JPH01247153A - Restraint type damping material and damping method - Google Patents
Restraint type damping material and damping methodInfo
- Publication number
- JPH01247153A JPH01247153A JP63075487A JP7548788A JPH01247153A JP H01247153 A JPH01247153 A JP H01247153A JP 63075487 A JP63075487 A JP 63075487A JP 7548788 A JP7548788 A JP 7548788A JP H01247153 A JPH01247153 A JP H01247153A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- electron beam
- resin composition
- composition layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 40
- 238000013016 damping Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000003822 epoxy resin Substances 0.000 claims abstract description 59
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 59
- 239000000203 mixture Substances 0.000 claims abstract description 32
- 238000010894 electron beam technology Methods 0.000 claims abstract description 29
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 15
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 13
- 238000002156 mixing Methods 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000126 substance Substances 0.000 abstract description 5
- 229920001971 elastomer Polymers 0.000 abstract description 4
- 239000005060 rubber Substances 0.000 abstract description 4
- 229920005992 thermoplastic resin Polymers 0.000 abstract description 3
- 238000001723 curing Methods 0.000 description 17
- 238000010438 heat treatment Methods 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- -1 polyethylene Polymers 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 229920005549 butyl rubber Polymers 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000010960 cold rolled steel Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 239000012766 organic filler Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 230000000452 restraining effect Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- POYODSZSSBWJPD-UHFFFAOYSA-N 2-methylprop-2-enoyloxy 2-methylprop-2-eneperoxoate Chemical compound CC(=C)C(=O)OOOC(=O)C(C)=C POYODSZSSBWJPD-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 244000025254 Cannabis sativa Species 0.000 description 1
- 235000012766 Cannabis sativa ssp. sativa var. sativa Nutrition 0.000 description 1
- 235000012765 Cannabis sativa ssp. sativa var. spontanea Nutrition 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- MGJKQDOBUOMPEZ-UHFFFAOYSA-N N,N'-dimethylurea Chemical compound CNC(=O)NC MGJKQDOBUOMPEZ-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 235000009120 camo Nutrition 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 235000005607 chanvre indien Nutrition 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- HDERJYVLTPVNRI-UHFFFAOYSA-N ethene;ethenyl acetate Chemical group C=C.CC(=O)OC=C HDERJYVLTPVNRI-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000011487 hemp Substances 0.000 description 1
- 239000010903 husk Substances 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000005078 molybdenum compound Substances 0.000 description 1
- 150000002752 molybdenum compounds Chemical class 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 239000003190 viscoelastic substance Substances 0.000 description 1
- 229940006076 viscoelastic substance Drugs 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Soundproofing, Sound Blocking, And Sound Damping (AREA)
- Vibration Prevention Devices (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、拘束型制振材およびこの制振材を使用して鋼
板等の金属板を制振する方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a constraint type damping material and a method of damping a metal plate such as a steel plate using this damping material.
〔従来技術及び発明が解決しようとする課題〕車両、機
械、建築材料等の構造部材の振動や騒音の防止に、従来
から瀝青質やブチルゴム等の合成ゴムを主成分とする制
振材が使用されている。[Prior art and problems to be solved by the invention] Damping materials whose main components are bituminous or synthetic rubber such as butyl rubber have traditionally been used to prevent vibrations and noise from structural members such as vehicles, machines, and building materials. has been done.
しかしながらこれら制振材は、通常５０℃以上の高温で
は制振性能が著しく低下するという問題がある。However, these damping materials usually have a problem in that their damping performance is significantly reduced at high temperatures of 50° C. or higher.
この対策として、 ■ 制振材の上部に金属系拘束板を設ける。As a countermeasure for this, ■ Install a metal restraint plate on top of the damping material.
■ 熱硬化性樹脂からなる拘束層を設ける。■ Provide a constraining layer made of thermosetting resin.
という方法が知られている。This method is known.
