JPH01248339A - Production of substrate for optical recording medium - Google Patents

Abstract

PURPOSE:To improve the adhesiveness of a 2P (photo polymerization) layer and a substrate by subjecting the substrate surface to UV/O3 cleaning before a resin layer is formed thereon. CONSTITUTION:The surface of the substrate 1 on which a curing type resin is to be provided is subjected to the UV/O3 cleaning. The UV curing type resin is then spin-coated on a stamper 3 provided with desired guide groove shapes and/or the ruggedness corresponding to signal pits. The substrate 1 subjected to the UV/O3 cleaning is imposed on this UV curing type resin layer 4 and the surface of the substrate is irradiated by UV light through this substrate to cure the UV curing type resin. The substrate is thereafter stripped from the stamper and the substrate formed with the guide grooves 6 and/or the signal pits made of the UV curing type resin is obtd. The adhesiveness of the substrate and the 2P layer is thereby improved.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a substrate used in an optical recording medium that can perform only reproduction, recording/reproduction, or erasing/recording/reproduction using a light beam. Regarding.

For more details, please see 2P (Photo Polymeri
The present invention relates to a method for manufacturing an optical recording medium substrate in which guide grooves and/or signal pits for preformat signals are formed using a method called a zation method.

[Conventional technology]

In order to perform high-density recording, it is necessary to form optical guide grooves and signal pits for preformatted signals on the base of an optical recording medium. One method is to apply a hardening resin onto a mold called a stamper, which has unevenness corresponding to the shape of the guide groove and the signal pit of the preformat signal, and then to place a substrate on top of this. By stacking and then curing the resin by light irradiation, etc.
There is a method called the 2P method, in which a guide groove is formed and the guide groove is fixed to the substrate.

[Problem that the invention is trying to solve] However,
As mentioned above, when manufacturing an optical recording medium substrate by the 2P method, a plastic substrate, ie, a methacrylic resin substrate, a polycarbonate resin substrate, or a polyolefin resin substrate is used as the substrate.

When using styrene resin substrate, epoxy resin substrate, acrylic casting substrate, etc., after environmental durability test (7
There was a problem in that the 2P layer peeled off from the substrate at 0°C, 185% R', H, 2,000 hours).

SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems and provide a method for manufacturing a substrate for an optical recording medium that has excellent adhesion between the substrate and the 2P layer.

[Failure to solve the problem]

The above-mentioned object of the present invention is to provide a method for manufacturing a substrate for an optical recording medium, which comprises a curable resin layer having guide grooves and/or signal pits provided on a plastic substrate, before forming the resin layer on the substrate. Then, UV103 is applied to the surface of this board.
This is achieved by washing.

〔Example〕

Embodiments of the present invention will be described in detail below with reference to the drawings.

When a plastic substrate such as a methacrylic resin substrate, a polycarbonate resin substrate, a polyolefin resin substrate, a styrene resin substrate, an epoxy resin substrate, an acrylic casting substrate, etc. is used as a substrate, the present invention provides a hardening resin substrate on the substrate. Before forming guide grooves and/or signal pits for preformat signals, the surface of the plastic substrate is subjected to UV103 cleaning.

When performing UV103 cleaning, it is recommended to use a UV103 generating lamp that emits deep ultraviolet rays with wavelengths in the range of 185 nm to 300 nm (in particular, UV wavelengths of 20 nm to 300 nm).
A low-pressure mercury lamp, a pulse excitation laser, etc. that emit deep ultraviolet light of 0 nm or less are suitable. The irradiation atmosphere is air or oxygen atmosphere. U
The V103 cleaning treatment is preferably performed so that the depth of oxidative etching using a low-pressure mercury lamp is approximately 200 to 400 A on the treated surface of the plastic substrate.

Furthermore, as the curable resin used here, conventionally 2P
Known resin compositions used in the method, such as JP-A-5
No. 4-130902, JP-A-54-1384.06.

JP-A-57-88503, JP-A-57-94946.

JP-A-57-500017, JP-A-58-15549
No. 1.

Radical polymerization types such as unsaturated polyesters, acrylics, and thiol/ene systems as described in Japanese Patent Publication No. 61-29053, ring-opening polymerization types such as spiro-orthoesters and spiro-orthocarbonates. Use the one.

If a substrate for an optical recording medium is manufactured by the manufacturing method of the present invention, there will be no peeling between the substrate and the 2P layer after an environmental durability test, and it will be possible to manufacture a substrate for an optical recording medium with excellent long-term reliability. be.

Actual JL example 2 The outer circumference of the board is φ130 mm, and the inner circumference is φ18 m.
m.

Using a doughnut-shaped acrylic casting substrate with a thickness of 1 mm and a thickness of 1 mm, as shown in FIG. cm, irradiation distance 25 mm.

