JPH01214922A - Transparent tablet - Google Patents
Transparent tabletInfo
- Publication number
- JPH01214922A JPH01214922A JP63040228A JP4022888A JPH01214922A JP H01214922 A JPH01214922 A JP H01214922A JP 63040228 A JP63040228 A JP 63040228A JP 4022888 A JP4022888 A JP 4022888A JP H01214922 A JPH01214922 A JP H01214922A
- Authority
- JP
- Japan
- Prior art keywords
- transparent
- fpc
- conductive film
- transparent conductive
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000011521 glass Substances 0.000 claims abstract description 10
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 abstract 2
- 238000000034 method Methods 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 239000000203 mixture Substances 0.000 description 6
- 238000000605 extraction Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical class N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010574 gas phase reaction Methods 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005486 sulfidation Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Abstract
Description
この発明は、取り出し回路の接続が容易で耐熱性のない
材料も用いることのできる透明タブレットに関する。The present invention relates to a transparent tablet that allows easy connection of a take-out circuit and allows the use of materials that are not heat resistant.
従来、電子機器にＸ−Ｙ座標を入力する透明タブレット
としては、透明導電膜が均一に形成されたガラス板の周
囲に取り出し回路としてリード線がハンダ付されたもの
があった。Conventionally, as a transparent tablet for inputting X-Y coordinates into electronic equipment, there has been one in which a lead wire is soldered as an extraction circuit around a glass plate on which a transparent conductive film is uniformly formed.
しかし、上記の透明タブレットは、取り出し回路の接点
の数が多いので、リード線のハンダ付に手間がかかるこ
と、透明電極に直接リード線をハンダ付できないので、
耐熱性を有する端子を高温焼成型の導電性ペーストや無
電解メツキによっぞ形成しなければならないことなどの
問題点があった。
この発明は、このような問題点を解決し、取り出し回路
の接続が容易で耐熱性のない材料も用いることのできる
透明タブレットを提供することを目的とする。However, since the transparent tablet mentioned above has a large number of contacts in the extraction circuit, it takes time and effort to solder the lead wires, and it is not possible to solder the lead wires directly to the transparent electrodes.
There are problems in that the heat-resistant terminals must be formed using high-temperature firing type conductive paste or electroless plating. The object of the present invention is to solve these problems and provide a transparent tablet that allows easy connection of a take-out circuit and allows the use of materials that are not heat resistant.
この発明は、以上の目的を達成するために、均一な透明
導電膜が形成された透明基板上に、基材上に取り出し回
路が形成されたフレキシブルプリント配線板を、透明導
電膜と基材とが対向するように積層して配線されるよう
に透明タブレットを構成した。
図面を参照しながらこの発明をさらに詳しく説明する。
第１図はこの発明の透明タブレットの一実施例を示す斜
視図、第２図はそのＡ−Ａ断面図である。
１は透明基板、２は透明導電膜、３はフレキシブルプリ
ント配線板（ＦＰＣ）、４は基材、５は取り出し回路、
６はハードコート層、７は接続端子、９は導電性インキ
層をそれぞれ示す。
透明基板１であるガラス板の表面には均一な抵抗値を示
す５ｎ０２やＩＴ○膜などの透明導電膜２が形成される
。形成方法としては、スプレー法、気相反応法（ＣＶＤ
法）や真空蒸着法、スパッタリング法などがある。
透明導電膜２の中央部分、つまり透明タブレットの入力
部分には、入力ペンなどに対する耐性を向上させるため
に、必要に応じて透明で導電性を有するハードコート剤
などを塗布してもよい。透明導電膜２の周囲には必要に
応じて接続端子７が形成される。接続端子７は、透明導
電膜２と後述する導電性インキ層９との接続をより確実
にするために設けられるものである。透明導電膜２の領
域を、実際に必要な入力領域よりも大きく形成し、非入
力部分にＦＰＣ３の取り出し回路５との接続端子７を形
成するようにするとよい。透明導電膜２と導電性インキ
層９との接続を直接性なっても導通が良好な場合は、接
続端子７は必要ない。また、導電性インキ層９を接続端
子７材料として使用することも可能である。また、その
場合には、透明基板１にメツキ工程または焼成工程が不