しかし■の方法では、作業性が著しく悪く、例えば被制
振材の形状にそって制振材を成形する必要がある。 し
かも被制振材の形状への追従性が悪く、割振効果が低下
する。 また■の方法では加熱工程が必須となるため、
通常使用されるエポキシ樹脂等の熱硬化性樹脂層の加熱
温度、加熱時間等の加熱条件の種々の制限によって、制
振材の適用部位、適用条件が制限されるという問題があ
る。However, in method (2), workability is extremely poor, and, for example, it is necessary to mold the damping material along the shape of the material to be damped. Moreover, the ability to follow the shape of the damped material is poor, and the vibration allocation effect is reduced. In addition, method ■ requires a heating process, so
There is a problem in that the areas to which the vibration damping material is applied and the conditions under which it is applied are restricted due to various restrictions on the heating conditions such as the heating temperature and heating time of the commonly used thermosetting resin layer such as epoxy resin.
本発明者らは上記の事情に鑑み鋭意研究した結果、エポ
キシ樹脂、エポキシ基と不飽和二重結合を有するエポキ
シ樹脂を併用してなる電子線架橋性エポキシ樹脂組成物
層を拘束層として採用することにより、上記課題を解決
できることを見出した。As a result of intensive research in view of the above circumstances, the present inventors adopted an electron beam crosslinkable epoxy resin composition layer as a restraining layer, which is made by using an epoxy resin and an epoxy resin having an epoxy group and an unsaturated double bond in combination. We have found that the above problems can be solved by doing so.
即ち本発明は、粘弾性層と、下記電子線架橋性エポキシ
樹脂組成物層とからなる拘束型制振材を提供するもので
ある。That is, the present invention provides a constrained vibration damping material comprising a viscoelastic layer and an electron beam crosslinkable epoxy resin composition layer described below.
（Ａ）エポキシ樹脂、
（Ｂ）１分子中に少なくとも１個のエポキシ基と少なく
とも１個の不飽和二重結合を有するエポキシ樹脂
を含有し、（Ａ）成分と（Ｂ）成分の配合割合が（Ａ）
／（Ｉｔ） ＝０．９５１０．０５〜０．１０１０．９
０ （重量比）である電子線架橋性エポキシ樹脂組成物
。(A) epoxy resin, (B) contains an epoxy resin having at least one epoxy group and at least one unsaturated double bond in one molecule, and the blending ratio of component (A) and component (B) is (A)
/(It) =0.9510.05~0.1010.9
An electron beam crosslinkable epoxy resin composition having a weight ratio of 0 (weight ratio).
さらに本発明は、上記拘束型制振材を用いた制振方法を
提供する。Furthermore, the present invention provides a vibration damping method using the above constrained vibration damping material.
本発明の拘束型制振材は、粘弾性層と電子線架橋性エポ
キシ樹脂組成物層とからなり、第１図に示す如く粘弾性
層１の片面に電子線架橋性エポキシ樹脂組成物層２が形
成されてなる。The constrained vibration damping material of the present invention consists of a viscoelastic layer and an electron beam crosslinkable epoxy resin composition layer, and as shown in FIG. is formed.
かかる粘弾性層としては、粘弾性を有する物質即ち粘弾
性を有する高分子物質、例えば熱可塑性樹脂、瀝青質物
質、各種ゴム類等の１種または２種以上を混合したもの
が用いられる。As such a viscoelastic layer, one or a mixture of two or more of viscoelastic substances, ie, viscoelastic polymeric substances, such as thermoplastic resins, bituminous substances, various rubbers, etc., is used.
ここで熱可塑性樹脂としては、酢酸ビニル−エチレン共
重合体、ポリエステル、ポリビニルブチラール、ポリア
ミド、ポリケトン等が挙げられる。Examples of the thermoplastic resin include vinyl acetate-ethylene copolymer, polyester, polyvinyl butyral, polyamide, polyketone, and the like.
