JPH01260058A - Electrically conductive fiber - Google Patents
Electrically conductive fiberInfo
- Publication number
- JPH01260058A JPH01260058A JP8343788A JP8343788A JPH01260058A JP H01260058 A JPH01260058 A JP H01260058A JP 8343788 A JP8343788 A JP 8343788A JP 8343788 A JP8343788 A JP 8343788A JP H01260058 A JPH01260058 A JP H01260058A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- electrically conductive
- fiber
- fibers
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000835 fiber Substances 0.000 title claims abstract description 52
- 229920005989 resin Polymers 0.000 claims abstract description 48
- 239000011347 resin Substances 0.000 claims abstract description 48
- 150000001875 compounds Chemical class 0.000 claims abstract description 31
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 19
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- 239000010445 mica Substances 0.000 claims abstract description 15
- 229910052618 mica group Inorganic materials 0.000 claims abstract description 15
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 14
- 239000000843 powder Substances 0.000 claims description 10
- 229910044991 metal oxide Inorganic materials 0.000 claims description 8
- 150000004706 metal oxides Chemical class 0.000 claims description 8
- 239000002313 adhesive film Substances 0.000 claims description 5
- 229920002994 synthetic fiber Polymers 0.000 abstract description 15
- 239000012209 synthetic fiber Substances 0.000 abstract description 15
- 229920001169 thermoplastic Polymers 0.000 abstract description 15
- 239000004416 thermosoftening plastic Substances 0.000 abstract description 14
- 238000000576 coating method Methods 0.000 abstract description 12
- 239000011248 coating agent Substances 0.000 abstract description 11
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 239000000203 mixture Substances 0.000 abstract description 6
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 abstract description 5
- 229910001887 tin oxide Inorganic materials 0.000 abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- 229920001568 phenolic resin Polymers 0.000 abstract description 3
- 239000005011 phenolic resin Substances 0.000 abstract description 3
- 238000005406 washing Methods 0.000 abstract description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 244000043261 Hevea brasiliensis Species 0.000 abstract description 2
- 239000004952 Polyamide Substances 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 2
- 229910000410 antimony oxide Inorganic materials 0.000 abstract description 2
- 229910017052 cobalt Inorganic materials 0.000 abstract description 2
- 239000010941 cobalt Substances 0.000 abstract description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229910003437 indium oxide Inorganic materials 0.000 abstract description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 abstract description 2
- 229920003052 natural elastomer Polymers 0.000 abstract description 2
- 229920001194 natural rubber Polymers 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 abstract description 2
- 229920002647 polyamide Polymers 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 239000004332 silver Substances 0.000 abstract description 2
- 150000002736 metal compounds Chemical class 0.000 abstract 2
- 229920006149 polyester-amide block copolymer Polymers 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 26
- 239000007788 liquid Substances 0.000 description 23
- 239000010419 fine particle Substances 0.000 description 14
- 239000000126 substance Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 11
- -1 polyethylene terephthalate Polymers 0.000 description 11
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920001059 synthetic polymer Polymers 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 230000002209 hydrophobic effect Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical compound [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229920000538 Poly[(phenyl isocyanate)-co-formaldehyde] Polymers 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000002981 blocking agent Substances 0.000 description 2
- 239000000306 component Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- 229960000878 docusate sodium Drugs 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003995 emulsifying agent Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002074 melt spinning Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 150000002923 oximes Chemical class 0.000 description 2
- 150000002924 oxiranes Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- RPACBEVZENYWOL-XFULWGLBSA-M sodium;(2r)-2-[6-(4-chlorophenoxy)hexyl]oxirane-2-carboxylate Chemical compound [Na+].C=1C=C(Cl)C=CC=1OCCCCCC[C@]1(C(=O)[O-])CO1 RPACBEVZENYWOL-XFULWGLBSA-M 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- SEGCOINEUCJSAP-UHFFFAOYSA-N (2-aminoacetyl) prop-2-enoate Chemical compound NCC(=O)OC(=O)C=C SEGCOINEUCJSAP-UHFFFAOYSA-N 0.000 description 1
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- CDULGHZNHURECF-UHFFFAOYSA-N 2,3-dimethylaniline 2,4-dimethylaniline 2,5-dimethylaniline 2,6-dimethylaniline 3,4-dimethylaniline 3,5-dimethylaniline Chemical group CC1=CC=C(N)C(C)=C1.CC1=CC=C(C)C(N)=C1.CC1=CC(C)=CC(N)=C1.CC1=CC=C(N)C=C1C.CC1=CC=CC(N)=C1C.CC1=CC=CC(C)=C1N CDULGHZNHURECF-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- DYBIGIADVHIODH-UHFFFAOYSA-N 2-nonylphenol;oxirane Chemical compound C1CO1.CCCCCCCCCC1=CC=CC=C1O DYBIGIADVHIODH-UHFFFAOYSA-N 0.000 description 1
- WRDNCFQZLUCIRH-UHFFFAOYSA-N 4-(7-azabicyclo[2.2.1]hepta-1,3,5-triene-7-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1C2=CC=C1C=C2 WRDNCFQZLUCIRH-UHFFFAOYSA-N 0.000 description 1
- AOYQDLJWKKUFEG-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]hept-4-ene-4-carboxylate Chemical compound C=1C2OC2CCC=1C(=O)OCC1CC2OC2CC1 AOYQDLJWKKUFEG-UHFFFAOYSA-N 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- RJDOZRNNYVAULJ-UHFFFAOYSA-L [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] RJDOZRNNYVAULJ-UHFFFAOYSA-L 0.000 description 1
- PXAJQJMDEXJWFB-UHFFFAOYSA-N acetone oxime Chemical compound CC(C)=NO PXAJQJMDEXJWFB-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 125000004103 aminoalkyl group Chemical group 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 1
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- YGANSGVIUGARFR-UHFFFAOYSA-N dipotassium dioxosilane oxo(oxoalumanyloxy)alumane oxygen(2-) Chemical compound [O--].[K+].[K+].O=[Si]=O.O=[Al]O[Al]=O YGANSGVIUGARFR-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052627 muscovite Inorganic materials 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- XUWHAWMETYGRKB-UHFFFAOYSA-N piperidin-2-one Chemical compound O=C1CCCCN1 XUWHAWMETYGRKB-UHFFFAOYSA-N 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 description 1
- 150000003509 tertiary alcohols Chemical class 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、無色ないしは白色〜淡色の導電性繊維に関し
、更に詳しくは、熱可塑性合成繊維を基体とし、その表
面に導電性物質を含有する樹脂層を形成せしめた導電性
繊維に関する。Detailed Description of the Invention (Industrial Application Field) The present invention relates to a colorless or white to light-colored conductive fiber, and more specifically, a conductive fiber having a thermoplastic synthetic fiber as a base and containing a conductive substance on the surface thereof. The present invention relates to conductive fibers having a resin layer formed thereon.
