JPH01222503A - Oscillation circuit - Google Patents
Oscillation circuitInfo
- Publication number
- JPH01222503A JPH01222503A JP4759588A JP4759588A JPH01222503A JP H01222503 A JPH01222503 A JP H01222503A JP 4759588 A JP4759588 A JP 4759588A JP 4759588 A JP4759588 A JP 4759588A JP H01222503 A JPH01222503 A JP H01222503A
- Authority
- JP
- Japan
- Prior art keywords
- varactor diode
- humidity
- change
- copper foils
- stray capacitance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000010355 oscillation Effects 0.000 title claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 20
- 239000011889 copper foil Substances 0.000 abstract description 20
- 238000010586 diagram Methods 0.000 description 9
- 239000003990 capacitor Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はテレビ信号受信を行う電子チューナの発振回路
の関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an oscillation circuit for an electronic tuner that receives television signals.
（従来の技術）
近年電子チューナは面実装部品の利用拡大で小型化が進
むとともに組立作業が簡易化されている。(Prior Art) In recent years, electronic tuners have become smaller due to the increased use of surface-mounted components, and assembly work has become simpler.
従来のＵＨＦ発振回路の共振線路を同調容量となる可変
容量ダイオード（以下、バラクタダイオードという）の
接続方法は、第６図及び第７図に示すようになっていた
。A method of connecting a variable capacitance diode (hereinafter referred to as a varactor diode) serving as a tuning capacitor to a resonant line of a conventional UHF oscillation circuit is as shown in FIGS. 6 and 7.
第６図において、１１はバラクタダイオード、１２は高
域補正用容量素子、１４は共振線路、１５はプリント基
板である。また、第７図において、２１はバラクタダイ
オード、２２は高域補正用容量素子、２３はバラクタダ
イオード結線用銅箔、２４は共振線路、２５はプリント
基板である。In FIG. 6, 11 is a varactor diode, 12 is a capacitive element for high frequency correction, 14 is a resonant line, and 15 is a printed circuit board. Further, in FIG. 7, 21 is a varactor diode, 22 is a capacitive element for high frequency correction, 23 is a copper foil for connecting the varactor diode, 24 is a resonant line, and 25 is a printed circuit board.
第６図ではバラクタダイオード１１の接続は立体的に構
成されていた。また第７図では、バラクタダイオード２
１を他の面実装部品（例えば高域補正用容量素子２２）
と同じ方法でプリント基板２５に装置し、共振線路２４
との接続点はプリント基板２５に印刷された銅箔２３ａ
、２３ｂを介して行うものである。In FIG. 6, the connections of the varactor diodes 11 are three-dimensionally configured. Also, in Fig. 7, varactor diode 2
1 to another surface-mounted component (for example, capacitive element 22 for high frequency correction)
The resonant line 24 is mounted on the printed circuit board 25 in the same manner as
The connection point is the copper foil 23a printed on the printed circuit board 25.
, 23b.
このような構成において、共振線路２４と接続されたバ
ラクタダイオードのカソード側結線用銅箔２３ａと、接
地されたバラクタダイオードのアノード側結線用銅箔２
３ｂの間に浮遊容量が発生する。In such a configuration, the copper foil 23a for connecting the cathode side of the varactor diode connected to the resonant line 24, and the copper foil 23a for connecting the anode side of the grounded varactor diode.
Stray capacitance occurs between 3b and 3b.
（発明が解決しようとする課題）
しかしながら、上記従来の第６図に示す接続方法では、
共振線路とバラクタダイオードの取付作業は１面実装部
品の利用で簡素化された組立てを阻害する問題があった
。また第７図の接続方法は、上記の如く浮遊容量が発生
し、メツ遊容量が湿度で変化し発振周波数を変化させ電
子チューナの受信安定性を劣化させる問題があった。浮
遊容量の湿度変化を抑える手段として、プリント基板の
基材を積層基板からアルミナ基材に変更することが可能
であるが、価格的に高価で実用上の大きな障害となる問
題があった。(Problems to be Solved by the Invention) However, in the conventional connection method shown in FIG.
The installation work of the resonant line and the varactor diode has the problem of hindering the simplified assembly due to the use of single-sided mounting components. Furthermore, the connection method shown in FIG. 7 has the problem that stray capacitance is generated as described above, and the stray capacitance changes with humidity, which changes the oscillation frequency and deteriorates the reception stability of the electronic tuner. As a means of suppressing humidity changes in stray capacitance, it is possible to change the base material of the printed circuit board from a laminated board to an alumina base material, but this has the problem of being expensive and a major hindrance in practical use.