要なため、ガラス板だけでなく、透明基板１に耐熱性の
ないプラスチックフィルムなどを用いた透明導電ＪＩＫ
２にも適用することができる。
ＦＰＣ３としては、通常のポリイミドフィルムを使用し
たＦＰＣ３を用いればよいが、その基材４をたとえばポ
リエステルのような比較的安価なフィルムで構成し、取
り出し回路５を導電ペーストの印刷によって形成するよ
うにするとコストダウンをはかることができる。ＦＰＣ
３の取り出し回路５と透明基板１の透明導電膜２とを接
続するために、ＦＰＣ３の基材４に取り出し回路５とと
もに貫通する貫通孔を設ける。ＦＰＣ３の取り出し回路
５の各線と透明タブレットの検出器の各端子との接続を
容易にするため、取り出し回路５のパターンをあらかじ
め線の一本一本が整列するような形に設計するとよい。
上記した接続端子７とＦＰＣ３の基材４とがそれぞれが
対向するように透明基板１とＦＰＣ３とが積層されて接
続される。ＦＰＣ３には貫通孔が形成され、この孔に導
電性材料が充填されて導通部となり、透明基板１の接続
端子７とＦＰＣ３の取り出し回路５とが接続される。導
電性材料としては、導電性インキ層９が適切であり、充
填方法としては、スクリーン印刷やデイスペンサーによ
るボッティングなどがある。導電性インキ層９としては
、溶剤乾燥型、熱硬化型あるいは紫外線硬化型の銀、銅
、カーボン、ニッケルなどの各ベーストのほか、導電性
接着剤、導電性塗料などを用いることができる。通常、
これらの導電性インキ層９による接続は、透明基板１と
ＦＰＣ３とを強固に接着させた場合には接点が固定され
るため、外部からの圧力や歪の影響が少なくなり、信頼
性の高いものとなる。
透明基板１とＦＰＣ３との接着に絶縁シートの両面に粘
着剤があらかじめ塗布された両面テープを用いた場合、
作業上での工程を短縮することができる。In order to achieve the above object, the present invention provides a flexible printed wiring board in which a uniform transparent conductive film is formed on a transparent substrate, and a lead-out circuit is formed on the base material. The transparent tablets were constructed so that they were stacked and wired so that they faced each other. The present invention will be explained in more detail with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of a transparent tablet of the present invention, and FIG. 2 is a cross-sectional view taken along line AA. 1 is a transparent substrate, 2 is a transparent conductive film, 3 is a flexible printed circuit board (FPC), 4 is a base material, 5 is a take-out circuit,
Reference numeral 6 indicates a hard coat layer, 7 indicates a connection terminal, and 9 indicates a conductive ink layer. A transparent conductive film 2 such as 5n02 or IT○ film showing a uniform resistance value is formed on the surface of a glass plate serving as a transparent substrate 1. Formation methods include spray method, gas phase reaction method (CVD).
method), vacuum evaporation method, and sputtering method. If necessary, a transparent and conductive hard coat agent may be applied to the central portion of the transparent conductive film 2, that is, the input portion of the transparent tablet, in order to improve resistance to input pens and the like. Connection terminals 7 are formed around the transparent conductive film 2 as necessary. The connection terminal 7 is provided to more securely connect the transparent conductive film 2 and the conductive ink layer 9 described later. It is preferable to form the area of the transparent conductive film 2 larger than the actually required input area, and form the connection terminal 7 with the output circuit 5 of the FPC 3 in the non-input area. If the connection between the transparent conductive film 2 and the conductive ink layer 9 is good even if the connection is made directly, the connection terminal 7 is not necessary. It is also possible to use the conductive ink layer 9 as the material for the connection terminal 7. In that case, since the plating process or baking process is not required for the transparent substrate 1, it is also possible to use not only a glass plate but also a transparent conductive JIK that uses a non-heat resistant plastic film etc. for the transparent substrate 1.
