JPH01268882A - Surface treatment of resin coating on metallic material - Google Patents
Surface treatment of resin coating on metallic materialInfo
- Publication number
- JPH01268882A JPH01268882A JP9399788A JP9399788A JPH01268882A JP H01268882 A JPH01268882 A JP H01268882A JP 9399788 A JP9399788 A JP 9399788A JP 9399788 A JP9399788 A JP 9399788A JP H01268882 A JPH01268882 A JP H01268882A
- Authority
- JP
- Japan
- Prior art keywords
- resist
- resin
- etching
- printing
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims abstract description 35
- 229920005989 resin Polymers 0.000 title claims abstract description 35
- 239000011248 coating agent Substances 0.000 title claims abstract description 9
- 238000000576 coating method Methods 0.000 title claims abstract description 9
- 238000004381 surface treatment Methods 0.000 title claims abstract description 8
- 239000007769 metal material Substances 0.000 title claims abstract description 7
- 238000005530 etching Methods 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000007788 roughening Methods 0.000 claims abstract description 8
- 238000007639 printing Methods 0.000 abstract description 15
- 239000000463 material Substances 0.000 abstract description 11
- 238000005498 polishing Methods 0.000 abstract description 6
- 238000010019 resist printing Methods 0.000 abstract description 6
- 239000006185 dispersion Substances 0.000 abstract description 3
- 238000000866 electrolytic etching Methods 0.000 abstract description 3
- 238000005488 sandblasting Methods 0.000 abstract description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 abstract description 3
- 239000002253 acid Substances 0.000 abstract description 2
- 229920002313 fluoropolymer Polymers 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 description 34
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 34
- 238000004873 anchoring Methods 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000001680 brushing effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000467686 Eschscholzia lobbii Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007644 letterpress printing Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
この発明は、アルミニウム材のような金属材に例えばフ
ッ素樹脂を被覆するに当り、樹脂を被覆すべき面に予め
下地処理を施しておく方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for coating a metal material such as an aluminum material with, for example, a fluororesin, in which the surface to be coated with the resin is preliminarily treated as a base.
従来技術およびその問題点
一般に、アルミニウム材の表面にフッ素樹脂をコーティ
ングあるいは接菅により塗布する場合、塗布すべき面と
樹脂との密着性が肝要であり、密着性の向上のために従
来より種々の粗面化方法が行なわれている。この方法の
1つとしてエツチング方法がある。これは、樹脂を被覆
すべき面にエツチングレジストを所定のパターンに印刷
して、レジストによるマスク部と非マスク部を形成し、
ついで非マスク部を化4的ないし電気的にエツチングし
て樹脂投錨用四部を形成し、ついでマスク部に残ったレ
ジストを除去するものである。Prior art and its problems Generally, when applying a fluororesin to the surface of an aluminum material by coating or glueing, it is important to have good adhesion between the surface to be applied and the resin, and various methods have been used to improve the adhesion. Surface roughening methods have been used. One of these methods is an etching method. This involves printing etching resist in a predetermined pattern on the surface to be coated with resin, forming masked areas and non-masked areas using the resist.
Next, the non-masked portions are etched chemically or electrically to form four resin anchoring portions, and then the resist remaining on the masked portions is removed.
しかし、この方法の場合、レジストが印刷されたマスク
部は必然的にエツチングされないため、レジスト除去後
にフッ素樹脂を被覆したときに、この部分においてアル
ミニウム材と樹脂との密着性がはなはだよくないという
問題があった。However, in this method, the mask area where the resist is printed is not necessarily etched, so when the fluororesin is coated after the resist is removed, there is a problem that the adhesion between the aluminum material and the resin is very poor in this area. was there.
この発明は、上記の如き点に鑑み、化学的ないし電気的
エツチングを採用する下地処理において、アルミニウム
材の非エツチング部と樹脂との密着性をすこぶる向上さ
せることができる下地処理方法を提供することを目的と
する。In view of the above points, an object of the present invention is to provide a surface treatment method that can greatly improve the adhesion between the non-etched portion of an aluminum material and a resin in surface treatment that employs chemical or electrical etching. With the goal.
