JPH01239715A - Manufacture of panel switch - Google Patents
Manufacture of panel switchInfo
- Publication number
- JPH01239715A JPH01239715A JP63063573A JP6357388A JPH01239715A JP H01239715 A JPH01239715 A JP H01239715A JP 63063573 A JP63063573 A JP 63063573A JP 6357388 A JP6357388 A JP 6357388A JP H01239715 A JPH01239715 A JP H01239715A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- switch
- panel
- forming
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000004020 conductor Substances 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims abstract description 14
- 238000004080 punching Methods 0.000 claims abstract description 7
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 claims description 4
- 229920006267 polyester film Polymers 0.000 abstract description 6
- 229920001971 elastomer Polymers 0.000 abstract description 3
- 229920000728 polyester Polymers 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2229/00—Manufacturing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2229/00—Manufacturing
- H01H2229/024—Packing between substrate and membrane
- H01H2229/028—Adhesive
Landscapes
- Manufacture Of Switches (AREA)
- Push-Button Switches (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、電子機器等の操作部に用いられるパネルスイ
ッチの製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a panel switch used in an operating section of an electronic device or the like.
(従来の技術)
従来のパネルスイッチの製造方法を、第12図及び第1
3図を用いて説明する。(Prior art) The conventional method of manufacturing a panel switch is shown in FIGS. 12 and 1.
This will be explained using Figure 3.
まず、第12図は、定尺のフィルム上に構成部品を多数
個数りにしてパターン形成したものである。First, in FIG. 12, a pattern is formed using a large number of component parts on a film of a fixed length.
1はパネル表示部であり、これを複数個並べて印刷し、
打ち抜き外形枠も形成している。2は粘着フィルムであ
り、所要の打ち抜き外形枠を形成している。3はスイッ
チ接点及び配線導体と、打ち抜き外形枠を形成したフレ
キシブル基板である。1 is a panel display section, which is printed side by side,
A punched outer frame is also formed. Reference numeral 2 represents an adhesive film, which forms a required punched outer frame. 3 is a flexible substrate on which switch contacts, wiring conductors, and a punched outer frame are formed.
4は絶縁性のスペーサで、フレキシブル基板3の接点に
対応する位置に孔と、打ち抜き外形枠を形成している。Reference numeral 4 denotes an insulating spacer, which has a hole and a punched outer frame formed at a position corresponding to the contact point of the flexible substrate 3.
上記のように、定尺フィルム上に形成された各構成部品
は、それぞれ個別に、金型により外形枠に従って打ち抜
かれ、第13図に示したように、積み重ねて組立られる
。なお、フレキシブル基板3は折り返してスペーサ4を
間に挟み、貼り合わせられる。As described above, each of the component parts formed on the fixed length film is individually punched out using a mold according to the outer frame, and then stacked and assembled as shown in FIG. 13. Note that the flexible substrate 3 is folded back and bonded together with the spacer 4 interposed therebetween.
(発明が解決しようとする課題)
しかしながら、上記従来の製造方法は、以下のような問
題点を有する。(Problems to be Solved by the Invention) However, the above conventional manufacturing method has the following problems.
(1)各構成部品を互いに貼り合わせる工程が多く、組
立に時間がかかり、製造コストが高くなる。(1) There are many steps for bonding each component to each other, which takes time to assemble and increases manufacturing costs.
(2)各部品毎に打ち抜き用の金型を必要とし。(2) A punching die is required for each part.
全型代が高い。All models are expensive.
(3)折り返されるフレキシブル基板3には配線導体が
走っているから折り返し部にアールをつけて湾曲させる
必要があり、そのため、パネル表示部1が浮いた状態と
なって耐水性、防塵性に欠け、外観上も良好でない。(3) Since wiring conductors run on the flexible board 3 that is folded back, it is necessary to curve the folded part with a radius, and as a result, the panel display part 1 is in a floating state and lacks water resistance and dust resistance. , the appearance is also not good.
(4)フレキシブル基板3のコネクタ接続部が長く、ま
た他の部品の2倍の面積を要するため、丁付けによる取
数が少なく、コスト高になる。(4) Since the connector connection portion of the flexible board 3 is long and requires twice the area of other parts, the number of connections required for binding is small, resulting in high costs.
本発明は、このような従来の問題点を解決するものであ
り、低コストで1品質の優れたパネルスイッチの製造方
法を提供することを目的とする。The present invention solves these conventional problems, and aims to provide a method for manufacturing a panel switch with excellent quality at low cost.
