JPH01205065A - Manufacture of copper or copper-alloy bar having zn diffusion layer on surface - Google Patents
Manufacture of copper or copper-alloy bar having zn diffusion layer on surfaceInfo
- Publication number
- JPH01205065A JPH01205065A JP2804488A JP2804488A JPH01205065A JP H01205065 A JPH01205065 A JP H01205065A JP 2804488 A JP2804488 A JP 2804488A JP 2804488 A JP2804488 A JP 2804488A JP H01205065 A JPH01205065 A JP H01205065A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- strip
- brass
- diffusion layer
- bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 239000010949 copper Substances 0.000 title claims abstract description 41
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 40
- 238000009792 diffusion process Methods 0.000 title claims abstract description 33
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 229910001369 Brass Inorganic materials 0.000 claims abstract description 32
- 239000010951 brass Substances 0.000 claims abstract description 32
- 239000011162 core material Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 9
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 8
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 6
- 229910052785 arsenic Inorganic materials 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 3
- 229920000642 polymer Polymers 0.000 claims description 7
- 229910052790 beryllium Inorganic materials 0.000 claims description 3
- 229910052793 cadmium Inorganic materials 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 229910052745 lead Inorganic materials 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 14
- 238000007747 plating Methods 0.000 abstract description 5
- 229910052725 zinc Inorganic materials 0.000 abstract description 5
- 238000007740 vapor deposition Methods 0.000 abstract description 4
- 239000010953 base metal Substances 0.000 abstract 4
- 239000000203 mixture Substances 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 238000005253 cladding Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 241001122767 Theaceae Species 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 2
- 241000257465 Echinoidea Species 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は表面にＺｎの拡散層を有する銅又は銅合金条の
製造法に関するもので、特に電気メツキ、溶融メツキ、
＠肴９機械的クラッド等高価なＺｎ被覆設備を用いるこ
となく、銅又は銅合金条の表面にＺｎの拡散層を形成さ
せる簡便な方法を提供するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing copper or copper alloy strips having a Zn diffusion layer on the surface, and particularly relates to a method for manufacturing copper or copper alloy strips having a Zn diffusion layer on the surface, and in particular, electroplating, hot-dip plating,
@Sake 9 This provides a simple method for forming a Zn diffusion layer on the surface of a copper or copper alloy strip without using expensive Zn coating equipment such as mechanical cladding.
（従来の技術）
一般に銅又は銅合金条の表面にＺｎを拡散させたものは
、Ｚｎの拡散層が犠牲腐食効果を示し、これと接する他
部材や芯材の孔食を防止するところから熱交換器のチュ
ーブやフィンに多用されている。銅又は銅合金条の表面
にＺｎの拡散層を形成する方法としては、電気メツキ。(Prior art) In general, when Zn is diffused on the surface of a copper or copper alloy strip, the Zn diffusion layer exhibits a sacrificial corrosion effect and prevents pitting corrosion of other members and core materials that come into contact with it. It is often used for exchanger tubes and fins. Electroplating is a method for forming a Zn diffusion layer on the surface of a copper or copper alloy strip.
溶融メツキ、蒸着２機械的クラッド等により、芯材とな
る銅又は銅合金の表面にＺｎを被覆し、これを加熱する
ことにより、Ｚｎを芯材の表面に拡散させている。Zn is coated on the surface of the copper or copper alloy serving as the core material by melt plating, vapor deposition 2 mechanical cladding, etc., and by heating this, Zn is diffused onto the surface of the core material.
しかしこのような方法では、Ｚｎの被覆設備やランニン
グコストが高く、更に熱拡散工程を要するため、リード
タイムも長くなる欠点がある。However, this method requires high Zn coating equipment and high running costs, and also requires a heat diffusion process, resulting in a long lead time.
（課題を解決するための手段〕
本発明はこれに鑑み種々検討の結果、電気メツキ、溶融
メツキ、蒸着２機械的クラッド等高価なＺｎｎ被設設備
用いることなく、表面にＺｎの拡散層を有する銅又は銅
合金条の製造法を開発したもので、７−ｎを９％以上含
む黄銅条と芯材となる銅又は銅合金条を重ね合せて１つ
の重合体にした後、該重合体全体を加熱し、黄銅茶巾の
Ｚｎを芯材の銅又は銅合金条の表面に拡散させ、しかる
後黄銅条と芯材の銅又は銅合金条とを分離することを特
徴とするものである。(Means for Solving the Problems) In view of this, as a result of various studies, the present invention has a Zn diffusion layer on the surface without using expensive Znn coating equipment such as electroplating, melt plating, vapor deposition 2 mechanical cladding, etc. A method for producing copper or copper alloy strips has been developed, in which a brass strip containing 9% or more of 7-n and a copper or copper alloy strip serving as a core material are stacked together to form a single polymer, and then the entire polymer is produced. The method is characterized in that the Zn of the brass tea towel is diffused onto the surface of the core copper or copper alloy strip, and then the brass strip and the core copper or copper alloy strip are separated.
