JPH01225144A - Lead processing machine - Google Patents

Abstract

PURPOSE:Not to deteriorate the quality of a product by providing a resin burr removing punch made of hard rubber having an end of width wider than the interval of leads of an IC to be processed. CONSTITUTION:A resin burr removing punch 6 made of hard rubber such as urethane rubber having an end face of wider width than the interval D of leads 7 of an IC 8 to be processed to be elevationally movable and inclined is provided at recesses formed on the side face and bottom of an upper block 1 as guides oppositely between the leads 7 positioned on a lower block 10. Since residual resin burr pieces 9 adhered between the leads 7 of the IC to be processed can be forcibly removed by the punch 6 before a bending roller 3 moves down, it can prevent the pieces 9 from being press-bonded to the leads 7. Thus, it can prevent the plated faces of the leads 7 from damaging and plating from peeling off.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead processing machine used for bending the leads of a resin-sealed dual in-line IC (hereinafter referred to as DIP IC).

[Conventional technology]

A conventional lead processing machine of this kind, as shown in the cross-sectional view of FIG. The lead 7 of the IC 8 to be processed is positioned in the lower block 10, and the lead 7 of the IC 8 to be processed is held between the lower block 10 by lowering the upper block 1, and then the bending roller 3 is lowered. It was bent.

[Means for solving problems]

In this case, as shown in FIG. 9, the resin-sealed workpiece I
Before the step of bending the leads 7 in C8, as shown in FIG. 10, there is a step of removing the resin burrs 12 between the leads 7 with a resin burr removing punch, and as shown in FIG. 11, the tie bars 13 are cut off. There is a process of cutting with a punch. This resin burr removal punch is used to remove resin burrs 12 as shown in FIG.
In order to avoid contact with the leads 7 and package 8 when removing the lead 7 and the package 8, there is a
It is made to have a clearance of about 1mlff1. Therefore, as shown in FIG. 11, residual resin burr 9 remains attached to the lead 7 only in the clearance portion, which is not removed by the resin burr punch.

Also, in the step of cutting the tie bar 13, the twelfth
As shown in the figure, the tie bar cutting punch is made to have a clearance of about 0.61mm between the lead 7 and the lead 7 to avoid contact with the lead 7, so that the tie bar cutting punch does not adhere to the lead 7 after the resin deburring process. The resin burr residue 9 remains as it is. When the IP IC is subjected to lead bending processing using a conventional lead processing machine shown in FIG.
As the bending progresses, the lead 7 separates from the lead 7, and even after the lead 7 is bent, it remains connected to the package 8 side and tries to take on a convex shape, but it breaks due to contact with the bending roller 3 that is descending at the same time. It is separated from the package 8. A portion of the broken and separated resin burr residue 9 adheres to the surface of the lead 70 or to the outer periphery of the bending roller 3. When the bending roller 3 rises while rolling on the surface of the lead 7, the resin burr residue 9 may be pressed against the surface of the lead 7, damage the plating surface of the lead 7, or damage the plating surface of the lead 7. To solve the above problem, the lead processing machine according to the present invention improves the quality of the product by peeling off the IC to be processed, which is positioned on the lower block. A resin burr removal punch made of hard rubber such as urethane rubber that can move up and down using the recesses provided on the side and bottom of the upper block facing between the leads as a guide, and has a tip surface wider than the sloping lead spacing. have.

〔Example〕

Next, the present invention will be explained by examples.

Figure 1 shows an IC to be processed in a lead processing machine according to an embodiment of the present invention.
FIG. 2 is a side view of FIG. 1 with the bending roller section omitted. In FIGS. 1 and 2, a resin burr removing punch 6 made of hard rubber such as urethane rubber is incorporated into the upper block 1. The punch 6 is pressed downward by the spring 5. Further, the tip of the punch 6 is located at a position where the tip of the punch 6 is inserted between adjacent leads at the base of the lead 7 from the resin package of the IC 8 to be processed, and is 0.5 m from the bottom surface of the upper block 1.
It protrudes by about m. Moreover, the width C is the IC8 to be processed.
It is about 0.2 inch wider than the lead spacing of
It is tilted at an angle of 0°.

