JPH01247559A - Fe-ni alloy for lead frame excellent in blanking characteristic - Google Patents
Fe-ni alloy for lead frame excellent in blanking characteristicInfo
- Publication number
- JPH01247559A JPH01247559A JP7731188A JP7731188A JPH01247559A JP H01247559 A JPH01247559 A JP H01247559A JP 7731188 A JP7731188 A JP 7731188A JP 7731188 A JP7731188 A JP 7731188A JP H01247559 A JPH01247559 A JP H01247559A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- lead
- plane
- lead frame
- relative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000990 Ni alloy Inorganic materials 0.000 title claims description 4
- 239000013078 crystal Substances 0.000 claims abstract description 7
- 238000002441 X-ray diffraction Methods 0.000 claims abstract description 5
- 239000012535 impurity Substances 0.000 claims abstract description 4
- 229910045601 alloy Inorganic materials 0.000 abstract description 18
- 239000000956 alloy Substances 0.000 abstract description 18
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 238000004080 punching Methods 0.000 description 12
- 230000007547 defect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000000137 annealing Methods 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、打抜性のすぐれたICリードフレーム用Fe
−Ni合金に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is directed to a Fe for IC lead frame with excellent punchability.
-Ni alloy.
IC等のリードフレームに使用されるF e −N i
合金の特性については、打抜性の良いことはもちろん、
メツキ性等の表面性状に関する特性も重要視されるよう
になってきている。F e -N i used for lead frames of IC etc.
As for the properties of the alloy, it has good punchability as well as
Characteristics related to surface properties such as plating properties are also becoming more important.
しかし、表面性状については、リードフレームへの加工
性において、化学研磨工程を導入することにより、安定
したメツキ性が得られるように配慮されているため、素
材への依存度は比較的少ないようである。However, the surface quality seems to be relatively less dependent on the material, as a chemical polishing process has been introduced to ensure stable plating properties when processing the lead frame. be.
一方、最近のリードフレームは多ピン複雑化の傾向にあ
り、エンドユーザーからの打抜後のリードフレーム形状
に関する要求が一段と厳しくなっていること、あるいは
コストの面から従来エツチング法によっていたものを打
抜法に変更する必要が生じていること等から、より打抜
性の良好な材質が要求されている。On the other hand, recent lead frames tend to have more pins and become more complex, and end users' demands regarding the shape of the lead frame after punching are becoming more stringent, or due to cost considerations, conventional etching methods are being replaced. Due to the need to change the punching method, materials with better punching properties are required.
リードフレーム用Fe−Ni合金の打抜性については、
これまで(1)材料の機械的性質、(2)形状(平坦度
)、(3)残留応力が重要な因子と考えられ、これ等の
点において主として改善がなされてきた。Regarding the punchability of Fe-Ni alloy for lead frames,
Until now, (1) mechanical properties of the material, (2) shape (flatness), and (3) residual stress have been considered to be important factors, and improvements have been made mainly in these points.
例えば、特開昭62−224636号、特開昭61−9
552号、特開昭61−6251号、特開昭61−38
35号等。For example, JP-A No. 62-224636, JP-A No. 61-9
No. 552, JP-A-61-6251, JP-A-61-38
No. 35 etc.
しかし、第1図(大部分のリードを省略した図)に示す
ごとき、40ピン以上の多ピンのリードフレームにおい
ては、リード1の幅が極めて小さくかつ複雑となり、第
2図および第3図に示すリードの正常位置2との差であ
るリードの寄り3および段差4等の打抜時の不具合が多
くなり、前述の打抜性に及ぼす因子のみでは対応できな
くなっている。ここでリードの寄り3とは、平面的にリ
ード間隔が不揃いになる現象であり、リードの段差4と
は上下方向に位置が変化する現象である。However, in a multi-pin lead frame with 40 or more pins as shown in Figure 1 (a diagram with most of the leads omitted), the width of lead 1 is extremely small and complicated, and as shown in Figures 2 and 3. Problems during punching, such as lead deviation 3 and step 4, which are differences from the normal position 2 of the lead shown in FIG. Here, the lead offset 3 is a phenomenon in which the lead intervals become uneven in a plan view, and the lead step 4 is a phenomenon in which the position changes in the vertical direction.
本発明は以上の点に鑑み、リードフレーム用Fe−Ni
合金の打抜性を改善し、打抜時のリードの形状不具合を
低減することを目的とする。In view of the above points, the present invention provides Fe-Ni for lead frames.
The purpose is to improve the punchability of the alloy and reduce lead shape defects during punching.