即ち本発明は芯材となる適当な厚さの銅又は銅合金条の
表面に、Ｚｎの拡散層を形成するため、第１図に示すよ
うに先ず芯材となる銅又は銅合金条（１）と、適当な厚
さの黄銅条（２）を重ね合μて１つのコイル（３）にタ
イ１〜に巻き取る。That is, in the present invention, in order to form a Zn diffusion layer on the surface of a copper or copper alloy strip with an appropriate thickness as a core material, first, as shown in FIG. ) and a brass strip (2) of appropriate thickness are overlapped and wound into one coil (3) around tie 1~.
このコイル（３）を加熱炉（４）に装入して適当な温度
に加熱することにより黄銅条（２）中のＺｎを芯材とな
る銅又は銅合金条（１）の表面に拡散させ、しかる後コ
イル（３）を表面にＺｎの拡散層を有する銅又は銅合金
条（１）と黄銅条（２）に分離するものである。このと
きＰ、Ｓｂその他の添加元素を含む黄銅条を用いること
により、加熱時にこれ等添加元素も同時に芯材表面に拡
散させることができる。またこのようにして得られた表
面にＺｎの拡散層を有する銅又は銅合金条は必要に応じ
て圧延することにより所定の厚さと機械的特性を付与す
ることができる。By placing this coil (3) in a heating furnace (4) and heating it to an appropriate temperature, the Zn in the brass strip (2) is diffused onto the surface of the copper or copper alloy strip (1) that serves as the core material. After that, the coil (3) is separated into a copper or copper alloy strip (1) having a Zn diffusion layer on its surface and a brass strip (2). At this time, by using a brass strip containing P, Sb, and other additive elements, these additive elements can be simultaneously diffused onto the surface of the core material during heating. Further, the thus obtained copper or copper alloy strip having a Zn diffusion layer on its surface can be rolled to a predetermined thickness and mechanical properties, if necessary.
このＪ：うに本発明は芯材となる銅又は銅合金条と黄銅
条を重ね合せて１つの重合体にした後、重合体全体を適
当な温度に加熱することにより、黄銅茶巾のＺｎを芯材
となる銅又は銅合金条の表面に拡散ざゼるもので、Ｚｎ
の拡散源となる黄銅条のＺｎ含有量は９％以上が適当で
あり、Ｚｎ含有量が９％未満ではＺｎの拡散に高温・長
時間を要し、実用的でない。This J: Sea urchin The present invention is made by stacking copper or copper alloy strips serving as the core material and brass strips to form one polymer, and then heating the entire polymer to an appropriate temperature to form the Zn core of the brass tea towel. Zn diffuses on the surface of the copper or copper alloy strip used as the material.
The appropriate Zn content of the brass strip, which serves as a diffusion source, is 9% or more; if the Zn content is less than 9%, Zn diffusion requires a high temperature and a long time, which is not practical.
Ｚｎ拡散層に耐食性を付与する場合は芯材と重ね巻きす
る黄銅条に、Ｐ、Ｓｂ、Ａｓ、Ｎ ｉ。When imparting corrosion resistance to the Zn diffusion layer, P, Sb, As, and Ni are added to the brass strip wound over the core material.
／Ｍ！、Ｓｎ、Ｍｎ、Ｃｒ、Ｓｉ、Ｆｅ、Ｐｂ。/M! , Sn, Mn, Cr, Si, Fe, Pb.
Ｇｏ、Ｂｅ、Ｂ、Ｃｄ、Ｔｉ、Ｔｅ、Ｉｎ。Go, Be, B, Cd, Ti, Te, In.
Ａｇの白河れか１種又は２種以上を合計０．００５％以
上含有させる事により、加熱によるＺｎの拡散と同時に
前記添加元素をＺｎ拡散層の中に含ませることができる
。しかして前記添加元素の含有量が０．００５％未満で
は拡散層中の前記添加元素の含有量が少なく、耐食性の
向上効果が少ない。又５％を超えると銅条へのＺｎの拡
散を阻害する。By containing one or more types of Ag in a total amount of 0.005% or more, the additional element can be included in the Zn diffusion layer at the same time as the Zn is diffused by heating. However, if the content of the additive element is less than 0.005%, the content of the additive element in the diffusion layer is small, and the effect of improving corrosion resistance is small. Moreover, if it exceeds 5%, diffusion of Zn into the copper strip will be inhibited.