問題点の解決手段
この発明による下地処理方法は、上記目的の達成のため
に、樹脂を被覆すべき面にエツチングレジストを所定の
パターンに印刷して、レジストによるマスク部と非マス
ク部を形成し、ついで非マスク部をエツチングして樹脂
投錨用凹部を形成する下地処理において、樹脂を被覆す
べき面をレジスト印刷前に粗面化しておくことを特徴と
する。Means for Solving the Problems In order to achieve the above object, the surface treatment method according to the present invention prints etching resist in a predetermined pattern on the surface to be coated with resin to form masked areas and non-masked areas by the resist. In the surface treatment in which the non-mask portions are then etched to form recesses for resin anchoring, the surface to be coated with resin is roughened before resist printing.
この明細書において、「アルミニウム」なる用語は、純
アルミニウムはもちろんのこと、少量の不純物を含む市
販のアルミニウム、アルミニウムをベースとするアルミ
ニウム合金などをも含むものとする。In this specification, the term "aluminum" includes not only pure aluminum but also commercially available aluminum containing small amounts of impurities, aluminum alloys based on aluminum, and the like.
アルミニウム材よりなる製品としては、炊飯ジャー、餅
つき器、パン焼き器、フライパン、鍋、ホットプレート
、製氷皿、オーブン皿などが例示される。Examples of products made of aluminum include rice cookers, rice cake makers, bread makers, frying pans, pots, hot plates, ice cube trays, and oven plates.
この発明によるアルミニウム材の樹脂被覆における下地
処理方法は、添付第1図のフローシートで示される。The base treatment method for coating aluminum material with resin according to the present invention is shown in the flow sheet of FIG. 1 attached hereto.
まず、樹脂を被覆すべき面は、好ましくは、脱脂処理せ
られる。この脱脂処理は、つぎの粗面化の後で洗浄処理
とともに行なってもよい。First, the surface to be coated with resin is preferably degreased. This degreasing treatment may be performed together with the cleaning treatment after the next surface roughening.
ついで、樹脂を被覆すべき面に施される粗面化は、一般
に、サンドブラスト、ワイヤーブラッシング、調布研摩
などの機械的研摩法によってなされる。粗面化は化学的
ないし電気的工・ソチングによってなされてもよい。粗
面化の粗度は、好ましくは、1〜101111 (Rm
a x)である。この理由は、1m未満では充分な密着
性が得られず、逆に10贋を越えるとつぎの印刷がきれ
いにできないからである。The surface to be coated with resin is then roughened, generally by mechanical polishing methods such as sandblasting, wire brushing, and Chofu polishing. The surface roughening may be performed by chemical or electrical processing or soching. The roughness of the surface roughening is preferably 1 to 101111 (Rm
ax). The reason for this is that if the length is less than 1 m, sufficient adhesion cannot be obtained, and if the length exceeds 10 m, the next printing cannot be done clearly.
粗面化の後は、好ましくは、生じた研摩粉をつぎの印刷
の前にアルカリ洗浄または酸洗浄によって除去しておく
。After surface roughening, the abrasive powder produced is preferably removed by alkaline or acid cleaning before the next printing.
つぎに、印刷工程において、エツチングレジストの印刷
は、平版印刷、凹版印刷、凸版印刷、スクリーン印刷、
グラビア印刷などによって行なわれる。形成されるパタ
ーンは、格子状、縦縞状、横縞状、千鳥格子状などであ
る。格子状パターンの場合、格子状のマスク部によって
多数の正方形ないし長方形の非マスク部が形成せられる
。印刷線の太さは0.05〜0.5mm、印刷線のピッ
チは0.11−1oIIが好ましい。印刷インクは、印
刷方法にしたがって適宜選択される。Next, in the printing process, etching resist printing can be performed using lithographic printing, intaglio printing, letterpress printing, screen printing,
This is done by gravure printing, etc. The pattern formed is a lattice, vertical stripes, horizontal stripes, houndstooth check, or the like. In the case of a grid-like pattern, a large number of square or rectangular non-masked parts are formed by the grid-like mask parts. The thickness of the printed lines is preferably 0.05 to 0.5 mm, and the pitch of the printed lines is preferably 0.11-1oII. The printing ink is appropriately selected according to the printing method.
つぎに、エツチング工程において、化学的エツチングを
行なう場合には、塩酸のような無機酸の溶液を用いる。Next, in the etching step, when chemical etching is performed, a solution of an inorganic acid such as hydrochloric acid is used.
