JPH01200633A - Semiconductor manufacturing apparatus - Google Patents

Abstract

PURPOSE:To eliminate the occurrence of an unetched part without obstructing an etching operation by a method wherein an multihole base plate used to place a magazine case is tilted and a wafer cradle used to lift a semiconductor substrate inside the magazine case is installed. CONSTITUTION:A multihole base plate 2 used to place a magazine case 5 is installed inside a tank 1 in a tilted posture; a water cradle 3 used to support semiconductor substrates 4 by lifting them to a prescribed height position from the bottom of the magazine case is provided. By this setup, it is possible to arrange the semiconductor substrates in a parallel and tilted posture; when they are to be housed in the magazine case, the direction of the semiconductor substrates can be regulated; it is possible to prevent that the surface of the semiconductor substrates comes into contact with a groove of the magazine case and that an air bubble to be generated during an etching operation creeps between both.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to semiconductor manufacturing equipment, and particularly to a semiconductor manufacturing equipment that etches an aluminum thin film on a semiconductor substrate by immersing the semiconductor substrate in an etching bath containing a certain chemical solution. It is something.

[Conventional technology]

The magazine case 5 is provided with 7-shaped grooves 6 at a constant pitch as shown in FIG. 6, and the edge of the semiconductor substrate 4 is fitted into the 7-shaped grooves 6 as shown in FIGS. A plurality of semiconductor substrates 4, 4, . . . were placed in parallel in a magazine case 5. Conventionally, the porous bottom plate 2 on which the magazine case 5 is placed is installed horizontally in the etching tank 1, and the magazine case 5 is placed on the porous bottom plate 2, and the semiconductor substrates 4, 4 inside the magazine case 5 are placed horizontally. ... was immersed in a chemical solution in tank 1 and subjected to etching treatment.

[Problem to be solved by the invention]

By the way, since the groove 6 for leaning the semiconductor substrate 4 on the magazine case 5 is V-shaped, when the magazine case 5 is placed horizontally, it will tilt forward or backward as shown in FIG. 4, and its posture will not be constant. First, as shown in FIG. 6, the surface 4a of the semiconductor substrate 4, that is, the surface on which the aluminum thin film is formed, may come into contact with the groove surface of the figure-7 groove 6, or depending on the tilted posture of the substrate 4, the surface 4a of the substrate 4 and the groove may come into contact with each other. A gap is created between the etching material 6 and the air bubbles 7 generated during etching, which impede etching and adversely affect the product.

An object of the present invention is to provide a semiconductor manufacturing apparatus that solves the above problems.

[Differences between the invention and the prior art]

In contrast to the conventional wet etching apparatus described above, the present invention is different in that the back side of the semiconductor substrate is placed against the groove surface and the surface, that is, the surface on which the aluminum thin film is formed, is reliably immersed in the chemical solution to perform the etching process. Has a point.

[Means to solve the problem]

In order to achieve the above object, in the semiconductor manufacturing apparatus of the present invention, a porous bottom plate on which a magazine case is placed is installed in the tank in an inclined position, and the semiconductor substrate is moved from the bottom of the magazine case to the top of the porous bottom plate. It is equipped with a wafer holder that lifts and supports the wafer at a certain height.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG.
FIG. 3 is an enlarged cross-sectional view of part 2 in FIG. 2.

As shown in FIGS. 2 and 3, the magazine case 5 is provided with a V-shaped groove 6 on which the semiconductor substrate 4 is placed.

In the present invention, a porous bottom plate 2 on which a magazine case 5 is placed is installed in an inclined manner in an etching bath 1, and on the porous bottom plate 2,
It is equipped with a trapezoidal wafer holder 3 that lifts and supports the semiconductor substrate 4 at a certain height from the bottom of the magazine case 5.

In the embodiment, a plurality of semiconductor substrates 4, 4, . According to the present invention, the porous bottom plate 2 is inclined, and the wafer holder 3 is installed on the porous bottom plate 2. Therefore, when the semiconductor substrate 4 is housed in the magazine case 5 with the orientation flat (OF) 4a at the bottom and placed on the porous bottom plate 2, the orientation flat (OF) 4a of the semiconductor substrate 4 is placed at the bottom.
F4a contacts the wafer holder 3 and is lifted upward in the V-shaped groove 6, and is tilted backward by the inclined porous bottom plate 2, so that the plurality of semiconductor substrates 4, 4... are parallel to each other. Arranged in a fixed position. Here, if the semiconductor substrate 4 is placed in the V-shaped groove 6 of the magazine case 5 so that the front surface 4a of the semiconductor substrate 4 in the backward-tilting position forms the aluminum thin film, the back surface 4b of the semiconductor substrate 4 can be placed in the V-shaped groove. M tangent to 6
As shown in FIG. 3, the surface 4a of the semiconductor substrate 4 is separated from the groove surface of the V-shaped groove 6.
The surface 4a of is in contact with the chemical solution in the tank 1.

〔Effect of the invention〕

As explained above, the present invention makes it possible to arrange semiconductor substrates in a parallel inclined posture by tilting the porous bottom plate on which the magazine case is placed and providing a wafer holder that lifts up the semiconductor substrates in the magazine case. By adjusting the orientation of the semiconductor substrate when storing it in the magazine case, it is possible to prevent the surface of the semiconductor substrate and the groove of the magazine case from coming into contact with each other, and to prevent air bubbles generated during etching from entering between the two. It has the effect of eliminating the occurrence of etching residue without inhibiting etching.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing the etching apparatus of the present invention, FIG. 2 is a sectional view taken along the line AA' in FIG. 1, and FIG.
4 is a sectional view showing a conventional etching device, FIG. 5 is a sectional view taken along the line B' in FIG. 4, and FIG. 6 is an enlarged sectional view of the section ■ in FIG. . 1...Etching bath 2...Porous bottom plate 3...Wafer holder 4...Semiconductor substrate 5...Magazine case 6...Groove of magazine case Patent applicant
Kyushu NEC Co., Ltd.-1 Representative Patent Attorney Naka Kanno: Yu
・' ＼ A' Figure 1 Figure 2 Figure 3 β' Figure 4 Figure 5 Figure 6

Claims (1)

[Claims] 1. In a wet etching device that removes a thin film on a semiconductor substrate by immersing a semiconductor substrate leaning against a magazine case in a chemical solution in an etching tank, the porous bottom plate on which the magazine case is placed is placed inside the tank. 1. A semiconductor manufacturing apparatus, which is installed in an inclined position in a magazine case, and is equipped with a wafer holder on the porous bottom plate for lifting and supporting a semiconductor substrate at a certain height from the bottom of a magazine case.