JPH01238133A - Multilayer structured probe card - Google Patents
Multilayer structured probe cardInfo
- Publication number
- JPH01238133A JPH01238133A JP63065476A JP6547688A JPH01238133A JP H01238133 A JPH01238133 A JP H01238133A JP 63065476 A JP63065476 A JP 63065476A JP 6547688 A JP6547688 A JP 6547688A JP H01238133 A JPH01238133 A JP H01238133A
- Authority
- JP
- Japan
- Prior art keywords
- probe card
- probes
- probe
- areas
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 42
- 239000008188 pellet Substances 0.000 abstract description 8
- 238000005259 measurement Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 9
- 239000002356 single layer Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプローバに関し、特にプローブカードの構造に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a prober, and particularly to the structure of a probe card.
従来のプローブカードは、単層構造となっており、同一
平面上にプローブを実装してペレットの測定を行ってい
る。Conventional probe cards have a single-layer structure and measure pellets by mounting probes on the same plane.
上述した従来のプローブカードは同一平面上にプローブ
を実装するため実装可能なプローブ本数に限界があり、
特に複数個のベレットを測定する場合に、プローブカー
ドの特定の場所にプローブが集中し、ブ、ローブの実装
が困難になるという欠点がある。The conventional probe card mentioned above has a limit to the number of probes that can be mounted because the probes are mounted on the same plane.
Particularly when measuring a plurality of pellets, the disadvantage is that the probes are concentrated in a specific location on the probe card, making it difficult to mount the probes.
本発明の目的は上記課題を解消した多層構造式プローブ
カードを提供することにある。An object of the present invention is to provide a multilayer probe card that solves the above problems.
（ｍａｌｌを解決するための手段〕
本発明の多層構造式プローブカードにおいては、プロー
ブカードの開口に、口径が異なる多段のプローブ固定エ
リアを備え、各段のエリアにそれぞれプローブを装着し
たものである。(Means for solving the problem of small problems) In the multilayer probe card of the present invention, the opening of the probe card is provided with multiple stages of probe fixing areas with different diameters, and a probe is attached to each stage area. .
以下、本発明の実施例を図により説明する。 Embodiments of the present invention will be described below with reference to the drawings.
（実施例１）
第１図（ａ）は本発明の多層構造式プローブカードを３
層構造とした場合の第１の実施例を示す平面図、第１図
（ｂ）は第１図（畠）のＡ−Ａ′線における断面図であ
る。(Example 1) Figure 1(a) shows a multilayer structure probe card of the present invention.
FIG. 1(b) is a plan view showing the first embodiment of the layered structure, and is a sectional view taken along the line AA' in FIG. 1 (Hata).
図において、１は３層構造を有するプローブカードであ
る。該プローブカード１は、外径が等しく、中心の開口
が上層、中間層、下層の順に口径を拡径した円形開口を
有する３枚の円板を積重ねて構成されている０本発明は
上記プローブカード１の各層の開口縁をプローブ固定エ
リアとして用いるものである。実施例の場合には上下方
向に３段のプローブ固定エリアが形成される。各段のエ
リアにそれぞれプローブ２，３．４を実装し、各段のプ
ローブ２，３．４をウェハー５上に設置されたＩＣチッ
プ６の端子に接続してその測定を行う。In the figure, reference numeral 1 indicates a probe card having a three-layer structure. The probe card 1 is constructed by stacking three disks having the same outer diameter and a circular opening in the center that increases in diameter in the order of the upper layer, the middle layer, and the lower layer. The opening edges of each layer of the card 1 are used as probe fixing areas. In the case of the embodiment, three stages of probe fixing areas are formed in the vertical direction. Probes 2, 3.4 are mounted in the area of each stage, and the probes 2, 3.4 of each stage are connected to the terminals of the IC chip 6 placed on the wafer 5 to perform measurement.
