JPH01211986A - Semiconductor pressure sensor - Google Patents

Semiconductor pressure sensor

Info

Publication number
JPH01211986A
JPH01211986A JP63035361A JP3536188A JPH01211986A JP H01211986 A JPH01211986 A JP H01211986A JP 63035361 A JP63035361 A JP 63035361A JP 3536188 A JP3536188 A JP 3536188A JP H01211986 A JPH01211986 A JP H01211986A
Authority
JP
Japan
Prior art keywords
connection signal
diffusion
gauge
pressure sensor
diaphragm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63035361A
Other languages
Japanese (ja)
Inventor
Kazuhiko Mizojiri
溝尻 和彦
Shogo Asano
浅野 勝吾
Takashi Morikawa
森川 貴志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP63035361A priority Critical patent/JPH01211986A/en
Publication of JPH01211986A publication Critical patent/JPH01211986A/en
Pending legal-status Critical Current

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  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

PURPOSE:To obtain an output excellent in linearity, by arranging diffusion resistors for gauge in the <110> axis direction wherein a piezo resistance coefficient becomes maximum, and arranging diffusion connection signal wires in the direction at 45 deg. to the <110> axis, which direction has no piezo resistance coefficient. CONSTITUTION:In the central part of a substrate 1 using the 100 surface of silicon single crystal, a diaphragm 1a is formed. In the vicinity of its four sides, diffusion resistors 2a-2d for gauge are arranged. At four corners of the substrate 1, electromagnetic pads 3a-3d are arranged. The diffusion resistors 2a-2d and the electromagnetic pads 3a-3d are connected with diffusion connection signal wires 5a, 5b and 6a, 5c, 5d, 5e and 6b, and 5f arranged in the direction at 45 deg. to the <110> axis. Thereby, when pressure is applied to the diaphragm 1a, resistance change due to expansion and contraction of the diffusion connection signal wires 5a-5f, 6a, 6b is avoided, so that the output voltage of a bridge circuit depends only on the diffusion resistors 2a-2d for gauge, and the linearity of applied pressure output is enhanced.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、圧力を電気信号に変換する半導体圧力センサ
に関し、特に自動車用エンジンの吸入空気圧や大気圧、
またはエギゾースト圧力などの検出に用いられる半導体
圧力センサに関するものである。
DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a semiconductor pressure sensor that converts pressure into an electrical signal, and particularly relates to a semiconductor pressure sensor that converts pressure into an electrical signal, and particularly relates to a semiconductor pressure sensor that converts pressure into an electrical signal.
Or it relates to a semiconductor pressure sensor used to detect exhaust pressure or the like.

(従来の技術) 近年、排気ガス規制が強化されるに伴い、自動車用エン
ジンは、いかなる運転状態でも常に最良の燃焼状態とな
るように制御する必要がある。それには、圧力電気信号
変換器によりエンジンの吸気圧力を検出した電気信号に
よって燃料の供給量や点火時期を制御して最適な燃焼状
態に維持する方法や、大気圧の変化を検知して高度補正
を行なう方法などが採用されるようになってきた。この
ような圧力電気信号変換器を自動車用として採用する場
合には、耐熱性、耐振性が要求され、これに応えるもの
として、半導体を歪ゲージとして利用した半導体圧力セ
ンサが広く採用されている。
(Prior Art) In recent years, as exhaust gas regulations have been tightened, it is necessary to control automobile engines so that they always have the best combustion state no matter the operating state. To do this, there are methods to maintain optimal combustion conditions by controlling the fuel supply amount and ignition timing using electrical signals detected by the engine's intake pressure using a pressure-electric signal converter, and methods to detect changes in atmospheric pressure and make altitude corrections. Methods of doing this have begun to be adopted. When such a pressure electric signal converter is used for automobiles, heat resistance and vibration resistance are required, and semiconductor pressure sensors using semiconductors as strain gauges are widely used to meet these requirements.

この種の従来の半導体圧力センサについて、第3図およ
び第4図により説明する。
This type of conventional semiconductor pressure sensor will be explained with reference to FIGS. 3 and 4.

