JPH01226103A - Surge absorber - Google Patents
Surge absorberInfo
- Publication number
- JPH01226103A JPH01226103A JP63052811A JP5281188A JPH01226103A JP H01226103 A JPH01226103 A JP H01226103A JP 63052811 A JP63052811 A JP 63052811A JP 5281188 A JP5281188 A JP 5281188A JP H01226103 A JPH01226103 A JP H01226103A
- Authority
- JP
- Japan
- Prior art keywords
- conductive adhesive
- surge absorber
- curing
- electrode plate
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006096 absorbing agent Substances 0.000 title claims description 16
- 239000000853 adhesive Substances 0.000 claims abstract description 18
- 230000001070 adhesive effect Effects 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 abstract description 10
- 229920005989 resin Polymers 0.000 abstract description 10
- 238000007747 plating Methods 0.000 abstract description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000004904 shortening Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、半導体素子および電子機器を静電気放電、開
閉サージ電圧、雷サージ電圧などの異常高電圧から保護
するためのサージ吸収器に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a surge absorber for protecting semiconductor devices and electronic equipment from abnormal high voltages such as electrostatic discharge, switching surge voltage, and lightning surge voltage.
従来の技術 近年、電子機器の多機能化に伴い、家電機器。Conventional technology In recent years, as electronic devices have become more multifunctional, home appliances.
情報通信機器、産業機器分野などにおいて電子化が推進
されている。この電子化に用いられるＩＣ（集積回路）
などは優れた機能をもつ反面、雷サージ電圧などのパル
ス状異常電圧に対して極めて敏感であり、そのため電子
機器の誤動作を招いたり、または破壊に至る場合も少な
くない。そのため、″ｉｌＹ子機器の信頼性確保の観点
からも、これら半導体素子のサージ電圧対策は極めて重
要である。Computerization is being promoted in the fields of information communication equipment and industrial equipment. IC (integrated circuit) used for this computerization
Although they have excellent functions, they are extremely sensitive to pulse-like abnormal voltages such as lightning surge voltages, which often lead to malfunction or destruction of electronic equipment. Therefore, from the viewpoint of ensuring the reliability of the ``ILY child devices, measures against surge voltages of these semiconductor elements are extremely important.
従来、この種のサージ吸収器は第２図に示すような構成
であった。同図において、１は板状のバリスタで、一般
に酸化亜鉛またはチタン酸ストロンチウムなどを主原料
とするセラミックスである。Conventionally, this type of surge absorber has had a configuration as shown in FIG. In the figure, numeral 1 denotes a plate-shaped varistor, which is generally made of ceramic whose main raw material is zinc oxide or strontium titanate.
２ａ、２ｂは、バリスタ１の表裏に対向する位置に銀ペ
ーストの焼付けなどによって形成された対向電極である
。ｓａ、ｓｂは対向電極２２Ｌ、２ｂと、電極板４１Ｌ
、４ｂとを、それぞれ電気的９機械的に接続するための
導電性接着剤で、通常、銀粉を含んだエポキシなどが用
いられる。ここで、電極板４＆、４ｂは外部配線との半
田付性を確保するために、全面に厚さ５ないし２０μｍ
の半田メッキが施されている。６は電極板４ａ、４ｂの
外部端子となる部分を除いてバリスタ１をモールドした
樹脂部である。2a and 2b are opposing electrodes formed at opposing positions on the front and back sides of the varistor 1 by baking silver paste or the like. sa and sb are the counter electrodes 22L and 2b and the electrode plate 41L
, 4b, respectively, is a conductive adhesive for electrically and mechanically connecting them, and epoxy containing silver powder is usually used. Here, the electrode plates 4&, 4b have a thickness of 5 to 20 μm over the entire surface in order to ensure solderability with external wiring.
solder plating is applied. Reference numeral 6 denotes a resin portion in which the varistor 1 is molded except for the portions of the electrode plates 4a and 4b that will become external terminals.
