JPH01242221A - Resin sealing die - Google Patents
Resin sealing dieInfo
- Publication number
- JPH01242221A JPH01242221A JP7140688A JP7140688A JPH01242221A JP H01242221 A JPH01242221 A JP H01242221A JP 7140688 A JP7140688 A JP 7140688A JP 7140688 A JP7140688 A JP 7140688A JP H01242221 A JPH01242221 A JP H01242221A
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- mold
- block
- insert
- cavities
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title abstract description 7
- 239000011347 resin Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 title 1
- 238000000465 moulding Methods 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 235000021395 porridge Nutrition 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds
- B29C45/2675—Mounting of exchangeable mould inserts
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野Ｊ
本発明は粥＋＋１１ｒ封止金型（以下モールド金型と称
す）に係り、特に最小構成単位のリードフレーム１枚毎
数のＬＳＩ寺の半４俸素子が接続されたものの・＋１１
記素子金咎々債・、汀で封止するための金型に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field J] The present invention relates to a porridge ++11r sealing mold (hereinafter referred to as a mold mold), and in particular, to a half of an LSI temple for each lead frame, which is the minimum structural unit. Although 4 elements are connected +11
This article relates to a mold for sealing the metal element with water.
従来のモールド金型は、第２１八）、第２図（１３１に
示す様に、各キャピテイ５は、金型の最小構成単位とな
っており、リードフレーム１枚毎に１個対応している。In the conventional molding die, as shown in Figure 218) and Figure 2 (131), each cavity 5 is the minimum structural unit of the mold, and one for each lead frame. .
キャビティ１０ツク２上に、直接加工されていた。最小
構成単位のリードフレームは、複数個のＬＳＩ素子を有
しているものがある。この場合でも、唯１個のキャビテ
ィブロック２が用意されていた。It was directly machined onto the cavities 10 and 2. Some lead frames, which are the minimum structural unit, have a plurality of LSI elements. Even in this case, only one cavity block 2 was prepared.
ここで、キャビティブロック２は、チエイスブロック３
に固定され、さらに金型ベース７に取り付けられている
。キャビティプロ、Ｉり２．チエイスブロック３．金型
ベース７を貫通して、Ｅビン（Ｗ−ｐｉｎ）４が、キャ
ビティ５ ’ｉｃ達している。Here, the cavity block 2 is the chase block 3
and is further attached to the mold base 7. Cavity Pro, Iri2. Chase block 3. An E pin (W-pin) 4 passes through the mold base 7 and reaches the cavity 5'ic.
前述した従来のモールド金型に谷リードフレームに１
対１に対応しているキャビティブロック２上に直接キャ
ピテイ部５を有している為に、１”Ｊらかの原因で金型
のキャピテイ部５に損湯ケ生じた場合、キャピテイブロ
ック２全体を又候しなければならない。このため同じキ
ャビティブロック２上に存在する他の正常なキャビティ
５も同時に交換する必要か有る。さらに、交侯用新規キ
ャビティプＯツク２が面画で、かつ加工ＶＣかなりの納
期ケ廟するといった欠点があった・
本発明の目的は、＋ＩｉＪ記欠点が解決さ（Ｌ１正常な
キャピテイ１でも交換する必要がないようＶＣした南＋
１＆封止金型を提供することＶＣある。1 in the valley lead frame in the conventional mold mentioned above.
Since the cavity part 5 is directly on the cavity block 2 which corresponds to the pair 1, if hot water is lost in the cavity part 5 of the mold due to 1"J, the cavity block 2 The entire cavity must be replaced.For this reason, it is necessary to replace other normal cavities 5 existing on the same cavity block 2 at the same time.Furthermore, if the new cavity block 2 for intersection is a screen and The purpose of the present invention is to solve the drawbacks mentioned above (L1 is a normal L1, but there is no need to replace it even if the L1 is normal).
1. VC provides sealing molds.
本発明の南＋」に封止金型の構成Ｑま、金型にＩｊ！４
１屋されたキャビティブロックに、キャビデイを有する
キャビティイン丈−トが、前記各キャビテイ毎に設けら
れていることを特徴とする。To the south of the present invention, the configuration of the sealing mold is Q, and the mold is Ij! 4
The cavity block is characterized in that a cavity inlet having a cavity is provided for each of the cavities.
次に本発明Ｖこついて図面をＣ照して説明すめ。 Next, let us explain the present invention with reference to the drawings.
