JPH01256194A - Resin smear removal - Google Patents
Resin smear removalInfo
- Publication number
- JPH01256194A JPH01256194A JP8444488A JP8444488A JPH01256194A JP H01256194 A JPH01256194 A JP H01256194A JP 8444488 A JP8444488 A JP 8444488A JP 8444488 A JP8444488 A JP 8444488A JP H01256194 A JPH01256194 A JP H01256194A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- inner layer
- hole
- resin smear
- layer copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 34
- 239000011347 resin Substances 0.000 title claims abstract description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000011889 copper foil Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 24
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 239000011888 foil Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 abstract description 16
- 238000005530 etching Methods 0.000 abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 7
- 239000006061 abrasive grain Substances 0.000 abstract description 5
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 239000002245 particle Substances 0.000 abstract description 2
- 239000004593 Epoxy Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- -1 that is Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
多層プリント配線板製造工程のスルーホールの下孔加工
時に発生するレジンスミアの除去方法に関し、
エポキシスミアをスルーホール下孔から完全に取り除く
ことを目的とし、
多層プリント配線板に加工したスルーホール下孔の内層
銅箔断面に付着するレジンスミアが浮き立つように内層
銅箔をエツチングし、つぎにスルーホール下孔を高圧液
体ホーニングし、さらに高水圧洗浄するように構成する
。[Detailed Description of the Invention] [Summary] Regarding a method for removing resin smear that occurs during the preparation of through-holes in the multilayer printed wiring board manufacturing process, the purpose of this method is to completely remove epoxy smear from the preparation of through-holes. The inner layer copper foil is etched so that the resin smear adhering to the cross section of the inner layer copper foil of the through-hole pilot hole processed on the wiring board stands out, and then the through hole pilot hole is high-pressure liquid honed, and then high-pressure cleaning is performed. .
多層プリント配線板製造工程のスルーホールの下孔加工
時に発生するレジンスミアの除去方法に関する。The present invention relates to a method for removing resin smear that occurs when preparing a through hole in a multilayer printed wiring board manufacturing process.
多層プリント配線板製造において、スルーホール下孔を
ドリリング加工により孔あけするとき、加工熱により樹
脂の切粉が軟化溶融し、スルーホール下孔面にレジンス
ミアとなって再付着する。In the production of multilayer printed wiring boards, when preparing through-holes are drilled, resin chips are softened and melted by processing heat and re-adhered to the surface of the prepared through-holes as resin smear.
とくに内層銅箔と例えばガラス・エポキシ樹脂積層基材
との境界付近のレジンスミア、即ちエポキシスミアは、
高圧液体ホーニングでもきれいに除去しにくく、これが
残っていれば次工程でスルーホール下孔をメツキする場
合、メツキ層とスルーホール下孔面との密着力を弱くし
たり、メツキ層が半田付は時の加熱により剥離し易く、
メッキと内層銅箔との電気的接続の信頼性を損なうこと
になる。In particular, resin smear near the boundary between the inner layer copper foil and the glass/epoxy resin laminated base material, that is, epoxy smear,
Even with high-pressure liquid honing, it is difficult to remove cleanly, and if this remains, when plating the pilot hole of the through hole in the next process, it may weaken the adhesion between the plating layer and the surface of the pilot hole of the through hole, or the plating layer may be difficult to solder. It is easy to peel off when heated,
This will impair the reliability of the electrical connection between the plating and the inner layer copper foil.
そのため、このエポキシスミアをスルーホール下孔から
完全に除去する方法が要望されている。Therefore, there is a need for a method for completely removing this epoxy smear from the pilot hole of the through hole.
上述のようにガラス・エポキシ樹脂基材と内層銅箔とか
らなる多層プリント配線板にスルーホール下孔をドリリ
ング加工により孔あけするとき、スルーホール下孔の内
層銅箔（ランド）断面にレジンスミア、即ちエポキシス
ミアが融着する。As mentioned above, when drilling a through-hole pilot hole in a multilayer printed wiring board consisting of a glass/epoxy resin base material and an inner layer copper foil, resin smear, That is, the epoxy smear is fused.
このエポキシスミアを除去するため、過酸化物、例えば
過マンガン酸塩やクロム酸塩、または濃硫酸などに多層
プリント配線板を浸漬した後、中和工程、水洗洗浄工程
を経てエポキシスミアを除去している。In order to remove this epoxy smear, the multilayer printed wiring board is immersed in a peroxide such as permanganate, chromate, or concentrated sulfuric acid, followed by a neutralization process and a water washing process to remove the epoxy smear. ing.
