JPH01248591A - Method for forming pattern of ceramic wiring board - Google Patents
Method for forming pattern of ceramic wiring boardInfo
- Publication number
- JPH01248591A JPH01248591A JP7719088A JP7719088A JPH01248591A JP H01248591 A JPH01248591 A JP H01248591A JP 7719088 A JP7719088 A JP 7719088A JP 7719088 A JP7719088 A JP 7719088A JP H01248591 A JPH01248591 A JP H01248591A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- pattern
- ceramic wiring
- nozzle
- powder particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000000843 powder Substances 0.000 claims abstract description 23
- 239000002245 particle Substances 0.000 claims abstract description 19
- 239000000853 adhesive Substances 0.000 claims abstract description 16
- 230000001070 adhesive effect Effects 0.000 claims abstract description 16
- 239000000203 mixture Substances 0.000 claims description 8
- 238000010304 firing Methods 0.000 claims description 5
- 238000007664 blowing Methods 0.000 claims 1
- 230000007261 regionalization Effects 0.000 claims 1
- 238000001035 drying Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、パターンを直接セラミック配線基板の表面に
描いてパターンを形成するセラミック配線基板のパター
ン形成方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a pattern forming method for a ceramic wiring board, in which a pattern is formed by directly drawing a pattern on the surface of the ceramic wiring board.
従来、この種のセラミック配線基板のパターン形成方法
は、ノズルからペーストを出し所望のパターンを描いた
のち、乾燥・焼成して、パターンを形成していた。Conventionally, in a pattern forming method for this type of ceramic wiring board, a desired pattern is drawn by dispensing a paste from a nozzle, and then the pattern is formed by drying and firing.
この方法について、第２図を参照して詳細を説明する。This method will be explained in detail with reference to FIG.
第２図（１）〜（３）は従来の一例を示すパターン形成
手順図である。第２図（１）はセラミックス配線基板１
の断面図であり、表面は凹凸を有する。FIGS. 2(1) to 2(3) are pattern forming procedure diagrams showing an example of the conventional method. Figure 2 (1) shows the ceramic wiring board 1
FIG.
第２図（２）はセラミックス配線基板１の表面上に５０
〜５００μｍの範囲内の一定位置にノズル８を固定した
断面図を示す。ノズル８は直径的５０〜２００μｍの孔
から、パターン組成粉末に溶剤と樹脂とを混合したペー
スト７を流出させ、基板１の表面上でパターンデータに
基づき縦横に動くことにより所定のパターンを塗布・形
成する。塗布されたペースト７は乾燥され、パターンを
固定する。次いで、第２図（３）に示すように、乾燥し
たペースドアを着けたセラミックス配線基板１は焼成炉
５内で焼成され、乾燥ペースト７はセラミックス配線基
板１にパターン６として焼結固着される。FIG. 2 (2) shows that 50
A cross-sectional view is shown in which the nozzle 8 is fixed at a fixed position within a range of ~500 μm. The nozzle 8 flows out a paste 7, which is a mixture of a pattern composition powder, a solvent, and a resin, from a hole having a diameter of 50 to 200 μm, and moves the paste 7 vertically and horizontally on the surface of the substrate 1 based on pattern data to apply a predetermined pattern. Form. The applied paste 7 is dried to fix the pattern. Next, as shown in FIG. 2(3), the ceramic wiring board 1 with the dried paste door attached is fired in a firing furnace 5, and the dry paste 7 is sintered and fixed as a pattern 6 on the ceramic wiring board 1.
上述した従来のセラミックス配線基板のパターン形成方
法は、ノズルからペーストを出し細かいパターンを描く
ので、基板の反りに応じてノズルを高さを高精度に制御
する必要があり、またノズルの先端が乾燥して詰まり易
いため取扱いが難しく、製造工程を複雑化するという欠
点がある。In the conventional pattern forming method for ceramic wiring boards mentioned above, paste is drawn from a nozzle to draw a fine pattern, so it is necessary to control the height of the nozzle with high precision according to the warpage of the board, and the tip of the nozzle may dry out. This has the disadvantage that it is difficult to handle because it is easily clogged, and it complicates the manufacturing process.
本発明の目的は、上記欠点をノズルから粉末を噴射し基
板上の接着剤に固着させることにより解決したセラミッ
クス配線基板のパターン形成方法を提供することにある
。SUMMARY OF THE INVENTION An object of the present invention is to provide a pattern forming method for a ceramic wiring board that solves the above-mentioned drawbacks by injecting powder from a nozzle and fixing the powder to an adhesive on the board.