以下本発明を実施例について説明する。The present invention will be described below with reference to Examples.
第１図に示すように、厚さ０．０３５ ｒａｎの３ｎ０
．０３％を含む耐熱銅条と厚さＯ６１調のＺｎ３５．３
％を含む黄銅条を重ね合せて１つのコイルに巻取り、加
熱炉に装入して６００°Ｃまで芦温し、３時間保持する
ことにより、黄銅茶巾の７ｎを耐熱銅条の表面に拡散さ
せた後、至温近くまで降温してから加熱炉より取出し、
これを耐熱銅条と黄銅条に分離しながら別々のコイルに
巻き取った。As shown in Figure 1, 3n0 with a thickness of 0.035 ran
．． Heat-resistant copper strip containing 03% and Zn35.3 with thickness O61 tone
Brass strips containing 100% of copper are layered and wound into a single coil, placed in a heating furnace and heated to 600°C, and held for 3 hours to diffuse 7N of the brass tea towel onto the surface of the heat-resistant copper strip. After letting the temperature drop to near the maximum temperature, take it out from the heating furnace.
This was separated into a heat-resistant copper strip and a brass strip and wound into separate coils.
このにうにして分離した耐熱銅条について、拡散層の深
さ（μｍ ） 、Ｚ ｎ １ｌｊｄ度（％）、導電率（
％ＩＡＣ３） 、引張強さ（ＫＦＩ ／ Ｉｒｌｌ７Ｉ
＞及び伸び（％）を測定した。その結果を第１表に示す
。Regarding the heat-resistant copper strips separated in this way, the depth of the diffusion layer (μm), the degree of Z n 1ljd (%), and the electrical conductivity (
%IAC3), tensile strength (KFI/Irll7I
> and elongation (%) were measured. The results are shown in Table 1.
第１表
次に第１図に示すように、厚さ０．１ｍのＳｎＯ，０２
５％を含む耐熱銅条と厚さ０．１．のＺｎ３５％とｐ
０．０２９％を含む黄銅条を重ね合せて１つのコイルに
巻取り、加熱炉に装入して６２０’Ｃまで昇温し、３時
間保持することにより、黄銅条中のＺｎとＰを耐熱鋼条
の表面に拡散させた後、室温近くまで降温してから加熱
炉より取出し、これを耐熱銅条と黄銅条に分離しながら
別々のコイルに巻き取った。次にこの耐熱鋼条を厚さ０
、０５簡まで圧延した。Table 1 Next, as shown in Figure 1, SnO, 02 with a thickness of 0.1 m
Heat-resistant copper strip containing 5% and thickness 0.1. Zn35% and p
Brass strips containing 0.029% are layered and wound into a single coil, placed in a heating furnace, heated to 620'C, and held for 3 hours to make the Zn and P in the brass strips heat resistant. After being diffused on the surface of the steel strip, the temperature was lowered to near room temperature, and then taken out from the heating furnace, and the steel strip was separated into a heat-resistant copper strip and a brass strip and wound into separate coils. Next, we cut this heat-resistant steel strip to a thickness of 0.
, rolled to 05 sheets.
このようにして表面にＺｎとＰを拡散させた耐熱銅条に
ついて、拡散層の深さ（μｍ）、Ｚｎ濃度（％）、Ｐ濃
度（％）、導電率（％ＩＡＣ３）、引張強ざ（Ｋｇ／−
）及び伸び（％）を測定した。その結果を第２表に示す
。Regarding the heat-resistant copper strip with Zn and P diffused on its surface in this way, the depth of the diffusion layer (μm), Zn concentration (%), P concentration (%), electrical conductivity (%IAC3), and tensile strength ( Kg/-
) and elongation (%) were measured. The results are shown in Table 2.
