JPH0121584Y2 - - Google Patents
Info
- Publication number
- JPH0121584Y2 JPH0121584Y2 JP2968882U JP2968882U JPH0121584Y2 JP H0121584 Y2 JPH0121584 Y2 JP H0121584Y2 JP 2968882 U JP2968882 U JP 2968882U JP 2968882 U JP2968882 U JP 2968882U JP H0121584 Y2 JPH0121584 Y2 JP H0121584Y2
- Authority
- JP
- Japan
- Prior art keywords
- reinforcing frame
- semiconductor wafers
- container
- reinforced
- gasket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 claims description 26
- 238000004806 packaging method and process Methods 0.000 claims description 21
- 230000003014 reinforcing effect Effects 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 16
- 230000002787 reinforcement Effects 0.000 claims description 11
- 239000004033 plastic Substances 0.000 claims description 7
- 229920003023 plastic Polymers 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- -1 polypropylene Polymers 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910000906 Bronze Inorganic materials 0.000 claims description 2
- 239000004640 Melamine resin Substances 0.000 claims description 2
- 229920000877 Melamine resin Polymers 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 239000010974 bronze Substances 0.000 claims description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 206010038743 Restlessness Diseases 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2968882U JPS58133931U (ja) | 1982-03-04 | 1982-03-04 | 半導体ウエ−ハの包装容器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2968882U JPS58133931U (ja) | 1982-03-04 | 1982-03-04 | 半導体ウエ−ハの包装容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58133931U JPS58133931U (ja) | 1983-09-09 |
JPH0121584Y2 true JPH0121584Y2 (enrdf_load_stackoverflow) | 1989-06-27 |
Family
ID=30041466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2968882U Granted JPS58133931U (ja) | 1982-03-04 | 1982-03-04 | 半導体ウエ−ハの包装容器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58133931U (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005041668A (ja) * | 2003-07-24 | 2005-02-17 | Mitsui Mining & Smelting Co Ltd | 長尺テープ巻装用リール |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1181778B (it) * | 1985-05-07 | 1987-09-30 | Dynamit Nobel Silicon Spa | Contenitore per l'immagazzinamento ed il trasporto di dischetti (fette) di silicio |
JPH0613114Y2 (ja) * | 1987-04-21 | 1994-04-06 | 信越ポリマ−株式会社 | 密閉容器の係止構造 |
-
1982
- 1982-03-04 JP JP2968882U patent/JPS58133931U/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005041668A (ja) * | 2003-07-24 | 2005-02-17 | Mitsui Mining & Smelting Co Ltd | 長尺テープ巻装用リール |
Also Published As
Publication number | Publication date |
---|---|
JPS58133931U (ja) | 1983-09-09 |
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