JPH01220886A - Thick-film circuit substrate - Google Patents

Thick-film circuit substrate

Info

Publication number
JPH01220886A
JPH01220886A JP63046831A JP4683188A JPH01220886A JP H01220886 A JPH01220886 A JP H01220886A JP 63046831 A JP63046831 A JP 63046831A JP 4683188 A JP4683188 A JP 4683188A JP H01220886 A JPH01220886 A JP H01220886A
Authority
JP
Japan
Prior art keywords
resistor
trimming
trimming groove
function
value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63046831A
Other languages
Japanese (ja)
Inventor
Mitsuru Murata
満 村田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP63046831A priority Critical patent/JPH01220886A/en
Publication of JPH01220886A publication Critical patent/JPH01220886A/en
Pending legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

PURPOSE:To enable the set value of function trimming to be set easily without being behind the speed of laser beams, etc., by forming structure in which a third resistor is connected in parallel with a second resistor through an electrode in the direction of the notch of a trimming groove. CONSTITUTION:An electronic part, etc., are mounted and a trimming groove 19 is shaped to a first resistor 15, a trimming groove 20 is cut to a second resistor 16 by laser beams, etc., and trimming is adjusted at a set value. Since a third resistor 17 is connected at the nose of the trimming groove 20 through electrodes 18a, 18b at that time, the effect of parallel resistance is displayed with proceeding in the direction of the arrow A of the trimming groove, and the change of a resistance value is made slower than the speed of a laser beams. Since the size of a resistor for function trimming, the third resistor 17, is determined in consideration of a set target value, proceeding in the direction of the arrow A of the trimming groove 20 means approaching the set target value.

Description

【発明の詳細な説明】 [発明の目的] (産業上の利用分野) 本発明は厚膜回路基板に関し、特に抵抗トリミング用抵
抗体とファンクショントリミング用抵抗体を備えた厚膜
回路基板の改良に係わる。
[Detailed Description of the Invention] [Object of the Invention] (Industrial Field of Application) The present invention relates to a thick film circuit board, and particularly to the improvement of a thick film circuit board equipped with a resistor for trimming a resistor and a resistor for function trimming. Involved.

(従来の技術) 周知の如く、混成集積回路においては、絶縁板上に抵抗
ペーストの印刷、焼成工程を施す厚膜技術により抵抗体
等を設けた回路基板が使用されている(特願昭6l−2
81728)。こうした回路基板では、この回路基板に
電子部品等を実装した後、ファンクショントリミング用
抵抗体に対してファンクショントリミングを実施し、混
成集積回路の使用に応じた抵抗値に設定する操作を行っ
ている。従来、上述した抵抗トリミング用抵抗体とファ
ンクショントリミング用抵抗体を備えた厚膜回路基板と
しては、例えば第2図に示す構造のものが知られている
(Prior Art) As is well known, in hybrid integrated circuits, circuit boards are used in which resistors, etc. are provided using a thick film technology in which a resistor paste is printed and fired on an insulating plate (Japanese Patent Application No. 1983) -2
81728). In such a circuit board, after electronic components and the like are mounted on the circuit board, function trimming is performed on the function trimming resistor to set the resistance value according to the use of the hybrid integrated circuit. Conventionally, a thick film circuit board having the structure shown in FIG. 2, for example, is known as a thick film circuit board provided with the above-mentioned resistor for resistance trimming and resistor for function trimming.

図中の1は、絶縁板である。この絶縁板1上には、左端
にパッド2a、2bを有した導体2、右端にパッド2b
を有した導体3、及び中間にパッド4aを有した導体4
が形成されている。前記導体2のパッド2bと導体4の
バッド4a間には、厚膜技術により抵抗トリミング用抵
抗体5が設けられている。同様に、前記導体2,3間に
は、ファンクショントリミング用抵抗体6が設けられて
いる。但し、前記ファンクショントリミング用抵抗体6
は、初期抵抗値が無視できる程度に小さい値に設置され
ている。この様な構成の回路基板においては、電子部請
等を実装してファンクショントリミングが実施される。
1 in the figure is an insulating plate. On this insulating plate 1, there is a conductor 2 with pads 2a and 2b on the left end, and a pad 2b on the right end.
and a conductor 4 having a pad 4a in the middle.
is formed. A resistor 5 for resistor trimming is provided between the pad 2b of the conductor 2 and the pad 4a of the conductor 4 by thick film technology. Similarly, a function trimming resistor 6 is provided between the conductors 2 and 3. However, the function trimming resistor 6
is set to a value so small that the initial resistance value can be ignored. In a circuit board having such a configuration, electronic parts and the like are mounted and function trimming is performed.