2 can also be applied. As the FPC 3, an FPC 3 using a normal polyimide film may be used, but the base material 4 may be made of a relatively inexpensive film such as polyester, and the take-out circuit 5 may be formed by printing conductive paste. In this way, costs can be reduced. FPC
In order to connect the extraction circuit 5 of No. 3 and the transparent conductive film 2 of the transparent substrate 1, a through hole is provided in the base material 4 of the FPC 3 to pass through the extraction circuit 5 and the transparent conductive film 2 of the transparent substrate 1. In order to facilitate connection between each line of the take-out circuit 5 of the FPC 3 and each terminal of the detector of the transparent tablet, the pattern of the take-out circuit 5 may be designed in advance so that each line is aligned one by one. The transparent substrate 1 and the FPC 3 are stacked and connected so that the above-mentioned connection terminal 7 and the base material 4 of the FPC 3 face each other. A through hole is formed in the FPC 3, and this hole is filled with a conductive material to become a conductive part, so that the connection terminal 7 of the transparent substrate 1 and the output circuit 5 of the FPC 3 are connected. The conductive ink layer 9 is suitable as the conductive material, and the filling method includes screen printing, botting with a dispenser, and the like. As the conductive ink layer 9, solvent drying type, thermosetting type, or ultraviolet curing type base materials such as silver, copper, carbon, and nickel, as well as conductive adhesives, conductive paints, and the like can be used. usually,
The connections using these conductive ink layers 9 are highly reliable because the contacts are fixed when the transparent substrate 1 and the FPC 3 are firmly adhered, so the influence of external pressure and distortion is reduced. becomes. When using double-sided tape with adhesive applied on both sides of the insulating sheet in advance to bond the transparent substrate 1 and FPC 3,
The work process can be shortened.
【実施例】
厚さ１．１ｍｍ、サイズが１６０ｍｍ角のソーダガラス
の片面全体に酸化インジウム−スズ透明導電膜を蒸着法
により形成し、導電性ガラスとした。この導電性ガラス
面に、ガラスの端部から各々５ｍｍ内側の位刀に３０ｍ
ｍ間隔で合計２０ケ所に、組成１の銀ペーストを用いて
スクリーン印刷法により５ｍｍ角のパターンを形成した
。次いで、１５０°Ｃの熱乾燥機にいれ、１時間放置し
て銀ペーストのパターンを熱硬化させ接続端子とした。
組成１ （重量部）球状銀粉
７０部エポキシ樹脂
１０部ブチルカルピトールアセテー
ト １０部硬１ヒ剤
１部一方、厚さ５０μｍのポリエステルフィルムに
組成２の銀ペーストを用いてスクリーン印刷し、１００
°Ｃの熱乾燥機にいれ、約１時間放置して熱乾燥し、収
り出し回路を有するＦＰＣを作製した。
組成２ （重量部）リン片状
銀粉 ６５部ポリエステル樹脂
１０部エチルカルピトールアセテート
２５部次に、このＦＰＣの収り出し回路が形成さ
れていない面にアクリル系の粘着剤をスクリーン印刷法
にて塗布して１０分間放置し、離型紙を貼り合わせた。
次に、各接続端子の中心に相当する位置に直径２ｍｍの
大きさの穴が形成できる打ち抜き型をつくり、この型に
前記ＦＰＣをセットし、プレス機によって押圧してＦＰ
Ｃに導通部用の穴を設けた。
次いで、ＦＰ−Ｃの離型紙を剥し、ガラス板の透明導電
膜面とＦＰＣの粘着剤面とが接し、ＦＰＣに設けた導通
部用の穴と接続端子とが一致するように貼りつけた。
次に、ＦＰＣに設けな導通部用の穴に組成３の導電ペー
ストを、厚さ１ｍｍのメタル版を使用してスクリーン印
刷して充填した。この状態で１００℃の熱乾燥機にいれ
、１時間放置して乾燥し、ＦＰＣの取り出し回路とＩＴ
Ｏの透明導電膜とを接続した。
組成３ （重量部）球状銀粉
６５部ポリエステル樹脂
１０部エチルカルピトールアセテート
２５部銀ペーストは、温度の影響や、酸化や硫化
の影響を受けやすいので、接続端子および取り出し回路
を１００μｍのポリエステルフィルムでカバーした。
以上のようにして透明タブレットを完成した。
上記の透明タブレットを６０℃、９５ＲＨ％の高温高湿
下に１０日間放置した結果、抵抗変化率は５％以内であ
り、５％の塩水を１６時間噴霧し、４８時間放置した結
果、抵抗変化率は１０％以内だった。また、２０ｐｐｍ
の硫化水素雰囲気や飽和のアンモニア雰囲気中に４日間
放置しても異常が認められなかった。[Example] An indium-tin oxide transparent conductive film was formed on the entire surface of one side of soda glass having a thickness of 1.1 mm and a size of 160 mm square by a vapor deposition method to obtain a conductive glass. On this conductive glass surface, place 30m of wire on each side 5mm inside from the edge of the glass.