(従来の技術)
ポリエステル繊維、ポリアミド繊維等の熱可塑性合成繊
維は、一般に衣料用や産業用に大量に用いられているが
、疎水性であり、10’Ω/ cm以上の電気抵抗を有
する絶縁体であるため、特に低湿度で使用される際に、
摩擦を受けると静電気を帯びるという欠点がある。この
帯電現象により、繊維製品の使用時に埃が付着し易く、
又静電気の放電により人体に不快感を与えるばかりでな
(、ガソリンスタンド等の危険物を取扱う場所では、爆
発火災等の重大事故をもたらすことになる。(Prior art) Thermoplastic synthetic fibers such as polyester fibers and polyamide fibers are generally used in large quantities for clothing and industrial purposes, but they are hydrophobic and have an electrical resistance of 10'Ω/cm or more. body, especially when used in low humidity.
It has the disadvantage that it becomes charged with static electricity when subjected to friction. Due to this charging phenomenon, dust tends to adhere to textile products when they are used.
In addition, the discharge of static electricity not only causes discomfort to the human body, but also causes serious accidents such as explosions and fires in places such as gas stations where hazardous materials are handled.
疎水性繊維の帯電による問題を解消する方法の一つとし
て、疎水性繊維と共に少量の金属繊維を混用する方法が
ある。この方法は、細デニールの金属繊維を必要とし、
金属繊維が高価であり、しかも異質の金属繊維が加工性
や製品の品質を低下させると言う問題がある。One method for solving the problem caused by electrostatic charge on hydrophobic fibers is to mix a small amount of metal fibers with hydrophobic fibers. This method requires fine denier metal fibers,
There are problems in that metal fibers are expensive and, moreover, foreign metal fibers degrade processability and product quality.
一方、金属繊維と同様の目的に用いられる導電性繊維と
して、各種導電性微粒子を混合した繊維が知られている
。例えば溶融可能な合成重合体中に、酸化第2錫で表面
をコーティングした酸化チタン微粒子を分散セしめた制
電性合成重合体組成物からなる繊維(特開昭58−39
175号公報)、導電性金属酸化物の皮膜を有する無機
粒子を含有する導電性熱可塑性重合体を芯成分とした導
電性複合繊維(特開昭61−174469号公報)、酸
化錫で表面をコーティングした酸化チタン微粒子及び/
又は酸化錫微粒子を含有する導電性複合繊維(特開昭5
6−169816号公報)などがそれである。これらの
導電性繊維は、いずれも非導電性の合成重合体に導電性
微粒子を混合分散させて溶融紡糸することにより得られ
るものであるが、十分な導電性を発揮させるためには、
導電性微粒子を高濃度に分散含有させ、導電性微粒子間
の距離を接近させる必要がある。しかしながら、合成重
合体の導電性微粒子濃度が高くなると、溶融紡糸時にノ
ズル詰まりが起こり易くなり、可紡性が悪化し、紡糸パ
ックや口金等の解体清掃の頻度が増して生産性が低下す
るほか、強度が低くて延伸工程や後の加工工程で毛羽発
生や断糸等のトラブルを起こし易く、さらに導電性重合
体の展延性が劣るために、導電性の層が切断して導電性
性能が低下し、高い導電性を得にくいといった問題があ
る。On the other hand, fibers mixed with various conductive fine particles are known as conductive fibers used for the same purpose as metal fibers. For example, fibers made of an antistatic synthetic polymer composition in which fine titanium oxide particles whose surface is coated with tin oxide are dispersed in a meltable synthetic polymer (Japanese Patent Laid-Open No. 58-39
No. 175), conductive composite fibers whose core component is a conductive thermoplastic polymer containing inorganic particles having a conductive metal oxide film (Japanese Patent Application Laid-open No. 174469/1983), whose surface is coated with tin oxide. Coated titanium oxide fine particles and/or
Or conductive composite fiber containing tin oxide fine particles (Japanese Patent Application Laid-open No. 5
6-169816). All of these conductive fibers are obtained by melt-spinning a mixture of conductive fine particles mixed and dispersed in a non-conductive synthetic polymer, but in order to exhibit sufficient conductivity,
It is necessary to disperse and contain conductive fine particles at a high concentration and to shorten the distance between the conductive fine particles. However, when the concentration of conductive fine particles in synthetic polymers increases, nozzle clogging becomes more likely to occur during melt spinning, deteriorating spinnability, increasing the frequency of disassembly and cleaning of spinning packs and nozzles, and reducing productivity. , its strength is low, and it tends to cause problems such as fuzzing and yarn breakage during the drawing process and subsequent processing steps.Furthermore, because the conductive polymer has poor malleability, the conductive layer may break, resulting in poor conductive performance. There is a problem that it is difficult to obtain high conductivity.