第１表及び第２表から判るように、芯材となる耐熱銅条
と黄銅条を単に重ね合せて巻き付けた後熱処理すること
により、耐熱銅条の表面に犠牲層としてＺｎの拡散層が
得られる。またＰを含む黄銅条を使用することにより、
耐熱銅条の表面にＰを含む７−ｎの拡散層を得ることが
できる。更に耐熱鋼条の表面にＺｎの拡散層を形成した
後、これを所望の厚さまで冷間圧延を施せばＺｎの拡散
層を形成した耐熱銅条の引張強さを改善することができ
る。As can be seen from Tables 1 and 2, a Zn diffusion layer can be obtained as a sacrificial layer on the surface of the heat-resistant copper strip by simply overlapping and winding the heat-resistant copper strip and brass strip, which serve as the core materials, and then heat-treating. It will be done. In addition, by using brass strips containing P,
A 7-n diffusion layer containing P can be obtained on the surface of the heat-resistant copper strip. Further, by forming a Zn diffusion layer on the surface of the heat-resistant steel strip and then cold rolling it to a desired thickness, the tensile strength of the heat-resistant copper strip on which the Zn diffusion layer is formed can be improved.
尚ＺｎとＰの拡散について説明したが、これに限るもの
ではなく、Ｓｂ、Ａｓ、Ｎ ｉ 、Ａ、ｅ。Although the explanation has been made regarding the diffusion of Zn and P, the diffusion is not limited to this, but includes diffusion of Sb, As, Ni, A, and e.
ｓｎ、 Ｍｎ、ｃｒ、ｓ ｒ、 Ｆｅ、ｐｂ、ｃｏ。sn, Mn, cr, sr, Fe, pb, co.
Ｂｅ、Ｂ、Ｃｄ、Ｔｉ、Ｔｅ、Ｉｎ、 Ａｇ等について
もこれを含む黄銅条を用いることにより、Ｐと同様にＺ
ｎ拡散層中に含ませることができる。By using brass strips containing Be, B, Cd, Ti, Te, In, Ag, etc., Z
It can be included in the n-diffusion layer.
〔発明の効果）
このように本発明によれば、Ｚｎ被覆のために特別の設
備（電気メツキ、溶融メツキ、蒸着。[Effects of the Invention] As described above, according to the present invention, special equipment (electroplating, melt plating, vapor deposition) is used for Zn coating.
機械的クラッド等）を必要とせず、表面にＺｎの拡散層
を有する銅又は銅合金条を得ることができる。また銅又
は銅合金条と重ね巻きする黄銅条に、Ｐ、Ｓｂ等の第３
元素を含有させることにより、Ｚｎ拡散層中にｐ、ｓｂ
等の第３元素を含有させることができる等工業上顕著な
効果を秦するものである。It is possible to obtain a copper or copper alloy strip having a Zn diffusion layer on the surface without requiring a mechanical cladding or the like. In addition, a third layer of P, Sb, etc. is added to the brass strip that is overlapped with the copper or copper alloy strip.
By containing elements, p, sb are added to the Zn diffusion layer.
This provides industrially significant effects such as the ability to contain a third element such as.
第１図は本発明製造法の一例を示す工程図である。 １、銅又は銅合金条 ２、黄銅条 ３、重ね巻きコイル ４、加熱炉 FIG. 1 is a process diagram showing an example of the manufacturing method of the present invention. 1. Copper or copper alloy strip 2. Brass strip 3. Layered coil 4. Heating furnace
Claims (3)
合金条を重ね合せて１つの重合体にした後、該重合体全
体を加熱し、黄銅条中のＺｎを芯材の銅又は銅合金条の
表面に拡散させ、しかる後黄銅条と芯材の銅又は銅合金
条とを分離することを特徴とする表面にＺｎの拡散層を
有する銅又は銅合金条の製造法。(1) After stacking a brass strip containing 9% or more of Zn and a copper or copper alloy strip serving as a core material to form a single polymer, the entire polymer is heated to transfer the Zn in the brass strip to the core material. A method for manufacturing a copper or copper alloy strip having a Zn diffusion layer on its surface, which comprises diffusing Zn on the surface of the copper or copper alloy strip, and then separating the brass strip from the core copper or copper alloy strip.
、更にＰ、Ｓｂ、Ａｓ、Ｎｉ、Ａｌ、Ｍｎ、Ｃｒ、Ｓｉ
、Ｆｅ、Ｓｎ、Ｐｂ、Ｃｏ、Ｂｅ。 Ｃｄ、Ｔｉ、Ｔｅ、Ｉｎ、Ｚｒ、Ａｇの内何れか１種又
は２種以上を合計０．００５〜５％含む黄銅条を用いる
請求項１記載の表面にＺｎの拡散層を有する銅又は銅合
金条の製造法。(2) The brass strip to be overlapped with the core material contains 9% or more of Zn, and also contains P, Sb, As, Ni, Al, Mn, Cr, Si.
