JPH01202676A - Connection apparatus for measuring integrated circuit - Google Patents

Abstract

PURPOSE:To facilitate the replacement of a socket board according to the kind of an IC and to enhance the maintenance efficiency of a contact probe, by performing the mounting and detachment of the socket board and an IC socket by inserting a projection in an L-shaped groove to slightly rotate the same. CONSTITUTION:Attachment rings 25, 26 are ones for easily mounting and detaching a socket board 1. The hole opened to a performance board 2 is used as a guide and the pin like metal fitting of a contact board 21 is inserted in said hole to fix the board 21 to the board 2. Further, the board 1 is mounted on the contact probes 22 provided to both ends of the board 21. Since springs are inserted in the probes 22, a pin like body 32 is inserted in an L-shaped groove 51 while the ring 25 is pushed toward the ring 26 against said springs to slightly rotate the ring 25 in the peripheral direction and the pin like body 32 is deeply inserted in the groove 51 to fix the ring 51. As a result, the predetermined conductor parts of the boards 1, 2 are electrically connected through the probes 22. The probes 22 are easily detachable with respect to the board 21.

Description

Detailed Description of the Invention [Object of the Invention] (Industrial Field of Application) The present invention relates to an IC (integrated circuit) measuring device installed between a test head and an IC socket provided at the tip of a main body of an IC (integrated circuit) measuring device. connection device.

(Prior Art) The configuration of a conventional integrated circuit measurement connecting device will be explained with reference to the drawings. FIG. 6 is a plan view thereof, and FIG. 7 is a sectional configuration diagram thereof. This one consists of socket port 91S - 4'7 Ohman port 2m IC socket 3 - IC to be measured 4, wiring 5.
It consists of a test head 6 and the like. test head 6
is connected to the IC measuring device main body (not shown).

FIG. 8 is a plan view of another conventional example of a connecting device for integrated circuit measurement, FIG. 9 is a cross-sectional configuration diagram thereof, and FIG. 10 is a cutaway sectional view showing a part thereof.

This device is the same as the above-mentioned device in that it is equipped with a socket board 1 to an IC socket 3, a test head 6, etc., but it also has a contact board 11, a ring 12, etc.
．． Manual board presser foot 13. Knurled screw 14. Conductive nidistomer (conductive rubber) 15. It is equipped with insect pins 16 to hold it down.

(Problems to be Solved by the Invention) When the apparatuses shown in FIGS. 6 and 7 measure the ICs 4 to be measured of different types, the devices are connected from the performance board 2 to the socket board 1 for each IC 4 to be measured. Because different electrical connections require different wiring, the socket board 1. Performance board J and IC socket 3 all had to be replaced.

Further, in the apparatus shown in FIGS. 8 to 1θ, the socket board 1. The assembly constituted by the IC socket 3 includes an IC 4 to be measured from the socket board 1 to the IC socket 3.
It was created to realize different electrical connections for each type. Therefore, when replacing the socket board 1, it is necessary to remove several knurled screws 14, which impairs workability.
2 was tightened using the manual board presser 13, the tightening force was uneven due to the mutual tightness of the plurality of knurled screws 14, and the conductive nystomer 15, 16.・
...The contact was uneven. Furthermore, conductive nidistomer 15
The contact board 11 is inserted in one piece into each of the holes penetrating the contact board 11, and is secured with an insect pin 16, so if a problem occurs, one of the pieces has to be replaced. .

The present invention has been made in view of the above-mentioned circumstances, and it is an object of the present invention to provide a connection device for IC measurement that improves each of the above-mentioned drawbacks.

The purpose of this is to make it easier to replace the manual board and to improve the efficiency of contact probe maintenance.