そして、この後、脱脂および酸化膜を除去するためのメ
ツキ前処理工程を経てスルーホールメツキする。Thereafter, through-hole plating is performed through degreasing and a pre-plating process to remove the oxide film.
第２図は多層プリント配線板１の内層銅箔（ランド）■
ｂ断面にレジンスミア３が残るスルーホール下孔２にメ
ツキを施し、メツキ層２ａを形成した状態を示す側断面
図である。Figure 2 shows the inner layer copper foil (land) of multilayer printed wiring board 1■
FIG. 3 is a side cross-sectional view showing a state in which the pilot hole 2 of the through hole in which the resin smear 3 remains on the cross section b is plated to form a plating layer 2a.
しかしながら、このような上記除去方法によれば、内Ｎ
銅箔１ｂ断面に付着したエポキシスミアは融着している
ため、その結合度はとくに強く、低分子物質に変質して
も取れにくく完全に除去しにくい。However, according to the above-mentioned removal method, the inner N
Since the epoxy smear attached to the cross section of the copper foil 1b is fused, its degree of bonding is particularly strong, and even if it changes into a low-molecular substance, it is difficult to remove and is difficult to completely remove.
そのため、スルーホール下孔２面に残滓があれば、メツ
キＮ２ａの密着力を弱くしたり、第３図の側断面図に示
すように、電子部品のリード１０を半田付け８するとき
、その加熱によりメツキ層２ａの剥離７の発生原因とな
り、メツキ層２ａと内層銅箔（ランド） ｌｂとの信頼
性の高い電気的接続が得られないといった問題があった
。Therefore, if there is any residue on the 2 surfaces of the prepared through-hole, it may weaken the adhesion of the plating N2a, or it may cause heating when soldering 8 the leads 10 of electronic components, as shown in the side cross-sectional view of FIG. This caused the occurrence of peeling 7 of the plating layer 2a, and there was a problem that a highly reliable electrical connection between the plating layer 2a and the inner layer copper foil (land) lb could not be obtained.
上記問題点に鑑み、本発明はエポキシスミアをスルーホ
ールから完全に取り除くレジンスミアの除去方法を提供
することを目的とする。In view of the above problems, an object of the present invention is to provide a resin smear removal method that completely removes epoxy smear from through holes.
上記目的を達成するために、本発明のレジンスミアの除
去方法においては、多層プリント配線板に加工したスル
ーホールの内層銅箔断面に付着するレジンスミアが浮き
立つように内層銅箔をエツチングし、つぎにスルーホー
ルを高圧液体ホーニングし、さらに高水圧洗浄するよう
に構成する。In order to achieve the above object, in the resin smear removal method of the present invention, the inner layer copper foil is etched so that the resin smear adhering to the cross section of the inner layer copper foil of a through hole processed in a multilayer printed wiring board stands out, and then the inner layer copper foil is etched. The hole is configured for high pressure liquid honing and further high pressure cleaning.
スルーホール加工後の多層プリント配線板を銅エツチン
グ液に浸漬させ、レジンスミアが内層銅箔断面から離れ
浮き立つように内層銅箔を僅かにエツチングすることに
より、次工程の高圧液体ホーニングの噴流により砥粒が
浮き立ったレジンスミアに衝突し、その衝撃力で物理的
に容易に脱落させ、同時に内壁面を研磨するとともに、
さらに次工程の高圧水の噴流によりレジンスミアの破砕
粉を残留することなく完全に除去することができる。The multilayer printed wiring board after through-hole processing is immersed in a copper etching solution, and the inner layer copper foil is slightly etched so that the resin smear separates from the cross section of the inner layer copper foil and stands out.The abrasive particles are removed by the jet of high-pressure liquid honing in the next process. collides with the raised resin smear, and the impact force makes it physically easy to fall off, simultaneously polishing the inner wall surface,
Furthermore, in the next step, the jet of high-pressure water can completely remove the crushed powder of the resin smear without leaving any residue.
以下図面に示した実施例に基づいて本発明の要旨を詳細
に説明する。なお、図において同一符号は従来と同一部
分を示す。The gist of the present invention will be explained in detail below based on embodiments shown in the drawings. In addition, in the figures, the same reference numerals indicate the same parts as in the prior art.
第１図の（ａ）、 （ｂ）、 （Ｃ１，（ｄ）図はレジ
ンスミアの除去方法の工程順を示す側断面図である。(a), (b), (C1, (d)) of FIG. 1 are side sectional views showing the order of steps in the resin smear removal method.