第3図は従来の半導体圧力センサの平面図で、半導体圧
力センサは、シリコン単結晶の(100)而を用いた基
板1の中央に破線で描いた長方形のダイアフラム1aを
形成し、その中央に(110)軸方向に4つのゲージ用
拡散抵抗2a、2b、2cおよび2dを配置して、ホイ
ートストンブリッジを形成するとともに、周囲に電極パ
ッド3ap 3b+ 3cおよび3dを形成して、これ
らと上記の拡散抵抗2a、2b、2cおよび2dとの間
に、(110)軸方向の拡散接続信号線4a、4b、4
cおよび4dで接続したものである。ダイアフラム1a
に圧力が印加されると、ダイアフラム1aが歪み、ゲー
ジ用拡散抵抗2aと20、または2aと2dに発生する
歪量の差によってホイートストンブリッジ回路の抵抗値
のバランスがくずれ、出力が得られる。
FIG. 3 is a plan view of a conventional semiconductor pressure sensor, in which a rectangular diaphragm 1a drawn by a broken line is formed at the center of a substrate 1 made of silicon single crystal (100). (110) Four gauge diffused resistors 2a, 2b, 2c and 2d are arranged in the axial direction to form a Wheatstone bridge, and electrode pads 3ap 3b+ 3c and 3d are formed around them, and these and the above diffusion resistors are formed. Between the resistors 2a, 2b, 2c and 2d, (110) axial diffusion connection signal lines 4a, 4b, 4
c and 4d. Diaphragm 1a
When pressure is applied to the diaphragm 1a, the diaphragm 1a is distorted, and the difference in the amount of distortion generated between the gauge diffused resistors 2a and 20, or 2a and 2d causes the resistance value of the Wheatstone bridge circuit to become unbalanced, and an output is obtained.

第4図は、ダイヤフラム1aに形成されたホイートスト
ンブリッジ回路の等価回路である。図中の短冊形は、ゲ
ージ用拡散抵抗2a、2b、2cおよび2d、鋸歯形は
拡散接続信号線4a、 4b、 4cおよび4d、なら
びに丸印は電極パッド3a、 3b。
FIG. 4 is an equivalent circuit of the Wheatstone bridge circuit formed in the diaphragm 1a. In the figure, the rectangular shapes are the gauge diffused resistors 2a, 2b, 2c, and 2d, the sawtooth shapes are the diffused connection signal lines 4a, 4b, 4c, and 4d, and the circles are the electrode pads 3a, 3b.

3cおよび3dを示し、符号はそれぞれ第3図に準じて
付しである。
3c and 3d, and the reference numerals are assigned according to FIG. 3, respectively.

第4図から明らかなように、ブリッジにかかるバイアス
電圧VB印加回路に直列に拡散接続信号線4bが形成さ
れている。
As is clear from FIG. 4, a diffusion connection signal line 4b is formed in series with the bias voltage VB application circuit applied to the bridge.

なお、図中の■。、。l+Va(−1は、それぞれ電極
3aおよび3cの出力電圧(+)、 (−)を示す。
In addition, ■ in the figure. ,. l+Va(-1 indicates the output voltages (+) and (-) of the electrodes 3a and 3c, respectively.

(発明が解決しようとする課題) しかしながら、このような構成では、拡散接続信号線4
a、4b、4cおよび4dが、ピエゾ抵抗係数を有する
ゲージ用拡散抵抗2a、2b、2cおよび2dが共に圧
力によって伸縮するダイアフラム1a上で(110)軸
方向に形成されているため、圧力によって拡散接続信号
線4a、4b、4cおよび4dも伸縮する結果、その抵
抗値も変化することになる。従って、第4図において、
電極3bと電極3dの間に一定のバイアス電圧■8を加
えても、ブリッジに加えられる実質のバイアス電圧が変
動するため、出力電圧■。も変動し、出力の直線性が悪
化するという問題があった。
(Problem to be Solved by the Invention) However, in such a configuration, the spread connection signal line 4
a, 4b, 4c and 4d are formed in the (110) axial direction on the diaphragm 1a which expands and contracts with pressure, so that the gauge diffusion resistors 2a, 2b, 2c and 2d having piezoresistance coefficients are formed in the (110) axial direction. As the connection signal lines 4a, 4b, 4c and 4d also expand and contract, their resistance values also change. Therefore, in Figure 4,
Even if a constant bias voltage (■8) is applied between the electrode 3b and the electrode 3d, the actual bias voltage applied to the bridge varies, so the output voltage (■). There was a problem in that the linearity of the output was deteriorated.

本発明は、上記の課題を解決するもので、直線性の良い
出力特性を有する半導体圧力センサを提供するものであ
る。
The present invention solves the above problems and provides a semiconductor pressure sensor having output characteristics with good linearity.