また、上述の問題がない導電性繊維として、通常の合成
繊維の表面に導電性物質の微粒子を分散含有した樹脂液
を塗布して導電性樹脂層を形成した繊維が知られている
。Furthermore, as conductive fibers that do not have the above-mentioned problems, there are known fibers in which a conductive resin layer is formed by applying a resin liquid containing fine particles of a conductive substance dispersed on the surface of an ordinary synthetic fiber.
(発明が解決しようとする課題)
しかし、このような導電性樹脂層を表面に形成した繊維
は、導電性微粒子を混合分散させた導電性繊維に比較し
て、屈曲や摩擦により導電性樹脂層が剥離、脱落し易く
、特に、導電性を向上させるために導電性粒子を60〜
70重量%といったように多量に添加すると、導電性樹
脂層の被膜強度が著しく低下する。その結果、屈曲、摩
擦、更には洗濯に対する導電耐久性が悪化するという問
題が生ずる。(Problem to be Solved by the Invention) However, compared to conductive fibers in which conductive fine particles are mixed and dispersed, fibers with such a conductive resin layer formed on the surface do not easily bend or rub against the conductive resin layer. are likely to peel off and fall off, and in particular, to improve conductivity, conductive particles are added to
When added in a large amount, such as 70% by weight, the film strength of the conductive resin layer decreases significantly. As a result, a problem arises in that conductive durability against bending, friction, and even washing deteriorates.
本発明の目的は、上記問題点を解消し、表面に導電性樹
脂層を形成した熱可塑性合成繊維において、導電性樹脂
層の剥離、脱落を防止し、導電耐久性に優れた無色(白
色〜淡色)の導電性繊維を一提供することにある。The purpose of the present invention is to solve the above-mentioned problems, to prevent peeling and falling off of the conductive resin layer in thermoplastic synthetic fibers with a conductive resin layer formed on the surface, and to provide colorless (white to white) fibers with excellent conductive durability. An object of the present invention is to provide a light-colored conductive fiber.
(課題を解決するための手段)
本発明者は、上記目的を達成すべく種々検討を重ねた結
果、熱可塑性合成繊維の表面に特定の接着剤被膜を形成
し、更にその上に特定の導電性微粉末を含有する導電性
樹脂層を形成することによって導電性樹脂層の脱落を防
止し、耐久性を著しく向上させうることを見出し本発明
に到達した。(Means for Solving the Problems) As a result of various studies to achieve the above object, the present inventor formed a specific adhesive film on the surface of thermoplastic synthetic fibers, and further applied a specific conductive film on the surface of thermoplastic synthetic fibers. The inventors have discovered that by forming a conductive resin layer containing a conductive fine powder, the conductive resin layer can be prevented from falling off and its durability can be significantly improved, and the present invention has been achieved.
即ち、本発明は、熱可塑性合成繊維表面に、ポリエポキ
シド化合物(A)とブロックドポリイソシアネート化合
物(B)とを含む接着剤被膜を形成し、更にその上に、
導電性金属及び/又は導電性金属酸化物で表面をコーテ
ィングしたマイカ微粉末を含有する樹脂層を形成したこ
とを特徴とする導電性繊維である。That is, in the present invention, an adhesive film containing a polyepoxide compound (A) and a blocked polyisocyanate compound (B) is formed on the surface of a thermoplastic synthetic fiber, and further, on the adhesive film,
This is a conductive fiber characterized by forming a resin layer containing fine mica powder whose surface is coated with a conductive metal and/or a conductive metal oxide.
本発明における熱可塑性合成繊維としては、ポリエチレ
ンテレフタレート、ポリブチレンテレフタレート、ポリ
エチレンナフタレートのような芳香族又はナフタレン環
含有線状ポリエステルからなる繊維、ナイロン6、ナイ
ロン66等の脂肪族ポリアミドからなる繊維、(P−フ
ェニレンテレフタルアミド)、ポリ(P−フェニレン−
3,4−ジフェニルエーテルテレフタルアミド)等の芳
香族ポリアミドからなる繊維などを挙げることができる
。また、繊維形態は、長繊維、短繊維のいずれでもよく
、断面形状は、異形、中空でもよい。The thermoplastic synthetic fibers in the present invention include fibers made of aromatic or naphthalene ring-containing linear polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; fibers made of aliphatic polyamides such as nylon 6 and nylon 66; (P-phenylene terephthalamide), poly(P-phenylene-
Examples include fibers made of aromatic polyamides such as 3,4-diphenyl ether terephthalamide). Further, the fiber form may be long fibers or short fibers, and the cross-sectional shape may be irregular or hollow.
更に薬品処理、物理的な表面処理(プラズマ処理等)に
よって繊維表面が粗面化されていてもよい。Furthermore, the fiber surface may be roughened by chemical treatment or physical surface treatment (plasma treatment, etc.).
