JPH01140071A - Probing card - Google Patents

Abstract

PURPOSE:To prevent the damage of a probe needle even when a probing card is allowed to fall, by providing the cover of the probe needle to the probing card. CONSTITUTION:In a water prober 19, the replacing work of a probing card (PC) main body 7 is performed at first by fixing a head plate (HP) 3 vertically from a horizontal state. Therefore, the ring insert (RI) 2 provided in the HP 3 and the main body 7 are exposed. Next, the pawl part of a cover 9 moves so as to slide along the side part of the main body 7 to be engaged therewith. In this state, the main body 7 provided with the cover 9 is detached from the RI 2, and the detached main body 7 and the PC 7 provided with a separate cover 9 are similarly mounted on the mount surface of the RI 2. When this mounting work is finished, there is no falling danger of the main body 7 because the RI 2 is fixed to and supported by the main body 7. Therefore, the cover 9 is detached and the HP 3 vertically provided is rotated horizontally to finish the replacement of the main body 7. As mentioned above, since the cover 9 is mounted and detached after mounting when the main body 7 is mounted to the RI 2, a needle 8 does not fall in a bare state and is not damaged.

Description

[Detailed description of the invention] [Purpose of the invention] The present invention relates to probing cards.

(Prior Art) A device called a wafer prober is known as a device that inspects chips on a semiconductor wafer (hereinafter referred to as wafer) by bringing the probe needle of a probing card into contact with the electrode pad of the chip on the wafer. . For example, it is described in Japanese Utility Model Application Publication No. Sho 61-96544. Furthermore, a probing card is well known as a component that is brought into contact with the chips of this wafer to establish continuity with a tester circuit provided externally. For example, it is described and shown in Japanese Utility Model Application No. 61-97839.

The fifth test is for inspecting wafers using the wafer prober and the probing card shown in the above publication.
As shown in the figure, a ring insert ■, which is a circular fixing member that fixes the probing card ω, is inserted into the head plate ■, and a mounting surface for attaching the probing card (1) to the ring insert ■ is provided. There is. Further, a contact terminal member called a pogo pin (trade name) (trade name) is provided which moves telescopically along the mounting surface (a) of the ring insert (i).

In this method, the probing card (■) is fixedly supported on the mounting surface of the ring insert (■).

First, move the probing card ■ to be attached to the mounting surface (to the mounting surface) by pushing the extended pogo pin ■ into pressure contact with the mounting surface (to) of the ring insert ■, and then fix the probing card ■ with an attachment means such as a screw. I support it.

(Problem to be solved by the invention) However, with such conventional probing cards,
Stretchable pogo pin installed in ring insert■
When the probing card ■ is being attached to the ring insert ■, pressure is applied to push it back to the opposite side, and the probing card ■ tries to attach against this pressure, causing the probing card ■ to fall onto the stage of the wafer prober, resulting in an expensive There was a drawback that the probe needle 0 could be damaged.

Furthermore, during installation, the installation tool accidentally came into contact with the probe needle 0, which also caused damage to the probe needle 0.

SUMMARY OF THE INVENTION An object of the present invention is to provide a probing card that does not damage the probe needles even if the probing card is dropped.

(Means for Solving the Problems) The present invention provides a probing card that brings a probe needle into contact with an electrode of an object to be tested to establish continuity with a tester circuit, in which an elastic protective member of the probe needle can be attached to and detached from the probing card. It is characterized by the fact that it is set in

(Function) In the present invention, since the protective member is removably provided to protect the probe needles of the probing card, even if the probing card is accidentally dropped, the impact force due to the fall is absorbed by the protective member and the probing card is protected. No impact force is transmitted to the probe needle.

It has the effect of not being damaged.

(Example) Hereinafter, an example in which the probing card of the present invention is applied to a wafer prober will be described with reference to the drawings.

In the above description, the same parts as those of the conventional example will be explained in the same appendix.

First, the configuration of the probing card of this embodiment will be explained.

As shown in FIGS. 1 and 2, a probing card body (■) that comes into contact with the electrodes of a wafer, which is an object to be inspected, and a protective member (for example, an elastic cover) that protects the probe needles (■) of this probing card body (■) It is composed of 〇.

The above probing card body ■ has an opening (10) in the center.
A printed circuit board (12) having a plurality of connection patterns (11) around the opening (10), for example, φ1
The rubber member (13) is made of a glass epoxy resin plate with a diameter of 00 mA + is located through.

Mounting holes (14) having a diameter of 3 m x a are provided evenly distributed along the periphery of the printed circuit board (12), for example, through which M2.6+m screws are screwed. It is being

Here, the through hole (14) is fixedly supported evenly on the mounting surface 0) of the ring insert (2) using screws of a mounting member.

Furthermore, the grooves (16) of concave portions are evenly arranged along the periphery of the opposite surface (15) to which the probe needles (■) are fixedly connected to the printed circuit board (12). A groove is provided.

