JPH01261843A - Wafer handling chuck - Google Patents
Wafer handling chuckInfo
- Publication number
- JPH01261843A JPH01261843A JP63089990A JP8999088A JPH01261843A JP H01261843 A JPH01261843 A JP H01261843A JP 63089990 A JP63089990 A JP 63089990A JP 8999088 A JP8999088 A JP 8999088A JP H01261843 A JPH01261843 A JP H01261843A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- chuck
- pawls
- end surface
- susceptor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 27
- 210000000078 claw Anatomy 0.000 description 12
- 239000010409 thin film Substances 0.000 description 3
- 235000011274 Benincasa cerifera Nutrition 0.000 description 2
- 235000015001 Cucumis melo var inodorus Nutrition 0.000 description 2
- 240000002495 Cucumis melo var. inodorus Species 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は気相化学反応を利用して薄膜を形成する薄膜成
長装置において、サセプタ上のウェハースをローディン
グ又はアンローディングするチャックに間する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention is applied to a chuck for loading or unloading a wafer on a susceptor in a thin film growth apparatus that forms a thin film using a gas phase chemical reaction.
従来、エピタキシャル又はＣＶＤ等の気相化学反応を利
用して薄膜を形成する装置において、サセプタ上のウェ
ハースをローディング又はアンローディングするチャッ
クとしては、ピンセット、又は真空チャック、ベルヌイ
チャック等の吸着式のものが一般に利用されている。Conventionally, in devices that form thin films using epitaxial or vapor phase chemical reactions such as CVD, the chuck used to load or unload the wafer on a susceptor is a tweezers, a vacuum chuck, a Bernoulli chuck, or other suction type chuck. is commonly used.
真空チャック、ベルヌイチャック等はウェハースのアン
ローディングには適しているが、一定位置に精度よく並
べることには不向きのものである。Vacuum chucks, Bernoulli chucks, etc. are suitable for unloading wafers, but are unsuitable for arranging them at fixed positions with precision.
またピンセットを使えば、ウェハースを精度よく並べる
ことは可能であるが、ピンセットでウェハースの周縁を
挾持するため、ウェハース表面に傷が付き、不良品を発
生させてしまうという欠点があった。Furthermore, using tweezers makes it possible to line up the wafers with high precision, but since the tweezers clamp the wafer's periphery, it has the drawback of scratching the wafer surface and producing defective products.
本発明の目的は前記課題を解決したウェハースハンドリ
ング用チャックを提供することにある。An object of the present invention is to provide a wafer handling chuck that solves the above problems.
上述した従来のウェハースハンドリング用チャックに対
し、本発明はカム状爪にてウェハースの端面を少なくと
も３点以上で支持することによりウェハースを精度よく
ハンドリングするという相違点を有する。The present invention differs from the conventional wafer handling chuck described above in that it handles the wafer with high precision by supporting the end face of the wafer at at least three points using cam-shaped claws.
上記目的を達成するため、本発明のウエハースハンドリ
ング用チャックにおいては、チャック本体に、ウェハー
スの端面を少なくとも３点以上で支えるカム状の爪を開
閉可能に枢支したものである。In order to achieve the above object, in the wafer handling chuck of the present invention, cam-shaped pawls that support the end surface of the wafer at at least three points are pivotally supported on the chuck body so as to be openable and closable.
以下、本発明の一実施例を図により説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図ｆａ）は本発明の一実施例を示す断面図、第２図
は同平面図である。FIG. 1 fa) is a sectional view showing an embodiment of the present invention, and FIG. 2 is a plan view thereof.
図において、円盤状のチャック本体１に、ウェハース１
０の端面を支える少なくとも３個のカム伏型３を同一円
周上に配列して矢印３′方向に開閉可能に枢支する。尚
、チャック本体１は発塵及び汚れの発生がしにくい例え
ば窒化硅素等により構成され、自動化のためにロボット
のアームに取付けられる。一方チャック本体１の中心に
植立した中心軸５に円盤上の操作板２を回転可能に軸支
し、かつ該操作板２をチャック本体１にベアリング６を
介して支持する。前記操作板２に中心軸５より一側にず
らせてアーム９ａを取付け、該アーム９ａを、支点９ｂ
のまわりに回動するてこ棒９ｃの一端に連結し、該てこ
棒９Ｃのｆｌ！！端に制御シャフト７を連結し、制御シ
ャフト７の操作により操作板２をチャック本体１に対し
て中心軸５のまわりに矢印２′方向に回動させる。In the figure, a wafer 1 is placed on a disc-shaped chuck body 1.