A pattern of 5 mm square was formed at a total of 20 locations at m intervals using a screen printing method using silver paste of composition 1. Next, it was placed in a heat dryer at 150°C and left to stand for 1 hour to thermally harden the silver paste pattern to form a connection terminal. Composition 1 (Parts by weight) Spherical silver powder 70 parts Epoxy resin
10 parts butyl carpitol acetate 10 parts hardening agent
On the other hand, a silver paste of composition 2 was screen printed on a polyester film with a thickness of 50 μm, and 100
It was placed in a heat dryer at °C and left to dry for about 1 hour to produce an FPC having a collection circuit. Composition 2 (parts by weight) flaky silver powder 65 parts polyester resin
10 parts ethyl carpitol acetate 25 parts Next, an acrylic adhesive was applied by screen printing to the surface of this FPC on which the outlet circuit was not formed, left for 10 minutes, and release paper was attached. . Next, a punching die capable of forming a hole with a diameter of 2 mm at a position corresponding to the center of each connection terminal is made, the FPC is set in this die, and the FPC is pressed with a press machine.
A hole for the conductive part was provided at C. Next, the release paper of the FP-C was peeled off, and the FPC was pasted so that the transparent conductive film surface of the glass plate was in contact with the adhesive surface of the FPC, and the holes for the conductive portion provided in the FPC were aligned with the connection terminals. Next, a conductive paste of Composition 3 was filled into holes for conductive parts provided in the FPC by screen printing using a metal plate with a thickness of 1 mm. In this state, put it in a heat dryer at 100℃ and leave it for 1 hour to dry.
A transparent conductive film of O was connected. Composition 3 (Parts by weight) Spherical silver powder 65 parts Polyester resin
10 parts ethyl carpitol acetate 25 parts Silver paste is susceptible to the effects of temperature, oxidation and sulfidation, so the connection terminals and output circuits were covered with a 100 μm polyester film. A transparent tablet was completed in the above manner. As a result of leaving the above transparent tablet under high temperature and high humidity conditions of 60°C and 95RH% for 10 days, the resistance change rate was within 5%, and when spraying 5% salt water for 16 hours and leaving it for 48 hours, the resistance change The rate was within 10%. Also, 20ppm
No abnormality was observed even when the product was left in a hydrogen sulfide atmosphere or a saturated ammonia atmosphere for 4 days.
この発明の透明タブレットは、均一な透明導電膜か形成
された透明基板上に、基材上に取り出し回路が形成され
たフレキシブルプリント配線板を、透明導電膜と基材と
が対向するように積層して配線されたものであるので、
取り出し回路の接続が容易であり、またハンダ付を必要
としないので、耐熱性のない材料によって構成すること
も可能である。In the transparent tablet of the present invention, a flexible printed wiring board with a lead-out circuit formed on the base material is laminated on a transparent substrate on which a uniform transparent conductive film is formed so that the transparent conductive film and the base material face each other. Since it is wired with
Since the connection of the extraction circuit is easy and no soldering is required, it is also possible to construct it from a material without heat resistance.