As shown in FIG. 3, this groove (16) is designed so that a convex part (9b) provided at the tip of a protruding claw part (9a) of a cover (9), which is a protection member to be described later, is fitted into the groove part (16). It is set in.

Here, this groove part (16) is a claw part (
9a).

In other words, the through hole (14) in the probing card body ■
There is no groove (16) in the vicinity of the peripheral edge with
), and thus grooves (16) are formed alternately on the periphery of the probing card body (2).

Cover which is the above protective member〇For example, φ104n104n
As shown in Figure 2, in the center of the cover (■) made of a star-shaped elastic polypropylene member of 5 am, there is a hollow part to the extent that it does not come into contact with the probe needle (■) that is assembled at the center of the probing card body (■). (17), and further,
A convex portion (9b) of a claw portion (9a) is provided on the outer circumferential portion 0 of the cover (9) so as to fit into the groove portion (16) of the probing card body (2).

Here, the structure is such that the cover (9) is not disposed in the through hole (14) of the probing card body (2).

Therefore, the probe needle (8) of the probing card body ■
The convex part (9b) of the claw part (9a) corresponding to the groove part (16) provided on the opposite surface (15) spreads from the a1 position to the a2 position along the side periphery of the probing card main body (■), and the concavo-convex part is fitted. will be combined.

Next, the effect will be explained.

As shown in FIG. 4, after the probe needle (2) of the probing card body (2) is brought into contact with the electrode of the wafer (18), the electrical characteristics of the wafer are tested using signals from an external tester.

The probing card body (2) is removably fixedly supported on the ring insert (2), for example, by screws, etc., and the ring insert (2) is internally installed in a mounting base called a head plate (0).

This head blade (2) is provided with a mechanism that rotates it from horizontal to vertical, as shown in Figure A, for example.

This rotatable mechanism is designed so that the probing card body (1) can be easily replaced according to the type of wafer (I8). In such a wafer prober (19), when replacing the probing card body (2), first, the head plate (2) is fixed from a horizontal position to a vertical position. Therefore, the head plate ■
The ring insert ■ and the probing card body ■ that are tucked inside are exposed.

When fitting this exposed probing card body ■, the outer diameter of the probing card body ■ and the inner diameter of the cover ■) are approximately the same, and the convex portion (9a) of the claw portion (9a) of the cover
b) slides along the side of the probing card body (2) and is fitted. In this way, the cover (9) is fitted to the probing card body (2) of the ring insert (3) provided on the wafer prober (19).

In this state, remove the probing card body ■ with the cover 〇 from the ring insert ■.

For this removal, use a tool to remove a screw or the like from the through hole (14) of the mounting hole provided on the periphery of the probing card body (2).

Then, attach the removed probing card body ■ and the probing card with another cover (9) to the mounting surface of the Ringay 4 insert ■ in the same manner.

Once this installation is complete, the probing card body ■ is fixedly supported by the ring insert ■, so there is no danger of it falling, so remove the cover ■, rotate the vertically installed head plate ■ horizontally, and start the probing card. The exchange of the card body ■ is completed.

In this embodiment, when attaching the probing card body ■ to the ring insert ■, the cover (9) of the protective member is attached to the probing card body ■.

Since the cover (9) is attached and detached after attachment, the probe needle (8) does not fall bare, so the probe needle (8) is not damaged.

〔Effect of the invention〕

As described above, according to the present invention, even if the probing card is accidentally dropped during replacement, the probe needles will not be damaged, and stable replacement work can be performed.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram for explaining one embodiment of the probing card of the present invention. FIG. 2 is a sectional view taken along line 1-1 in FIG. FIG. 3 is an explanatory enlarged view for explaining a state in which the probing card main body and cover of FIG. 1 are fitted together. FIG. 4 is an explanatory diagram for explaining an embodiment in which the embodiment of FIG. 1 is used in a wafer prober. FIG. 5 is an explanatory diagram for explaining a probing card used in a conventional wafer prober. 7. Probing card body. 8. Probe needle, 9. cover. 9a, claw part, 9b, convex part. 10. opening; 11. connection pattern. 12. Printed circuit board, 13. rubber parts. 14, through hole (mounting hole) 150 opposite side. 17. Hollow part. Patent applicant: Tokyo Electron Ltd. Figure 1) 870-A Needle Figure 2 Broom Figure 4

Claims (1)

[Scope of Claims] 1) A probing card for bringing a probe needle into contact with an electrode of an object to be tested to establish continuity with a tester circuit, characterized in that the probing card is provided with an elastic protection member for the probe needle in a detachable manner. probing card. 2) The probing according to claim 1, wherein only the protective member can be removed from the probing card after the probing card provided with the protective member is fixedly supported by a ring insert of a wafer prober. card. 3) The probing card according to claim 1, wherein the elastic protective member is made of polypropylene.