(課題を解決するための手段) 上記の課題を達成するため、本発明は、ピエゾ抵抗係数
が最大となる010>軸方向にゲージ用拡散抵抗を配置
するとともに、上記の拡散抵抗と電極パッドを接続する
拡散接続信号線を、ピエゾ抵抗係数を有しない<110
>軸と45″の角度を持つ方向に配置することによって
、拡散抵抗の感度を最大とし、且つ拡散接続信号線の影
響をなくしたものである。
(Means for Solving the Problems) In order to achieve the above problems, the present invention arranges a gauge diffused resistor in the 010> axial direction where the piezoresistance coefficient is maximum, and also connects the above diffused resistor and electrode pad. Connect the diffused connection signal line with a piezoresistance coefficient of <110
By arranging the resistor in a direction having an angle of 45'' with the axis, the sensitivity of the diffused resistor is maximized and the influence of the diffused connection signal line is eliminated.

また、バイアス側の拡散接続信号線をブリッジ回路に内
蔵させ、圧力印加時のブリッジ回路へのバイアス電圧値
の変動をなくするものである。
Furthermore, the diffusion connection signal line on the bias side is built into the bridge circuit to eliminate fluctuations in the bias voltage value applied to the bridge circuit when pressure is applied.

(作 用) 上記の構成により、拡散接続信号線が<110>軸と4
5°の角度を持ち、ピエゾ抵抗不感方向に形成されてい
るため、ダイヤフラムへ圧力が印加されたときに、拡散
接続信号線の伸縮による抵抗変化がなくなり、ブリッジ
回路の出力電圧はゲージ用拡散抵抗だけに依存すること
になって、印加圧カー出力の直線性が大幅に向上する。
(Function) With the above configuration, the diffusion connection signal line is connected to the <110> axis and the 4
It has an angle of 5° and is formed in the piezoresistance-insensitive direction, so when pressure is applied to the diaphragm, there is no change in resistance due to expansion and contraction of the diffusion connection signal line, and the output voltage of the bridge circuit is determined by the diffusion resistance for the gauge. The linearity of the applied pressure car output is greatly improved.

(実施例) 本発明の一実施例を第1図および第2図により説明する
。なお、第3図に示した従来例と同じ構成部品には同一
符号を付す。
(Example) An example of the present invention will be described with reference to FIGS. 1 and 2. Note that the same components as in the conventional example shown in FIG. 3 are given the same reference numerals.

第1図は本発明による半導体圧力センサの平面図で、半
導体センサは、シリコン単結晶の(100)面を用いた
基板1の中央部に、図に破線で示したダイヤフラム1a
を形成し、その四辺近傍に(110)軸方向にゲージ用
拡散抵抗2a、2b、2cおよび2dを、また、基板1
の四隅に電極パッド3a。
FIG. 1 is a plan view of a semiconductor pressure sensor according to the present invention.
, and gauge diffused resistors 2a, 2b, 2c, and 2d are formed near its four sides in the (110) axis direction, and the substrate 1
Electrode pads 3a at the four corners.

3b、3cおよび3dをそれぞれ配置し、上記の拡散抵
抗2a、2b、2cおよび2dと上記の電極パッド3a
、3b、3cおよび3dとの間を、(110>軸と45
°をなす方向に配置した拡散接続信号、s5 a 。
3b, 3c and 3d are arranged respectively, and the above diffusion resistors 2a, 2b, 2c and 2d and the above electrode pad 3a are arranged.
, 3b, 3c and 3d, (110> axis and 45
Diffuse connection signals, s5 a , arranged in the direction of .degree.

5bと6a、5c、5d、5eと6bおよび5fで接続
したものである。
5b and 6a, 5c, 5d, and 5e are connected by 6b and 5f.

なお、接地接続する電極パッド3aとバイアス電圧VB
を印加する電極パッド3Cとの間には、拡散接続信号線
5bおよび5eを介してそれぞれ接続された拡散抵抗2
aと2b、および2Cと2dが、電極パッド3aおよび
3cに並列に接続されており、その両端の拡散抵抗2a
と2d、および2bと20をそれぞれ拡散接続信号線5
aと5f、および5Cと5dが直列になるように接続さ
れている。また、上記の中間に挿入された拡散接続信号
線5bおよび5eと信号を出力する電極パッド3bおよ
び3dとは、それぞれ拡散接続信号線6aおよび6bで
接続されている。
Note that the electrode pad 3a connected to ground and the bias voltage VB
Diffused resistors 2 are connected to the electrode pad 3C through diffusion connection signal lines 5b and 5e, respectively.
a and 2b, and 2C and 2d are connected in parallel to the electrode pads 3a and 3c, and the diffused resistor 2a at both ends is connected to the electrode pads 3a and 3c in parallel.
and 2d, and 2b and 20, respectively, are connected to the diffusion connection signal lines 5.
A and 5f and 5C and 5d are connected in series. Further, the diffusion connection signal lines 5b and 5e inserted in the middle and the electrode pads 3b and 3d for outputting signals are connected by diffusion connection signal lines 6a and 6b, respectively.

