JPH01210184A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPH01210184A
JPH01210184A JP63035917A JP3591788A JPH01210184A JP H01210184 A JPH01210184 A JP H01210184A JP 63035917 A JP63035917 A JP 63035917A JP 3591788 A JP3591788 A JP 3591788A JP H01210184 A JPH01210184 A JP H01210184A
Authority
JP
Japan
Prior art keywords
laser beam
workpiece
detection
machined
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63035917A
Other languages
Japanese (ja)
Inventor
Tsutomu Horinouchi
堀ノ内 力
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP63035917A priority Critical patent/JPH01210184A/en
Publication of JPH01210184A publication Critical patent/JPH01210184A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To control the output of a laser beam and to simplify a program by reflecting a part of the laser beam on material to be machine slightly ahead in the proceeding direction and detecting this by an element fitted to a different place. CONSTITUTION:The laser beam 10 oscillated from a laser beam oscillator 6 is reflected and condensed in the direction of the material 3 to be machined by a reflection mirror 1 to perform machining. A mirror part 2 for detection reflects a part of the laser beam 10 and a laser beam 11 for detection is projected on the position 8 slightly ahead in the direction of the machining direction from the machining position 9 of the surface of the material 3 to be machined through an aperture 13. The beam 11 for detection is reflected from the position 8 which is detected by a photodetector 5 via a light receiving device 4. Bits of information such as material and surface conditions of the material 3 to be machined are fed back to the laser beam oscillator 6 via a feedback controller 7 and its output is controlled. By this method, the output of laser beam oscillator 6 is controlled and the program is simplified and machining is performed according to the state of the material 3 to be machined.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、レーザビームを使用して被加工物を加工する
レーザ加工機に関し、とくに、板状の被加工物を切断す
る場合、微妙な表面状態の変化や材質の変化に伴い、レ
ーザビームの出力を制御できるレーザ加工機に関する。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a laser processing machine that processes a workpiece using a laser beam, and in particular, when cutting a plate-shaped workpiece, delicate The present invention relates to a laser processing machine that can control laser beam output according to changes in surface conditions and materials.

[従来の技術] 従来、この種のレーザ加工機の切断制御は、予めプログ
ラム中で出力を制御する方法しか取り得なかった。
[Prior Art] Conventionally, the only way to control the cutting of this type of laser processing machine was to control the output in advance in a program.

[発明が解決しようとする課題] たとえば、第2図に示す様な同じ表面状態をもつものの
、異なる2種類以上の材質A、Bより構成された被加工
物31を、レーザビームにて切断する場合、上述した従
来の技術では、予め材質のA、Hの変化する位置を算出
して、プログラム中で制御するという方法しか取り得な
かった。そのため、複雑な形状の製品の加工となると、
材質A、Bの変化する個所を通過する回数が増えるため
、プログラムが複雑になってしまうという欠点かある。
[Problems to be Solved by the Invention] For example, a workpiece 31 that has the same surface condition as shown in FIG. 2 but is made of two or more different materials A and B is cut with a laser beam. In this case, with the above-mentioned conventional technology, the only method available is to calculate in advance the changing positions of A and H of the material and control it in a program. Therefore, when it comes to processing products with complex shapes,
The disadvantage is that the program becomes more complex because the number of times it passes through locations where materials A and B change is increased.

また、第3図に示す様に、同一材料であっても、表面状
態C,Dが、微妙に変化している被加工物32の場合、
同じ出力で切断加工を行なうために、切断面の状態が均
一にならないという欠点がある。
Further, as shown in FIG. 3, in the case of a workpiece 32 whose surface conditions C and D slightly change even though it is made of the same material,
Since the cutting process is performed with the same output, there is a drawback that the condition of the cut surface is not uniform.

[課題を解決するための手段] 本発明のレーザ加工機は、被加工物にレーザビームを照
射して加工するレーザ加工機において、少なくとも、前
記レーザビームの一部を反射して、前記加工の位置より
前方の当該被加工物を照射する検出用のミラー部と、該
ミラー部により反射され、前記被加工物の照射後に反射
された前記レーザビームの一部を検出する手段と、を備
えていることを特徴とする。
[Means for Solving the Problems] A laser processing machine of the present invention is a laser processing machine that processes a workpiece by irradiating a laser beam to the workpiece, and reflects at least a part of the laser beam to perform the processing. A detection mirror unit that irradiates the workpiece in front of the position, and a means for detecting a part of the laser beam that is reflected by the mirror unit and reflected after irradiating the workpiece. It is characterized by the presence of