以上のように形成されたサージ吸収器について、その動
作を説明する。The operation of the surge absorber formed as described above will be explained.
第２図に示されたサージ吸収器は、通常、サージ電圧が
侵入または発生する信号線や電源線の線間に接続され、
その非オーム特性により、サージ電圧の吸収抑制に用い
られる。このサージ吸収器の接続は、電極板４＆、４ｂ
の外部端子をプリント基板の配線上に面実装半田付けす
ることによって行われる。また、サージ電圧吸収時のサ
ージ電流流入経路は、電極板４２Ｌ−導電性接着剤３ａ
→対向電極２ａ−バリスタ１一対向電極２ｂ→導電性接
着剤３ｂ−電極板４ｂ、または、この逆経路である。The surge absorber shown in Figure 2 is usually connected between signal lines and power lines where surge voltage enters or occurs.
Due to its non-ohmic characteristics, it is used to suppress the absorption of surge voltages. The connections of this surge absorber are electrode plates 4&, 4b
This is done by surface-mounting soldering of the external terminals on the wiring of the printed circuit board. In addition, the surge current inflow path when absorbing surge voltage is from electrode plate 42L to conductive adhesive 3a.
-> counter electrode 2a - varistor 1 - counter electrode 2b -> conductive adhesive 3b - electrode plate 4b, or this reverse path.
発明が解決しようとする課題
以上のような従来のサージ吸収器は、その構成上、下記
のような問題点を有している。すなわち、導電性接着剤
およびモールド樹脂の硬化を行う場合、半田の共晶点温
度（１８３°Ｃ）以上の温度にすると、電極板の半田メ
ッキ膜が溶ける。したがって、前記導電性接着剤および
モールド樹脂の硬化は半田の共晶点温度未満で実施しな
ければならず、高温硬化による硬化時間短縮、生産性向
上を阻害する要因となっていた。Problems to be Solved by the Invention The conventional surge absorber described above has the following problems due to its configuration. That is, when curing the conductive adhesive and molding resin, if the temperature is higher than the eutectic temperature of the solder (183° C.), the solder plating film on the electrode plate will melt. Therefore, the conductive adhesive and the molding resin must be cured at a temperature below the eutectic point temperature of the solder, which is a factor that hinders shortening of curing time and improvement of productivity due to high temperature curing.
本発明はこのような問題点を解決するもので、導電性接
着剤およびモールド樹脂の高温硬化を可能とするサージ
吸収器を提供することを目的とするものである。The present invention is intended to solve these problems, and aims to provide a surge absorber that enables high-temperature curing of conductive adhesives and mold resins.
課題を解決するための手段
以上のような課題を解決するために本発明のサージ吸収
器は、表裏に電極を有したバリスタに導電性接着剤で接
続される電極板をＳｎメッキ電極板としたものである。Means for Solving the Problems In order to solve the above-mentioned problems, the surge absorber of the present invention uses a Sn-plated electrode plate as the electrode plate connected to the varistor having electrodes on the front and back sides with a conductive adhesive. It is something.
作用
この構成により、導電性接着剤およびモールド樹脂の硬
化温度を約２３０°Ｃまで高温化でき、硬化時間が短縮
し、生産性が大幅に向上することとなる。Function: With this configuration, the curing temperature of the conductive adhesive and mold resin can be increased to about 230° C., thereby shortening the curing time and greatly improving productivity.
実施例 本発明の一実施例を第１図に基づいて説明する。Example An embodiment of the present invention will be described based on FIG.
同図は本発明によるサージ吸収器の断面図である。This figure is a sectional view of a surge absorber according to the present invention.
図において、６は酸化亜鉛などを主原料とする板状のバ
リスタ、７＆、７ｂはバリスタ６の表裏に設けられた対
向電極、ｓａ、ｓｂは対向電極７１Ｌ。In the figure, 6 is a plate-shaped varistor whose main material is zinc oxide or the like, 7&, 7b are counter electrodes provided on the front and back of the varistor 6, and sa and sb are counter electrodes 71L.