また瀝青質物質は、アスファルトを主成分としてこれに
無機質又は有機質充填剤を適宜配合したものであり、無
機質充填剤としては、例えば炭酸カルシウム、マイカ、
タルク、石綿、パーライト、シラスバルーン等を、また
有機質充填剤としては、ポリエチレン、ポリアミド、ポ
リエステル等の合成樹脂又は繊維、石油樹脂、合成ゴム
、天然ゴム、木粉、モミガラ、麻、毛等が挙げられる。The bituminous material is mainly composed of asphalt and is mixed with an appropriate amount of inorganic or organic filler. Examples of the inorganic filler include calcium carbonate, mica,
Examples of organic fillers include synthetic resins or fibers such as polyethylene, polyamide, and polyester, petroleum resins, synthetic rubber, natural rubber, wood flour, rice husk, hemp, and wool. It will be done.
また各種ゴム類としては、ブチルゴム系、スチレンゴ
ム系、ブタジェンゴム系、ニトリルゴム系、エチレンプ
ロピレンゴム系、ウレタンゴム系等が挙げられる。Examples of various rubbers include butyl rubber, styrene rubber, butadiene rubber, nitrile rubber, ethylene propylene rubber, urethane rubber, and the like.
本発明における電子線架橋性エポキシ樹脂組成物層は、
（Ａ）エポキシ樹脂、
（Ｂ）１分子中に少なくとも１個のエポキシ基と少なく
とも１個の不飽和二重結合を有するエポキシ樹脂、
を含有してなる。The electron beam crosslinkable epoxy resin composition layer in the present invention contains (A) an epoxy resin; (B) an epoxy resin having at least one epoxy group and at least one unsaturated double bond in one molecule. It will be done.
上記エポキシ樹脂（Ａ）は特に限定されず、通常１分子
中に平均１．５個以上、好ましくは平均２個以上のエポ
キシ基を有するものであればよい。The above-mentioned epoxy resin (A) is not particularly limited as long as it has an average of 1.5 or more epoxy groups, preferably an average of 2 or more epoxy groups in one molecule.
また常温で液状、固型等の何れも使用できる。Furthermore, either liquid or solid forms at room temperature can be used.
かかる具体例としては、ビスフェノールＡ型、ビスフェ
ノールＦ型、環状脂肪族型、ヒダントイン型、ノボラッ
ク型、グリシジルエステル型、グリシジルアミン型、ポ
リエーテル型等のエポキシ樹脂を単独もしくは２種以上
混合して使用することができる。Specific examples include bisphenol A type, bisphenol F type, cycloaliphatic type, hydantoin type, novolac type, glycidyl ester type, glycidylamine type, polyether type, etc. epoxy resins used alone or in combination of two or more types. can do.
またエポキシ樹脂（Ｂ）は、１分子中に少なくとも１個
のエポキシ基と少なくとも１個の不飽和二重結合を有す
るものである。Further, the epoxy resin (B) has at least one epoxy group and at least one unsaturated double bond in one molecule.
かかるエポキシ樹脂（Ｂ）は、前述のエポキシ樹脂（＾
）を、通常例えばアクリル酸、メタアクリル酸等の不飽
和二重結合を有するカルボン酸と反応させて、エポキシ
樹脂（Ａ）の少なくとも１個のエポキシ基をエポキシア
クリレートもしくはエポキシメタアクリレート等に変換
することにより得られる。Such epoxy resin (B) is the above-mentioned epoxy resin (^
) is usually reacted with a carboxylic acid having an unsaturated double bond, such as acrylic acid or methacrylic acid, to convert at least one epoxy group of the epoxy resin (A) into epoxy acrylate, epoxy methacrylate, etc. It can be obtained by
本発明においては、エポキシ樹脂（１）成分とエポキシ
樹脂（Ｂ）成分の割合を、重量比で（Ａ） ／ （Ｂ）
＝０．９５１０．０５〜０．１０１０．９０、好ましく
は（Ａ） ／ （Ｂ）＝０．９５１０．０５〜０．５０
１０．５０となるように配合する。In the present invention, the ratio of the epoxy resin (1) component and the epoxy resin (B) component is (A) / (B) in weight ratio.
=0.9510.05~0.1010.90, preferably (A)/(B)=0.9510.05~0.50
Blend so that the ratio becomes 10.50.