[作 用] したがって本発明によると、レーザビームの一部が進行
方向の数ミリ先の被加工物で反射され、それを他の個所
に取付だ素子により検出するため、レーザビームの出力
を制御できると共に、結果として、プログラムの簡素化
ならびに加工面の均一化を得ることができる。
[Function] Therefore, according to the present invention, a part of the laser beam is reflected by the workpiece several millimeters ahead in the traveling direction, and this is detected by an element attached to another location, so that the output of the laser beam is controlled. As a result, the program can be simplified and the machined surface can be made uniform.

[実施例] 以下に本発明を、その実施例について図面を参照して説
明する。
[Example] The present invention will be described below with reference to the drawings.

第1図は、本発明による一実施例を概略的に示す断面図
で、加工される被加工物3の表面の上方に、該被加工物
3の表面と平行なレーザビームlOを放射するHgTe
−(:dTe素子等のレーザ発振器6が設けられ、該レ
ーザビーム10は大きな反射鏡1によって、被加工物3
に向けられる。
FIG. 1 is a cross-sectional view schematically showing an embodiment of the present invention, in which a laser beam IO parallel to the surface of the workpiece 3 is emitted above the surface of the workpiece 3 to be machined.
-(: A laser oscillator 6 such as a dTe element is provided, and the laser beam 10 is transmitted to the workpiece 3 by a large reflecting mirror 1.
directed towards.

12はレーザビームlOを集束するレンズ、14は該レ
ンズ12を囲むケース、13は該ケース14の周壁に開
口される窓である。
12 is a lens that focuses the laser beam IO; 14 is a case surrounding the lens 12; and 13 is a window opened in the peripheral wall of the case 14.

大きな反射鏡1の反射面のほぼ中央に突出されているの
は、検出用のミラー部2で、該ミラー部2はレーザビー
ム10の一部を反射して、窓13から検出用ビーム11
を被加工物3に照射する。被加工物3で反射された検出
用ビーム11は、受光装置4で集められると共に、光検
知器5で検出され、該検出信号はフィードバック制御装
置7に送られ、該フィードバック制御装置7はレーザ発
振器6をコントロールする。
A detection mirror section 2 is protruded from approximately the center of the reflecting surface of the large reflecting mirror 1, and the mirror section 2 reflects a portion of the laser beam 10 and directs the detection beam 11 through the window 13.
irradiates the workpiece 3 with The detection beam 11 reflected by the workpiece 3 is collected by the light receiving device 4 and detected by the photodetector 5, and the detection signal is sent to the feedback control device 7, which controls the laser oscillator. Control 6.

上述の実施例の動作を説明すると、レーザ発振器6から
発振されるレーザビームIOは、ビーム偏向器を構成す
る反射鏡1によって被加工物3に向けて反射され、被加
工物3の表面で集光されて加工を行なう。
To explain the operation of the above embodiment, the laser beam IO emitted from the laser oscillator 6 is reflected toward the workpiece 3 by the reflecting mirror 1 constituting the beam deflector, and is focused on the surface of the workpiece 3. It is illuminated and processed.

検出用のミラー部2は、レーザビームlOの一部を反射
し窓13を通して、検出用ビーム11を被加工物3の表
面の、加工位置9から加工方向に向けて僅かに前方の位
置8を照射する。
The detection mirror unit 2 reflects a part of the laser beam 10, passes through the window 13, and directs the detection beam 11 from the processing position 9 on the surface of the workpiece 3 to a position 8 slightly forward in the processing direction. irradiate.

分岐された検出用ビーム11は、位置8から反射され、
受光装置4を介して光探知器5によって検知され、該被
加工物3の材質ならびに表面状況等に応じた情報を得る
ことになり、フィードバック制御装置7を介在してレー
ザ発振器6に帰還することにより、該レーザ発振器6の
出力を制御して被加工物3の状態に応じた加工を行なう
ことになる。
The branched detection beam 11 is reflected from position 8,
It is detected by the light detector 5 via the light receiving device 4, and information corresponding to the material and surface condition of the workpiece 3 is obtained, and the information is fed back to the laser oscillator 6 via the feedback control device 7. Accordingly, the output of the laser oscillator 6 is controlled to perform processing according to the state of the workpiece 3.