(課題を解決するための手段)
上記目的を達成するために、複数個の部品パターンが形
成された各部品の定尺のフィルムを予め貼り合わせた後
、パネルスイッチ部を一括して個々に打ち抜き分離させ
、その後、上下の配線導体を端子部で接続する工程を採
るものである。(Means for solving the problem) In order to achieve the above purpose, after pasting together in advance a fixed length film of each component on which a plurality of component patterns are formed, panel switch parts are individually punched out at once. The process involves separating the wires and then connecting the upper and lower wiring conductors at terminals.
(作 用)
この工程によれば、打ち抜き工程数が減少し、従って、
金型の数も減り、フレキシブル基板の折り返しがないの
で耐水性、防塵性が向上し、外観も良好になる。(Function) According to this process, the number of punching processes is reduced, and therefore,
The number of molds is reduced, and since there is no folding of the flexible substrate, water resistance and dust resistance are improved, and the appearance is also improved.
(実施例) 以下、図面を参照して実施例を詳細に説明する。(Example) Hereinafter, embodiments will be described in detail with reference to the drawings.
まず、第1図は、複数の上部導体パターンを形成した定
尺シートと、複数のパネル表示パターンを形成した定尺
シートとを貼り合わせて積層し、所要の部分に孔を打ち
抜いて端子部の外形を形成する工程を示している。即ち
、原反のポリエステルフィルム6を定尺に裁断した定尺
シート6aに、第2図に示すようなスイッチ接点及び配
線導体からなる上部導体パターン6bを導電ペーストに
て複数個並べてスクリーン印刷し、乾燥後、接点部及び
端子部を除く部分にシリコンゴム6Cをスクリーン印刷
して被覆する。また原反のポリエステルフィルム7を定
尺に裁断した定尺シート7aに、第3図に示したような
複数のパネル表示パターン7bをスクリーン印刷し、乾
燥後、その裏面に接着剤7cを印刷する。そして、定尺
シート6aと7aとを位置合わせして重ね、2本のゴム
ローラ21.22間を通し、両定尺シートを貼り合わせ
る。First, in Figure 1, a fixed-length sheet with a plurality of upper conductor patterns formed thereon and a fixed-length sheet with a plurality of panel display patterns formed on it are laminated together, and holes are punched in the required areas to form terminals. It shows the process of forming the outer shape. That is, a plurality of upper conductor patterns 6b consisting of switch contacts and wiring conductors as shown in FIG. 2 are lined up and screen-printed using conductive paste on a fixed-length sheet 6a obtained by cutting an original polyester film 6 into a fixed length. After drying, silicone rubber 6C is screen printed to cover the parts excluding the contact and terminal parts. In addition, a plurality of panel display patterns 7b as shown in FIG. 3 are screen printed on a fixed size sheet 7a obtained by cutting the original polyester film 7 into a fixed length, and after drying, an adhesive 7c is printed on the back side. . Then, the regular size sheets 6a and 7a are aligned and overlapped, and passed between two rubber rollers 21 and 22 to bond the regular size sheets together.
これを上部貼着シート5としておく。次いで、第4図に
示したように、所定の部分に孔5aを打ち抜き、端子部
5bの外形を形成する。This is used as the upper adhesive sheet 5. Next, as shown in FIG. 4, a hole 5a is punched in a predetermined portion to form the outer shape of the terminal portion 5b.
第5図は、複数の下部導体パターンを形成した定尺シー
トを作製する工程を示している。即ち、原反のポリエス
テルフィルム8を定尺に裁断した定尺シート8aに、第
6図に示すようなスイッチ接点及び配線導体からなる下
部導体パターン8bを導電ペーストにて複数個並べてス
クリーン印刷し、乾燥後、接点部及び端子部を除く部分
にシリコンゴムからなる粘着絶縁層8cをスクリーン印
刷して形成する。また、端子部8dの所要の範囲に異方
導電性接着剤層15をスクリーン印刷により形成する。FIG. 5 shows the process of producing a regular size sheet on which a plurality of lower conductor patterns are formed. That is, a plurality of lower conductor patterns 8b consisting of switch contacts and wiring conductors as shown in FIG. 6 are lined up and screen-printed using conductive paste on a fixed-length sheet 8a obtained by cutting an original polyester film 8 into a fixed length. After drying, an adhesive insulating layer 8c made of silicone rubber is formed by screen printing on the portions excluding the contact portions and terminal portions. Further, an anisotropic conductive adhesive layer 15 is formed in a required range of the terminal portion 8d by screen printing.