（Ｂ）成分が少なすぎると電子線架橋性が小さくなリ、
硬化性が不十分となり、さらに電子線照射を高エネルギ
ーあるいは長時間行う必要があるため好ましくない。ま
た（Ｂ）成分が多すぎると電子線−架橋後も未反応の不
飽和二重結合が組成物内部に残存しやすく、そのため得
られる拘束層の耐熱性、耐水性等の特性が低下するので
好ましくない。(B) If the amount of the component is too small, the electron beam crosslinking property will be low.
This is not preferred because the curing properties become insufficient and electron beam irradiation needs to be performed at high energy or for a long time. In addition, if the amount of component (B) is too large, unreacted unsaturated double bonds tend to remain inside the composition even after electron beam crosslinking, which reduces the properties such as heat resistance and water resistance of the resulting constrained layer. Undesirable.
また本発明においては、上記電子線架橋性エポキシ樹脂
組成物層にさらに硬化剤を配合することが好ましい。Further, in the present invention, it is preferable that a curing agent is further added to the electron beam crosslinkable epoxy resin composition layer.
かかる硬化剤は、−液性エポキシ樹脂用の通常の加熱硬
化型硬化剤であれば特に限定されず、具体的にはポリア
ミド系、ホウ素系、ジシアンジアミド系、ヒドラジド系
、イミダゾール系、フェノール系、アミンイミド系等の
硬化剤を挙げることができる。 硬化剤の配合量は、使
用するエポキシ樹脂（Ａ）、エポキシ樹脂（Ｂ）の種類
及び量、さらに使用する硬化剤の種類によって異なり、
適宜設定することができる。The curing agent is not particularly limited as long as it is a normal heat curing curing agent for liquid-based epoxy resins, and specifically includes polyamide-based, boron-based, dicyandiamide-based, hydrazide-based, imidazole-based, phenol-based, and amine imide. Examples include curing agents such as those based on hardening agents. The blending amount of the curing agent varies depending on the type and amount of the epoxy resin (A) and epoxy resin (B) used, and the type of curing agent used.
It can be set as appropriate.
また本発明では上記の硬化剤と共に硬化促進剤を併用す
ることもできる。 かかる硬化促進剤は特に限定されな
いが、例えばアミン系、イミダゾール系、グアニジン系
、アミンイミド系、尿素系等を挙げることができる。Further, in the present invention, a curing accelerator can be used in combination with the above-mentioned curing agent. Such curing accelerators are not particularly limited, but include, for example, amine-based, imidazole-based, guanidine-based, amine-imide-based, urea-based, and the like.
また本発明の電子線架橋性エポキシ樹脂組成物にさらに
シランカップリング剤を用いて、得られる拘束層の耐水
性、耐薬品性、密着性等をより一層向上させることもで
きる。 かかるシランカップリング剤としては、例えば
Ｘ５ｉＹ：＋（Ｘはビニル基、メタアクリロキシプロピ
ル基、アミノアルキル基、メルカプトアルキル基、エポ
キシアルキル基等の非加水分解型の有機基、Ｙはハロゲ
ン、アルコシキ基等の加水分解基）で表される。 その
配合量は、エポキシ樹脂成分（Ａ成分十Ｂ成分）１００
重量部に対して５重量部以下、好ましくは０．２〜３重
量部程度とする。Further, by further using a silane coupling agent in the electron beam crosslinkable epoxy resin composition of the present invention, the water resistance, chemical resistance, adhesion, etc. of the resulting restraining layer can be further improved. Such a silane coupling agent is, for example, X5iY: (hydrolyzable groups such as groups). The blending amount is 100 epoxy resin components (A component 10 B component)
The amount is 5 parts by weight or less, preferably about 0.2 to 3 parts by weight.