Irradiation for 1 minute, conditions of 03 (80 m W/c debris on the substrate surface at 254 nm light intensity)) were applied.

Next, as shown in FIG. 2, an ultraviolet curable resin MRA-5000 (epoxy acrylic resin manufactured by Mitsubishi Rayon Co., Ltd.) is placed on the stamper 3 provided with unevenness corresponding to the desired guide groove shape and/or signal pit. -1-based resin composition) was spin-coded. On this ultraviolet curable resin layer 4, the UV
The substrate 1 which had been subjected to the No. 103 cleaning treatment was placed on the substrate, and the surface of the substrate was irradiated with UV light with a wavelength of 365 nm for 1 minute at a UV illumination intensity of 233 mW/crrr to cure the ultraviolet curable resin.

Thereafter, as shown in FIG. 3, it was peeled off from the stamper to obtain a substrate 1 on which guide grooves 6 and/or signal pits made of ultraviolet curable resin were formed.

Next, in order to evaluate the adhesion between the board and the 2P layer, we conducted a board test (JIS 54.OO), and the result was an evaluation score of 10, indicating that the adhesion between them was good. .

Except for using a polycarbonate injection molded substrate instead of an acrylic casting substrate as the substrate,
A base was created and evaluated in the same manner as in Example 1.

As a result, as in Example 1, the adhesion between the substrate and the 2P layer was good.

A substrate was prepared and evaluated in the same manner as in Example 1, except that an epoxy resin substrate was used as the substrate instead of the acrylic casting substrate.

As a result, as in Example 1, the adhesion between the substrate and the 2P layer was good.

Balance L'' A substrate was prepared and evaluated in the same manner as in Example 1, except that a polyolefin resin substrate was used instead of the acrylic casting substrate.

As a result, as in Example 1, the adhesion between the substrate and the 2P layer was good.

! LJL[5 A substrate was prepared and evaluated in the same manner as in Example 1, except that an acrylic resin injection molded substrate was used as the substrate instead of an acrylic casting substrate.

As a result, as in Example 1, the adhesion between the substrate and the 2P layer was good.

Comparative Example 1 A substrate was created in the same manner as in Example 1, except that an acrylic casting substrate was used as the substrate and the surface of this substrate was not subjected to Uv103 cleaning treatment.

The adhesion between the substrate and the 2P layer of this substrate was tested by the substrate eye test JI.
As a result of evaluation at 354.00, the evaluation score was 2, indicating that the adhesion was not good.

A polycarbonate injection molded substrate was used as the substrate, and the surface of the substrate was not subjected to UV/O3 cleaning treatment.In the following, a substrate was prepared and evaluated in the same manner as in Example 1.

As a result, as in Comparative Example 1, the adhesion between the substrate and the 2P layer was good (not good).

A substrate was prepared and evaluated in the same manner as in Example 1, except that an epoxy resin substrate was used as the substrate and the surface of this substrate was not subjected to UV/O3 cleaning treatment.

As a result, as in Comparative Example 1, the adhesion between the substrate and the 2P layer was not good.

Comparison Example 11 A substrate was prepared and evaluated in the same manner as in Example 1, except that a polyolefin resin substrate was used as the substrate, and the surface of this substrate was not subjected to Uv103 cleaning treatment. As a result, as in Comparative Example 1, the adhesion between the substrate and the 2P layer was not good.

A substrate was prepared and evaluated in the same manner as in Example 1, except that an acrylic resin injection molded substrate was used as the substrate, and the surface of this substrate was not subjected to Uv103 cleaning treatment. As a result, as in Comparative Example 1, the adhesion between the substrate and the 2P layer was not good.

Said Example 1. 2. 3. 4. 5 and Comparative Example 1,
Environmental durability test (70°
Table 1 shows the results of evaluating the peeling between the substrate and the 2P layer after C185%R, H, 2,000 hours).

As is clear from Table 1, in the optical recording medium using the substrate manufactured according to the present invention, no peeling between the substrate and the 2P layer occurred even after the environmental durability test.

〔Effect of the invention〕

As explained above, the method for manufacturing an optical recording medium substrate of the present invention allows the substrate and the 2P layer to be firmly adhered to each other, making it possible to manufacture a highly reliable optical recording medium substrate.

[Brief explanation of the drawing]

FIGS. 1 to 3 are schematic diagrams illustrating each step of the method for manufacturing an optical recording medium substrate of the present invention.

Claims (1)

[Claims] (1) In a method for manufacturing an optical recording medium substrate in which a curable resin layer having guide grooves and/or signal pits is provided on a plastic substrate, before forming the resin layer on the substrate, A method of manufacturing a substrate for an optical recording medium, which comprises subjecting the surface to UV/O_3 cleaning.