さらに、所定の部分に孔8eを打ち抜き、端子部の外形
を形成する。Furthermore, a hole 8e is punched in a predetermined portion to form the outer shape of the terminal portion.
次に、第7図に示したように、第1図で作製した上部貼
着シート5と第5図で作製した下部導体パターン形成定
尺シート8aとを、スイッチ接点が対向するようにして
重ね合わせ、ゴムローラ21゜22間に通すことにより
両シートを貼り合わせる。Next, as shown in FIG. 7, the upper adhesive sheet 5 produced in FIG. 1 and the lower conductor pattern forming regular sheet 8a produced in FIG. The two sheets are pasted together by passing them between rubber rollers 21 and 22.
この貼り合わせ体9aから個々のパネルスイッチ部9を
一括して打ち抜き分離する。The individual panel switch parts 9 are punched out and separated from this bonded body 9a at once.
さらに、第8図は、コネクタテール部を形成する工程を
示している。原反のポリエステルフィルム10を定尺に
裁断した定尺シート10aに、導電ペーストをスクリー
ン印刷して配線導体10bを複数個数べて形成し、その
所要部分に、予め打ち抜き加工された粘着剤付きポリエ
ステルフィルムからなる絶縁テープ10cを貼り付けた
後、一括して個々の部材に打ち抜く。このようにして作
製したコネクタテール11を、第9図に示したように、
パネルスイッチ部9の端子部9bに熱プレスにより異方
導電性接着剤層15を溶かして接続する。第10図に接
続した状態を示している。Furthermore, FIG. 8 shows the process of forming the connector tail portion. A plurality of wiring conductors 10b are formed by screen printing a conductive paste on a fixed-length sheet 10a obtained by cutting an original polyester film 10 into a fixed length, and pre-punched adhesive-coated polyester is applied to the required portions. After pasting the insulating tape 10c made of film, the pieces are punched out into individual members all at once. The connector tail 11 produced in this way is as shown in FIG.
The anisotropically conductive adhesive layer 15 is melted and connected to the terminal portion 9b of the panel switch portion 9 by hot pressing. FIG. 10 shows the connected state.
コネクタテール11の接続方法についてさらに説明する
。第11図において、コネクタテール11の導体部11
aと上部導電基板13の端子部13aとを、下部導電基
板12の端子部12aの予め異方導電性接着剤層15を
形成した部分に熱プレスにより接着する。The method of connecting the connector tail 11 will be further explained. In FIG. 11, the conductor portion 11 of the connector tail 11
a and the terminal portion 13a of the upper conductive substrate 13 are bonded by hot press to the portion of the terminal portion 12a of the lower conductive substrate 12 on which the anisotropic conductive adhesive layer 15 has been formed in advance.
この接着された状態では、コネクタテール11の導体パ
ターンllbは異方導電性接着剤層15を介して下部導
電基板12の導体パターン12bと接続され、その延長
部につながるスイッチ接点12dと連結されている。ま
た、コネクタテール11の導体パターンlieは異方導
電性接着剤層15を介して下部導電基板12の導体パタ
ーン12cと接続され、さらに、異方導電性接着剤層1
5を介して上部導電基板13の導体パターン13cと接
続され、そのその延長部につながるスイッチ接点13d
と連結されている。従って、互いに対向するスイッチ接
点12dと13dがスイッチングにより接触すると、コ
ネクタテール11の導体パターンllbとllcとが電
気的に接続されることになる。In this bonded state, the conductor pattern llb of the connector tail 11 is connected to the conductor pattern 12b of the lower conductive substrate 12 via the anisotropic conductive adhesive layer 15, and connected to the switch contact 12d connected to the extension thereof. There is. Further, the conductor pattern lie of the connector tail 11 is connected to the conductor pattern 12c of the lower conductive substrate 12 via the anisotropic conductive adhesive layer 15, and furthermore, the conductor pattern 12c of the lower conductive substrate 12
A switch contact 13d is connected to the conductive pattern 13c of the upper conductive substrate 13 via
is connected to. Therefore, when the mutually opposing switch contacts 12d and 13d come into contact through switching, the conductor patterns llb and llc of the connector tail 11 are electrically connected.