また本発明の組成物に、シリカ、クレー、石膏、炭酸カ
ルシウム、硫酸バリウム、石英粉、ガラス繊維、カオリ
ン、マイカ、金属アルミ粉、アルミナ、水和アルミナ、
水酸化アルミ、タルク、ドロマイト、ジルコン、酸化亜
鉛、チタン化合物、モリブデン化合物、アンチモン化合
物等の充填剤、金属粉末、顔料、老化防止剤、その他の
一般的に使用されている添加剤を用途や目的性状に応じ
て適宜配合することもできる。 また１分子中に重合性
炭素−炭素二重結合が１個以上含まれた反応性希釈剤を
併用することもできる。The composition of the present invention also includes silica, clay, gypsum, calcium carbonate, barium sulfate, quartz powder, glass fiber, kaolin, mica, metallic aluminum powder, alumina, hydrated alumina,
Fillers such as aluminum hydroxide, talc, dolomite, zircon, zinc oxide, titanium compounds, molybdenum compounds, antimony compounds, metal powders, pigments, anti-aging agents, and other commonly used additives for use and purpose. It can also be blended as appropriate depending on the properties. Further, a reactive diluent containing one or more polymerizable carbon-carbon double bonds in one molecule can also be used.
本発明の制振材は、上記のエポキシ樹脂（Ａ）、エポキ
シ樹脂（Ｂ）、場合によりさらに硬化剤に、必要に応し
て任意成分を加えたのち、通常常温で混合、攪拌し、次
いで３本ロール等に通して得られたエポキシ樹脂組成物
シートと、粘弾性層シートとを積層することにより得る
ことができる。The vibration damping material of the present invention is prepared by adding optional components to the above-mentioned epoxy resin (A), epoxy resin (B), and optionally a hardening agent, and then mixing and stirring the mixture at normal temperature. It can be obtained by laminating an epoxy resin composition sheet obtained by passing it through three rolls or the like and a viscoelastic layer sheet.
また粘弾性層シートに上記エポキシ樹脂組成物を塗布す
ることによっても得られる。 粘弾性層の厚みは通常０
．５〜４０龍程度、またエポキシ樹脂組成物層の厚みは
通常０．２〜２０鶴程度である。It can also be obtained by applying the above epoxy resin composition to a viscoelastic layer sheet. The thickness of the viscoelastic layer is usually 0
．． The thickness of the epoxy resin composition layer is usually about 0.2 to 20 mm.
本発明においては、上記拘束型制振材を被制振材に適用
し、次いで電子線を照射することによってエポキシ樹脂
組成物層を硬化せしめて被制振材を制振することができ
る。In the present invention, the constrained vibration damping material described above is applied to a material to be damped, and then the epoxy resin composition layer is cured by irradiating the material with an electron beam, thereby damping the material to be damped.
ここで被制振材としては、特に限定されないが、鋼板、
ステンレス板、アルミ板等の金属板、鍍金塗装等を施し
た処理金属板、塩化ビニル、ＡＢＳ、ポリプロピレン等
の各種プラスチック板、ガラス等の無機質板、木板等が
適用される。Here, the material to be damped is not particularly limited, but steel plate,
Metal plates such as stainless steel plates and aluminum plates, treated metal plates with plating, various plastic plates such as vinyl chloride, ABS, and polypropylene, inorganic plates such as glass, and wooden plates are applicable.
また被制振材に粘弾性層を適用した後、エポキシ樹脂組
成物層を塗布等の方法で設けても良い。Further, after applying the viscoelastic layer to the damping material, an epoxy resin composition layer may be provided by a method such as coating.
また本発明においては、エポキシ樹脂組成物層にさらに
硬化剤を用いた場合は、電子線照射後さらに加熱するこ
とによって、かかる樹脂層の硬化を完全にするとともに
粘弾性層を被制振材に強固に融着させることもできる。In addition, in the present invention, when a curing agent is further used in the epoxy resin composition layer, by further heating after electron beam irradiation, the resin layer is completely cured and the viscoelastic layer is turned into a damped material. It can also be firmly fused.