熱可塑性合成繊維表面に接着剤被膜を形成するには、ポ
リエポキシド化合物(A)とブロックドポリイソシアネ
ート化合物(B)とを含む乳化液あるいは溶液のような
前処理液を、従来公知の漫漬搾液法、スプレー法、塗布
法等によって繊維表面に付与し、次いで乾燥、ベーキン
グする方法が用いられる。この際、前処理液の付与は、
未延伸糸、延伸糸、紡績糸、捲縮加工糸、織編物、不織
布等任意の形の繊維に行うことができる。本発明におい
て用いられる接着剤被膜は、ポリエポキシド化合物(A
)とブロックドポリイソシアネート化合物(B)との両
方を含んでいることが必要であり、いずれか一方のみで
は十分な耐久性が得られない。本発明において用いられ
るポリエポキシド化合物(A)は1分子中に少なくとも
2個以上のエポキシ基を化合物100g当り062g当
呈以上で有する化合物であり、このようなポリエポキシ
ド化合物としては、エチレングリコール、グリセロール
、ソルビトール、ペンタエリスリトール、ポリエチレン
グリコール等の多価アルコール類とエピクロルヒドリン
の如きハロゲン含有エポキシド類との反応生成物、レゾ
ルシン、ビス(4−ヒドロキシフェニル)ジメチルメタ
ン、フェノール、ホルムアルデヒド樹脂、レゾルシン・
ホルムアルデヒド樹脂等の多価フェノール類と前記ハロ
ゲン含有エポキシド類との反応生成物、過酢酸又は過酸
化水素等で不飽和結合部を酸化して得られるポリエポキ
シド化合物、即ち、3.4−エポキシシクロヘキセンエ
ポキシド、3,4−エポキシシクロヘキシルメチル−3
,4−エポキシシクロヘキセンカルボキシレート、ビス
(3,4−エポキシ−6−メチル−シクロヘキシメチル
)アジペートなどを挙げることができる。これらの内、
特に多価アルコールとエピクロルヒドリンとの反応生成
物、即ち多価アルコールのポリグリシジルエーテル化合
物が優れた性能を発現するので好ましい。In order to form an adhesive film on the surface of thermoplastic synthetic fibers, a pretreatment liquid such as an emulsion or solution containing a polyepoxide compound (A) and a blocked polyisocyanate compound (B) is subjected to a conventionally known manzuke-squeezing process. A method is used in which it is applied to the fiber surface by a liquid method, a spray method, a coating method, etc., followed by drying and baking. At this time, the application of pretreatment liquid is
The treatment can be applied to fibers in any form, such as undrawn yarn, drawn yarn, spun yarn, crimped yarn, woven or knitted fabric, or nonwoven fabric. The adhesive coating used in the present invention is made of a polyepoxide compound (A
) and the blocked polyisocyanate compound (B), and sufficient durability cannot be obtained with either one alone. The polyepoxide compound (A) used in the present invention is a compound having at least two epoxy groups in one molecule in an amount of 0.62 g or more per 100 g of the compound, and examples of such polyepoxide compounds include ethylene glycol, glycerol, and sorbitol. , pentaerythritol, reaction products of polyhydric alcohols such as polyethylene glycol and halogen-containing epoxides such as epichlorohydrin, resorcinol, bis(4-hydroxyphenyl)dimethylmethane, phenol, formaldehyde resin, resorcinol.
A reaction product of polyhydric phenols such as formaldehyde resin and the above-mentioned halogen-containing epoxides, a polyepoxide compound obtained by oxidizing the unsaturated bond with peracetic acid or hydrogen peroxide, i.e., 3,4-epoxycyclohexene epoxide , 3,4-epoxycyclohexylmethyl-3
, 4-epoxycyclohexenecarboxylate, bis(3,4-epoxy-6-methyl-cyclohexymethyl)adipate, and the like. Among these,
In particular, reaction products of polyhydric alcohols and epichlorohydrin, ie, polyglycidyl ether compounds of polyhydric alcohols, are preferred because they exhibit excellent performance.
一方、ブロックドポリイソシアネート化合物(B)はポ
リイソシアネート化合物とブロック化剤との付加化合物
であり、加熱によりブロック成分が遊離して活性なポリ
イソシアネート化合物を生ぜしめるものである。ポリイ
ソシアネート化合物としては、例えばトリレンジイソシ
アネート、メタフェニレンジイソシアネート、ジフェニ
ルメタンジイソシアネート、ヘキサメチレンジイソシア
ネート、ポリメチレンポリフェニルイソシアネート、ト
リフェニルメタントリイソシアネート等のポリイソシア
ネート、或いはこれらのポリイソシアネートと、トリメ
チロールプロパン、ペンタノールIJ )−ル等の活性
水素原子を2個以上有する化合物とを、NC010H>
1となるモル比で反応させて得られる末端NCO基含有
のポリアルキレングリコールアダクトポリイソシアネー
トが挙げられる。特にトリレンジイソシアネート、ジフ
ェニルメタンジイソシアネート、ポリメチレンポリフェ
ニルイソシアネートの如き芳香族ポリイソシアネートが
優れた性能を発現するので好ましい。On the other hand, the blocked polyisocyanate compound (B) is an addition compound of a polyisocyanate compound and a blocking agent, and the blocking component is liberated by heating to produce an active polyisocyanate compound. Examples of the polyisocyanate compound include polyisocyanates such as tolylene diisocyanate, metaphenylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, polymethylene polyphenylisocyanate, and triphenylmethane triisocyanate, or these polyisocyanates together with trimethylolpropane and pen. NC010H>
Examples include terminal NCO group-containing polyalkylene glycol adduct polyisocyanates obtained by reacting at a molar ratio of 1. In particular, aromatic polyisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate, and polymethylene polyphenylisocyanate are preferred because they exhibit excellent performance.
ブロック化剤としては、例えば、フェノール、チオフェ
ノール、クレゾール、レゾルシノール等のフェノール類
、t−ブタノール、L−ペンタノール等の第3級アルコ
ール類、ジフェニルアミン、キシリジン等の芳香族第2
級アミン類、フタル酸イミド等のイミド類、カプロラク
タム、バレロラクタム等のラクタム類、アセトキシム、
メチルエチルケントンオキシム、シクロヘキサンオキシ
ム等のオキシム類及び酸性亜流酸ソーダがある。Examples of blocking agents include phenols such as phenol, thiophenol, cresol, and resorcinol, tertiary alcohols such as t-butanol and L-pentanol, and aromatic secondary alcohols such as diphenylamine and xylidine.
amines, imides such as phthalic acid imide, lactams such as caprolactam and valerolactam, acetoxime,
These include oximes such as methyl ethyl kentone oxime and cyclohexane oxime, and acidic sodium sulfite.