（実施例２）
第２図は本発明の多層構造式プローブカードを３層構造
とし、２個のベレットの同時測定に用いる第２の実施例
を示す平面図である。(Embodiment 2) FIG. 2 is a plan view showing a second embodiment of the multilayer probe card of the present invention, which has a three-layer structure and is used for simultaneous measurement of two pellets.
本実施例においては、プローブカード１に該ベレット７
．７の配置形状にあわせてこれを包含する形状の開口が
設けてあり、上層の開口の口径が小さく、中層、下層に
したがってその口径を拡径しである。これによって、３
層の積層の開口縁には３段のプローブ固定エリアが形成
され、各段のエリアにそれぞれプローブ２，３．４を実
装している。In this embodiment, the bellet 7 is attached to the probe card 1.
．． Openings are provided in a shape that matches and encompasses the arrangement shape of 7, and the diameter of the opening in the upper layer is small, and the diameter increases as the opening goes to the middle and lower layers. With this, 3
Three stages of probe fixing areas are formed at the edge of the opening of the laminated layer, and probes 2, 3.4 are mounted in each stage area, respectively.
本実施例では各段のプローブを用いて一挙に２個のベレ
ット７ａ、 ７ｂの測定を同時に行う。In this embodiment, two pellets 7a and 7b are measured simultaneously using probes at each stage.
以上説明したように本発明によれば、実装可能なプロー
ブの本数を増し、多ビンＩＣや複数のベレット及び特殊
形状ベレット等に対応でき、ひいては正確な測定を行う
ことができる効果を有する。As explained above, according to the present invention, the number of probes that can be mounted is increased, it is possible to cope with multi-bin ICs, a plurality of pellets, pellets of special shapes, etc., and it is possible to perform accurate measurements.
第１図偽）は本発明の第１の実施例を示す平面図、第１
図（ｂ）は第１図（ａ）のＡ−Ａ’線断面図、第２図は
本発明の第２の実施例を示す平面図である。
１・・・プローブカード ２，３．４・・・プローブ
５・・・ウェハー ６・・・ＩＣチップ７ａ
、 ７ｂ・・・ベレット
特許出願人 九州日本電気株式会社
２フｂ−フ゛
第１図Figure 1 (false) is a plan view showing the first embodiment of the present invention;
Figure (b) is a sectional view taken along the line AA' in Figure 1 (a), and Figure 2 is a plan view showing a second embodiment of the present invention. 1... Probe card 2, 3.4... Probe 5... Wafer 6... IC chip 7a
, 7b...Berrett Patent Applicant Kyushu NEC Co., Ltd. 2F-B Figure 1
Claims (1)
ーブ固定エリアを備え、各段のエリアにそれぞれプロー
ブを装着したことを特徴とする多層構造式プローブカー
ド。1. A multi-layered probe card characterized in that the opening of the probe card has multiple stages of probe fixing areas with different diameters, and a probe is attached to each stage area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63065476A JPH01238133A (en) | 1988-03-18 | 1988-03-18 | Multilayer structured probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63065476A JPH01238133A (en) | 1988-03-18 | 1988-03-18 | Multilayer structured probe card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01238133A true JPH01238133A (en) | 1989-09-22 |
Family
ID=13288194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63065476A Pending JPH01238133A (en) | 1988-03-18 | 1988-03-18 | Multilayer structured probe card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01238133A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0955410A (en) * | 1995-08-16 | 1997-02-25 | Nec Corp | Probe card |
| US10274516B2 (en) * | 2017-05-03 | 2019-04-30 | Global Unichip Corporation | Probe card system, probe loader device and manufacturing method of the probe loader device |
-
1988
- 1988-03-18 JP JP63065476A patent/JPH01238133A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0955410A (en) * | 1995-08-16 | 1997-02-25 | Nec Corp | Probe card |
| US10274516B2 (en) * | 2017-05-03 | 2019-04-30 | Global Unichip Corporation | Probe card system, probe loader device and manufacturing method of the probe loader device |
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