この場合、電子線照射により、エポキシ樹脂（Ｂ）に含
まれる不飽和二重結合を架橋させた後、次いでエポキシ
樹脂（Ａ）のエポキシ基と、エポキシ樹脂（Ｂ）に残さ
れたエポキシ基を、硬化剤で加熱硬化させることにより
、各成分が一体化した所望の特性を有する拘束層が得ら
れる。In this case, after crosslinking the unsaturated double bonds contained in the epoxy resin (B) by electron beam irradiation, the epoxy groups of the epoxy resin (A) and the epoxy groups left in the epoxy resin (B) are then bonded together. By heating and curing with a curing agent, a constraining layer having desired characteristics in which each component is integrated can be obtained.
ここで電子線照射条件は、５０〜５００にＶの電子線加
速器により加速された通常０．５〜２０ Ｍｒａｄ程度
とする。Here, the electron beam irradiation conditions are normally about 0.5 to 20 Mrad, which is accelerated by an electron beam accelerator of 50 to 500 V.
また加熱硬化条件は、使用する硬化剤の種類、量、そし
て硬化促進剤の有無を考慮して適宜設定することができ
るが、通常１５０〜２００℃で３０分程度とする。Further, the heat curing conditions can be appropriately set in consideration of the type and amount of the curing agent used, and the presence or absence of a curing accelerator, but are usually set at 150 to 200° C. for about 30 minutes.
本発明においては、さらに電子線架橋型エポキシ樹脂組
成物層の外側に樹脂製シート等の如き外層基材を付加す
ることができる。 この外層基材を付加することにより
、上記樹脂組成物の未硬化状態でのベタ付きを未然に防
ぎ、シート状制振材を重ねて保管することができる効果
を発揮する。In the present invention, an outer layer base material such as a resin sheet can further be added to the outside of the electron beam crosslinkable epoxy resin composition layer. By adding this outer layer base material, it is possible to prevent the resin composition from becoming sticky in an uncured state, and it is possible to stack and store the sheet-like damping materials.
また施工作業者に対しても汚染が防止でき、作業性に優
れ、加えて硬化後でも硬化膜の表面保護に役立つもので
ある。 しかしてこの外側基材シートとしては、通常の
樹脂フィルム例えばポリエステル、塩化ビニル、ナイロ
ン、ポリエチレン、ポリプロピレン等を用いることが出
来るが、制振材の追従性を損なわず、加熱時の収縮が少
な（、硬化後エポキシ樹脂等と良好に接着する利点をも
つ接着性ポリオレフィンが良く、特に透明なＥＶＡ（エ
チレン−酢酸ビニル共重合体）が望ましい。It also prevents contamination for construction workers, has excellent workability, and is useful for protecting the surface of the cured film even after curing. However, as the outer base material sheet of the lever, ordinary resin films such as polyester, vinyl chloride, nylon, polyethylene, polypropylene, etc. can be used; Adhesive polyolefins, which have the advantage of adhering well to epoxy resins and the like after curing, are preferred, and transparent EVA (ethylene-vinyl acetate copolymer) is particularly desirable.
この際のフィルムの厚さとしては、通常０．０１〜１．
８鶴程度のものが好ましい。The thickness of the film at this time is usually 0.01 to 1.
The size of about 8 cranes is preferable.
本発明の拘束型制振材は、電子線照射によりエポキシ樹
脂組成物層が硬化するため、特に加熱を必要とせず、例
えば被制振材が加熱出来ない材質の場合や、加熱工程が
あっても粘弾性層の被制振材への融着が低温または短時
間の場合でも、充分に硬化し優れた割振効果を発揮する
。Since the epoxy resin composition layer of the restrained vibration damping material of the present invention is cured by electron beam irradiation, there is no particular need for heating. Even when the viscoelastic layer is fused to the damping material at low temperatures or for a short time, it is sufficiently cured and exhibits excellent vibration allocation effects.
本発明の制振材及び制振方法は、特に制振作用が要求さ
れる各分野、例えば自動車、航空機等の部材、大型電動
機のボデー板、家電、事務機器のケーシング材等におい
て有効に使用することができる。The vibration damping material and vibration damping method of the present invention can be effectively used in various fields where vibration damping is particularly required, such as parts for automobiles, aircraft, etc., body plates of large electric motors, home appliances, casing materials for office equipment, etc. be able to.