（ａ）図はスルーホール下孔加工工程を示す。The figure (a) shows the through-hole preparation process.
先に述べたように、ガラス・エポキシ樹脂基材１ａと内
層銅箔ｉｂとからなる多層プリント配線板１にスルーホ
ール下孔２をドリリング加工により孔あけするとき、加
工熱によりエポキシ樹脂の切粉が軟化溶融し、レジンス
ミア３、即ちエポキシスミアとなってスルーホール下孔
２に再付着したものである。図は内層銅箔１ｂ （ラン
ドを示す）と基材１ａとの境界付近に融着した状態を示
す。As mentioned above, when the through-hole pilot hole 2 is drilled in the multilayer printed wiring board 1 made of the glass/epoxy resin base material 1a and the inner layer copper foil ib, epoxy resin chips are generated due to the processing heat. is softened and melted, becoming a resin smear 3, that is, an epoxy smear, which is reattached to the lower hole 2 of the through hole. The figure shows a state in which the inner layer copper foil 1b (indicating a land) and the base material 1a are fused near the boundary.
（ｂ１図は内層銅箔エツチング工程を示す。(Figure b1 shows the inner layer copper foil etching process.
スルーホール下孔２加工後の多層プリント配線板１を過
硫酸塩や塩化鉄や硫酸・過酸化水素などの銅エツチング
液（図示路）に浸漬し、レジンスミア３が内層銅箔断面
から離れ浮き立つ程度に内Ｎ ｌ”ｌ 箔１ ｂを僅か
にエツチング４する。エツチング量（深さ）はエツチン
グ液の温度調節および濃度調節を行い制御する。The multilayer printed wiring board 1 after through-hole preparation 2 is immersed in a copper etching solution (as shown in the diagram) such as persulfate, iron chloride, sulfuric acid, hydrogen peroxide, etc., to the extent that the resin smear 3 separates from the cross section of the inner layer copper foil and stands out. The foil 1b is slightly etched within 4 hours.The amount of etching (depth) is controlled by adjusting the temperature and concentration of the etching solution.
（Ｃ）図は高圧液体ホーニング工程を示す。(C) Diagram shows the high pressure liquid honing process.
砥粒５ａを含む高圧ホーニング液５の噴流により砥粒５
ａをレジンスミア３に衝突させ、衝撃力により物理的に
脱落させ、同時に研磨する。図はレジンスミア３の脱落
状態を示す。The abrasive grains 5 are removed by a jet of high-pressure honing liquid 5 containing the abrasive grains 5a.
a is caused to collide with the resin smear 3, physically falling off due to the impact force, and polished at the same time. The figure shows the resin smear 3 falling off.
（ｄ１図は高圧水洗工程を示す。(Figure d1 shows the high-pressure water washing process.
高圧水６の噴流によりレジンスミア３を残留することな
く完全に洗浄・除去する。図はレジンスミア３や研磨粉
が除去される状態を示す。The resin smear 3 is completely washed and removed by a jet of high-pressure water 6 without leaving any residue. The figure shows a state in which resin smear 3 and polishing powder are removed.
そして、この後、脱脂および酸化膜を除去するためのメ
ツキ前処理工程を経てスルーホールのメツキ工程に入る
。After this, a through-hole plating process is started after degreasing and a plating pretreatment process to remove an oxide film.
これらの処理工程は複数枚をまとめて行うバッチ処理や
搬送コンベアのハンガーに吊り順次、処理する連続処理
の従来工程に組み込んで行われる。These processing steps are incorporated into conventional processes such as batch processing in which a plurality of sheets are processed at once or continuous processing in which the sheets are hung on a hanger on a conveyor and processed one after another.
この除去方法によれば、と（に基材と内層銅箔との境界
付近から内Ｎ銅箔断面上に延びたレジンスミアを一旦、
内Ｎ銅箔を僅かにエツチングすることにより、内層銅箔
から離れ浮き立たせて高圧液体ホーニングにより砥粒を
打撃衝突させて容易に脱落させることができ、さらに同
時にスルーホール下孔内壁面を研磨するとともに高圧水
洗により完全にレジンスミアや研磨粉などの残滓を除去
することができる。According to this removal method, once the resin smear extending from the vicinity of the boundary between the base material and the inner layer copper foil onto the inner N copper foil cross section,
By slightly etching the inner copper foil, it can be lifted away from the inner layer copper foil, and the abrasive grains can be struck and collided with high-pressure liquid honing to make it easier to fall off. Furthermore, at the same time, the inner wall surface of the lower through hole can be polished. At the same time, high-pressure water washing can completely remove residues such as resin smear and polishing powder.
