JPH0122881B2 - - Google Patents

Info

Publication number
JPH0122881B2
JPH0122881B2 JP16846680A JP16846680A JPH0122881B2 JP H0122881 B2 JPH0122881 B2 JP H0122881B2 JP 16846680 A JP16846680 A JP 16846680A JP 16846680 A JP16846680 A JP 16846680A JP H0122881 B2 JPH0122881 B2 JP H0122881B2
Authority
JP
Japan
Prior art keywords
measured
electrode
counter electrode
potential
area ratio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16846680A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5793203A (en
Inventor
Yoshibumi Iwata
Michihiro Yoshioka
Katsumi Kosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP16846680A priority Critical patent/JPS5793203A/ja
Publication of JPS5793203A publication Critical patent/JPS5793203A/ja
Publication of JPH0122881B2 publication Critical patent/JPH0122881B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/32—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
JP16846680A 1980-11-29 1980-11-29 Measuring method for ratio between front and back surface areas of flat-board-shaped solid substance Granted JPS5793203A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16846680A JPS5793203A (en) 1980-11-29 1980-11-29 Measuring method for ratio between front and back surface areas of flat-board-shaped solid substance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16846680A JPS5793203A (en) 1980-11-29 1980-11-29 Measuring method for ratio between front and back surface areas of flat-board-shaped solid substance

Publications (2)

Publication Number Publication Date
JPS5793203A JPS5793203A (en) 1982-06-10
JPH0122881B2 true JPH0122881B2 (https=) 1989-04-28

Family

ID=15868626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16846680A Granted JPS5793203A (en) 1980-11-29 1980-11-29 Measuring method for ratio between front and back surface areas of flat-board-shaped solid substance

Country Status (1)

Country Link
JP (1) JPS5793203A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105057608B (zh) * 2015-09-11 2017-10-10 重庆大学 一种用于重力铸造合金临界凝固系数检测的装置和方法

Also Published As

Publication number Publication date
JPS5793203A (en) 1982-06-10

Similar Documents

Publication Publication Date Title
US4132605A (en) Method for evaluating the quality of electroplating baths
US6808611B2 (en) Methods in electroanalytical techniques to analyze organic components in plating baths
EP1203950B1 (en) Plating bath analysis
US4479852A (en) Method for determination of concentration of organic additive in plating bath
US6572753B2 (en) Method for analysis of three organic additives in an acid copper plating bath
US6645364B2 (en) Electroplating bath control
US8535504B2 (en) Analysis of an auxiliary leveler additive in an acid copper plating bath
CN100412541C (zh) 用于电镀液伏安分析的参考电极校准方法
US4310389A (en) Method for simultaneous determination of thickness and electrochemical potential in multilayer plated deposits
US7186326B2 (en) Efficient analysis of organic additives in an acid copper plating bath
US3925168A (en) Method of monitoring the active roughening agent in a copper plating bath
Huang et al. Corrosion behavior of immersion silver printed circuit board copper under a thin electrolyte layer
JP3223829B2 (ja) 電気ニッケルめっき浴又は電気ニッケル合金めっき浴及びそれを用いためっき方法
US6709568B2 (en) Method for determining concentrations of additives in acid copper electrochemical deposition baths
EP1471348A1 (en) Electrochemical method for determining a quantity of an organic component in an electroplating bath
Lambert et al. Analysis of films on copper by coulometric reduction
US7384535B2 (en) Bath analysis
JPH0122881B2 (https=)
GB2054865A (en) Process for the rapid determination of the resistance of corrosion of an electrophoretic coating, and apparatus for its accomplishment
JP4385824B2 (ja) 電気銅めっき液の分析方法及び分析装置
CN114740070A (zh) 一种检测酸性镀铜液中的铜离子浓度的方法
JP3063448B2 (ja) 限界電流密度測定用試料電極および測定方法
WO2013035780A1 (ja) めっき電流密度分布測定装置およびめっき電流密度分布の測定方法
JP2025112331A (ja) 銅めっき液のレベラー濃度測定方法
JP2006241566A (ja) めっき液の建浴方法と銅めっき装置