また電気的エツチングを行なう場合には、アルカリを含
む電解液中で直流電解、交流電解または交直重畳電解を
行なう。When electrical etching is performed, direct current electrolysis, alternating current electrolysis, or alternating current electrolysis is performed in an electrolytic solution containing an alkali.
印刷レジストを損傷しないという点で、直流電解エツチ
ングが特に好ましい。このエツチングの結果、非マスク
部が樹脂投錨用の四部になされる。この凹部の深さは、
通常1001m、好ましくは20〜50切である。Direct current electrolytic etching is particularly preferred because it does not damage the printed resist. As a result of this etching, the unmasked parts are made into four parts for resin anchoring. The depth of this recess is
Usually 1001 m, preferably 20 to 50 m.
エツチング後、通常は、レジストが除去せられる。レジ
ストの除去は、無機酸溶液ないし有機溶剤でレジスト面
を処理することによってなされる。ただし、印刷インク
としてフッ素樹脂系のものを用いた場合には、レジスト
を除去する必要はない。After etching, the resist is typically removed. The resist is removed by treating the resist surface with an inorganic acid solution or an organic solvent. However, if a fluororesin-based printing ink is used, there is no need to remove the resist.
下地処理せられた金属材への樹脂の被覆は、四フッ化エ
チレン樹脂のようなフッ素樹脂の水性分散液をアルミニ
ウム材に塗布し、ついで焼付けを行なうことによってな
される。なお、樹脂皮膜の前に下地面にアルマイト層を
形成しておくこともある。金属材への樹脂被覆の例とし
ては、上記の如きアルミニウム材へのフッ素樹脂の被覆
の外に、鋼材への塩化ビニル樹脂の被覆などがある。The coated metal material is coated with a resin by applying an aqueous dispersion of a fluororesin such as tetrafluoroethylene resin to the aluminum material and then baking the material. Note that an alumite layer may be formed on the underlying surface before the resin film is applied. Examples of coating metal materials with resin include coating steel materials with vinyl chloride resin, in addition to coating aluminum materials with fluororesin as described above.
実 施 例
つぎに、この発明の実施例を図面を基に具体的に説明す
る。Embodiments Next, embodiments of the present invention will be specifically described based on the drawings.
実施例1
第2〜5図において、アルミニウム材として、厚み1.
5mmのアルミニウム板(AIloo) (1)を使用
した。Example 1 In FIGS. 2 to 5, the aluminum material has a thickness of 1.
A 5 mm aluminum plate (AIloo) (1) was used.
まず、このアルミニウム板(1)の表面をワイヤーブラ
ッシングによって機械的に研摩し、粗度5/11!1(
Rmax)に粗面化した。この粗面化アルミニウム板(
1)をついで50℃の5%水酸化ナトリウム水溶液より
なる処理液に1分間浸漬して、粗面化によって生じた研
摩粉の除去とともに脱脂を行なった。First, the surface of this aluminum plate (1) was mechanically polished by wire brushing to a roughness of 5/11!1 (
Rmax). This roughened aluminum plate (
1) was then immersed in a treatment solution of 5% sodium hydroxide aqueous solution at 50° C. for 1 minute to remove abrasive powder produced by roughening the surface and to degrease it.
つぎに、第2図に示すように、研摩処理されたアルミニ
ウム板(1)の表面にスクリーン印刷によりエツチング
レジスト(2)を格子状パターンに印刷した。ここで、
レジスト(2)によって形成された格子線の太さは0.
2mm、格子線のピッチは0.5+ni、格子状パター
ンのレジスト(2)によってマスクされない非マスク部
(3)の大きさは0.5 mm X 0.5 mmとし
た。印刷インクとしては、酸化チタンを含む白色インク
を用いた。Next, as shown in FIG. 2, an etching resist (2) was printed in a grid pattern on the surface of the polished aluminum plate (1) by screen printing. here,
The thickness of the grid lines formed by resist (2) is 0.
2 mm, the pitch of the grid lines was 0.5+ni, and the size of the non-masked portion (3) not masked by the grid pattern resist (2) was 0.5 mm x 0.5 mm. As the printing ink, a white ink containing titanium oxide was used.