When the resin burr removal punch 6 descends together with the upper block l and thrusts between the leads at the base of the leads 7 of the IC 8 to be processed, which are drawn out from the package, as shown in the cross-sectional view of FIG.
A bending moment acts on the resin burr residue 9 adhering to the IC lead 7, and a crack is generated between the resin burr residue 9 and the lead 7. Further, as shown in the sectional view of FIG. 4, a similar bending moment acts at the boundary between the sandwiched portions of the resin burr remnants 9 that are sandwiched between the punch 6 and the lower block 10, causing cracks. Furthermore, when the punch 6 descends, the punch 6 is elastically deformed at the surface in contact with the lead 7, as shown in the cross-sectional view of FIG. Due to cracks between the resin burr remaining piece 9 and the lead 7 and cracks at the boundary where the resin burr remaining piece 9 is held between the punch 6 and the lower block 10, the punch 6 is in contact with the remaining piece 9 other than the sandwiched part. The tip surface of the lead 7 is not elastically deformed, and a shearing force is generated at each crack portion, and the remaining piece 9 is separated from the lead 7 and from the remaining piece 9 of the clamping portion. After that, the spring 5 contracts and the punch 6 does not descend any further, but the upper block 1 descends further, and the punch 6
As shown in the sectional view, the lead 7 is held between the lower block 10 and then the bending roller 3 is lowered to bend the lead 7. Until the bending roller 10 is raised, the resin burr residue 9 remains sandwiched between the punch 6 and the lower block 10, so that the quality is not adversely affected.

FIG. 7 is a sectional view showing a state in which a processed IC is set in another embodiment of the present invention, and FIG. 18 is a side view of the embodiment shown in FIG. 7, with the bending roller section omitted. In FIGS. 7 and 8, when this example is compared with the embodiment shown in FIG. 1, it is found that in FIG. On the other hand, in this example, the ceiling part of the resin burr removal punch 16 is connected to the upper block 1.
The difference is that the upper block 11 and the resin burr removal punch 16 are combined so as to overlap on the ceiling of the embodiment 1, and the shape of the tip of the punch is the same in both embodiments.

This embodiment is effective when the package width of the DIP IC to be processed is narrow and it is not possible to incorporate an overload prevention spring inside the upper block to prevent the leads 7 from being deformed.

〔Effect of the invention〕

As explained above, according to the lead processing machine of the present invention, the resin burr residue adhering between the leads of the DIPIC to be processed can be forcibly removed by the resin burr removal punch before the bending roller descends. This has the effect of preventing resin burr residue from being crimped onto the lead, and preventing scratches on the plated surface of the lead and peeling of the plate.

[Brief explanation of the drawing]

Fig. 1 is a sectional view showing a state in which a processed IC is set in an embodiment of the present invention, Fig. 2 is a side view of Fig. 1, and Figs. 3 to 6 are resins according to the embodiment of Fig. 1. 7 is a sectional view showing the second embodiment of the present invention and an IC to be processed; FIG. 8 is a side view of FIG. 7; FIG.
The figure is a cross-sectional view showing a conventional lead processing machine and an IC to be processed, and FIGS. 10 to 12 are cross-sectional views for explaining resin burr removal in the conventional lead processing machine. 1.11...Upper block, 2.Old...Bending roller support block, 3...Bending roller, 4,5.
Old... Suffling, 6.16... Resin burr removal punch, 7... Lead of IC to be processed, 8...
... Processed IC (or package), 9...
・Resin burr remains, 10・Old...lower block, 12...
...Resin burr, 13...Tie bar. Agent Patent Attorney Oto Uchihara

Claims (1)

[Claims] In a lead processing machine that holds the leads of an IC to be processed between a lower block and an upper block and bends the leads of the IC using a bending roller, the lead processing machine is made of hard rubber and has a tip portion wider than the interval between the leads of the IC. A lead processing machine characterized by being equipped with a resin burr removal punch.