(発明の効果)
本発明は、以上の実施例から明らかなように、(1)打
ち抜き工程、貼り合わせ工程が減少し、従って、工数の
大幅削減となるので製造コストが下がる。(Effects of the Invention) As is clear from the above embodiments, the present invention (1) reduces the punching process and bonding process, resulting in a significant reduction in the number of man-hours, resulting in lower manufacturing costs.
(2)従来例に比較して打ち抜き金型の数が減り、従っ
て、型代の大幅削減となる。(2) The number of punching dies is reduced compared to the conventional example, resulting in a significant reduction in die costs.
(3)フレキシブル基板の折り返しを行なわないので、
折り返し部の湾曲がなく、従って、パネル表示部の浮き
上がりがないので耐水性、防塵性が向上し、外観も良好
になる。(3) Since the flexible circuit board is not folded back,
Since there is no curvature in the folded portion and therefore no lifting of the panel display portion, water resistance and dust resistance are improved, and the appearance is also good.
等の効果を奏するものである。It has the following effects.
第1図は、本発明の一実施例における、上部導体パター
ン形成定尺シートとパネル表示パターン形成定尺シート
を貼り合わせて上部貼着シートを作製する工程を示す図
、第2図は、上部導体パターンの一区画を示す図、第3
図は、パネル表示パターンの一区画を示す図、第4図は
、上部貼着シートの一区画を示す図、第5図は、下部導
体パターン形成定尺シートを示す図、第6図は、下部導
体パターンの一区画を示す図、第7図は、上部貼着シー
トと下部導体パターン形成定尺シートとを貼り合わせて
貼り合わせ体を作製する工程を示す図、第8図は、コネ
クタテールを作製する工程を示す図、第9図及び第10
図は、個々に分離されたパネルスイッチ部の端子部にコ
ネクタテールを接続する工程を示す図、第11図は、コ
ネクタテールの接続方法の詳細図、第12図及び第13
図は、従来例の製造方法を示す図である。
5・・・上部貼着シート、 5a・・・孔、 6a・
・定尺シート、 6b・・・上部導体パターン、6c・
・・シリコンゴム、 7a・・・定尺シート、7b・・
・パネル表示パターン、 7c・・・接着剤、8a・・
・定尺シート、 8b・・・下部導体パターン、 8c
・・・粘着絶縁層、 8e・・・孔、 9・・・パネル
スイッチ部、 9a・・・貼り合わせ体、11・・・コ
ネクタテール、15・・・異方導電性接着剤層。
特許出願人 松下電器産業株式会社
第2図
第3図
第4図
aL
第5図
第6図
第8図
第9図
第10図
第11図
第12図
第13図FIG. 1 is a diagram showing the process of producing an upper adhesive sheet by pasting together an upper conductor pattern-forming regular-length sheet and a panel display pattern-forming regular-length sheet in one embodiment of the present invention, and FIG. Diagram showing one section of the conductor pattern, 3rd
4 shows a section of the panel display pattern, FIG. 4 shows a section of the upper adhesive sheet, FIG. 5 shows a lower conductor pattern forming standard sheet, and FIG. 6 shows a section of the panel display pattern. FIG. 7 is a diagram showing a section of the lower conductor pattern, FIG. 7 is a diagram showing the process of laminating the upper adhesive sheet and the lower conductor pattern forming regular sheet to produce a bonded body, and FIG. 8 is a diagram showing the connector tail. Figures 9 and 10 showing the process of manufacturing
The figures show the process of connecting the connector tails to the terminals of the individually separated panel switch parts, Figure 11 is a detailed diagram of the connector tail connection method, Figures 12 and 13
The figure is a diagram showing a conventional manufacturing method. 5... Upper adhesive sheet, 5a... Hole, 6a.
・Standard size sheet, 6b...Top conductor pattern, 6c・
...Silicone rubber, 7a...Standard length sheet, 7b...
・Panel display pattern, 7c...adhesive, 8a...
