JPH01207960A - Power module element - Google Patents

Abstract

PURPOSE:To remove an electrical exposure part outside and install elements outside the apparatus, by connecting wires, outer circumferences of which are insulated with insulation covering materials, with a plurality of semiconductor elements and by taking out the non-connected end side of the wires outside after coating the connected end side of these wires. CONSTITUTION:Transistors consisting of a plurality of semiconductor elements are coated with an insulation substance 2 and are shaped in the form of a plate. One end side of an input signal wire 13, an outer circumference of which is insulated, is connected with an input signal part of a plurality of transistors which are coated with the insulation substance 2 and the other end side of the input signal wire 13 is taken outside. One end side of a power wire 14, an outer circumference of which is insulated, is connected with a power terminal part of the transistors which are coated with the insulation substance 2 and the other end side of the power wire 14 is taken outside. As electrical exposure parts disappear in this way, a power module element 11 is incorporated outside the gastight apparatus 6.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a power module element, and particularly to the structure of a power module element.

[Conventional technology]

Fig. 8 is a perspective view showing a conventional power module element, Fig. 9 is a circuit diagram of the power module element, Fig. 10 is a perspective view showing the state in which the power module element is incorporated into a sealed device, and Fig. 11 is a power module element. FIG. 2 is an explanatory diagram showing the state of heat inside a sealed device incorporating a module element.

In FIGS. 8 and 9, (1) is a now-a-day module element in which transistors Tr, which are six semiconductor elements, are covered with an insulator (2) and formed into a flat plate shape. (
3) is an input signal terminal that is electrically exposed to the surface of the insulator (2), and (4) is an input signal terminal that is also electrically exposed to the surface of the insulator (2). The input signal terminal (3) and the power terminal (4) are connected to lead wires using faston terminals or screws.In this way, the input signal terminal (3) and the power terminal The reason why the terminal (4) is electrically exposed as a conductive part on the surface of the insulator (2) is to provide versatility so that those using the transistor Tr can freely select lead wires of different diameters. This is to make it last.

Conventional power module elements are configured as above,
When using, please connect the input signal terminal (3) and Nonowa terminal (
Since terminals (4) and (4) are electrically exposed to the outside, it is conceivable to cover these terminals (3) and (4) with a cover to prevent electric shock, but even if they are covered, they must be secured fairly tightly. The power module element (1) must be installed inside a sealed device, as shown in Figure 10, because this requires a lot of effort and reduces safety. there were.

In Fig. 10, (6) is a sealed device, (7) is a picture-shaped chassis that is the main body of the sealed device (6), (7) is a heat dissipation fin provided at the bottom of the chassis (7), ( 9) is a fan attached to a heat dissipation fin (8), and (10) is a control unit that is installed inside the chassis (7) together with a power module (1) that is a heat generating element, and is equipped with electronic components that are sensitive to heat. It is a printed circuit board.

As described above, since the power module element (1) is disposed and used within the chassis (7) of the sealed device (6), it is excellent in terms of dust prevention.

[Problem to be solved by the invention]

In the conventional power module element as described above, the input signal terminal (3) is connected to multiple transistors (1).
Since the power terminal (4) is electrically exposed to the surface of the insulator (2) covering the transistor (1),
For safety measures such as preventing electric shock, the power module element (1) is used by being incorporated inside a chassis (7) which has a heat dissipation fin (8) and a fan (9) attached at the bottom. The heat generated in the power module element (11) during use is the first
As shown in Figure 1, the bottom surface of the power module element (1) is in contact with the bottom of the chassis (7), so heat is transferred from the bottom of the power module element (1) to the bottom of the chassis (7). However, the power module element (1
) is also emitted into the chassis (7) from the upper part of the power module element (1). The heat transferred to the lower part of the chassis (7) is transferred to the heat dissipation fins (8) and released to the outside, but at the upper peripheral edge of the heat dissipation fins (8), the heat is transferred to the chassis (7) and the heat is transferred to the chassis (7). 7) Communicated internally. Therefore, heat is released from the upper part of the power module element (1) and the heat dissipation fin (8)
) is transferred to the chassis (7) from the upper periphery of the chassis (7), causing heat to accumulate inside the chassis (7).
) There was a problem in that it adversely affected heat-sensitive electronic components mounted on the control printed board (10) disposed inside. In addition, in order to avoid this negative effect, heat dissipation fins (8
) In order to increase the heat dissipation effect of the heat dissipation fins (8), it is necessary to increase the size of the heat dissipation fins (8), or to increase the efficiency of heat dissipation from the heat dissipation fins (8) to the outside, it is necessary to install a fan (9). In order to solve this problem, it is an object of the present invention to provide a power module element that can be installed outside the equipment by eliminating electrically exposed parts.

[Means to solve the problem]

The power module element according to the present invention connects a plurality of semiconductor elements to a wire whose outer periphery is insulated by an insulating coating material,
The connecting ends of the wires and the plurality of semiconductor elements are covered with an insulating material, and the non-connecting ends of the wires are taken out to the outside.

[Effect]

In this invention, a wire whose outer periphery is insulated by an insulating coating material is connected to a plurality of semiconductor elements, the connecting ends of these semiconductor elements and the wires are covered with an insulating material, and the unconnected ends of the wires are taken out to the outside. Since there are no external electrically exposed parts, the power module element can be incorporated outside the sealed device.