しかしながら、このトリミングの際、ファンクショント
リミングの目標値に近付くに従って、レーザビームなど
のスピードに対して抵抗値の変化する割合が大きくなる
傾向にあり、目標値の設定が難しくなる。
However, during this trimming, as the target value of function trimming is approached, the rate at which the resistance value changes with respect to the speed of the laser beam etc. tends to increase, making it difficult to set the target value.

(発明が解決しようとする課題) 本発明は上記事情に鑑みてなされたもので、ファンクシ
ョントリミングの設定値に対してレーザビームなどのス
ピードに遅することなく容易に設定し得る厚膜回路基板
を提供することを目的とする。
(Problems to be Solved by the Invention) The present invention has been made in view of the above circumstances, and provides a thick film circuit board that can easily set the function trimming setting value without slowing down the speed of a laser beam or the like. The purpose is to provide.

[発明の構成] (課題を解決するための手段と作用) 本発明は、抵抗トリミング用第1抵抗体と、この第1抵
抗体に直列に接続され、初期値が無視しえる程度に小さ
いファンクショントリミング用第2抵抗体と、この第2
抵抗体に並列に接続されたトリミング用第3抵抗体とを
具備することを要旨とする。
[Structure of the Invention] (Means and Effects for Solving the Problems) The present invention includes a first resistor for resistor trimming, and a function connected in series to the first resistor and whose initial value is negligible. a second resistor for trimming and this second resistor;
The gist is to include a third resistor for trimming connected in parallel to the resistor.

本発明によれば、初期値が無視しえる程度に小さいファ
ンクショントリミング用第2抵抗体をレーザビームなど
によりトリミングすると、トリミングが第2抵抗体に電
極を介して並列に接続された第3抵抗体の方向に進むに
つれて、並列効果があられれ、レーザビームのスピード
に対して抵抗値の変化が緩やかになる。従って、予め設
定された目標値に容易に近づくことができる。
According to the present invention, when the second resistor for function trimming whose initial value is negligibly small is trimmed with a laser beam or the like, the trimming is applied to the third resistor connected in parallel to the second resistor through the electrode. As the direction increases, the parallel effect increases and the change in resistance value becomes more gradual with respect to the speed of the laser beam. Therefore, it is possible to easily approach a preset target value.

(実施例) 以下、本発明の一実施例を第1図を参照して説明する。(Example) An embodiment of the present invention will be described below with reference to FIG.

図中の11は、絶縁板である。この絶縁板11上には、
左端にパッド12a、12bを有した導体12、右端に
パッド12bを有した導体13、及び中間にパッド14
aを有した導体14が形成されている。前記導体12の
パッド12bと導体14のパッド14a間には、厚膜技
術により抵抗トリミング用抵抗体(第1抵抗体)15が
設けられている。同様に、前記導体12.13間には、
ファンクショントリミング用抵抗体(第2抵抗体)16
が設けられている。但し、この第2抵抗体16は、初期
抵抗値が無視できる程度に小さい値に設定されている。
11 in the figure is an insulating plate. On this insulating plate 11,
A conductor 12 with pads 12a and 12b on the left end, a conductor 13 with a pad 12b on the right end, and a pad 14 in the middle.
A conductor 14 having a is formed. A resistor trimming resistor (first resistor) 15 is provided between the pad 12b of the conductor 12 and the pad 14a of the conductor 14 by thick film technology. Similarly, between the conductors 12 and 13,
Function trimming resistor (second resistor) 16
is provided. However, the initial resistance value of the second resistor 16 is set to a value so small that it can be ignored.

前記第2抵抗体16には、トリミング用抵抗体(第3抵
抗体)17が電極18a、18bを介して前記第2抵抗
体16と並列に接続されている。ここで、前記第2抵抗
体16の初期の抵抗値は無視できる程度に小さく設定さ
れているため、第2抵抗体16に並列に接続された第3
抵抗体17の初期の抵抗値も無視でき−る程度に小さい
A trimming resistor (third resistor) 17 is connected in parallel to the second resistor 16 via electrodes 18a and 18b. Here, since the initial resistance value of the second resistor 16 is set to a negligibly small value, the third resistor 16 connected in parallel with the second resistor 16
The initial resistance value of the resistor 17 is also negligibly small.