ついで、第3図に示すように、この格子状パターンの印
刷レジスト(2)を有するアルミニウム板(1)を30
℃の5%塩化ナトリウム水溶液よりなる電解液に浸漬し
て、該アルミニウム板(1)を陽極とし、対極にカーボ
ン板を接続して、電流密度20A/ drti’で、3
分間、直流電解エツチングを行なった。これによって非
マスク部(3)がエツチングされて、アルミニウム板(
1)の表面に多数の樹脂投錨用凹部(4)が形成された
。Next, as shown in FIG. 3, the aluminum plate (1) having the grid pattern printing resist (2) was
The aluminum plate (1) was immersed in an electrolytic solution consisting of a 5% sodium chloride aqueous solution at a temperature of 3°C, and the aluminum plate (1) was used as an anode and a carbon plate was connected to the counter electrode, and the current density was 20 A/drti'.
Direct current electrolytic etching was performed for 1 minute. As a result, the non-mask portion (3) is etched, and the aluminum plate (
A large number of resin anchoring recesses (4) were formed on the surface of 1).
こうしてアルミニウム板(1)の表面が粗度40μ@
(Rmax)に粗面化せられた。In this way, the surface of the aluminum plate (1) has a roughness of 40μ@
(Rmax).
つぎに、第4図に示すようにjfli化アルミニウム板
(1)を塩酸溶液に浸漬して、マスク部に残ったレジス
ト(2)を除去した。こうして粗面化下地面を形成した
。Next, as shown in FIG. 4, the jfli aluminum plate (1) was immersed in a hydrochloric acid solution to remove the resist (2) remaining on the mask portion. In this way, a roughened base surface was formed.
ついで、第5図に示すように、こうして下地処理せられ
たアルミニウム板(1)の表面に四フッ化エチレン樹脂
の水性分散液(デュポン社製、品番456−300)を
スプレーコートで塗布し、約400℃の温度で10分間
、焼付けを行なって、粗面化アルミニウム板(1)の表
面に厚さ30μlの樹脂被覆層(5)を形成した。Next, as shown in FIG. 5, an aqueous dispersion of tetrafluoroethylene resin (manufactured by DuPont, product number 456-300) was spray coated on the surface of the aluminum plate (1) which had been subjected to the surface treatment in this way. Baking was performed at a temperature of about 400° C. for 10 minutes to form a resin coating layer (5) with a thickness of 30 μl on the surface of the roughened aluminum plate (1).
実施例2
アルミニウム板(1)の表面の機械的研摩において、ワ
イヤーブラッシングの代わりに、アルミナ粒子を用いて
サンドブラストを行ない、アルミニウム板(1)の表面
を研摩し、粗度5IyI(Rmax)に粗面化した。そ
の他の点は実施例1と同様に操作した。Example 2 In mechanically polishing the surface of the aluminum plate (1), sandblasting was performed using alumina particles instead of wire brushing, and the surface of the aluminum plate (1) was polished to a roughness of 5IyI (Rmax). It turned into a face. The other points were operated in the same manner as in Example 1.
比較例
アルミニウム板(1)の表面の機械的研摩を行なず、そ
の他の点を実施例1と同様に操作した。Comparative Example The aluminum plate (1) was operated in the same manner as in Example 1 except that the surface of the aluminum plate (1) was not mechanically polished.
密着性の評価
実施例1、実施例2および比較例においてそれぞれ形成
した樹脂被覆層について、JISの手法にしたがって剥
離試験を行なった。その結果を下表に示す。Evaluation of Adhesion A peel test was conducted on the resin coating layers formed in Example 1, Example 2, and Comparative Example in accordance with the JIS method. The results are shown in the table below.
この表から明らかなように、印刷前に研摩操作を行なっ
た実施例の場合には、この研摩を行なわなたった比較例
の場合に比べて、樹脂被覆層の剥離強度が著しく大きい
。As is clear from this table, the peel strength of the resin coating layer in the examples in which the polishing operation was performed before printing was significantly greater than in the comparative examples in which this polishing was performed.
発明の効果
この発明の下地処理方法によれば、レジストを印刷すべ
き面を予め粗面化しておくので、レジストが印刷された
マスク部は、つぎの工程でエツチングされなくても、こ
の部分に被覆された樹脂層に対して大きな密着性を発揮
することができる。したがって、本書冒頭で述べた従来
技術の場合のようにマスク部において密着性が劣るとい
った問題を効果的に解消することができる。Effects of the Invention According to the base treatment method of the present invention, the surface on which the resist is to be printed is roughened in advance, so that the mask portion on which the resist is printed can be etched in this area even if it is not etched in the next step. It can exhibit great adhesion to the coated resin layer. Therefore, it is possible to effectively solve the problem of poor adhesion at the mask portion as in the case of the prior art described at the beginning of this document.