At least three cam depression molds 3 supporting the end face of the cam are arranged on the same circumference and pivoted to be openable and closable in the direction of arrow 3'. The chuck body 1 is made of, for example, silicon nitride, which is less likely to generate dust or dirt, and is attached to a robot arm for automation. On the other hand, a disk-shaped operating plate 2 is rotatably supported on a central shaft 5 set in the center of the chuck body 1, and the operating plate 2 is supported by the chuck body 1 via a bearing 6. An arm 9a is attached to the operation plate 2 so as to be shifted to one side from the central axis 5, and the arm 9a is attached to the fulcrum 9b.
is connected to one end of a pry bar 9c that rotates around fl! of the pry bar 9C. ! A control shaft 7 is connected to the end, and by operating the control shaft 7, the operation plate 2 is rotated in the direction of arrow 2' about the central axis 5 with respect to the chuck body 1.
さらに、操作板２の同一円周上に複数シャフトガイド用
スリット８を円周方向に傾斜させて設け、各スリット８
内に前記カム伏型３のシャフト４を嵌合させ、操作板２
の回動動作に伴って冬瓜３のシャフト４をスリット８に
よりチャック本体１の中心軸５に対する矢印４′の径方
向に往復動させて該爪３を開閉させる構造とする。Further, a plurality of shaft guide slits 8 are provided on the same circumference of the operation plate 2 so as to be inclined in the circumferential direction, and each slit 8
The shaft 4 of the cam folding type 3 is fitted inside the operating plate 2.
With the rotational movement, the shaft 4 of the winter melon 3 is reciprocated through the slit 8 in the radial direction of the arrow 4' with respect to the central axis 5 of the chuck body 1, thereby opening and closing the claws 3.
一方、第３図に示すようにウェハース搭載用サセプタ１
１には、ウェハース１０を受は入れる座ぐり１３を設け
るとともに、座ぐり１３内のウェハースの端面位置に向
けてチャック本体１の冬瓜３を誘導案内する爪ガイド溝
１２を設ける。On the other hand, as shown in Fig. 3, the wafer mounting susceptor 1
1 is provided with a counterbore 13 for receiving the wafer 10, and a claw guide groove 12 for guiding the winter melon 3 of the chuck body 1 toward the end face position of the wafer in the counterbore 13.
実施例において、操作板２を反時計方向に回動させてチ
ャック本体１の爪３を開き、ウェハース１０の端面位置
にその外側より爪３を対向させ、次いで操作板２を時計
方向に回動させて爪３を閉じて該爪３をウェハース１０
の端面に当接させ、ウェハース１０の端面を爪３により
３点支持させる（第１図（ｂ））。In the embodiment, the operation plate 2 is rotated counterclockwise to open the claws 3 of the chuck body 1, the claws 3 are opposed to the end surface of the wafer 10 from the outside, and then the operation plate 2 is rotated clockwise. close the claw 3 and attach the claw 3 to the wafer 10.
The end surface of the wafer 10 is supported at three points by the claws 3 (FIG. 1(b)).
サセプタ１１上にウェハース１０をローディングするに
は第１図（ｂ）に示すように、ウェハース１０を支えた
チャック本体１の爪３をサセプタ１１上の爪ガイド４１
２内に受は入れてウェハース１０をサセプタ１１の座ぐ
り１３内にセットする。その後、爪３を開いて爪ガイド
溝１２によりウェハース１０の端面より後退させる。ア
ンローディング時には上記操作と逆の操作を行う。To load the wafer 10 onto the susceptor 11, as shown in FIG.
2 and set the wafer 10 in the counterbore 13 of the susceptor 11. Thereafter, the claws 3 are opened and moved back from the end surface of the wafer 10 through the claw guide grooves 12. When unloading, perform the reverse operation to the above.