第2図は、上記の基板1の上に形成されたホイートスト
ンブリッジ回路の等価回路である。短冊形は拡散抵抗2
a、2b、2cおよび2d、鋸歯形は拡散接続信号線5
a、 5b、 5c、 5d、 5e、 5f。
FIG. 2 shows an equivalent circuit of the Wheatstone bridge circuit formed on the substrate 1 described above. The rectangular shape is diffused resistance 2
a, 2b, 2c and 2d, the sawtooth shape is the diffusion connection signal line 5
a, 5b, 5c, 5d, 5e, 5f.

6aおよび6b、丸印は電極パッド3a、 3b、 3
cおよび3dで、それぞれ第3図に準するものである。
6a and 6b, circle marks are electrode pads 3a, 3b, 3
c and 3d, which correspond to FIG. 3, respectively.

このように構成された実施例の動作について説明する。The operation of the embodiment configured in this way will be explained.

ダイアフラム1aに圧力が加わると、ダイアフラム1a
が歪み、(110)軸方向に形成されたゲージ用拡散抵
抗2a、2b、2cおよび2dの抵抗値が変化し、出力
が得られる。拡散接続信号線5a、5b、5c、5d、
5e、5f、6aおよび6bは、共に(110)軸に対
して45°の角度をなす方向に配置されているため抵抗
値の変化が生じないので、半導体圧力センサの出力に対
する影響がない。
When pressure is applied to the diaphragm 1a, the diaphragm 1a
is distorted, the resistance values of the gauge diffused resistors 2a, 2b, 2c and 2d formed in the (110) axis direction change, and an output is obtained. Diffused connection signal lines 5a, 5b, 5c, 5d,
5e, 5f, 6a, and 6b are all arranged in a direction forming an angle of 45° with respect to the (110) axis, so that no change in resistance value occurs, so there is no effect on the output of the semiconductor pressure sensor.

さらに、バイアス電圧VBの印加部には直列に接続され
た拡散接続信号線がないので、印加圧カー出力電圧値の
直線性を悪化させる要因が除去されている。
Furthermore, since there is no serially connected diffusion connection signal line in the bias voltage VB application section, a factor that deteriorates the linearity of the applied pressure Kerr output voltage value is eliminated.

(発明の効果) 以上説明したように、本発明によれば、ゲージ用拡散抵
抗と電極パッド間を接続する拡散接続信号線が、歪によ
り影響を受けない方向に配置され、且つバイアス印加部
に直列に挿入された拡散接続信号線がないので、出力特
性の直線性を大幅に向上することができる。
(Effects of the Invention) As described above, according to the present invention, the diffused connection signal line connecting between the gauge diffused resistor and the electrode pad is arranged in a direction that is not affected by strain, and is connected to the bias applying section. Since there is no spread connection signal line inserted in series, the linearity of the output characteristics can be greatly improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明による半導体圧力センサ平面図、第2図
はその等価回路図、第3図は従来の半導体圧力センサの
平面図、第4図はその等価回路図である。 1・・・基板、1a・・・ダイアフラム、 2a。 2 b 、 2 c 、 2 d−ゲージ用拡散抵抗、
 3a。 3 b 、 3 c 、 3 d−電極パッド、  4
a、 4b。 4ct 4d、 5a、 5b、 5c、 5d、 5
e、 5f。 6a、 6b・・・拡散接続信号線。 第1図 C 1−9基板  〕〕aミーダイアフ ラム2a、2b、22d−リー−”j#41i散%t7
L  3a、3b、3c、 3d−電Mバ、7ド5a、
5b、5c、5d、5e、5f、6a、6b JE散持
続伍’=n第2図 b 第3図 −<410> 1一基板  1a−ダイヤフラム 2a、2b、2C,2d−グ―゛i用[敗MFA   
3a、3b、3c、3d−、電檜パ・、ド4a、4b、
4c、4d −J:fi!に才(ト一りで546勺1【
第4図 h
FIG. 1 is a plan view of a semiconductor pressure sensor according to the present invention, FIG. 2 is an equivalent circuit diagram thereof, FIG. 3 is a plan view of a conventional semiconductor pressure sensor, and FIG. 4 is an equivalent circuit diagram thereof. 1...Substrate, 1a...Diaphragm, 2a. 2b, 2c, 2d-gauge diffused resistor,
3a. 3b, 3c, 3d-electrode pad, 4
a, 4b. 4ct 4d, 5a, 5b, 5c, 5d, 5
e, 5f. 6a, 6b... Diffusion connection signal lines. Fig. 1 C 1-9 board]]a me diaphragm 2a, 2b, 22d-Lee-"j#41i dispersion%t7
L 3a, 3b, 3c, 3d-Electric M bar, 7 Do 5a,
5b, 5c, 5d, 5e, 5f, 6a, 6b JE dispersion duration '=n Fig. 2 b Fig. 3 - <410> 1 - Substrate 1a - Diaphragm 2a, 2b, 2C, 2d - For goo i [Defeated MFA
3a, 3b, 3c, 3d-, electric cypress pa., de 4a, 4b,
4c, 4d-J:fi! Nii (546 people in one person)
Figure 4h