[Structure of the invention]

(Means and effects for solving the problem) The present invention provides a test head connected to the main body of an IC measuring device, and a nota performance board with wiring provided thereon. The contact board has multiple double-ended contact probes that pass through it.
This double-ended contact probe is divided into upper and lower parts, both of which can be retracted and retracted vertically by means of a spring. Both ends of the contact glove are pressed against both ends, and a protrusion protruding laterally from the performance board is connected to a plurality of L-shaped grooves of an attachment that is in contact with the socket board and has a lid-shaped periphery. , and by rotating the attachment a little in the circumferential direction to insert the protruding object deep into the L-shaped groove, fixing the socket board and the arm formance board, and fixing the A connecting device for measuring integrated circuits, characterized in that the wiring of the socket board and/or the motherboard is electrically connected via contact gloves at both ends, and connected to the IC socket on the socket port P. It is.

That is, in the present invention, the socket board and the IC socket can be attached and detached by inserting the protrusion into the L-shaped groove and slightly rotating it, so that it is possible to easily measure different types of ICs. In addition, since it has a contact probe configuration at both ends that is split into two parts,
If one of the gloves wears out, only one glove can be replaced.

In addition, the lower side of the contact board is constant regardless of the type of IC being measured, and only the socket board and IC socket are related to the type of IC being measured, so different types of ICs can be measured with one performance board. . Furthermore, since the shapes of the protrusion, the L-shaped groove, and the attachment are predetermined by the plate, the force applied to the contact probes at both ends becomes equal.

(Example) An example of the present invention will be described below with reference to the drawings. 1st
The figure is a plan view of the device, and FIG. 2 is a partially cutaway side view thereof. In these figures, 1 is the socket board, 2 is the performance board, 3 is the IC socket, and 4 is the I to be measured.
C, 6 is a test head. 21 is a contact board arranged between boards 1 and 2; 22 is a contact probe at both ends that penetrates the contact board 21 and connects the wiring on board 1.2; 23 is a pin-like metal fitting that fixes between the boards 2 and 21; 24 is a pin-like metal fitting that fixes between the boards 1 and 21; 25 is an attachment ring with a lid-like circumference that surrounds the circumference of the board 21; 26 is a plurality of protrusions 27 on the board 2;
．． The attachment ring 28 is fixed by screws 2 along the circumference on the attachment ring 26.
A ring 9 is fixed, and a ring 30 is placed between the board Pl and the attachment ring 25, and is fixed to the ring 25 with a screw 31. This ring 30 is in contact with the board 1 only at point b. Reference numeral 32 denotes a pin-like object (protruding object) that is attached to the ring 28 and whose tip protrudes toward the outer circumference. They are respectively fitted into L-shaped grooves of the attachment ring 25 provided at the same locations.

FIG. 3 shows one of each double-ended contact probe 22. As shown in FIG. This configuration has a metal probe piece 22□.

22, each with a spring 33. .

33! Both ends of the metal sleeve portion 34 are retractable. Electrical continuity between metal probe pieces 221 #'z is established by springs 33..33.

Stotsu 1435. , 35, may be taken through the sleeve portion 34, but the probe piece 22. , 22. FIG. 4 shows a method of fixing the forman spode 2 and the attachment ring 26 by bending them into a dogleg shape and bringing them into contact with the inner wall of the sleeve portion 34.

for that purpose.

By inserting the protrusion 27 of the board 2 into the deformable elongated hole 41 of the ring 26 and rotating the board 2 and the ring 26 relative to each other in the direction of the arrow in the figure, it is possible to attach and detach them both.

Broom 5 Figure 5 shows a side configuration of an attachment ring 25 whose periphery is lid-shaped. That is, since a 5-shaped groove 51 is cut out in the side of the ring, the tip of the pin-shaped object 32 is inserted into the groove from below the 5-shaped groove 51, and the ring 25 is inserted into the contact probe 22 at each end. If the pin-like object 32 is pushed down against the pressure and then rotated in the circumferential direction, the tip of the pin-like object 32 will be located at the back 51. of the 5-shaped groove 51. to go into. These five operations are from a to a in Figure 1.
The ring 25 is attached to the board 2 via the ring 2B, the 26° protrusion 27, etc., respectively.