・Standard size sheet, 8b...lower conductor pattern, 8c
... Adhesive insulating layer, 8e... Hole, 9... Panel switch portion, 9a... Bonded body, 11... Connector tail, 15... Anisotropic conductive adhesive layer. Patent applicant: Matsushita Electric Industrial Co., Ltd.Figure 2Figure 3Figure 4Figure 4aLFigure 5Figure 6Figure 8Figure 9Figure 10Figure 11Figure 12Figure 13
Claims (1)
配線導体からなる上部導体パターンを複数個配置、形成
し、次いで前記スイッチ接点及び配線導体の端子部を除
く部分に絶縁層を形成する工程と、 所定の大きさの第2の絶縁性シートにパネル表示パター
ンを複数個配置、形成し、次いでその裏面に接着剤層を
形成する工程と、 前記第1のシートと第2のシートとを貼り合わせて上部
貼着シートを作製し、次いで所要の部分に孔を打ち抜い
て端子部の外形を形成する工程と、所定の大きさの第3
の絶縁シートにスイッチ接点及び配線導体からなる下部
導体パターンを複数個配置、形成し、次いで前記スイッ
チ接点及び配線導体の端子部を除く部分に絶縁層を形成
し、さらに所要の部分に孔を打ち抜いて端子部の外形を
形成する工程と、 前記上部貼着シートと、下部導体パターンを形成した第
3のシートとをスイッチ接点が対向するように位置合わ
せして貼り合わせ、貼り合わせ体を作製する工程と、 前記貼り合わせ体から、一括して個々のパネルスイッチ
部を打ち抜き分離する工程と、 打ち抜き分離されたパネルスイッチ部における上部導体
パターンの端子部と下部導体パターンの端子部にコネク
タテールを接続する工程と、からなることを特徴とする
パネルスイッチの製造方法。[Claims] A plurality of upper conductor patterns each consisting of a switch contact and a wiring conductor are arranged and formed on a first insulating sheet of a predetermined size, and then a portion of the switch contact and the wiring conductor excluding the terminal portion is formed. a step of forming an insulating layer; a step of arranging and forming a plurality of panel display patterns on a second insulating sheet of a predetermined size, and then forming an adhesive layer on the back surface of the first sheet; A step of pasting the second sheet together to produce an upper adhesive sheet, then punching out holes in required areas to form the outer shape of the terminal portion, and a third sheet of a predetermined size.
Arrange and form a plurality of lower conductor patterns consisting of switch contacts and wiring conductors on an insulating sheet, then form an insulating layer on the parts other than the terminal parts of the switch contacts and wiring conductors, and further punch holes in required parts. forming the outer shape of the terminal portion; and producing a bonded body by aligning and bonding the upper adhesive sheet and the third sheet with the lower conductor pattern formed thereon so that the switch contacts face each other. a step of punching out and separating individual panel switch sections from the bonded body in a batch; and connecting a connector tail to a terminal section of an upper conductor pattern and a terminal section of a lower conductor pattern in the punched and separated panel switch section. A method for manufacturing a panel switch, comprising the steps of:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63063573A JP2681794B2 (en) | 1988-03-18 | 1988-03-18 | Panel switch manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63063573A JP2681794B2 (en) | 1988-03-18 | 1988-03-18 | Panel switch manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01239715A true JPH01239715A (en) | 1989-09-25 |
JP2681794B2 JP2681794B2 (en) | 1997-11-26 |
Family
ID=13233130
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63063573A Expired - Fee Related JP2681794B2 (en) | 1988-03-18 | 1988-03-18 | Panel switch manufacturing method |
Country Status (1)
Country | Link |
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JP (1) | JP2681794B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2017134961A (en) * | 2016-01-27 | 2017-08-03 | Fdk株式会社 | Laminate type power storage device, and method for mounting laminate type power storage device |
US10546700B2 (en) | 2016-01-20 | 2020-01-28 | Fdk Corporation | Laminate-type power storage element and method of implementing the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54142573A (en) * | 1978-04-27 | 1979-11-06 | Nikkan Ind | Method of producing key switch compound conductive sheet employing insulating plastic film |
JPS5678014A (en) * | 1979-11-30 | 1981-06-26 | Fujitsu Ltd | Method of manufacturing transparent switch |
JPS5691321A (en) * | 1979-12-26 | 1981-07-24 | Fujitsu Ltd | Method of manufacturing transparent switch |
-
1988
- 1988-03-18 JP JP63063573A patent/JP2681794B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54142573A (en) * | 1978-04-27 | 1979-11-06 | Nikkan Ind | Method of producing key switch compound conductive sheet employing insulating plastic film |
JPS5678014A (en) * | 1979-11-30 | 1981-06-26 | Fujitsu Ltd | Method of manufacturing transparent switch |
JPS5691321A (en) * | 1979-12-26 | 1981-07-24 | Fujitsu Ltd | Method of manufacturing transparent switch |
Also Published As
Publication number | Publication date |
---|---|
JP2681794B2 (en) | 1997-11-26 |
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