セラミックス配線基板のパターン形成方法は、セラミッ
クス配線基板上に直接描いて所定のパターンを形成する
セラミックス配線基板のパターン形成方法において、ま
ずセラミックス配線基板のパターン形成表面に熱分解性
の有機物接着剤を塗布し、この塗布面にパターン組成の
粉体粒子をノズルの吹出口から吹付けて所定のパターン
を描いたのち、焼成してパターンを形成する。A pattern forming method for a ceramic wiring board involves forming a predetermined pattern by directly drawing on the ceramic wiring board. First, a pyrolytic organic adhesive is applied to the pattern forming surface of the ceramic wiring board. Then, powder particles having a pattern composition are sprayed onto this coated surface from an outlet of a nozzle to draw a predetermined pattern, and then fired to form the pattern.
上述の手段によれば、粉体粒子をノズルから吹出すので
、ノズルの吹出口は接着剤が塗布された配線基板面に近
接することを不要にする。According to the above-mentioned means, since the powder particles are blown out from the nozzle, it is not necessary for the outlet of the nozzle to be close to the surface of the wiring board coated with the adhesive.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（１）〜（３）は本発明の一実施例を示す手順説
明図であり、それぞれは構成要素の縦断面図である。FIGS. 1(1) to 1(3) are procedural explanatory diagrams showing one embodiment of the present invention, and each is a longitudinal cross-sectional view of a component.
まず、第１図（１）に示すように、セラミックス配線基
板１の表面に有機物接着剤２が塗付される。First, as shown in FIG. 1(1), an organic adhesive 2 is applied to the surface of a ceramic wiring board 1.
有機物接着剤２は後工程の５００℃〜６００°Ｃで熱分
解し、水と炭酸ガスに変化して消滅する。The organic adhesive 2 is thermally decomposed at 500° C. to 600° C. in the post-process, changes into water and carbon dioxide gas, and disappears.
第１図（２）では、セラミックス配線基板１の表面から
１０〜５０ｍｍ離したノズル４の吹出口からパターン組
成粉末としての粉体粒子３を、基板表面の有機物接着剤
２へ吹付ける図を示す。粉体粒子３は例えば紛擾が１〜
２０μｍの銀粉末とはうけい酸鉛ガラス粉末等を８０
： ２０〜５０ ： ５０の割合で混合したものである
。ノズル４は縦横に移動し、所定のパターンデータに基
づき粉体粒子３を有機物接着剤２へ吹付は所定形状を成
して固着する。このようなノズル４からの吹付けは先端
吹出口からセラミックス配線基板１の表面までの距離に
対する高精度設定を不要とする。FIG. 1 (2) shows a diagram in which powder particles 3 as pattern composition powder are sprayed onto the organic adhesive 2 on the surface of the substrate from the outlet of the nozzle 4 located 10 to 50 mm away from the surface of the ceramic wiring board 1. . For example, the powder particles 3 have a particle size of 1~
20μm silver powder and lead silicate glass powder etc.
:20 to 50:50. The nozzle 4 moves vertically and horizontally and sprays the powder particles 3 onto the organic adhesive 2 based on predetermined pattern data, forming a predetermined shape and fixing them. Such spraying from the nozzle 4 eliminates the need for highly accurate setting of the distance from the tip outlet to the surface of the ceramic wiring board 1.
第１図（３）の工程は、所定の形状に吹付は固着さえた
粉体粒子３を有するセラミックス配線基板１を焼成炉５
へ入れ、約８５０°Ｃで焼成する。従って、粉体粒子３
はパターン６としてセラミックス配線基板１に焼結する
と共に、有機物接着剤２は消散し、所定のパターン６が
セラミックス配線基板１上に形成される。In the process shown in FIG. 1 (3), a ceramic wiring board 1 having powder particles 3 sprayed and fixed in a predetermined shape is placed in a firing furnace.
and bake at approximately 850°C. Therefore, powder particles 3
is sintered onto the ceramic wiring board 1 as a pattern 6, the organic adhesive 2 is dissipated, and a predetermined pattern 6 is formed on the ceramic wiring board 1.