Next, the method of assembling the connection device of the second prisoner shown in FIG. 1 will be explained. Attachment rings zs, z6) t'r This is for easily attaching and detaching the socket board 1. The contact probes 22 at both ends are for electrically connecting the socket board 1 and the performance board 2 (both printed circuit board type). Moreover, the contact probes 22 at both ends can be easily attached to and detached from the contact board 21. The contact board 21 is fixed to the performance board 2 by inserting the pin-shaped metal fitting 23 of the contact board 21 into the hole using the hole drilled in the performance board 2 as a guide. Furthermore, the socket board 1 is attached to each end of the contact board 21 with contact gloves 22.
Put it on top. A spring 3 is attached to each end contact probe 22.
3m, 33. is inserted, so push the attachment ring 25 in the direction of the attachment ring 26 against this and put the pin-shaped object 32 into the L-shaped groove 51.

Rotate the attachment ring 25 slightly in the circumferential direction,
Insert the pin-shaped object 32 into the inner part 51 of the 5-shaped groove 51. When the seat attachment ring 25 is fixed by inserting the seat attachment ring 25 into the socket, predetermined conductor portions of the socket board 1 and the performance board 2 are electrically connected via the contact probes 22 at both ends.

The above configuration has the following advantages. (a) Since the mounting structure is such that the pin-shaped object 32 is inserted into the 5-shaped groove 51 and the attachment ring 25 is slightly rotated, it is easy to attach and detach the socket board l according to the type of IC 4 to be measured.

(c4 Because the double-ended contact probe 22 was used.

Either the probe half 22□ or the half 223 that is damaged should be replaced.

(c) Contact board 21. A fixed performance board 2 may be used regardless of the type of IC 4 to be measured, and the socket board 1 and the IC socket 3 on it may be
Since the socket board 1 can be installed and removed by performing the reverse operation, it is possible to measure different types of ICs with a single board or formance board 2.

) Attachment 25. L-shaped *51. Bottle-like object 3
Since the shape of the second grade is made in a predetermined mold, it is possible to fix the rotation mechanism of the attachment ring 25, 26, and contact both ends! The forces applied to the lobes 22 are now equalized.

〔Effect of the invention〕

As explained above, according to the present invention, the socket board can be easily replaced according to the type of IC to be measured, and the maintenance efficiency of the contact glove can be improved. This is what the equipment can provide.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a device according to an embodiment of the present invention, FIG. 2 is a partially cutaway side view of the same device, FIG. is a plan view of a conventional device, FIG. 7 is a cross-sectional configuration diagram thereof, FIG. 8 is a plan view of another conventional device, and FIG. 9 is a plan view of a conventional device.
The figure is a cross-sectional configuration diagram taken along the line AA' in FIG. 8, and FIG. 10 is a cutaway diagram showing a part thereof. 1... Socket board, 2... Performance board, 3... IC socket, 4... IC to be measured, 6...
...Test head, 21...Contact board, 22
・・・Both ends contact probe, 23, 24, 27...
・Bottle-shaped metal fittings, 28.30...Ring, 29,
,? 1...Screw. 32... Bottle-shaped object (protruding object), 33. ．． 33□...
Spring #34...Metal sleeve part, 51...L
gutter groove.

Claims (1)

[Claims] A performance board with wiring is installed on top of the test head that is connected to the IC measurement device body.
The contact board placed on top of the contact board has a plurality of contact probes at both ends passing through it, and these contact probes at both ends are divided into upper and lower parts, both of which can be retracted and retracted up and down by means of springs. Both ends of the contact probes at both ends are pressed between the performance board and the socket board on which the wiring is installed, and the actual object protruding from the side of the performance board is brought into contact with the socket board. by fitting the protrusion into a plurality of L-shaped grooves of an attachment having a lid-like circumference and rotating the attachment slightly in the circumferential direction to insert the protrusion deep into the L-shaped groove;
The socket board and the performance board are fixed together, and the wiring of the socket board and the performance board is electrically connected via the contact probes at both ends, and connected to the IC socket on the socket board. Connecting device for measuring integrated circuits.