third sheet 10 overlaps a part of the first sheet 2, and that the overlapping portion of the second sheet and the third sheet needs to be pressed and enlarged with an enlarging jig. stomach.

Furthermore, if it is desired to increase the magnification ratio in the X direction, a third adhesive sheet may be attached closer to the Y axis as shown in FIG.

However, in the example of FIG. 3, the dimensional ratio of the pellet in the X direction and the X direction is not so large compared to the previous example, so the third adhesive sheet can be applied at an open angle to the Y axis.

The shape of the third adhesive sheet is not limited to a rectangular shape, but may be oval, triangular, etc. Needless to say, it can be arbitrarily selected depending on the adhesive properties such as the elongation rate of the second adhesive sheet.

〔Effect of the invention〕

As explained in detail above, according to the present invention, the enlargement ratio of the wafer in the X direction and the X direction can be changed arbitrarily,
It is effective in obtaining the necessary pellet spacing even for pellets with an extremely large aspect ratio, such as those used in area sensors.

4. Brief Description of the Drawings FIG. 4 is a plan view showing the embodiment of FIG. 4, and a sectional view showing a conventional manufacturing method.

1...Flat ring, 2...1st
adhesive sheet, 3...semiconductor wafer, 3'...
... Semiconductor element (pellet), 4 ... Blade, 5 ... Notch, 6 ... Second
Adhesive sheet, 7... stand, 8... enlarging ring, 9... enlarging jig, 1゛0......
Third adhesive sheet.

Agent Patent Attorney Oto Uchihara Figure 1 Figure 1 (C)

Claims (1)

[Claims] A first adhesive sheet is pasted on the back side of a semiconductor wafer, cuts are made in the semiconductor wafer in a grid pattern with a depth that reaches the first adhesive sheet, and further the semiconductor wafer and the first adhesive sheet are bonded to each other. In the method, a second adhesive sheet larger than the first adhesive sheet is affixed to the opposing surface, and the second adhesive sheet is enlarged to enlarge the relative positions of the individual pieces of the semiconductor wafer in which the incisions have been made. and spanning only the first and second adhesive sheets,
At least two pieces of a third adhesive sheet are pasted on both surfaces so as not to overlap each other, and the first adhesive sheet is expanded by expanding the second and third adhesive sheets. A method for manufacturing a semiconductor device.