これらのポリエポキシド化合物(A)及びブロックドポ
リイソシアネート化合物(B)は、そのまま、あるいは
必要に応じて少量の溶媒に溶解して、公知の乳化剤、例
えばアルキルベンゼンスルホン酸ソーダ、ジオクチルス
ルホサクシネートNa塩、ノニルフェノールエチレンオ
キサイド付加物等を用いて乳化又は溶解し、水等の希釈
剤で希釈して、前処理液とする。前処理液でのポリエポ
キシド化合物(A)とブロックドポリイソシアネート化
合物(B)との配合重量比は、(A)/ (B)=98
/2〜20/80とするのが好ましい。(A)/ (B
)が上記範囲外になると、熱可塑性合成繊維への樹脂層
の接着力が低下する傾向がある。These polyepoxide compound (A) and blocked polyisocyanate compound (B) can be used as they are, or if necessary, dissolved in a small amount of solvent and mixed with known emulsifiers such as sodium alkylbenzenesulfonate, dioctylsulfosuccinate Na salt, Emulsify or dissolve using a nonylphenol ethylene oxide adduct, etc., and dilute with a diluent such as water to obtain a pretreatment liquid. The blending weight ratio of the polyepoxide compound (A) and the blocked polyisocyanate compound (B) in the pretreatment liquid is (A)/(B) = 98
It is preferable to set it as /2 - 20/80. (A)/(B
) outside the above range, the adhesive strength of the resin layer to the thermoplastic synthetic fiber tends to decrease.
また、前処理液の総固形分濃度(ポリエポキシド化合物
(A)とブロックドポリイソシアネート化合物(B)と
を含む)は、充分な接着剤層を形成させ、かつ繊維の風
合いを低下させないという点で、1〜30重量%、特に
3〜20重量%とするのが望ましい。In addition, the total solids concentration of the pretreatment liquid (including the polyepoxide compound (A) and blocked polyisocyanate compound (B)) is set so that a sufficient adhesive layer is formed and the texture of the fibers is not deteriorated. , 1 to 30% by weight, preferably 3 to 20% by weight.
また、前処理液を乳化分散液とするのに用いる乳化剤即
ち界面活性剤は、処理液の全固形分に対応して15重量
%以下、特に10重量%以下とすることが好ましい。こ
れを多(用いると、導電性樹脂層の繊維表面に対する接
着力が低下するようになる。Further, the amount of the emulsifier, ie, the surfactant, used to form the pretreatment liquid into an emulsified dispersion is preferably 15% by weight or less, particularly 10% by weight or less, based on the total solid content of the treatment liquid. If too much of this is used, the adhesive force of the conductive resin layer to the fiber surface will decrease.
前処理液は、熱可塑性合成繊維に対してポリエボキシド
化合物(A)およびブロックドポリイソシアネート化合
物(B)の付着量が0.1〜10重量%、特に0.2〜
5重量%となるように付与するのが好ましい。この量が
少なすぎると、導電性樹脂層の接着性を高める被膜が形
成されないようになるし、多過ぎると被膜が厚過ぎて繊
維を硬化させるようになる。好ましい付着量は、前述の
ような濃度の前処理液を用いることによって容易に得ら
れる。The pretreatment liquid has a coating amount of the polyeboxide compound (A) and the blocked polyisocyanate compound (B) based on the thermoplastic synthetic fibers of 0.1 to 10% by weight, particularly 0.2 to 10% by weight.
It is preferable to add it in an amount of 5% by weight. If this amount is too small, a film that enhances the adhesion of the conductive resin layer will not be formed, and if it is too large, the film will be too thick and will harden the fibers. A preferable coating amount can be easily obtained by using a pretreatment liquid having the concentration as described above.
前処理液を付与した後の乾燥、固化は、熱可塑性合成繊
維の強度やモジユラス等に変化を与えない温度や加熱時
間で行うことが望ましく、生産性の点から、180 ’
C以下で乾燥し、200〜250°Cで短時間熱処理す
ることが好ましい。It is desirable to dry and solidify after applying the pretreatment liquid at a temperature and heating time that do not change the strength, modulus, etc. of the thermoplastic synthetic fiber, and from the viewpoint of productivity,
It is preferable to dry at a temperature below C and heat-treat at 200 to 250°C for a short time.
導電性物質の微粒子を含有する樹脂層は、導電性物質の
微粒子を分散含有した樹脂の溶液あるいは分散液を熱可
塑性合成繊維にポリエポキシド化合物(A)及びブロッ
クドポリイソシアネート化合物(B)の被膜を形成させ
た糸、織編物、不織布等に前処理液の付与方法と同様の
方法で付与して、乾燥、固化することにより形成される
。The resin layer containing fine particles of a conductive substance is produced by coating a thermoplastic synthetic fiber with a solution or dispersion of a resin containing fine particles of a conductive substance dispersed therein and applying a coating of a polyepoxide compound (A) and a blocked polyisocyanate compound (B). It is formed by applying the pretreatment liquid to the formed yarn, woven or knitted fabric, nonwoven fabric, etc. in the same manner as the method of applying the pretreatment liquid, and drying and solidifying it.
また、樹脂層に添加する導電性物質の微粒子としては、
表面を導電性金属瓦d/又は導電性金属M(IJIでコ
ーティングしたマイカのリン片状微粉末を使用する。マ
イカのリン片状微粉末を用いることで、(1)酸化チタ
ンなどの粒状微粉末に導電性成分をコーティングしたも
のに比較して、樹脂層の添加量が少なくても、有効に導
電性能を発揮させることができ、(2)添加量を少なく
することによって、導電性樹脂被膜の強度が向上し、か
つ柔軟性及び耐摩耗性が改良され、さらに(3)導電性
樹脂被膜の透明性が向上し、樹脂層が目立ちにくくなる
。In addition, as fine particles of conductive substance added to the resin layer,
Use a mica scale-like fine powder whose surface is coated with conductive metal tile d/or conductive metal M (IJI).By using mica scale-like fine powder, (1) granular fine powder such as titanium oxide is used. Compared to a powder coated with a conductive component, even if the amount of the resin layer added is small, it can effectively exhibit conductive performance. (2) By reducing the amount added, the conductive resin coating (3) The transparency of the conductive resin coating is improved, and the resin layer becomes less noticeable.