〔Example〕

Fig. 1 is a perspective view showing an embodiment of the present invention, Fig. 2 is a perspective view showing a state in which a power module element is incorporated into a sealed device, and Fig. 3 is a bottom view of a sealed device in which a power module element is incorporated. 4 are explanatory diagrams showing the thermal state of a sealed device incorporating a power module element.

In FIG. 1, (11) is a power module element,
A plurality of transistors (not shown), which are semiconductor elements, are covered with an insulating material (12) and formed into a flat plate shape.

(13) is an input signal line whose outer periphery is insulated, one end of which is connected to the input signal section of a plurality of transistors covered with an insulator (12), and the other end of the input signal line (13) is It is taken outside. (14) is a power line whose outer periphery is insulated, one end of which is connected to the power terminal of the transistor covered with insulator (12), and the other end of the power line (14) is taken out to the outside. ing. (15)
is an insulating coating material that insulates the outer peripheries of the input signal line (13) and the power line (14), respectively.

The power module element (11) having such a configuration is made of an insulator (
Connect the input signal line (13) to the transistor covered by (12)
Since the and power wires (14) are connected, there is no room to choose wires with different diameters after connection, but the current flowing through the input signal wires (13) and power wires (14) is already almost fixed. Therefore, since the current capacity or rating of the wire is determined, there is no problem for the device user even if the wire is taken out.

In the power module element configured as above, the input signal line (13) and power line (14) connected to the transistor covered by the insulator (12) are taken out to the outside of the insulator (12). These lines (13)
(14) are each insulated with an insulating coating material (15), so when in use, as shown in Figures 2 and 3, the lower part of the sealed device (6), that is, the chassis (7) Even if it is incorporated into the center of the lower outer surface of the heat dissipation fin (8) attached to the lower part, there is no safety problem because the power module element (11) has no electrically exposed parts.

In addition, the influence of heat generated in the power module element (11) is also reduced when the power module element (11) is connected to the heat radiation fin (8).
Since the heat generated from the outer surface of the power module element (11) is completely dissipated to the outside, no heat is trapped inside the chassis (7). Therefore, the heat-sensitive electronic components mounted on the control printed circuit board (10) disposed inside the chassis (7) can be protected from the heat generated from the power module element (11). Furthermore, the heat dissipation fins (8) can be made smaller, and there is no need to provide a fan (9) as in the conventional case. Therefore, the chassis (7) can also be downsized.

Figure 5 is a perspective view showing the power module element incorporated into another type of sealed equipment, Figure 6 is a bottom view of the sealed equipment incorporating the power module element, and Figure 7 is the power module element assembled into another type of sealed equipment. FIG. 3 is an explanatory diagram showing the thermal state of the incorporated sealed device.

An example of how to use this power module element is to remove the heat dissipation fin (8) from the bottom of the chassis (7) via the struts (16) attached to the corners of the chassis (7). The power module element (11) is then removed.

In this usage example, the heat dissipation fin (8) is completely separated by the chassis (7) and the support column (16) via the space (17), so the heat dissipation area of the heat dissipation fin (8) is doubled. The heat transferred from the power module element (11) to the radiation fins (8) is transferred to the outside, and the amount of heat transferred to the chassis (7) becomes extremely small.

Therefore, the control printed circuit board (1) inside the Nyashi (7)
The amount of heat transferred to the heat-sensitive electronic components mounted on the 0) is extremely small.

〔Effect of the invention〕

As explained above, the present invention connects a plurality of semiconductor elements with a wire whose outer periphery is insulated with an insulating coating, coats the connecting end of the semiconductor and the wire with an insulating material, and connects the unconnected end of the wire with an external Since there are no electrically exposed parts on the outside of the power module element, the power module element can be installed on the outside of the sealed device, and is thermally isolated from the components installed inside the sealed device. As a result, heat-sensitive parts can be protected from the heat of the power module, the heat dissipation fins can be made smaller, and since a fan is not required, the entire device can also be made smaller.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing an embodiment of the present invention, Fig. 2 is a perspective view showing a power module installed in a sealed device, and Fig. 3 is a bottom view of a sealed device incorporating a power module element. , Fig. 4 is an explanatory diagram showing the thermal state of a sealed device incorporating a power module element, Fig. 5 is a perspective view showing a state in which the power module element is incorporated into another type of sealed device, and Fig. 6 is a bottom view of a sealed device incorporating a power module element, FIG. 7 is an explanatory diagram showing the thermal state of a sealed device incorporating a power module element, and FIG. 8 is a perspective view showing a conventional power module element. Figure 9H is a circuit diagram of the power module element, Figure 10 is a perspective view showing the state in which the power module element is incorporated into a sealed device, and Figure 11 is a diagram showing the thermal state inside the sealed device in which the power module element is incorporated. FIG. In the figure, (11) is a power module element, (12)
) is an insulator, (13) is an input signal line, (14) is a power line, and (15) is an insulating coating material. In each figure, the same reference numerals indicate the same or corresponding parts. Agent Patent Attorney Muneharu SasakiFigure 4Figure 5Figure 7Figure 8Figure 1 RyoFigure 6Figure 9

Claims (1)

[Claims] It is characterized by connecting multiple semiconductor elements with wires whose outer peripheries are insulated by an insulating coating, covering the connecting ends of these semiconductor elements and the wires with an insulating material, and taking out the non-connecting ends of the wires to the outside. power module element.