こうした構成の厚膜回路基板においては、電子部品等を
実装して第1抵抗体15のにトリミング溝19を形成し
た後、第2抵抗体16にレーザビームなどによりトリミ
ング溝20を入れ、設定値に2J整する。この際、第3
抵抗体17はトリミング溝20の先端に電極18a、1
8bを介して接続されているため、トリミング溝が矢印
A方向に進むにつれて並列抵抗の効果があられれ、レー
ザビームのスピードに対して抵抗値の変化が緩やかにな
る。しかるに、ファンクショントリミング用抵抗体即ち
第3抵抗体17の大きさは設定目標値を考慮して決めら
れているので、トリミング溝20が矢印A方向に進むこ
とは設定目標値に近づくことを示す。なお、図中の21
は第3抵抗体17に設けられたトリミング溝を示し、第
2抵抗体16をトリミングしすぎたとき微調整用にトリ
ミングされるもので通常はトリミングしなくて調整可能
になっている。
In a thick film circuit board having such a configuration, after mounting electronic components etc. and forming a trimming groove 19 in the first resistor 15, a trimming groove 20 is formed in the second resistor 16 using a laser beam or the like. Adjust 2J to. At this time, the third
The resistor 17 has electrodes 18a, 1 at the tip of the trimming groove 20.
8b, as the trimming groove advances in the direction of arrow A, the effect of the parallel resistance is enhanced, and the resistance value changes gradually with respect to the speed of the laser beam. However, since the size of the function trimming resistor, that is, the third resistor 17, is determined in consideration of the set target value, the progress of the trimming groove 20 in the direction of arrow A indicates that the trimming groove 20 approaches the set target value. In addition, 21 in the figure
indicates a trimming groove provided in the third resistor 17, which is trimmed for fine adjustment when the second resistor 16 is trimmed too much, and can normally be adjusted without trimming.

このように、上記実施例に係る厚膜回路基板によれば、
第3抵抗体17をトリミング溝20の切り込み方向に電
極18a、18bを介して第2抵抗体16と並列に接続
した構造となっているため、ファンクショントリミング
操作を極めて容易に行うことが出来るとともに、設定目
標値に対して切りすぎや切り不足での不良を減少して歩
留りを向上できる。
In this way, according to the thick film circuit board according to the above embodiment,
Since the third resistor 17 is connected in parallel to the second resistor 16 via the electrodes 18a and 18b in the cutting direction of the trimming groove 20, the function trimming operation can be performed extremely easily. It is possible to improve yield by reducing defects caused by cutting too much or not cutting enough relative to the set target value.

[発明の効果] 以上詳述した如く本発明によれば、ファンクショントリ
ミングの設定値に対してレーザビームなどのスピードに
遅することなく容易に設定し得る厚膜回路基板を提供で
きる。
[Effects of the Invention] As described in detail above, according to the present invention, it is possible to provide a thick film circuit board in which the setting value of function trimming can be easily set without slowing down the speed of a laser beam or the like.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例に係る厚膜回路基板の・+=
面図、第2図は従来の厚膜回路基板の平面図である。 11・・・絶縁板、12.13.14・・・導体、15
.16.17・・・抵抗体、19,20.21・・・ト
リミング溝、18a、18b・・・電極。 出願人代理人 弁理士 鈴江武彦 第1図 第2図
FIG. 1 shows a thick film circuit board according to an embodiment of the present invention.
FIG. 2 is a plan view of a conventional thick film circuit board. 11... Insulating plate, 12.13.14... Conductor, 15
.. 16.17...Resistor, 19,20.21...Trimming groove, 18a, 18b...Electrode. Applicant's agent Patent attorney Takehiko Suzue Figure 1 Figure 2

Claims (1)

【特許請求の範囲】[Claims]  抵抗トリミング用第1抵抗体と、この第1抵抗体に直
列に接続され、初期値が無視しえる程度に小さいファン
クショントリミング用第2抵抗体と、この第2抵抗体に
並列に接続されたトリミング用第3抵抗体とを具備する
ことを特徴とする厚膜回路基板。
A first resistor for resistor trimming, a second resistor for function trimming that is connected in series to the first resistor and whose initial value is negligibly small, and a trimmer that is connected in parallel to the second resistor. A thick film circuit board characterized by comprising a third resistor for use in the circuit board.
JP63046831A 1988-02-29 1988-02-29 Thick-film circuit substrate Pending JPH01220886A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63046831A JPH01220886A (en) 1988-02-29 1988-02-29 Thick-film circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63046831A JPH01220886A (en) 1988-02-29 1988-02-29 Thick-film circuit substrate

Publications (1)

Publication Number Publication Date
JPH01220886A true JPH01220886A (en) 1989-09-04

Family

ID=12758280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63046831A Pending JPH01220886A (en) 1988-02-29 1988-02-29 Thick-film circuit substrate

Country Status (1)

Country Link
JP (1) JPH01220886A (en)

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