なお、被加工物3の表面において、反射の位置8と加工
の位置9との距離は、溶接、切断など加工の種類によっ
て異なるが、数mmが適切である。
The distance between the reflection position 8 and the processing position 9 on the surface of the workpiece 3 varies depending on the type of processing such as welding or cutting, but is suitably several mm.

ここで上述の実施例を言い換えて要約すると、本実施例
は、レーザ発振器より出力されるレーザビームの一部を
、検出ビーム用のミラー部にて被加工物に反射させ、進
行方向の表面状態、材質の変化等を検出して、その情報
をフィードバック制御系にてフィードバックを行ない、
前記レーザ発振器の出力を制御させる事を特徴とするレ
ーザ加工器の出力制御方式である。
To summarize the above-mentioned embodiment in other words, this embodiment reflects a part of the laser beam output from the laser oscillator onto the workpiece using a detection beam mirror to improve the surface condition in the traveling direction. , detect changes in material, etc., and feed that information back to the feedback control system.
This is an output control method for a laser processing machine characterized by controlling the output of the laser oscillator.

[発明の効果] 以上説明したように本発明は、改良された反射鏡を用い
ることで、レーザビームの一部を被加工物の加工直前に
、該被加工物の微妙な表面状態や材質の変化を検出でき
るため、これによってレーザビームの出力を制御できる
と共に、プログラムの簡素化がはかれ、しかも均一な加
工面が得られるという効果がある。
[Effects of the Invention] As explained above, the present invention uses an improved reflecting mirror to direct a portion of the laser beam to the workpiece immediately before processing the workpiece, to reflect the delicate surface condition and material of the workpiece. Since changes can be detected, the output of the laser beam can be controlled, the program can be simplified, and a uniform machined surface can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明による一実施例を示す概略的な断面図
、第2図ならびに第3図はそれぞれ、同上を説明するた
めの斜視図である。 1・・・反射鏡、 2・・・検出用のミラー部、 3・・・被加工物、 4・・・受光装置、 5・・・光検知器、 6・・・レーザ発振器、 7・・・フィードバック制御装置。
FIG. 1 is a schematic sectional view showing one embodiment of the present invention, and FIGS. 2 and 3 are perspective views for explaining the same. DESCRIPTION OF SYMBOLS 1... Reflection mirror, 2... Mirror part for detection, 3... Workpiece, 4... Light receiving device, 5... Photodetector, 6... Laser oscillator, 7...・Feedback control device.

Claims (1)

【特許請求の範囲】 1)被加工物にレーザビームを照射して加工するレーザ
加工機において、少なくとも、 前記レーザビームの一部を反射して、前記加工の位置よ
り前方の当該被加工物を照射する検出用のミラー部と、 該ミラー部により反射され、前記被加工物の照射後に反
射された前記レーザビームの一部を検出する手段と、 を備えていることを特徴とするレーザ加工機。 2)前記の検出する手段から得られる検出信号によって
、前記のレーザビームを発生するレーザ発振器をコント
ロールするフィードバック制御装置を備えている前記請
求項1に記載のレーザ加工機。
[Claims] 1) In a laser processing machine that processes a workpiece by irradiating it with a laser beam, at least a portion of the laser beam is reflected to target the workpiece in front of the processing position. A laser processing machine comprising: a detection mirror section for irradiation; and means for detecting a part of the laser beam that is reflected by the mirror section and reflected after irradiating the workpiece. . 2) The laser processing machine according to claim 1, further comprising a feedback control device that controls a laser oscillator that generates the laser beam based on a detection signal obtained from the detection means.
JP63035917A 1988-02-17 1988-02-17 Laser beam machine Pending JPH01210184A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63035917A JPH01210184A (en) 1988-02-17 1988-02-17 Laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63035917A JPH01210184A (en) 1988-02-17 1988-02-17 Laser beam machine

Publications (1)

Publication Number Publication Date
JPH01210184A true JPH01210184A (en) 1989-08-23

Family

ID=12455385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63035917A Pending JPH01210184A (en) 1988-02-17 1988-02-17 Laser beam machine

Country Status (1)

Country Link
JP (1) JPH01210184A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7825349B2 (en) 2005-11-10 2010-11-02 Hon Hai Precision Industry Co., Ltd. Laser system and method for patterning mold inserts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7825349B2 (en) 2005-11-10 2010-11-02 Hon Hai Precision Industry Co., Ltd. Laser system and method for patterning mold inserts

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