第１図ｍは本発明の一実施例のモールド金型の下型の平
面図、第１図（均Ｖｉ第１図ｔ、’！のＡ −Ａ ’巌
に沿って切断した矢視断囲図である。本実施例の樹脂封
止金型は、これら図に示す様に、最小成形単位である各
キャビティ５．１個毎に、１ン丈−ト化したもの（以下
、キャビティ１ン丈−トｌと略す）を用いている。本実
施ν１１のキャビティイン丈−ト１は、各々キャビティ
５を１個ずつ、ｈしており、一対のネジ６により、キャ
ビティブロック２に固定されている。尚、キャビティブ
ロック２は、従来通り、チエイスブロック３に固定され
、さらに金型ベース７に取り付けしれて、モールド金型
を構成している。Fig. 1 m is a plan view of the lower mold of a mold according to an embodiment of the present invention; As shown in these figures, the resin-sealed mold of this example is one in which each cavity, which is the minimum molding unit, has a one-inch length (hereinafter, one cavity is one inch long). The cavity in length 1 of this embodiment ν11 each has one cavity 5 of length h, and is fixed to the cavity block 2 with a pair of screws 6. Incidentally, the cavity block 2 is fixed to the chase block 3 and further attached to the mold base 7, as in the conventional manner, to constitute a mold die.
以上説明したようＶＣ１本発明は、各キャビティ５７α
にキャビティ１ノ丈−トを設け、このインプートを分割
口」能ｌ溝数にすることにより、次の効果がある。As explained above, in the VC1 of the present invention, each cavity 57α
The following effects can be obtained by providing a cavity with a length of 1 length and making this input have the number of grooves with a split opening.
（１）一部のキャビティ５が用湯した場合に、このキャ
ビティ５に対応するキャビティイン丈−ト１を交換する
だけで、修復が可能となる。(1) When some of the cavities 5 are exposed to hot water, it can be repaired by simply replacing the cavity inlet 1 corresponding to this cavity 5.
（１１）各キャピテイインプートの製作費が簀加で、か
つ納ＪυＪが早い。(11) The production cost of each capital input is low and delivery is quick.
（ｉｉｉ） モールド金型の耐久性向上の為には、キ
ャビティインプートを、他の部位とは異なった特殊素材
で裏作する事が可能となる。(iii) In order to improve the durability of the mold, the cavity input can be lined with a special material different from other parts.
第１図ｔｅｌは本発明の一実施例の切崩封止金型の下型
平面図、第１図（８１は第１図（ＮのＡ−Ａ’線の矢視
断面図、第２図ｔＡ）は従来のモールド金型の下型の平
口図、第２図Ｈに第２図（Ｎの１１−１３ ’線の矢視
断面図である。
ｌ・・・・・・キャビティ１ンブート、２・・・・・・
キャビティブロック、３・・・・・・チェイスグロ、り
、４・・・・・・イビン（Ｅ−ｐｉｎ）、５・・・・・
・キャビティ（成形部）、６・・・・・・固足坏ジ、７
・・・・・・金型ベース。
代理人 弁理士 内 原 台Fig. 1 (tel) is a plan view of the lower mold of a cut-off sealing mold according to an embodiment of the present invention, Fig. 1 (81 is a sectional view taken along the line AA' of Fig. tA) is a plan view of the lower mold of a conventional mold, and FIG. 2H is a sectional view taken along line 11-13' in FIG. 2...
Cavity block, 3...Chase Gro, Ri, 4...Ibin (E-pin), 5...
・Cavity (molded part), 6...Fixed base, 7
...Mold base. Agent Patent Attorney Uchihara Dai
Claims (1)
を有するキャビティインサートが、前記各キャビティ毎
に設けられていることを特徴とする樹脂封止金型。A resin-sealed mold characterized in that a cavity block fixed to the mold is provided with a cavity insert having a cavity for each cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7140688A JPH01242221A (en) | 1988-03-24 | 1988-03-24 | Resin sealing die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7140688A JPH01242221A (en) | 1988-03-24 | 1988-03-24 | Resin sealing die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01242221A true JPH01242221A (en) | 1989-09-27 |
Family
ID=13459602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7140688A Pending JPH01242221A (en) | 1988-03-24 | 1988-03-24 | Resin sealing die |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01242221A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0401586A2 (en) * | 1989-06-07 | 1990-12-12 | Motorola, Inc. | Method for fabricating semiconductor device including package |
| JPH03197015A (en) * | 1989-12-26 | 1991-08-28 | Matsumoto Kanagata:Kk | Mold device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS492859B1 (en) * | 1968-07-18 | 1974-01-23 | ||
| US3871611A (en) * | 1973-05-07 | 1975-03-18 | Taketa Phyllis | Mold with removable and replaceable core and cavity inserts |
| JPS6299126A (en) * | 1985-10-25 | 1987-05-08 | Tominaga Jushi Kogyosho:Kk | Cassette type mold for injection molding |
-
1988
- 1988-03-24 JP JP7140688A patent/JPH01242221A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS492859B1 (en) * | 1968-07-18 | 1974-01-23 | ||
| US3871611A (en) * | 1973-05-07 | 1975-03-18 | Taketa Phyllis | Mold with removable and replaceable core and cavity inserts |
| JPS6299126A (en) * | 1985-10-25 | 1987-05-08 | Tominaga Jushi Kogyosho:Kk | Cassette type mold for injection molding |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0401586A2 (en) * | 1989-06-07 | 1990-12-12 | Motorola, Inc. | Method for fabricating semiconductor device including package |
| JPH03197015A (en) * | 1989-12-26 | 1991-08-28 | Matsumoto Kanagata:Kk | Mold device |
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