JPH01211878A - Rehabilitation of i/o pin - Google Patents

Abstract

PURPOSE:To rehabilitate all kinds of I/O pins including a power feed pin by sticking a circular rehabilitating pad to the missing portion of an I/O pin, filling solder on its center, and erecting the I/O pin. CONSTITUTION:A circular rehabilitating pad 3 made of a conducting material forming a metal plating layer 30 is fixed to the broken portion of a ceramic substrate by filling an adhesive in a recess groove 31. Paste-shaped solder 4 is then filled in the pad 3, a new I/O pin 2 is erected to allow the solder 4 to reflow. The solder 4 forms a fillet 40 and is solidified, the pin 2 is firmly fitted while maintaining the conductive state to a through via hole 11. A power feed pin can be also rehabilitated like an ordinary signal pin.

Description

[Detailed Description of the Invention] [Summary] I falling off a ceramic substrate such as a pin grid array
How to repair I/O pins, including power supply pins, how to repair I/O pins
With the aim of making it possible to repair even /O pins, a conductive ring-shaped repair pad was bonded to the part of the ceramic board where the I/O pin had fallen off, and then paste-like solder was applied to the center of the repair pad. The ceramic substrate is filled with I/O pins, and the solder is reflowed to stand up I/O pins on the ceramic substrate.

[Industrial application field]

The present invention relates to an I/O pin repair method for repairing I/O pins that have fallen off from a ceramic substrate such as a bin grid array.

In recent years, due to the demand for smaller and faster computer systems, circuit board modules in which a plurality of semiconductor elements are mounted on a ceramic substrate have been used.

I/O pins are mounted in a matrix on the back surface of this circuit board for power supply and signal input/output. The above-mentioned I/O pins are joined to the ceramic substrate by soldering, but when assembling the circuit board, the I/O pins may fall off the ceramic substrate due to operational errors. Dropped I/O pins need to be repaired.

[Prior Art] When an I/O pin falls off from a ceramic substrate, there are three main modes as shown in FIG. That is, in the first mode (Fig. 3 (
a)), a second mode involving pad/O separation (see FIG. 3(b)), and a third mode involving destruction of the ceramic substrate 1 (see FIG. 3(C)).

If the I/O pin 2 falls off in the first mode, it can be restored to its original state by applying paste solder 4 to the pad/O and reflowing the solder 4. and in the case of the third shedding mode,
Since it is no longer possible to restore the electrical connection between the ceramic substrate l and the through-via 11, as shown in FIG. The connection was made using wire 6.

[Problems to be Solved by the Invention] However, the above-mentioned wiring connection is time-consuming, and if the dropped I/O pin 2 is a power supply pin, a power drop may occur due to the resistance of the wire 6. Due to the large size, this method could not be used and had the problem that the circuit board had to be discarded.

The present invention was made under such circumstances, and
Easily and including power supply pins, any kind of I
An object of the present invention is to provide a method for repairing an I/O pin that can repair even the /O pin 2.

[Failure to solve the problem]

According to the present invention, the above object is to adhere an annular conductive repair pad to the part of the ceramic substrate where the I/O pin has fallen off, and then fill the center part of the repair pad with paste solder. This is accomplished by providing a method for repairing I/O pins in which the I/O pins are erected on a ceramic substrate by reflowing solder.

[Function] Based on the above configuration, the I/O that has fallen off from the ceramic substrate 1
The O-bottle 2 is re-fixed at the center of the annular repair pad 3 with reflowed solder 4, and returned to its original state.

In this way, in the present invention, the I/O pin 2 that has fallen off the ceramic base Fi1 can be repaired without wiring.

〔Example〕

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 shows a state in which the I/O pin 2 has fallen off from the ceramic substrate 1 due to the third mode described above.
The O pin 2 is detached from the pad/O formed as a thin film or a thick film on the ceramic substrate 1 and the ceramic portion 12.

In such a state, first, as shown in FIG. 1(a), an annular repair pad 3 is adhered to the damaged part of the ceramic substrate 1, and a paste solder 4 is applied to the center of the repair pad 3.
(See Figure 1(a)).

The repair pad 3 is formed by molding a conductive material such as copper or aluminum into an annular shape, and has a metal plating layer 30 of good solder wettability, such as gold, on the part exposed to the outside when bonded to the ceramic substrate 1. It is formed. Further, on the back surface of this repair pad 3, that is, on the surface that comes into contact with the ceramic substrate 1, a groove 31 is formed to form an adhesive reservoir between the surface of the ceramic substrate 1 and the groove 31 is filled with a groove. After filling the thermosetting adhesive 5, it is considered that the repair pad 3 can be fixed by pressing the surface coated with the adhesive 5 against the ceramic substrate 1.

On the other hand, the paste solder 4 may be a well-known cream solder or the like, and is filled to the extent that it bulges out from the top surface of the repair pad 3 slightly.

After this, a new I/O pin 2 is placed on the paste solder 4.
When the solder 4 is locally heated or reflowed in a reflow furnace, the solder 4 forms a fillet 40 and solidifies, as shown in FIG.
is firmly mounted on the ceramic substrate 1 while maintaining conduction with the through-via 11.

In the above, the present invention has been explained by taking as an example the case of the third mode, that is, the falling-off mode of the I/O pin 2 accompanied by the breakage of the ceramic substrate 1, but the present invention can be similarly applied to other modes as well. It goes without saying that repairs can be made.

C Effects of the Invention] As is clear from the above explanation, according to the I/O bin repair method according to the present invention, troublesome work such as wiring is not required during repair work, so the repair work becomes easy and Since the repair method does not use wires, there is no power drop, and repair of power supply pins can be performed in the same way as normal signal pins, and any type of I/O
Even bottles can be repaired.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram showing an embodiment of the present invention, Fig. 2 is an I/O
FIG. 3 is an explanatory diagram showing a pin falling state, FIG. 3 is an explanatory diagram showing an I/O pin dropping mode, and FIG. 4 is an explanatory diagram showing a conventional example. In FIG. 1, 1 is a ceramic substrate, 2 is an I/O bin, 3 is a repair pad, and 4 is solder. , l ￥ All inventions have been made by the I-Ratsu-sho Agency/Suto-bone day chart Fig. 1 (a+ (bl (cl panic green example υ ding explanation mouth Fig.

Claims (1)

[Claims] A conductive annular repair pad (3) is adhered to the part of the ceramic substrate (1) where the I/O pin (2) has fallen off, and then a paste solder (4) is applied to the center of the repair pad (3). I/O pins (2) are erected on the ceramic substrate (1) by filling and reflowing the solder (4).
/How to repair O pin.