図面はこの発明の実施例を示すもので、第1図はこの発
明の方法を実施するフローシート、第2図〜第5図はこ
の発明の方法を工程順に説明するためのもので、第2図
はエツチングレジスト印刷後のアルミニウム板の部分拡
大平面図、第3図はレジスト印刷を有するアルミニウム
板のエツチング後の部分拡大断面図、第4図は工ッチン
グ後にレジスト印刷を除去した粗面化アルミニウム板の
部分拡大断面図、第5図は粗面化アルミニウム板の表面
に樹脂を被覆した状態を示す部分拡大断面図である。
(1)・・・アルミニウム板、(2)・・・エツチング
レジスト、(3)・・・非マスク部、(4)・・・樹脂
投錨用凹部、(5)・・・樹脂被覆層。
以 上
第1図The drawings show an embodiment of the present invention, and FIG. 1 is a flow sheet for carrying out the method of the present invention, and FIGS. 2 to 5 are for explaining the method of the present invention in the order of steps. The figure is a partially enlarged plan view of an aluminum plate after etching resist printing, Figure 3 is a partially enlarged sectional view of an aluminum plate with resist printing after etching, and Figure 4 is a roughened aluminum plate with resist printing removed after etching. FIG. 5 is a partially enlarged sectional view of the plate, showing a state in which the surface of the roughened aluminum plate is coated with resin. (1) Aluminum plate, (2) Etching resist, (3) Non-mask portion, (4) Resin anchoring recess, (5) Resin coating layer. Above Figure 1
Claims (1)
ーンに印刷して、レジストによるマスク部と非マスク部
を形成し、ついで非マスク部をエッチングする下地処理
において、樹脂を被覆すべき面をレジスト印刷前に粗面
化しておくことを特徴とする、金属材の樹脂被覆におけ
る下地処理方法。Etching resist is printed in a predetermined pattern on the surface to be coated with resin to form a masked part and a non-masked part by the resist, and then the non-masked part is etched.In the base treatment, the surface to be coated with resin is printed with resist. A surface treatment method for coating metal materials with resin, which is characterized by roughening the surface beforehand.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63093997A JP2764165B2 (en) | 1988-04-15 | 1988-04-15 | Base treatment method for resin coating of metal material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63093997A JP2764165B2 (en) | 1988-04-15 | 1988-04-15 | Base treatment method for resin coating of metal material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01268882A true JPH01268882A (en) | 1989-10-26 |
JP2764165B2 JP2764165B2 (en) | 1998-06-11 |
Family
ID=14098042
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63093997A Expired - Fee Related JP2764165B2 (en) | 1988-04-15 | 1988-04-15 | Base treatment method for resin coating of metal material |
Country Status (1)
Country | Link |
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JP (1) | JP2764165B2 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS48103044A (en) * | 1972-04-14 | 1973-12-24 | ||
JPS55141598A (en) * | 1979-04-20 | 1980-11-05 | Showa Alum Corp | Treatment of substrate for resin coating of aluminum material |
JPS6036196A (en) * | 1983-08-09 | 1985-02-25 | Mitsubishi Chem Ind Ltd | Base for planographic printing plate |
JPS61147596A (en) * | 1984-12-21 | 1986-07-05 | 大日本インキ化学工業株式会社 | Manufacture of double side through hole printed circuit board |
-
1988
- 1988-04-15 JP JP63093997A patent/JP2764165B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS48103044A (en) * | 1972-04-14 | 1973-12-24 | ||
JPS55141598A (en) * | 1979-04-20 | 1980-11-05 | Showa Alum Corp | Treatment of substrate for resin coating of aluminum material |
JPS6036196A (en) * | 1983-08-09 | 1985-02-25 | Mitsubishi Chem Ind Ltd | Base for planographic printing plate |
JPS61147596A (en) * | 1984-12-21 | 1986-07-05 | 大日本インキ化学工業株式会社 | Manufacture of double side through hole printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
JP2764165B2 (en) | 1998-06-11 |
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