マイカとしては、フロゴバイト(金雲母)、マスコバイ
ト(白雲母)、パオタイト(黒雲母)、セリサイト(絹
雲母)などの天然フレーク状のマイカ及び合成雲母を挙
げることができ、その微粉末の大きさは、通常10μm
以下、好ましくは5μm以下である。Examples of mica include natural flake mica and synthetic mica such as phlogovite, muscovite, paotite, and sericite, and the size of the fine powder The diameter is usually 10μm
The thickness is preferably 5 μm or less.
マイカの表面にコーティングする導電性金属としては、
ニッケル、コバルト、銅、銀等の各種導電性金属又はそ
れらの合金を挙げることができ、これらは、単層又は2
層以上で用いることができる。また、導電性金属酸化物
としては、酸化錫、酸化アンチモン、酸化インジウム、
酸化カドミウム等の各種導電性金属酸化物を挙げること
ができ、これらは、単独又は2種以上の混合物として用
いられる。導電性金属又は導電性金属酸化物のマイカに
対するコーテイング量は、20〜80重量%が適当であ
る。As a conductive metal to coat the surface of mica,
Examples include various conductive metals such as nickel, cobalt, copper, and silver, and alloys thereof.
It can be used in more than one layer. In addition, examples of conductive metal oxides include tin oxide, antimony oxide, indium oxide,
Various conductive metal oxides such as cadmium oxide can be mentioned, and these can be used alone or as a mixture of two or more. The appropriate amount of the conductive metal or conductive metal oxide to be coated on mica is 20 to 80% by weight.
また、樹脂には、天然ゴムやアクリロニトリル−ブタジ
ェン共重合体(NBR)のような合成ゴムとそれに共溶
性があるフェノール系樹脂との組合わせ、レゾルシン−
ホルマリン−ゴムラテックス系の樹脂及びホントメルト
型ポリエステル系接着剤士イソシアネートとの組合わせ
、ポリウレタン系重合体、尿素、メラミン、アミノアル
キル、アミノアリールトリアジン等のアミノ化合物の少
な(とも1種とホルムアルデヒドの縮合物をブタノール
、イソプロパツール等のアルコール類で従来公知の方法
により変性したアルコール変性アミノ樹脂、塩化ビニー
ル酢酸ビニルの共重合体の一部を酸化したビニル重合体
、アクリニ酸エステル又はメタクリル酸エステルとスチ
レンとメチロールアクリルアミド、グリジルアクリレー
ト、ヒドロキシエチルメタクリレート等の反応性モノマ
ーとを共重合させたアクリル系重合体、ポリビニルブチ
ラール等のポリビニルアセクール系重合体等のビニル重
合体が柔軟性、可撓性を有して破断伸度10〜500%
の被膜を形成するので好ましく用いられる。このほか、
エポキシ系樹脂、アルキッド系樹脂、メラミン樹脂、尿
素樹脂等も用いられる。In addition, resins include combinations of natural rubber and synthetic rubbers such as acrylonitrile-butadiene copolymer (NBR) and phenolic resins that are cosoluble therein, and resorcinol-based resins.
Combinations of formalin-rubber latex resins and true-melt polyester adhesives with isocyanates, polyurethane polymers, urea, melamine, aminoalkyl, aminoaryltriazine, and other amino compounds (both one type and formaldehyde). Alcohol-modified amino resins obtained by modifying condensates with alcohols such as butanol and isopropanol by conventionally known methods, vinyl polymers obtained by partially oxidizing vinyl chloride vinyl acetate copolymers, acrinic acid esters or methacrylic acid esters. Vinyl polymers such as acrylic polymers made by copolymerizing styrene and reactive monomers such as methylol acrylamide, glycylacrylate, and hydroxyethyl methacrylate, and polyvinyl acecoolic polymers such as polyvinyl butyral are flexible and flexible. Breaking elongation 10-500%
It is preferably used because it forms a film of other than this,
Epoxy resins, alkyd resins, melamine resins, urea resins, etc. are also used.
特に、NBRとそれに共溶性のあるフェノール系樹脂と
の併用がポリエポキシド化合物(A)及びブロックドポ
リイソシアネート化合物(B)によって形成された被膜
との接着性に優れて好ましい。In particular, it is preferable to use NBR in combination with a phenolic resin that is co-soluble therein since it has excellent adhesion to the film formed from the polyepoxide compound (A) and the blocked polyisocyanate compound (B).
導電性金属及び/又は導電性金属酸化物で表面をコーテ
ィングしたマイカ微粉末の樹脂に対する配合割合は、3
0〜80重量%、特に40〜60重量%であることが好
ましい。この範囲であれば、密着性と被膜強度に優れて
繊維の電気抵抗を109Ω/cm以下とする導電性樹脂
層を容易に形成することができる。これに対し、導電性
物質の割合が少ないと、導電性樹脂層の電気抵抗が大き
くなって繊維の電気抵抗を109Ω/ cm以下とする
ことが困難となり、また導電性物質の割合いが多過ぎる
と、導電性樹脂層の密着性と被膜強度が低下して、耐久
性が劣るようになる。The mixing ratio of mica fine powder whose surface is coated with conductive metal and/or conductive metal oxide to resin is 3.
It is preferably 0 to 80% by weight, particularly 40 to 60% by weight. Within this range, it is possible to easily form a conductive resin layer that has excellent adhesion and film strength and has a fiber electrical resistance of 10 9 Ω/cm or less. On the other hand, if the proportion of the conductive substance is small, the electrical resistance of the conductive resin layer will increase, making it difficult to reduce the electrical resistance of the fiber to 109Ω/cm or less, and if the proportion of the conductive substance is too high. As a result, the adhesion and film strength of the conductive resin layer decrease, resulting in poor durability.