本発明は、X線回折による各結晶面の相対X線強度が下
表を満足し、Ni:30〜55wt%、残部Feおよび
不可避的不純物からなることを特徴とする打抜性のすぐ
れたリードフレーム用F e −N i合金である。The present invention provides a lead with excellent punchability, characterized in that the relative X-ray intensity of each crystal plane according to X-ray diffraction satisfies the table below, and the lead is composed of Ni: 30 to 55 wt%, the balance being Fe and unavoidable impurities. This is an Fe-Ni alloy for frames.
ICリードフレーム用Fe−Ni合金において、Niが
30wt%未満では、合金の熱処理係数が大きくなり、
ICのシリコンチップの熱膨張係数と適合しなくなる。In Fe-Ni alloys for IC lead frames, if Ni is less than 30 wt%, the heat treatment coefficient of the alloy becomes large;
It becomes incompatible with the coefficient of thermal expansion of the silicon chip of the IC.
また、55vt%を越えると0.2%耐力が増加してそ
の加工性が大幅に低下する。さらには、Niを多量に含
有させることは経済的にも不利になる。このため、Ni
含有量を30wt%から55vt%に規定した。Moreover, when it exceeds 55 vt%, the yield strength increases by 0.2% and the workability is significantly reduced. Furthermore, it is economically disadvantageous to contain a large amount of Ni. For this reason, Ni
The content was defined as 30wt% to 55vt%.
ICリードフレーム用Fe−Ni合金は、前述の打抜性
の点から、冷間圧延、中間焼鈍を繰り返した後、更に仕
上げ圧延−条取り切断−ストレスレリーフを施して使用
されている。この状態において、Fe−Ni合金はある
結晶方位を有する。Fe--Ni alloys for IC lead frames are used after repeated cold rolling and intermediate annealing, followed by finish rolling, striation cutting, and stress relief, in order to improve punchability. In this state, the Fe-Ni alloy has a certain crystal orientation.
Fe−Ni合金においては、X線回折により(311)
、(220)、(200)、(111)面の相対X線強
度が得られ、結晶方位の集合度合がわかる。この結晶方
位は加工条件により変化するものである1本発明者等は
、この結晶方位の違いにより、打抜時のリードの寄り、
断差等の不具合の発生頻度が大きく異なることを見出し
たものである。In Fe-Ni alloy, (311) is determined by X-ray diffraction.
, (220), (200), and (111) planes, and the degree of aggregation of crystal orientations can be determined. This crystal orientation changes depending on processing conditions.1 The present inventors believe that due to the difference in crystal orientation, lead deviation during punching,
It was discovered that the frequency of occurrence of defects such as deviations differs greatly.
第4図に、Fe−Ni合金を用いて圧延加工度を変化さ
せた場合、およびその後焼鈍を施した場合の、各回折面
の相対X線強度の変化を示すが、加工度ならびにその後
の焼鈍により、特に(220)、(200)面の相対X
線強度が顕著に変化するのが明らかである。Figure 4 shows the changes in the relative X-ray intensity of each diffraction plane when the degree of rolling is changed using an Fe-Ni alloy and when annealing is performed after that. In particular, the relative X of the (220) and (200) planes
It is clear that the line intensity changes significantly.
本発明者等は、この特定面の相対X線強度を制御するこ
とにより、打抜時のリードの寄り1段差等の不具合の発
生を抑えることができることを見出した。すなわち、(
200)面の相対X線強度が50%を越すと材料の違法
性が強くなり、打抜時にリードの寄り1段差不具合を生
じ易くなる。また、(220)面の相対X線強度が強く
、異方性が増し、打抜時のリードの形状不具合を生じ易
くなる。The present inventors have discovered that by controlling the relative X-ray intensity of this specific surface, it is possible to suppress the occurrence of defects such as a one-step difference in lead deviation during punching. That is, (
If the relative X-ray intensity of the 200) plane exceeds 50%, the illegality of the material becomes strong, and it is easy to cause a one-step difference in lead deviation during punching. In addition, the relative X-ray intensity of the (220) plane is strong, the anisotropy increases, and lead shape defects are likely to occur during punching.
以上の点より、 (200)面の相対X線強度を25〜
50%の範囲に規定した。この(200)面の相対X線
強度の規定範囲を満足し、打抜時にリードの寄り、段差
不具合を生じない他の相対X線強度は、(220)面、
(311)面、(111)面についてそれぞれ30〜5
0%。From the above points, the relative X-ray intensity of the (200) plane is set to 25~
The range was set at 50%. Other relative X-ray intensities that satisfy the specified range of the relative X-ray intensity of the (200) plane and do not cause lead deviation or step defects during punching are the (220) plane,
30 to 5 for (311) plane and (111) plane, respectively.
0%.
5〜20%、3〜15%であって、この範囲に規定した
。5 to 20% and 3 to 15%, and these ranges were defined.
以下、本発明を一実施例に基づき説明する。 The present invention will be explained below based on one embodiment.