本発明はこのような従来の問題を解決するものであり、
組み立て作業を簡単にするとともに湿度変化に対して安
定な動作を可能にする発振回路を提供することを目的と
するものである。The present invention solves these conventional problems,
It is an object of the present invention to provide an oscillation circuit that simplifies assembly work and enables stable operation against changes in humidity.
（課題を解決するための手段）
本発明は上記目的を達成するために、バラクタダイオー
ドを並列に接続される高域補正用容量素子の上に該バラ
クタダイオードを重ねて配置したものである。(Means for Solving the Problems) In order to achieve the above object, the present invention includes a varactor diode stacked on a high-frequency correction capacitor element connected in parallel.
（作 用）
本発明の上記のような構成により、バラクタダイオード
の両端子が接続される銅箔面積が縮少され、該銅箔間で
生じる浮遊容量が減少する。該浮遊容量は湿度変化で一
定率の変動を生じる性質があり、初期容量が少ない程湿
度による変化量が減少するため周波数変化幅を抑えるこ
とができる。(Function) With the above configuration of the present invention, the area of the copper foil to which both terminals of the varactor diode are connected is reduced, and the stray capacitance generated between the copper foils is reduced. The stray capacitance has a property of causing fluctuations at a constant rate due to changes in humidity, and the smaller the initial capacitance, the less the amount of change due to humidity, so the width of frequency change can be suppressed.
（実施例）
第１図は本発明の一実施例を示す局部発振回路の組立図
である。第１図において、１はバラクタダイオード、２
は高域補正用容量素子、３ａはバラクタダイオードのカ
ソード側結線用銅箔、３ｂはバラクタダイオードのアノ
ード側結線用銅箔、４は共振線路、５はプリント基板で
あり、バラクタダイオード１を高域補正用容量素子２の
上に重ねて配置し、バラクタダイオード結線用銅箔３
ａ ＋３ｂに一諸に接続するものである。(Embodiment) FIG. 1 is an assembly diagram of a local oscillation circuit showing an embodiment of the present invention. In Figure 1, 1 is a varactor diode, 2
is a capacitive element for high frequency correction, 3a is a copper foil for connecting the cathode side of the varactor diode, 3b is a copper foil for connecting the anode side of the varactor diode, 4 is a resonant line, and 5 is a printed circuit board. Copper foil 3 for varactor diode connection is placed over the correction capacitor 2.
It is connected to a +3b all together.
第２図はプリント基板の平面上に対向に配置された銅箔
間で構成される容量の湿度変化に対する容量変化率を示
した図である。FIG. 2 is a diagram showing the rate of change in capacitance with respect to changes in humidity of the capacitance formed between copper foils placed oppositely on the plane of the printed circuit board.
第３図は８９４ＭＴＩｚの局部発振周波数の湿度に対す
る変化特性を示した図であり、Ａは従来の特性でＢは本
発明の一実施例の特性である。第４図は局部発振回路の
結線図であるが、バラクタダイオードのカソード及びア
ノード側の結線用銅箔間にプリント基板を介して浮遊容
量が発生し、第５図のような等価回路で表される。第４
図及び第５図において、ｌ、２．４は第１図の１．２．
４と同一であり、６は浮遊容量である。FIG. 3 is a diagram showing the change characteristics of the local oscillation frequency of 894MTIz with respect to humidity, where A is a conventional characteristic and B is a characteristic of an embodiment of the present invention. Figure 4 is a wiring diagram of a local oscillation circuit. Stray capacitance is generated between the cathode of the varactor diode and the copper foil for connection on the anode side via the printed circuit board, and it is expressed as an equivalent circuit as shown in Figure 5. Ru. Fourth
In the figure and FIG. 5, l, 2.4 is 1.2 in FIG.
4, and 6 is the stray capacitance.