以下、本発明の実施例及び比較例を示す。 Examples and comparative examples of the present invention are shown below.
ここで部および％とあるのはいずれも重量部および重量
％を意味する。Parts and % herein mean parts by weight and % by weight.
実施例１
エポキシ樹脂（Ａ）として、ビスフェノールＡ型エポキ
シ樹脂（１分子中平均エポキシ基数２個、エポキシ当量
１９０）９０部、エポキシ樹脂（Ｂ）として、後記の構
造式を有するエポキシ樹脂（※）１０部、ジシアンジア
ミド５部、３−（３，４ジクロルフエニル）−１，１−
ジメチル尿素３部を、室温で１時間混合、攪拌した後、
３本ロールに通して厚み０．５龍の組成物シートを得た
。Example 1 As the epoxy resin (A), 90 parts of bisphenol A type epoxy resin (average number of epoxy groups per molecule: 2, epoxy equivalent: 190), as the epoxy resin (B), an epoxy resin having the structural formula shown below (*) 10 parts, dicyandiamide 5 parts, 3-(3,4 dichlorophenyl)-1,1-
After mixing and stirring 3 parts of dimethylurea at room temperature for 1 hour,
A composition sheet having a thickness of 0.5 mm was obtained by passing it through three rolls.
８８ 。88.
得られた組成物シートを、厚み２鶴のブチルゴム系粘弾
性層シートに積層して制振材を得た。The obtained composition sheet was laminated on a butyl rubber viscoelastic layer sheet having a thickness of 2 mm to obtain a vibration damping material.
この制振材を、０．８ ＋ｎ１１ｙ−の冷延鋼板上に貼
付し、次いで５Ｍｒａｄで電子線照射を行った。This damping material was pasted on a 0.8+n11y- cold rolled steel plate, and then irradiated with an electron beam at 5 Mrad.
こうして得られた鋼板についてその損失係数を、振動リ
ード法により測定した結果を第２図に示す。The loss coefficient of the steel plate thus obtained was measured by the vibrating lead method, and the results are shown in FIG.
実施例２
実施例１で得られた制振材を、実施例１と同様にして電
子線照射を行った後、さらに１５０℃で２０分間加熱し
た。Example 2 The damping material obtained in Example 1 was subjected to electron beam irradiation in the same manner as in Example 1, and then further heated at 150° C. for 20 minutes.
こうして得られた鋼板についてその損失係数を、実施例
１と同様にして測定した結果を第２図に示す。The loss coefficient of the steel plate thus obtained was measured in the same manner as in Example 1, and the results are shown in FIG.
比較例
実施例１で用いたブチルゴム系粘弾性層シートのみを、
０．８１厚の冷延鋼板上に貼付して得た鋼板についてそ
の損失係数を、実施例１と同様にして測定した結果を第
２図に示す。Comparative Example Only the butyl rubber viscoelastic layer sheet used in Example 1,
FIG. 2 shows the results of measuring the loss coefficient of a steel plate obtained by pasting it on a 0.81-thick cold-rolled steel plate in the same manner as in Example 1.
第２図から本発明の制振材を用いることにより、０〜６
０℃で温度に影響されることなく安定した制振性能が得
られることがわかる。From Fig. 2, by using the vibration damping material of the present invention, 0 to 6
It can be seen that stable vibration damping performance can be obtained at 0°C without being affected by temperature.