Ni 42vt%、残部Feおよび不可避的不純物から
なるICリードフレーム用Fe−Ni合金の加工条件を
変化させ、第1表に示すような相対X線強度を有する材
料を製作した0次にこの材料を第1図に示すリードフレ
ームに打抜、リードの寄り3、段差4について調査を行
なった。その結果も第1表に示す。By changing the processing conditions of a Fe-Ni alloy for IC lead frames consisting of 42vt% Ni, the balance being Fe and unavoidable impurities, we produced a material with the relative X-ray intensity shown in Table 1. The lead frame shown in FIG. 1 was punched, and an investigation was conducted regarding lead offset of 3 and level difference of 4. The results are also shown in Table 1.
第1表から明らかなように、本発明合金では打抜後のリ
ードの寄り3およびリードの段差4を共に0.1■未満
にすることができ、リードフレームとしての打抜性が良
好であった。一方、比較合金は、リードの寄り3および
リードの段差が大きく打抜性に問題が生じた。As is clear from Table 1, in the alloy of the present invention, both the lead deviation 3 and the lead height difference 4 after punching can be made less than 0.1 square inch, and the punching performance as a lead frame is good. Ta. On the other hand, the comparative alloy had a large lead deviation 3 and a large lead height difference, which caused problems in punchability.
この相対X線強度とリードの寄り3およびリードの段差
4の関係は、Ni含有量を変化させても同じであって、
相対X線強度の範囲が(311) (220)(200
)(111)面に対してそれぞれ、5〜20.30〜5
0.25−50.3〜15%を満足すれば打抜性は良好
であった。The relationship between the relative X-ray intensity and the lead deviation 3 and the lead height difference 4 is the same even if the Ni content is changed,
The range of relative X-ray intensity is (311) (220) (200
) (111) plane, respectively, 5 to 20.30 to 5
If the range of 0.25-50.3 to 15% was satisfied, the punchability was good.
本発明によれば、相対X線強度を回折面に対して規定す
ることによって、良好な打抜性を有するリードフレーム
用Fe−Ni合金が得られ、多ビンのリードを有するリ
ードフレームへの打抜でもリードの寄りおよびリードの
段差が十分許容できるものとなり、リードフレームの品
質を大幅に向上するものである。According to the present invention, by specifying the relative X-ray intensity with respect to the diffraction surface, an Fe-Ni alloy for lead frames having good punchability can be obtained, and it is possible to obtain a Fe-Ni alloy for lead frames having good punchability. Even when the lead frame is blanked, the deviation of the leads and the level difference in the leads can be sufficiently tolerated, and the quality of the lead frame is greatly improved.
第1図はリードフレームの一形態を示す図、第2図はリ
ード寄りの説明図、第3図はリードの段差の説明図、第
4図は回折面に対するX線強度と圧延および焼鈍の関係
を示した図である。
1:リード、2:正常位置、3:リードの寄り。
4:リードの段差
第1図Figure 1 is a diagram showing one form of the lead frame, Figure 2 is an explanatory diagram closer to the lead, Figure 3 is an explanatory diagram of the step of the lead, and Figure 4 is the relationship between X-ray intensity and rolling and annealing for the diffraction plane. FIG. 1: Lead, 2: Normal position, 3: Lead bias. 4: Lead step diagram 1
Claims (1)
足し、Ni:30〜55wt%、残部Feおよび不可避
的不純物からなることを特徴とする打抜性のすぐれたリ
ードフレーム用Fe−Ni合金。1 Fe for lead frames with excellent punchability, characterized in that the relative X-ray intensity of each crystal plane according to X-ray diffraction satisfies the table below, and consists of Ni: 30 to 55 wt%, the balance Fe and unavoidable impurities. -Ni alloy.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7731188A JP2953662B2 (en) | 1988-03-30 | 1988-03-30 | Fe-Ni alloy for lead frame with excellent punchability |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7731188A JP2953662B2 (en) | 1988-03-30 | 1988-03-30 | Fe-Ni alloy for lead frame with excellent punchability |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01247559A true JPH01247559A (en) | 1989-10-03 |
JP2953662B2 JP2953662B2 (en) | 1999-09-27 |
Family
ID=13630369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7731188A Expired - Lifetime JP2953662B2 (en) | 1988-03-30 | 1988-03-30 | Fe-Ni alloy for lead frame with excellent punchability |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2953662B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0700085A3 (en) * | 1994-08-29 | 1996-07-17 | Tadahiro Ohmi | Lead frame and lead frame material |
-
1988
- 1988-03-30 JP JP7731188A patent/JP2953662B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0700085A3 (en) * | 1994-08-29 | 1996-07-17 | Tadahiro Ohmi | Lead frame and lead frame material |
Also Published As
Publication number | Publication date |
---|---|
JP2953662B2 (en) | 1999-09-27 |
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