上述のような割合で導電性物質の微粒子を分散含有した
樹脂液としては、ブタノールのようなアルコールi、M
EKのようなケ1−ン類、トルエンのような芳香族炭化
水素、エチルセロソルブ等の単独または混合を溶剤とし
て前述のような樹脂の溶液を作成し、これに前述のよう
な導電性物質の微粒子を分散させた適当な粘度のもの、
さらに必要に応じて燐酸モノアルキルエステルのような
硬化促進剤や可塑剤あるいは他のポリマーを適宜添加し
た適当な粘度のものが好ましく用いられる。The resin liquid containing fine particles of a conductive substance dispersed in the proportions described above may include alcohols such as butanol, M
A solution of the above-mentioned resin is prepared using a solvent such as a carbon such as EK, an aromatic hydrocarbon such as toluene, ethyl cellosolve, etc. alone or in combination, and a conductive substance such as the above-mentioned conductive substance is added to this solution. Appropriate viscosity with fine particles dispersed in it,
Further, it is preferable to use a resin having an appropriate viscosity and containing a curing accelerator such as a phosphoric acid monoalkyl ester, a plasticizer, or other polymer as appropriate.
この粘度は、従来公知の方法で樹脂液を付与して、0.
5〜15μm(7)厚さの導電性樹脂層を形成する付着
量が容易に得られる粘度とするのが好ましい。This viscosity can be determined by applying a resin liquid using a conventionally known method.
It is preferable that the viscosity is such that a coating amount that forms a conductive resin layer with a thickness of 5 to 15 μm (7) can be easily obtained.
樹脂液を付与したら前処理液の場合と同様に乾燥、固化
し、それによって導電性樹脂層を形成する。乾燥、固化
は、樹脂液を付与した糸等を70〜180″Cの熱風炉
中に通して溶剤を除去し、次いで130〜240°Cの
熱風炉中に通して樹脂を硬化させる方法で行うことが好
ましい。これによって、ポリエステル繊維の強度やモジ
ュラス等を保ち、電気抵抗が104〜109Ω/ cm
の耐久性に優れた導電性繊維が得られる。Once the resin liquid is applied, it is dried and solidified in the same manner as the pretreatment liquid, thereby forming a conductive resin layer. Drying and solidification are carried out by passing the thread, etc. to which the resin liquid has been applied, through a hot air oven at 70 to 180"C to remove the solvent, and then passing it through a hot air oven at 130 to 240°C to harden the resin. This preferably maintains the strength, modulus, etc. of the polyester fiber, and reduces the electrical resistance to 104 to 109 Ω/cm.
A conductive fiber with excellent durability can be obtained.
本発明の導電性繊維は、ステープル、フィラメント糸、
加工糸、織編物等の100%使いで用いられしる、また
他の絶縁性の繊維や糸に混ぜて帯電を防止するように用
いてもよい。The conductive fibers of the present invention include staples, filament yarns,
It can be used 100% in processed yarns, woven and knitted fabrics, etc., or it can be mixed with other insulating fibers or threads to prevent static electricity.
(作用)
本発明において、表面に導電性金属及び/又は導電性金
属酸化物をコーティングしたマイカを用いることにより
、樹脂層への添加量を少なくしても十分な導電性能を発
揮するのは、次の理由によるものと考えられる。(Function) In the present invention, by using mica whose surface is coated with a conductive metal and/or conductive metal oxide, sufficient conductive performance is exhibited even if the amount added to the resin layer is reduced. This is thought to be due to the following reasons.
即ち、リン片状マイカを基体とする導電性物質を含む樹
脂を、繊維表面に塗布する過程で、リン片状マイカの平
面が塗布面と平行に配列する確率が高く、その結果、マ
イカ微粉末同志が近接して、間隔がせまくなり、導電性
能が向上するものである。That is, in the process of applying a resin containing a conductive substance based on flaky mica to the fiber surface, there is a high probability that the planes of the flaky mica will be aligned parallel to the applied surface, and as a result, fine mica powder The comrades are brought closer together, the distance between them becomes narrower, and the conductive performance is improved.
(実施例)
以下、さらに実施例、比較例によって本発明を説明する
。尚、実施例、比較例において、電気抵抗は、横河電機
製作所製FMマルチテスターL−19−B型及び自動式
絶縁抵抗計L−68型で測定し、摩耗試験は、試料糸を
モジュール3.61、歯数20、回転数120 rpm
のナイロンギアに掛けて先端に0゜36g/deの荷重
を吊るす方法で行った。(Examples) Hereinafter, the present invention will be further explained by Examples and Comparative Examples. In the Examples and Comparative Examples, the electrical resistance was measured using an FM multi-tester L-19-B model and an automatic insulation resistance meter L-68 model manufactured by Yokogawa Electric Corporation. .61, number of teeth 20, rotation speed 120 rpm
The test was carried out by hanging a load of 0°36 g/de on the tip of a nylon gear.
実施例1〜5、比較例1〜4
ツルビートルポリグリシジルエーテル(長瀬産業社製デ
ナコールEX−611)60gに界面活性剤としてジオ
クチルスルフオサクシネートNa塩の30重量%水溶液
(第−工業製薬社製ネオコールSW −30) 40g
を加えて均一に溶解する。これを水740g中に激しく
撹拌しながら加え、次いで、4゜4′−ジフェニルメタ
ンジイソシアネートのε−カプロラクタム・ブロック体
の25%乳化分散物(明成化学■製S5−3)160を
加えて均一に混合し、前処理液を得る。Examples 1 to 5, Comparative Examples 1 to 4 A 30% by weight aqueous solution of dioctyl sulfosuccinate Na salt (Dai-Kogyo Seiyaku Co., Ltd.) as a surfactant was added to 60 g of Trubeetle polyglycidyl ether (Denacol EX-611, manufactured by Nagase Sangyo Co., Ltd.). Neocol SW-30) 40g
Add to dissolve uniformly. Add this to 740 g of water with vigorous stirring, then add 160 g of a 25% emulsified dispersion of ε-caprolactam block of 4゜4'-diphenylmethane diisocyanate (S5-3 manufactured by Meisei Kagaku ■) and mix uniformly. and obtain a pretreatment solution.