上記実施例では寸法、距離、温度等を具体的に説明した
が、粉体粒子の組成・ノズルの形状・パターンの種別に
よりそれぞれ適度な値が設定されるので、上記説明が本
発明を限定するものではない。例えば上記実施例による
粉体粒子の組成は導体パターンであるが、別に抵抗値を
有する抵抗パターン、更に絶縁体となるガラスパターン
等がある。Although dimensions, distances, temperatures, etc. were specifically explained in the above embodiments, appropriate values are set depending on the composition of the powder particles, the shape of the nozzle, and the type of pattern, so the above explanations do not limit the present invention. It's not a thing. For example, the composition of the powder particles according to the above embodiments is a conductive pattern, but there are also resistive patterns having a resistance value, glass patterns serving as insulators, and the like.
以上説明したように、本発明は、熱分解性の有機物接着
剤を表面に塗付したセラミックス配線基板上に、パター
ン組成の粉体粒子を吹き付けて所望のパターンを描くこ
とにより、粉体粒子の吹き出し口を基板面から離すこと
ができるため、基板の反り等による凹凸に対して検討粒
子の吹出口は、高さ方向の高精度のコントロールが不要
になり、また、ノズルの先端が乾燥等により詰まること
もない製造上の改善効果がある。As explained above, the present invention sprays powder particles having a pattern composition onto a ceramic wiring board whose surface is coated with a pyrolyzable organic adhesive to draw a desired pattern. Since the air outlet can be separated from the substrate surface, the air outlet for the particles under consideration does not require high-precision control in the height direction due to unevenness caused by warping of the substrate, and the tip of the nozzle does not need to be controlled due to dryness. This has the effect of improving manufacturing without clogging.
第１図（１）〜（３）は、本発明の一実施例を示す手順
説明図、第２図（１）〜（３）は従来の一例を示す手順
説明図である。
１・・・セラミックス配線基板、２・・・有機物接着剤
、３・・・粉体粒子、４・・・ノズル、５・・・焼成炉
、６・・・パターン。
＄ Ｉ 附
（Ｉ）
ｌ七２ミツ７ズ盾口ａ店淳（FIGS. 1 (1) to (3) are explanatory diagrams of a procedure showing an embodiment of the present invention, and FIGS. 2 (1) to (3) are explanatory diagrams of a procedure showing an example of the conventional method. DESCRIPTION OF SYMBOLS 1... Ceramic wiring board, 2... Organic adhesive, 3... Powder particles, 4... Nozzle, 5... Firing furnace, 6... Pattern. $ I Attachment (I)
Claims (1)
形成するセラミックス配線基板のパターン形成方法にお
いて、まずセラミックス配線基板のパターン形成表面に
熱分解性の有機物接着剤を塗布し、この塗布面にパター
ン組成の粉体粒子をノズルの吹出口から吹付けて所定の
パターンを描いたのち、焼成してパターンを形成するこ
とを特徴とするセラミックス配線基板のパターン形成方
法。In a pattern forming method for a ceramic wiring board in which a predetermined pattern is formed by directly drawing on the ceramic wiring board, a pyrolyzable organic adhesive is first applied to the pattern formation surface of the ceramic wiring board, and a pattern composition is applied to this applied surface. A method for forming a pattern on a ceramic wiring board, which comprises blowing powder particles from an outlet of a nozzle to draw a predetermined pattern, and then firing the pattern to form the pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7719088A JPH01248591A (en) | 1988-03-29 | 1988-03-29 | Method for forming pattern of ceramic wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7719088A JPH01248591A (en) | 1988-03-29 | 1988-03-29 | Method for forming pattern of ceramic wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01248591A true JPH01248591A (en) | 1989-10-04 |
Family
ID=13626897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7719088A Pending JPH01248591A (en) | 1988-03-29 | 1988-03-29 | Method for forming pattern of ceramic wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01248591A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06190643A (en) * | 1992-10-21 | 1994-07-12 | Natl Res Inst For Metals | Manufacture of part |
| CN106278383A (en) * | 2016-08-05 | 2017-01-04 | 佛山石湾鹰牌陶瓷有限公司 | A kind of manufacture the method that surface has Z-Correct bump mapping Z-correct Ceramic Tiles |
-
1988
- 1988-03-29 JP JP7719088A patent/JPH01248591A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06190643A (en) * | 1992-10-21 | 1994-07-12 | Natl Res Inst For Metals | Manufacture of part |
| CN106278383A (en) * | 2016-08-05 | 2017-01-04 | 佛山石湾鹰牌陶瓷有限公司 | A kind of manufacture the method that surface has Z-Correct bump mapping Z-correct Ceramic Tiles |
| CN106278383B (en) * | 2016-08-05 | 2019-04-16 | 佛山石湾鹰牌陶瓷有限公司 | A method of manufacture surface has Z-Correct bump mapping Z-correct Ceramic Tiles |
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