発振周波数変動の湿度変化による要因は、バラクタダイ
オード端子間容量の湿度特性と、バラクタダイオードと
並列に構成される銅箔間容量の湿度特性の両特性が主要
因である。本発明は銅箔間の容量を第１図の配置及び接
続により、銅箔対向幅を従来（第７図）の５０％に削減
でき、したがって容量変化量も５０％に低減が図られ周
波数変化量の改善が得られる。本発明の実施例によれば
、第３図に示す如＜８９４Ｍ１（ｚの局部発振周波数の
湿度に対する変化特性が、従来のＡから本発明のＢに改
善される。The main causes of the oscillation frequency fluctuation due to humidity changes are both the humidity characteristics of the capacitance between the varactor diode terminals and the humidity characteristics of the capacitance between the copper foils configured in parallel with the varactor diode. In the present invention, the capacitance between copper foils can be reduced by 50% of the width of the copper foils facing each other by 50% of the conventional width (FIG. 7) by arranging and connecting the copper foils as shown in FIG. Improvement in quantity can be obtained. According to the embodiment of the present invention, the change characteristic of the local oscillation frequency of <894M1(z) with respect to humidity is improved from the conventional A to the B of the present invention as shown in FIG.
（発明の効果）
本発明は上記実施例より明らかなように、バラクタダイ
オードに並列に接続される高域補正用容量素子の上に該
バラクタダイオードを重ねて配置することにより、プリ
ント基板に構成される銅箔対向面積が削減され局部発振
周波数の湿度に対する変化量を減少させることができる
。(Effects of the Invention) As is clear from the above embodiments, the present invention is constructed on a printed circuit board by arranging a varactor diode overlappingly on a high-frequency correction capacitor element connected in parallel with the varactor diode. The area facing the copper foil can be reduced, and the amount of change in local oscillation frequency with respect to humidity can be reduced.
第１図は本発明の一実施例による局部発振回路の組立図
、第２図はプリント基板上に対向する銅箔間容量の湿度
に対する変化率を示すグラフ、第３図は局部発振周波数
の湿度に対する変化量を示すグラフ、第４図は局部発振
回路の結線図、第５図は第４図の等価回路、第６図は従
来例の局部発振回路の組立図、第７図は同じく他の従来
例の局部発振回路の組立図である。
１．１１．２１・・・バラクタダイオード、２，１２゜
２２・・・高域補正用容量素子、３ａ、２３ａ・・・バ
ラクタダイオードのカソード側結線用鋼箔、３ｂ、２３
ｂ・・・バラクタダイオードのアノード側結線用鋼箔、
４，１４．２４・・・共振線路、 ５，１５．２５・・
・プリント基板、６・・・浮遊容量。
第２図
第４図
２＃Ｊ埴桶′工旧咎蔓承５
４・戎謙蝋賂
６°゛ヅざ連努受
第５図Fig. 1 is an assembly diagram of a local oscillation circuit according to an embodiment of the present invention, Fig. 2 is a graph showing the rate of change in capacitance between copper foils facing each other on a printed circuit board with respect to humidity, and Fig. 3 is a graph showing the rate of change of the local oscillation frequency with respect to humidity. Figure 4 is a wiring diagram of a local oscillation circuit, Figure 5 is an equivalent circuit of Figure 4, Figure 6 is an assembly diagram of a conventional local oscillation circuit, and Figure 7 is a diagram of another local oscillation circuit. FIG. 2 is an assembly diagram of a conventional local oscillation circuit. 1.11.21...Varactor diode, 2,12゜22...Capacitive element for high frequency correction, 3a, 23a...Steel foil for cathode side connection of varactor diode, 3b, 23
b... Steel foil for anode side connection of varactor diode,
4,14.24...resonant line, 5,15.25...
・Printed circuit board, 6... Stray capacitance. Fig.2
Claims (1)
該バラクタダイオードを重ねて配置したことを特徴とす
る発振回路。An oscillation circuit characterized in that a varactor diode is stacked on a capacitive element connected in parallel with the varactor diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4759588A JPH01222503A (en) | 1988-03-02 | 1988-03-02 | Oscillation circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4759588A JPH01222503A (en) | 1988-03-02 | 1988-03-02 | Oscillation circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01222503A true JPH01222503A (en) | 1989-09-05 |
Family
ID=12779599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4759588A Pending JPH01222503A (en) | 1988-03-02 | 1988-03-02 | Oscillation circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01222503A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6026968A (en) * | 1996-05-13 | 2000-02-22 | Nitto Denko Corporation | Reverse osmosis composite membrane |
-
1988
- 1988-03-02 JP JP4759588A patent/JPH01222503A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6026968A (en) * | 1996-05-13 | 2000-02-22 | Nitto Denko Corporation | Reverse osmosis composite membrane |
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