第１図は本発明の制振材の断面図、第２図は実施例及び
比較例における鋼板の損失係数を示すグラフである。
である。
１ −−−−一・粘弾性層FIG. 1 is a cross-sectional view of the damping material of the present invention, and FIG. 2 is a graph showing loss coefficients of steel plates in Examples and Comparative Examples. It is. 1 ----1. Viscoelastic layer
Claims (3)
型制振材。 （Ａ）エポキシ樹脂、 （Ｂ）１分子中に少なくとも１個のエポキシ基と少なく
とも１個の不飽和二重結合を有するエポキシ樹脂 を含有し、（Ａ）成分と（Ｂ）成分の配合割合が（Ａ）
／（Ｂ）＝０．９５／０．０５〜０．１０／０．９０（
重量比）である電子線架橋性エポキシ樹脂組成物。(1) A constrained vibration damping material comprising a viscoelastic layer and an electron beam crosslinkable epoxy resin composition layer described below. (A) epoxy resin, (B) contains an epoxy resin having at least one epoxy group and at least one unsaturated double bond in one molecule, and the blending ratio of component (A) and component (B) is (A)
/(B)=0.95/0.05~0.10/0.90(
electron beam crosslinkable epoxy resin composition (weight ratio).
線架橋性エポキシ樹脂組成物層がさらに硬化剤を含有し
ていることを特徴とする拘束型制振材。(2) The constrained vibration damping material according to claim (1), wherein the electron beam crosslinkable epoxy resin composition layer further contains a curing agent.
制振材に適用し、次いで電子線を照射することにより、
電子線架橋性エポキシ樹脂組成物層を硬化せしめること
を特徴とする制振方法。(3) By applying the restrained vibration damping material according to claim (1) or (2) to a damped material and then irradiating it with an electron beam,
A vibration damping method characterized by curing an electron beam crosslinkable epoxy resin composition layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63075487A JPH01247153A (en) | 1988-03-28 | 1988-03-28 | Restraint type damping material and damping method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63075487A JPH01247153A (en) | 1988-03-28 | 1988-03-28 | Restraint type damping material and damping method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01247153A true JPH01247153A (en) | 1989-10-03 |
Family
ID=13577695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63075487A Pending JPH01247153A (en) | 1988-03-28 | 1988-03-28 | Restraint type damping material and damping method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01247153A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5969622A (en) * | 1997-10-07 | 1999-10-19 | Robert N. Hamburger | Allergen detector system and method |
-
1988
- 1988-03-28 JP JP63075487A patent/JPH01247153A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5969622A (en) * | 1997-10-07 | 1999-10-19 | Robert N. Hamburger | Allergen detector system and method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8137500B2 (en) | Sprayable low-viscosity rubber damping compounds | |
| KR101891068B1 (en) | Hybrid matrix for fiber composite materials | |
| CN1692133A (en) | Metal-acylates as curing agents for polybutadiene, melamine and epoxy compounds | |
| JPH08100162A (en) | Bonding method using epoxy resin-based adherent composition | |
| JP2011069020A (en) | Adhesive composition for organic fiber cord, and rubber reinforcing material and tire as well as method of adhesion using the same | |
| JPS5980454A (en) | Vibration-damping composite | |
| JPH01247153A (en) | Restraint type damping material and damping method | |
| JP4051605B2 (en) | Resin composition, adhesive using the same, and adhesion method thereof | |
| JP3274249B2 (en) | Steel sheet vibration suppression reinforcement sheet | |
| JPS6247886B2 (en) | ||
| US6919406B2 (en) | Modified polyolefin films | |
| JPH07157740A (en) | Adhesive resin composition | |
| EP3741561A1 (en) | Compositions and methods for waterproofing applications | |
| JPS61181886A (en) | Vibration damper for panel | |
| JPH01203456A (en) | Panel vibration damper | |
| JPS6049078A (en) | Adhesive sheet for reinforcing metallic plate | |
| JPH01221236A (en) | Adhesive sheet for reinforcement of thin sheet | |
| JPH11246827A (en) | Heat curing type adhesive sheet | |
| JPH1076586A (en) | Steel sheet reinforcing material | |
| KR960005305B1 (en) | High strength foamed sheet and the method for manufacturing the same | |
| JPS62251131A (en) | Vibration-damping sound-insulating sheet for car | |
| JPS61154838A (en) | Vibration-damping and sound-proof material | |
| JPH0679840B2 (en) | Multi-layer heat-resistant damping material | |
| JPH03167283A (en) | Adhesive composition for aluminum alloy | |
| JPS6055023A (en) | Epoxide compound-containing composition and manufacture |