第１図はこの発明の透明タブレットの一実施例を示す斜
視図、第２図はそのＡ−Ａ断面図である。
１・・・透明基板、２・・・透明導電膜、３・・・フレ
キシブルプリント配線板（ＦＰＣ）、４・・・基材、５
・・・取り出し回路、６・・・ハードコート層、７・・
・接続端子、９・・・導電性インキ層。
特許出願人 日本写真印刷株式会社FIG. 1 is a perspective view showing an embodiment of a transparent tablet of the present invention, and FIG. 2 is a cross-sectional view taken along line AA. DESCRIPTION OF SYMBOLS 1... Transparent substrate, 2... Transparent conductive film, 3... Flexible printed circuit board (FPC), 4... Base material, 5
...Takeout circuit, 6...Hard coat layer, 7...
- Connection terminal, 9... conductive ink layer. Patent applicant Nissha Printing Co., Ltd.
Claims (4)
１）上に、基材（４）上に取り出し回路（５）が形成さ
れたフレキシブルプリント配線板（３）を、透明導電膜
（２）と基材（４）とが対向するように積層して配線さ
れたことを特徴とする透明タブレット。(1) A transparent substrate on which a uniform transparent conductive film (2) is formed (
1) A flexible printed wiring board (3) having a lead-out circuit (5) formed on the base material (4) is laminated on top of the flexible printed wiring board (3) so that the transparent conductive film (2) and the base material (4) face each other. A transparent tablet characterized by being wired with
１）とフレキシブルプリント配線板（３）の導通部が導
電インキ層（９）で接続されている請求項１に記載の透
明タブレット。(2) A transparent substrate on which a uniform transparent conductive film (2) is formed (
2. The transparent tablet according to claim 1, wherein the conductive portion of the flexible printed wiring board (3) is connected by a conductive ink layer (9).
１）とフレキシブルプリント配線板（３）の導通部が導
電インキ層（９）で接続され、導通部以外が絶縁性を有
する両面テープで接着されている請求項１に記載の透明
タブレット。(3) A transparent substrate on which a uniform transparent conductive film (2) is formed (
2. The transparent tablet according to claim 1, wherein the conductive portions of the flexible printed wiring board (3) and the conductive portion are connected by a conductive ink layer (9), and the portions other than the conductive portions are adhered with an insulating double-sided tape.
いずれかに記載の透明タブレット。(4) The transparent tablet according to any one of claims 1 to 3, wherein the transparent substrate (1) is a glass plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4022888A JP2700654B2 (en) | 1988-02-23 | 1988-02-23 | Transparent tablet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4022888A JP2700654B2 (en) | 1988-02-23 | 1988-02-23 | Transparent tablet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01214922A true JPH01214922A (en) | 1989-08-29 |
| JP2700654B2 JP2700654B2 (en) | 1998-01-21 |
Family
ID=12574886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4022888A Expired - Lifetime JP2700654B2 (en) | 1988-02-23 | 1988-02-23 | Transparent tablet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2700654B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102497684A (en) * | 2011-11-22 | 2012-06-13 | 中航华东光电有限公司 | Conductive glass and preparation method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6819316B2 (en) * | 2001-04-17 | 2004-11-16 | 3M Innovative Properties Company | Flexible capacitive touch sensor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62288925A (en) * | 1986-06-09 | 1987-12-15 | Matsushita Electric Ind Co Ltd | Transparent panel input device |
| JPS635536U (en) * | 1986-06-27 | 1988-01-14 |
-
1988
- 1988-02-23 JP JP4022888A patent/JP2700654B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62288925A (en) * | 1986-06-09 | 1987-12-15 | Matsushita Electric Ind Co Ltd | Transparent panel input device |
| JPS635536U (en) * | 1986-06-27 | 1988-01-14 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102497684A (en) * | 2011-11-22 | 2012-06-13 | 中航华东光电有限公司 | Conductive glass and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2700654B2 (en) | 1998-01-21 |
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