了すと電極板９１Ｌ 、９ｂを接続する導電性接着剤、
１０＆、１０ｂは電極板９ａ、９ｂ上にＳｎメッキを施
したメッキ部、１１は電極板９１！Ｌ、９ｂの外部端子
部を残してバリスタ６を樹脂モールドしたモールド部で
ある。When completed, conductive adhesive connects the electrode plates 91L and 9b,
10&, 10b are plated parts where Sn plating is applied on the electrode plates 9a and 9b, and 11 is an electrode plate 91! This is a molded part in which the varistor 6 is molded with resin, leaving the external terminal parts L and 9b.
つぎに、以上のように構成されたサージ吸収器の動作を
説明する。Next, the operation of the surge absorber configured as above will be explained.
サージ吸収器としての信号線あるいは電源線などへの接
続方法、ならびにサージ電圧抑制の作用は、第２図の従
来例と同じである。The method of connection to a signal line or power line as a surge absorber, and the effect of suppressing surge voltage are the same as in the conventional example shown in FIG.
このサージ吸収器の導電性接着剤の硬化温度を１８０°
Ｃから２２０’Ｃにすることにより約１／１゜の硬化時
間に短縮される。また、モールド樹脂の硬化温度を１７
０’Ｃから１９０℃にすることにより、約１／２の硬化
時間に短縮される。The curing temperature of the conductive adhesive of this surge absorber is set to 180°.
By increasing the temperature from C to 220'C, the curing time is reduced to about 1/1 degree. In addition, the curing temperature of the mold resin was set to 17
By increasing the temperature from 0'C to 190C, the curing time is reduced to about 1/2.
発明の効果
本発明によれば、表裏に電極を有したバリスタに導電性
接着剤で接続される電極板をＳｎメッキ電極板にするこ
とによって、導電性接着剤およびモールド樹脂の硬化温
度を約２３０°Ｃまで高温化でき、作業時間短縮による
生産性向上という効果が得られる。Effects of the Invention According to the present invention, by using a Sn-plated electrode plate as the electrode plate connected to the varistor having electrodes on the front and back sides with a conductive adhesive, the curing temperature of the conductive adhesive and mold resin can be lowered to about 230°C. The temperature can be raised up to °C, resulting in improved productivity by shortening working time.
第１図は本発明の一実施例によるサージ吸収器を示す断
面図、第２図は従来のサージ吸収器を示す断面図である
。
６・・・・・・バリスタ、７＆、７ｂ・・・・・・対向
電極、８ａ。
８ｂ・・・・・・導電性接着剤、９＆、９ｂ・・・・・
・電極板、１０１Ｌ、１０ｂ・・・・・・Ｓｎメッキ部
、１１・・・・・・モールド部。FIG. 1 is a sectional view showing a surge absorber according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional surge absorber. 6...Varistor, 7&, 7b...Counter electrode, 8a. 8b... Conductive adhesive, 9&, 9b...
- Electrode plate, 101L, 10b...Sn plating part, 11...Mold part.
Claims (1)
れる電極板をＳｎメッキ電極板としたことを特徴とする
サージ吸収器。A surge absorber characterized in that an electrode plate connected with a conductive adhesive to a varistor having electrodes on the front and back sides is a Sn-plated electrode plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63052811A JPH01226103A (en) | 1988-03-07 | 1988-03-07 | Surge absorber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63052811A JPH01226103A (en) | 1988-03-07 | 1988-03-07 | Surge absorber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01226103A true JPH01226103A (en) | 1989-09-08 |
Family
ID=12925230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63052811A Pending JPH01226103A (en) | 1988-03-07 | 1988-03-07 | Surge absorber |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01226103A (en) |
-
1988
- 1988-03-07 JP JP63052811A patent/JPH01226103A/en active Pending
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