以上、詳述したように本発明によれば、スルーホール下
孔内壁面からレジンスミアを完全に除去することができ
、メツキ層と内Ｎ銅箔とは密着度のよい電気的接続が得
られ、スルーホール下孔ギの剥離の恐れもなく信頼度の
高い高品質の多層プリント配線板が提供できるといった
実用上極めて有用な効果を発揮する。As described in detail above, according to the present invention, resin smear can be completely removed from the inner wall surface of the prepared through hole, and electrical connection with good adhesion between the plating layer and the inner N copper foil can be obtained. The present invention exhibits extremely useful effects in practice, such as being able to provide a highly reliable, high-quality multilayer printed wiring board without fear of peeling of the through-hole pilot hole.
第１図は本発明による一実施例の工程順を示す側断面図
、
第２図は従来技術によるレジンスミアの残る；ルーホー
ル下孔にメツキを施した状態を示７側断面図、
第３図は従来技術による半田付は時のメツキｈ離を示す
側断面図である。
図において、
１は多層プリント配線板、
１ａは基材、
ｌｂは内Ｎ銅箔（ランド）、
２はスルーホール下孔、
３はレジンスミア（エポキシスミア）、４はエツチング
、
５は高圧ホーニング液、
５ａは砥粒、
６は高圧水、
１０はリードをそれぞれ示す。
代理人 弁理士 井 桁 貞 −
人
すＩ
スルーホール下孔加工工程
ａｔ
内ｍｌ箔エッチング工程
（ｂｌ
高圧液体ホーニング工程
（Ｃ１
ぐ
第ｌ凶Fig. 1 is a side sectional view showing the process order of an embodiment of the present invention, Fig. 2 is a side sectional view showing the state in which resin smear remains due to the prior art; Soldering according to the prior art is a side sectional view showing the distance between plating and h. In the figure, 1 is a multilayer printed wiring board, 1a is a base material, lb is an inner N copper foil (land), 2 is a through-hole pilot hole, 3 is a resin smear (epoxy smear), 4 is an etching, 5 is a high-pressure honing liquid, 5a represents abrasive grains, 6 represents high pressure water, and 10 represents lead. Agent Patent Attorney Sada Igeta - Person I Through-hole preparation process at Inner ml foil etching process (BL High-pressure liquid honing process (C1)
Claims (1)
（２）の内層銅箔（１ｂ）断面に付着するレジンスミア
（３）が浮き立つように内層鋼箔（１ｂ）をエッチング
し、つぎにスルーホール下孔（２）を高圧液体ホーニン
グし、さらに高水圧洗浄することを特徴とするレジンス
ミアの除去方法。The inner layer steel foil (1b) is etched so that the resin smear (3) adhering to the cross section of the inner layer copper foil (1b) of the through hole prepared hole (2) in the multilayer printed wiring board (1) stands out, and then the through hole is etched. A method for removing resin smear, which comprises subjecting the lower hole (2) to high-pressure liquid honing and further high-pressure cleaning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8444488A JPH01256194A (en) | 1988-04-05 | 1988-04-05 | Resin smear removal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8444488A JPH01256194A (en) | 1988-04-05 | 1988-04-05 | Resin smear removal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01256194A true JPH01256194A (en) | 1989-10-12 |
Family
ID=13830771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8444488A Pending JPH01256194A (en) | 1988-04-05 | 1988-04-05 | Resin smear removal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01256194A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003092344A1 (en) * | 2002-04-24 | 2003-11-06 | Ube Industries, Ltd. | Production of via hole in flexible circuit printable board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59175797A (en) * | 1983-03-25 | 1984-10-04 | 富士通株式会社 | Method of producing multilayer printed plate |
| JPS60164396A (en) * | 1984-02-06 | 1985-08-27 | 日立化成工業株式会社 | Method of producing multilayer printed circuit board |
-
1988
- 1988-04-05 JP JP8444488A patent/JPH01256194A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59175797A (en) * | 1983-03-25 | 1984-10-04 | 富士通株式会社 | Method of producing multilayer printed plate |
| JPS60164396A (en) * | 1984-02-06 | 1985-08-27 | 日立化成工業株式会社 | Method of producing multilayer printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003092344A1 (en) * | 2002-04-24 | 2003-11-06 | Ube Industries, Ltd. | Production of via hole in flexible circuit printable board |
| US7918021B2 (en) | 2002-04-24 | 2011-04-05 | Ube Industries, Ltd. | Production of via hole in a flexible printed circuit board by applying a laser or punch |
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