, Fe, Sn, Pb, Co, Be. The copper or copper having a Zn diffusion layer on the surface according to claim 1, wherein a brass strip containing a total of 0.005 to 5% of any one or more of Cd, Ti, Te, In, Zr, and Ag is used. Manufacturing method for alloy strips.
１又は２記載の表面にＺｎの拡散層を有する銅又は銅合
金条の製造法。(3) The method for producing a copper or copper alloy strip having a Zn diffusion layer on the surface according to claim 1 or 2, wherein the polymer is wound into one coil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2804488A JPH01205065A (en) | 1988-02-09 | 1988-02-09 | Manufacture of copper or copper-alloy bar having zn diffusion layer on surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2804488A JPH01205065A (en) | 1988-02-09 | 1988-02-09 | Manufacture of copper or copper-alloy bar having zn diffusion layer on surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01205065A true JPH01205065A (en) | 1989-08-17 |
Family
ID=12237745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2804488A Pending JPH01205065A (en) | 1988-02-09 | 1988-02-09 | Manufacture of copper or copper-alloy bar having zn diffusion layer on surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01205065A (en) |
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| EP0559230A2 (en) * | 1992-03-06 | 1993-09-08 | Kabushiki Kaisha Toshiba | Electroconductive article, method of producing same, and motor produced from the article |
| WO2011044772A1 (en) * | 2009-10-14 | 2011-04-21 | 北京中路大成科技发展有限公司 | Method for preparing zinc-aluminum-titanium multi-element alloy anti-corrosion coating on surface of workpiece |
| US20130323532A1 (en) * | 2012-06-01 | 2013-12-05 | Hitachi Cable, Ltd. | Copper-based material and method for producing the same |
| JP2015206065A (en) * | 2014-04-18 | 2015-11-19 | 株式会社村田製作所 | Metal laminate and method for manufacturing metal laminate |
| US9564255B2 (en) | 2013-01-30 | 2017-02-07 | Hitachi Metals, Ltd. | High-speed transmission cable conductor, and producing method thereof, and high-speed transmission cable |
| US9769933B2 (en) | 2013-11-29 | 2017-09-19 | Hitachi Metals, Ltd. | Printed circuit board and method of manufacturing the same |
| US10006138B2 (en) | 2013-11-29 | 2018-06-26 | Hitachi Metals, Ltd. | Copper foil and method of manufacturing the same |
| CN115533110A (en) * | 2022-12-05 | 2022-12-30 | 福州市富恒新材料有限公司 | Preparation method of copper-zinc alloy powder |
-
1988
- 1988-02-09 JP JP2804488A patent/JPH01205065A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0559230A2 (en) * | 1992-03-06 | 1993-09-08 | Kabushiki Kaisha Toshiba | Electroconductive article, method of producing same, and motor produced from the article |
| EP0559230A3 (en) * | 1992-03-06 | 1994-07-13 | Toshiba Kk | Electroconductive article, method of producing same, and motor produced from the article |
| WO2011044772A1 (en) * | 2009-10-14 | 2011-04-21 | 北京中路大成科技发展有限公司 | Method for preparing zinc-aluminum-titanium multi-element alloy anti-corrosion coating on surface of workpiece |
| US20130323532A1 (en) * | 2012-06-01 | 2013-12-05 | Hitachi Cable, Ltd. | Copper-based material and method for producing the same |
| US9884467B2 (en) * | 2012-06-01 | 2018-02-06 | Hitachi Cable, Ltd. | Copper-based material and method for producing the same |
| US9564255B2 (en) | 2013-01-30 | 2017-02-07 | Hitachi Metals, Ltd. | High-speed transmission cable conductor, and producing method thereof, and high-speed transmission cable |
| US9769933B2 (en) | 2013-11-29 | 2017-09-19 | Hitachi Metals, Ltd. | Printed circuit board and method of manufacturing the same |
| US10006138B2 (en) | 2013-11-29 | 2018-06-26 | Hitachi Metals, Ltd. | Copper foil and method of manufacturing the same |
| JP2015206065A (en) * | 2014-04-18 | 2015-11-19 | 株式会社村田製作所 | Metal laminate and method for manufacturing metal laminate |
| CN115533110A (en) * | 2022-12-05 | 2022-12-30 | 福州市富恒新材料有限公司 | Preparation method of copper-zinc alloy powder |
| CN115533110B (en) * | 2022-12-05 | 2023-03-10 | 福州市富恒新材料有限公司 | Preparation method of copper-zinc alloy powder |
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