Claims (1)

【特許請求の範囲】[Claims] (100)面を持つシリコン単結晶板に形成したダイア
フラム上に、〈110〉軸方向にゲージ用の拡散抵抗を
配置し、上記の拡散抵抗間および電極パッドとの間を接
続する拡散接続信号線を〈110〉軸と45゜をなす方
向に形成したことを特徴とする半導体圧力センサ。
A diffused resistor for a gauge is arranged in the <110> axis direction on a diaphragm formed on a silicon single crystal plate having a (100) plane, and a diffused connection signal line connects between the diffused resistors and the electrode pad. A semiconductor pressure sensor characterized in that the pressure sensor is formed in a direction making an angle of 45 degrees with the <110> axis.
JP63035361A 1988-02-19 1988-02-19 Semiconductor pressure sensor Pending JPH01211986A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63035361A JPH01211986A (en) 1988-02-19 1988-02-19 Semiconductor pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63035361A JPH01211986A (en) 1988-02-19 1988-02-19 Semiconductor pressure sensor

Publications (1)

Publication Number Publication Date
JPH01211986A true JPH01211986A (en) 1989-08-25

Family

ID=12439750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63035361A Pending JPH01211986A (en) 1988-02-19 1988-02-19 Semiconductor pressure sensor

Country Status (1)

Country Link
JP (1) JPH01211986A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0729019A2 (en) * 1995-02-27 1996-08-28 Motorola, Inc. Method of forming a piezoresistive pressure sensor and a piezoresistive pressure sensor
US5872315A (en) * 1996-02-26 1999-02-16 Denso Corporation Pressure detecting apparatus
KR100248194B1 (en) * 1997-07-31 2000-03-15 김춘호 Piezoresistor pressure sensor and manufacturing method thereof
JP2008215892A (en) * 2007-02-28 2008-09-18 Yamatake Corp Pressure sensor
WO2014080759A1 (en) * 2012-11-26 2014-05-30 日立オートモティブシステムズ株式会社 Pressure sensor
JP2018100975A (en) * 2018-02-07 2018-06-28 株式会社東芝 Pressure sensor, acoustic microphone, blood pressure sensor and touch panel
US10234343B2 (en) 2013-06-12 2019-03-19 Kabushiki Kaisha Toshiba Pressure sensor, acoustic microphone, blood pressure sensor, and touch panel

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0729019A2 (en) * 1995-02-27 1996-08-28 Motorola, Inc. Method of forming a piezoresistive pressure sensor and a piezoresistive pressure sensor
EP0729019A3 (en) * 1995-02-27 1996-12-11 Motorola Inc Method of forming a piezoresistive pressure sensor and a piezoresistive pressure sensor
EP0729019B1 (en) * 1995-02-27 2001-10-10 Motorola, Inc. Piezoresistive sensors with overlapping contacts
US5872315A (en) * 1996-02-26 1999-02-16 Denso Corporation Pressure detecting apparatus
KR100248194B1 (en) * 1997-07-31 2000-03-15 김춘호 Piezoresistor pressure sensor and manufacturing method thereof
JP2008215892A (en) * 2007-02-28 2008-09-18 Yamatake Corp Pressure sensor
WO2014080759A1 (en) * 2012-11-26 2014-05-30 日立オートモティブシステムズ株式会社 Pressure sensor
JP2014106013A (en) * 2012-11-26 2014-06-09 Hitachi Automotive Systems Ltd Pressure sensor
US9835508B2 (en) 2012-11-26 2017-12-05 Hitachi Automotive Systems, Ltd. Pressure sensor having strain gauges disposed on a diaphragm
US10234343B2 (en) 2013-06-12 2019-03-19 Kabushiki Kaisha Toshiba Pressure sensor, acoustic microphone, blood pressure sensor, and touch panel
JP2018100975A (en) * 2018-02-07 2018-06-28 株式会社東芝 Pressure sensor, acoustic microphone, blood pressure sensor and touch panel

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