尚、実施例では本発明をウェハースのハンドリング用チ
ャックとして用いた例を説明したが、例えば半導体素子
製造用のガラスマスク等の洗浄又は搬送用として利用す
ることもでき、さらには他の産業分野において薄板円板
状のものの運搬等にも利用することができる。In the examples, an example was explained in which the present invention was used as a chuck for handling wafers, but it can also be used for cleaning or transporting glass masks for semiconductor device manufacturing, and furthermore, it can be used in other industrial fields. It can also be used for transporting thin disc-shaped objects.
以上説明したように本発明は開閉する爪にてウェハース
の端面を少なくとも３点支持するため、ウェハースをサ
セプタ上に精度よくセットすることができ、しかも、ビ
ンセットのようにウェハースの表面を挾持することがな
いため、ウェハースに損傷を与えることがなく、製造歩
留りを向上できる効果を有するものである。As explained above, the present invention supports the end face of the wafer at at least three points with the claws that open and close, so the wafer can be set on the susceptor with high precision, and the surface of the wafer can be held in place like a bin set. Therefore, there is no damage to the wafer, which has the effect of improving manufacturing yield.
第１図（ａ） 、 （ｂ）は本発明の一実施例を示す断
面図、第２図は同平面図、第３図はサセプタを示す平面
図である。
１・・・チャック本体 ２・・・操作板３・・・
カム状爪
（ａ）
（ｂ）
ｈｋ Ａ ｉ１FIGS. 1(a) and 1(b) are sectional views showing one embodiment of the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is a plan view showing a susceptor. 1...Chuck body 2...Operation plate 3...
Cam-shaped claw (a) (b) hk A i1
Claims (1)
３点以上で支えるカム状の爪を開閉可能に枢支したこと
を特徴とするウェハースハンドリング用チャック。(1) A chuck for wafer handling, characterized in that a cam-shaped pawl that supports the end surface of the wafer at at least three points is pivotally supported on the chuck body so as to be openable and closable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63089990A JPH01261843A (en) | 1988-04-12 | 1988-04-12 | Wafer handling chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63089990A JPH01261843A (en) | 1988-04-12 | 1988-04-12 | Wafer handling chuck |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01261843A true JPH01261843A (en) | 1989-10-18 |
Family
ID=13986071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63089990A Pending JPH01261843A (en) | 1988-04-12 | 1988-04-12 | Wafer handling chuck |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01261843A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04250648A (en) * | 1991-01-25 | 1992-09-07 | Toshiba Corp | Wafer holder |
| EP0943398A3 (en) * | 1998-03-20 | 2001-01-10 | Speedfam Co., Ltd. | Surface grinding machine and workpiece carrier used therefor |
| US6548596B1 (en) | 1997-09-08 | 2003-04-15 | Rohm And Haas Company | Polymer compositions |
| JP2019197865A (en) * | 2018-05-11 | 2019-11-14 | 株式会社ディスコ | Conveyance mechanism and conveyance method |
| JP2022176246A (en) * | 2018-11-20 | 2022-11-25 | 株式会社東京精密 | Wafer positioning device |
-
1988
- 1988-04-12 JP JP63089990A patent/JPH01261843A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04250648A (en) * | 1991-01-25 | 1992-09-07 | Toshiba Corp | Wafer holder |
| US5520501A (en) * | 1991-01-25 | 1996-05-28 | Kabushiki Kaisha Toshiba | Wafer holding apparatus |
| US6548596B1 (en) | 1997-09-08 | 2003-04-15 | Rohm And Haas Company | Polymer compositions |
| EP0943398A3 (en) * | 1998-03-20 | 2001-01-10 | Speedfam Co., Ltd. | Surface grinding machine and workpiece carrier used therefor |
| JP2019197865A (en) * | 2018-05-11 | 2019-11-14 | 株式会社ディスコ | Conveyance mechanism and conveyance method |
| JP2022176246A (en) * | 2018-11-20 | 2022-11-25 | 株式会社東京精密 | Wafer positioning device |
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