JPH01239993A - Printed-circuit board - Google Patents
Printed-circuit boardInfo
- Publication number
- JPH01239993A JPH01239993A JP6881188A JP6881188A JPH01239993A JP H01239993 A JPH01239993 A JP H01239993A JP 6881188 A JP6881188 A JP 6881188A JP 6881188 A JP6881188 A JP 6881188A JP H01239993 A JPH01239993 A JP H01239993A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- base material
- hole
- printed
- spiral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims abstract description 4
- 239000004020 conductor Substances 0.000 abstract description 18
- 238000000034 method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、プリン）・基板のスルホール部の改良に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] This invention relates to improvements in through-hole portions of printed circuit boards.
第３図は従来のプリント基板のスルホール部を示す断面
図で、図において、１は例えばガラスエポキシ等でなる
プリント基板の基材であり、２はこのプリント基板の基
材に形成されたスルホール、３はこのスルホール２に設
けられた銅箔などの導体である。FIG. 3 is a cross-sectional view showing a through-hole portion of a conventional printed circuit board. In the figure, 1 is a base material of the printed circuit board made of, for example, glass epoxy, and 2 is a through hole formed in the base material of this printed circuit board. 3 is a conductor such as copper foil provided in this through hole 2.
従来のプリント基板では、スルホールの導体３と基材１
の熱膨張係数の違いのため、（基材くスルホール導体）
、プリント基板が加熱されると、第４図の様に、基材１
の板厚方向（矢印Ａ方向）の膨張にスルホールの導体３
が整合できずに導体層が破断してしまうという問題点が
あった。In a conventional printed circuit board, through-hole conductor 3 and base material 1
Due to the difference in thermal expansion coefficient of (base material and through-hole conductor)
, when the printed circuit board is heated, as shown in FIG.
Through-hole conductor 3 expands in the plate thickness direction (direction of arrow A)
There was a problem in that the conductor layer could not be aligned and the conductor layer would break.
この発明は上記のような問題点を解消するためになされ
たもので、基板の板厚方向の熱膨張に対して確実に整合
してい（スルホールを有するプリント基板を得ることを
目的とする。This invention was made to solve the above-mentioned problems, and aims to obtain a printed circuit board that is reliably matched to the thermal expansion in the thickness direction of the board (having through holes).
この発明に係るプリント基板は、スルホールの形状をス
パイラル状に構成したものである。The printed circuit board according to the present invention has through holes configured in a spiral shape.
この発明におけるスパイラル型構造のスルホールは、基
材の板厚方向の膨張変化に確実に整合する。The through-holes of the spiral type structure in this invention reliably match expansion changes in the thickness direction of the base material.
以下この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図において、第３図の従来例と異なるところは、プ
リント基板にスパイラル状のスルホール４ｅＪ［し、乙
のスパイラル状のスルボールの壁面に銅メッキ等の導体
層５を施したものである。1, the difference from the conventional example shown in FIG. 3 is that the printed circuit board has a spiral through hole 4eJ and a conductor layer 5 such as copper plating is applied to the wall surface of the spiral through hole.
次に作用について説明する。スルホ−２，、導体と基材
の熱膨張係数の違いは従来のものと同じであるが、プリ
ント基板が加熱され基材１が板厚方向Ａに膨張した場合
、スパイラル状に形成されたスルホールの導体５ば第２
図の様にバネが伸びるごとく基材１の膨張に確実に整合
するものとなる。Next, the effect will be explained. Through-hole 2, the difference in thermal expansion coefficient between the conductor and the base material is the same as that of the conventional one, but when the printed circuit board is heated and the base material 1 expands in the board thickness direction A, the through-hole formed in a spiral shape conductor 5 second
As shown in the figure, as the spring expands, it will surely match the expansion of the base material 1.
なお上記実施例で；よ、プリント基板が加熱された場合
の基材の膨張に対するスルホールの導体の整合性につい
て述べたが、プリント基板が冷却された場合の基材の収
縮に対しても、この発明によるベローズ型構造のスルホ
ールは同様の効果を奏する。In the above example, the consistency of the through-hole conductor with respect to the expansion of the base material when the printed circuit board is heated was described, but this also applies to the contraction of the base material when the printed circuit board is cooled. The bellows-type structure of the through hole according to the invention has a similar effect.
また多層基板におけろパイヤホールにおいてもスパイラ
ル状に形成された導体層が有効なことは言うまでもない
。It goes without saying that a spirally formed conductor layer is also effective in a pie hole as well as in a multilayer board.
以上のようにこの発明によれば、スルホールをスパイラ
ル状に形成したので、基材の板厚方向の１１縮に確実に
整合し、導体層が破断するのを防ぐことができる効果が
ある。As described above, according to the present invention, since the through holes are formed in a spiral shape, the through holes are reliably aligned with the 11 shrinkage in the thickness direction of the base material, and it is possible to prevent the conductor layer from breaking.
第１図はこの発明の一実施例によるプリント基板のスル
ホール部を示す断面図、第２図はその作用説明図、第３
図は従来のプリント基板のスルホール部を示す断面図、
第４図はその作用説明図である。
図中、１はプリン、ト基板の基材、４はスルホール、５
はスルホール導体である。
尚、図中同一符号は同−又は相当部分を示す。FIG. 1 is a sectional view showing a through-hole portion of a printed circuit board according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of its operation, and FIG.
The figure is a cross-sectional view showing the through-hole part of a conventional printed circuit board.
FIG. 4 is an explanatory diagram of its operation. In the figure, 1 is the base material of the printed circuit board, 4 is the through hole, and 5 is the base material of the printed circuit board.
is a through-hole conductor. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
し、その壁面に銅メッキ等の導体層を施したことを特徴
とするプリント基板。A printed circuit board characterized in that a spiral through hole is formed in the base material of the printed circuit board, and a conductive layer such as copper plating is applied to the wall surface of the spiral through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6881188A JPH01239993A (en) | 1988-05-26 | 1988-03-22 | Printed-circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6881188A JPH01239993A (en) | 1988-05-26 | 1988-03-22 | Printed-circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01239993A true JPH01239993A (en) | 1989-09-25 |
Family
ID=13384468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6881188A Pending JPH01239993A (en) | 1988-05-26 | 1988-03-22 | Printed-circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01239993A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010258048A (en) * | 2009-04-22 | 2010-11-11 | Nec Access Technica Ltd | Printed wiring board and through-hole forming method for the same |
-
1988
- 1988-03-22 JP JP6881188A patent/JPH01239993A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010258048A (en) * | 2009-04-22 | 2010-11-11 | Nec Access Technica Ltd | Printed wiring board and through-hole forming method for the same |
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