JPH01244631A - Inspection of semiconductor wafer - Google Patents
Inspection of semiconductor waferInfo
- Publication number
- JPH01244631A JPH01244631A JP7234588A JP7234588A JPH01244631A JP H01244631 A JPH01244631 A JP H01244631A JP 7234588 A JP7234588 A JP 7234588A JP 7234588 A JP7234588 A JP 7234588A JP H01244631 A JPH01244631 A JP H01244631A
- Authority
- JP
- Japan
- Prior art keywords
- marking
- product
- semiconductor wafer
- section
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 10
- 238000007689 inspection Methods 0.000 title claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 230000001678 irradiating effect Effects 0.000 claims 1
- 230000002950 deficient Effects 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体ウェハ検査方法に係り、特にシリコンウ
ェハの主表面へのマーキング方法に１男する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor wafer inspection method, and particularly relates to a method for marking the main surface of a silicon wafer.
従来、この種のマーキング方式としては、熱硬化性樹脂
によるインクマーキング方式や、マグネット吸引で作動
する針先にてクリコンウェハ主表面ヘキズをつけるスク
ラッチマーキング方式等があり夷。Conventionally, this type of marking method includes an ink marking method using thermosetting resin, and a scratch marking method in which scratches are made on the main surface of the Cricon wafer using a needle tip operated by magnetic suction.
前述した従来のマーキング方式は、クリーンオーブン内
での熱硬化処理の為の工程の増加、及びマーク品質の不
安定等の欠点がある。The conventional marking method described above has drawbacks such as an increased number of steps for heat curing in a clean oven and unstable mark quality.
本発明の目的は、このような欠点を解決し、工程数を増
加する必要がなく、安定したマーキングが得られるよう
にした半導体ウェハ検査方法を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor wafer inspection method that solves these drawbacks, eliminates the need to increase the number of steps, and allows stable marking to be obtained.
本発明の半導体ウェハ検査方法の構成は、半導体ウェハ
の検査結果に応じて、前記ウェハの主表面にマーキング
を行う際、紫外線硬化性樹脂を使用し、前記マーキング
後は直ちに紫外線照射によるマーク硬化処理を行うこと
を特徴とする。The structure of the semiconductor wafer inspection method of the present invention is that when marking the main surface of the wafer according to the inspection result of the semiconductor wafer, an ultraviolet curable resin is used, and immediately after the marking, mark hardening treatment is performed by ultraviolet irradiation. It is characterized by doing the following.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例であるところの半導体検査方
法を説明するマーキング装置の上面図である。同図にお
いて、製品供給・収納部５から取り出された製品は、ブ
ロービングとマーキング部２に移送され、良・不良の判
定が行なわれた後、吐出コントローラ１にて紫外線硬化
性樹脂の吐出量を制御されつつ、判定結果に応じた不良
マーキングを実施する。次に、ブロービングとマーキン
グが終了した製品は、即紫外線照射部４に移され、極め
て短時間の内に紫外線硬化全完了し、再び製品供給・収
納部５へ収納され、必要な一連の動作を完了する。FIG. 1 is a top view of a marking device for explaining a semiconductor inspection method which is an embodiment of the present invention. In the figure, the product taken out from the product supply/storage section 5 is transferred to the blobbing and marking section 2, and after being judged as good or bad, the discharge controller 1 discharges the amount of ultraviolet curable resin. While being controlled, defect marking is performed according to the determination result. Next, the product that has been blown and marked is immediately transferred to the UV irradiation unit 4, where the UV curing is completely completed within an extremely short period of time, and the product is stored again in the product supply/storage unit 5 where it undergoes a series of necessary operations. complete.
以上説明したように、本発明は、マーク素材として紫外
線硬化性樹脂を採用し、マーキング完了後特に同一装置
内では直ちに紫外線硬化処理を短時間に施すことができ
るから、次の効果がある。As explained above, the present invention employs an ultraviolet curable resin as the mark material and can perform ultraviolet curing treatment immediately after marking is completed, particularly within the same apparatus, in a short time, so that the present invention has the following effects.
（１）従来のマーク硬化処理工程をなくすことによる納
期短縮。(1) Shorter delivery time by eliminating the conventional mark hardening process.
（２）マーキング後部硬化処理を施すことができる為、
周辺機構への樹脂付着がなく、安定した樹脂マーキング
が可能。(2) Since marking can be hardened afterward,
Stable resin marking is possible without resin adhesion to surrounding mechanisms.
（３）硬化処理装置としては、従来設備と比べ、安価で
コンパクト設計が可能。(3) The curing equipment is cheaper and more compact than conventional equipment.
第１図は本発明の一実施例を説明する半導体ウェハのマ
ーキング装置の上面図である。
１・・・・・・吐出コントローラ、２・・・・・・ブロ
ービングとマーキング部％ ３・・・・・・製品受渡し
部、４・・・・・・紫外線照射部、５・・・・・・製品
供給・収納部、６・・・・・・操作部。
代理人 弁理士 内 原 晋FIG. 1 is a top view of a semiconductor wafer marking device illustrating an embodiment of the present invention. 1... Discharge controller, 2... Blobbing and marking section 3... Product delivery section, 4... Ultraviolet irradiation section, 5... ...Product supply/storage section, 6...Operation section. Agent Patent Attorney Susumu Uchihara
Claims (1)
面にマーキングを行う際、紫外線硬化性樹脂を使用し、
前記マーキング後は直ちに紫外線照射によるマーク硬化
処理を行うことを特徴とする半導体ウェハ検査方法。When marking the main surface of the wafer according to the inspection results of the semiconductor wafer, using an ultraviolet curable resin,
A semiconductor wafer inspection method characterized in that immediately after the marking, a mark hardening process is performed by irradiating ultraviolet rays.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7234588A JPH01244631A (en) | 1988-03-25 | 1988-03-25 | Inspection of semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7234588A JPH01244631A (en) | 1988-03-25 | 1988-03-25 | Inspection of semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01244631A true JPH01244631A (en) | 1989-09-29 |
Family
ID=13486624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7234588A Pending JPH01244631A (en) | 1988-03-25 | 1988-03-25 | Inspection of semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01244631A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6585927B2 (en) * | 2000-01-11 | 2003-07-01 | Micron Technology, Inc. | Methods for labeling semiconductor device components |
-
1988
- 1988-03-25 JP JP7234588A patent/JPH01244631A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6585927B2 (en) * | 2000-01-11 | 2003-07-01 | Micron Technology, Inc. | Methods for labeling semiconductor device components |
| US6703105B2 (en) | 2000-01-11 | 2004-03-09 | Micron Technology, Inc. | Stereolithographically marked semiconductor devices and methods |
| US6706374B2 (en) | 2000-01-11 | 2004-03-16 | Micron Technology, Inc. | Stereolithographically marked semiconductor devices and methods |
| US6939501B2 (en) | 2000-01-11 | 2005-09-06 | Micron Technology, Inc. | Methods for labeling semiconductor device components |
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