この前処理液に20デニールのポリエチレンテレフタレ
ートモノフィラメントを浸漬し引き上げた後、150°
Cで2分間乾燥、次いで230°Cで1分間熱処理した
。前処理剤の固着量は0.25重量%であった。得られ
たモノフィラメントの複数本を間隔をあけて並べた整列
状態で下記組成の樹脂液中を通過させ、次いでスリット
を通して樹脂液の付着厚さを調整し、引き続き130°
Cの熱風乾燥器を通して乾燥し、さらに200 ”Cの
空気浴中に導いて樹脂を固化した後、複数のモノフィラ
メントを1本に纏めてワインダに巻取って、構成フィラ
メントの導電性被膜の厚さが平均2.5μmの導電性マ
ルチフィラメントを得た。この糸の性能を第1表に示す
。After immersing a 20 denier polyethylene terephthalate monofilament in this pretreatment solution and pulling it up, the
It was dried at 230°C for 2 minutes and then heat treated at 230°C for 1 minute. The amount of pretreatment agent fixed was 0.25% by weight. A plurality of the obtained monofilaments were passed through a resin liquid having the composition shown below in an aligned state with intervals, and then passed through a slit to adjust the adhesion thickness of the resin liquid, and then heated at 130°.
After drying in a hot air dryer at 200°C and solidifying the resin by introducing it into an air bath at 200"C, the plurality of monofilaments are rolled up in a winder to determine the thickness of the conductive coating on the constituent filaments. A conductive multifilament having an average diameter of 2.5 μm was obtained.The performance of this yarn is shown in Table 1.
第 1 表
比較例5〜7
実施例において、前処理液による処理を行わなかった場
合(比較例5)、前処理液として60gのブナコール6
11と40gのネオコール5W−30のみを含むものを
使用した場合(比較例6)及び前処理液としてS−3の
みを160g含むものを使用した場合(比較例7)につ
いて、得られた導電性マルチフィラメント糸の性能を測
定し、その結果を第2表に示した。Table 1 Comparative Examples 5 to 7 In the example, when the treatment with the pretreatment liquid was not performed (Comparative Example 5), 60 g of Bunacol 6 was used as the pretreatment liquid.
The conductivity obtained when using a solution containing only 11 and 40 g of Neocol 5W-30 (Comparative Example 6) and when using a solution containing only 160 g of S-3 as a pretreatment solution (Comparative Example 7) The performance of the multifilament yarn was measured and the results are shown in Table 2.
第2表
第1表および第2表に見る通り、本発明の導電性繊維は
、導電性物質の添加量を少なくしても十分な導電性を示
す。従って、導電性物質の添加量を少なくすることによ
って、導電性樹脂層の密着性と被膜強度が低下するのを
防ぎ、耐久性の優れた導電性繊維を提供することができ
る。Table 2 As shown in Tables 1 and 2, the conductive fibers of the present invention exhibit sufficient conductivity even when the amount of the conductive substance added is reduced. Therefore, by reducing the amount of the conductive substance added, it is possible to prevent the adhesion and film strength of the conductive resin layer from decreasing and provide a conductive fiber with excellent durability.
(発明の効果)
本発明導電性繊維は、摩擦や、洗濯に対する導電性の耐
久性が非常に優れると言う効果を奏する。(Effects of the Invention) The conductive fiber of the present invention exhibits an effect that the conductivity is extremely durable against friction and washing.
Claims (1)
A)とブロックドポリイソシアネート化合物(B)とを
含む接着剤被膜を形成し、更にその上に、導電性金属及
び/又は導電性金属酸化物で表面をコーティングしたマ
イカ微粉末を含有する樹脂層を形成したことを特徴とす
る導電性繊維。1. Polyepoxide compound (
An adhesive film containing A) and a blocked polyisocyanate compound (B) is formed, and further thereon, a resin layer containing mica fine powder whose surface is coated with a conductive metal and/or a conductive metal oxide. A conductive fiber characterized by forming.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8343788A JPH01260058A (en) | 1988-04-04 | 1988-04-04 | Electrically conductive fiber |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8343788A JPH01260058A (en) | 1988-04-04 | 1988-04-04 | Electrically conductive fiber |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01260058A true JPH01260058A (en) | 1989-10-17 |
Family
ID=13802406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8343788A Pending JPH01260058A (en) | 1988-04-04 | 1988-04-04 | Electrically conductive fiber |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01260058A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03241067A (en) * | 1990-02-20 | 1991-10-28 | Kanebo Ltd | Electrically conductive fiber |
KR20000036402A (en) * | 2000-03-02 | 2000-07-05 | 권귀숙 | Far-infrared emission functional fiber manufacturing method to block electromagnetic waves and water waves |
WO2008103013A1 (en) * | 2007-02-22 | 2008-08-28 | Inktec Co., Ltd. | Conductive fibers and a method of manufacturing the same |
-
1988
- 1988-04-04 JP JP8343788A patent/JPH01260058A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03241067A (en) * | 1990-02-20 | 1991-10-28 | Kanebo Ltd | Electrically conductive fiber |
KR20000036402A (en) * | 2000-03-02 | 2000-07-05 | 권귀숙 | Far-infrared emission functional fiber manufacturing method to block electromagnetic waves and water waves |
WO2008103013A1 (en) * | 2007-02-22 | 2008-08-28 | Inktec Co., Ltd. | Conductive fibers and a method of manufacturing the same |
KR101296404B1 (en) * | 2007-02-22 | 2013-08-14 | 주식회사 잉크테크 | Conductive fibers and a method of manufacturing the same |
US8518478B2 (en) | 2007-02-22 | 2013-08-27 | Inktec Co., Ltd. | Conductive fibers and a method of manufacturing the same |
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