JPH0119280B2 - - Google Patents
Info
- Publication number
- JPH0119280B2 JPH0119280B2 JP56037892A JP3789281A JPH0119280B2 JP H0119280 B2 JPH0119280 B2 JP H0119280B2 JP 56037892 A JP56037892 A JP 56037892A JP 3789281 A JP3789281 A JP 3789281A JP H0119280 B2 JPH0119280 B2 JP H0119280B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- wires
- support mechanism
- twin
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント配線板にツインワイヤを配線
するワイヤボンデイング装置のワイヤ支持機構に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wire support mechanism of a wire bonding apparatus for wiring twin wires on a printed wiring board.
従来、通信用搬送装置あるいは電子計算装置な
どに組込まれたプリント配線板においては、電気
的特性上、特に使用周波数の高い部分には同軸線
又はツインワイヤを用いての配線を必要とする場
合がある。このツインワイヤを配線する場合、従
来は特開昭55−53482号に開示されている様に、
ワイヤボンデイング装置のワイヤ供給機構内で先
端を２本の単線に分割されたワイヤを第１図に示
す如くワイヤフイーダパイプ１より送り出し、各
単線２をピンセツトにてＸ−Ｙテーブル３上のプ
リント配線板４のパツド５に位置決めし、ボンデ
イングチツプ６にてボンデイングするような方法
をとつている。
Conventionally, printed wiring boards built into communications transport devices or electronic computing devices sometimes require wiring using coaxial lines or twin wires, especially in areas where high frequencies are used due to electrical characteristics. be. When wiring this twin wire, conventionally, as disclosed in Japanese Patent Application Laid-Open No. 55-53482,
In the wire supply mechanism of the wire bonding machine, the wire whose tip is divided into two single wires is fed out from the wire feeder pipe 1 as shown in Fig. 1, and each single wire 2 is printed on the X-Y table 3 using tweezers. A method is used in which it is positioned on a pad 5 of a wiring board 4 and bonded with a bonding chip 6.
上記従来の方式では、ツインワイヤの先端と、
パツドとの位置決めに人手を要し、能率も悪いた
め自動化の要望が強い。
In the conventional method described above, the tips of the twin wires,
There is a strong demand for automation as positioning with the pads requires manpower and is inefficient.
本発明はこの要望に基いて案出されたもので、
ワイヤボンデイング装置においてツインワイヤの
配線を自動化可能とするワイヤ支持機構を提供す
ることを目的とするものである。 The present invention was devised based on this request.
The object of the present invention is to provide a wire support mechanism that enables automation of twin wire wiring in a wire bonding apparatus.
上記目的を達成するために、本発明のワイヤボ
ンデイング装置のワイヤ支持機構は、ツインワイ
ヤの先端が予め分割された２本のワイヤをそれぞ
れ反対方向に真空吸引してＶ字状に保持する案内
溝をワイヤ受け部材に設けたことを特徴とするも
のである。
In order to achieve the above object, the wire support mechanism of the wire bonding apparatus of the present invention has a guide groove that vacuum-suctions two wires, each of which has a pre-divided tip of the twin wire, in opposite directions to hold them in a V-shape. is provided on the wire receiving member.
また、本発明のワイヤボンデイング装置のワイ
ヤ支持機構はツインワイヤの先端が予め分割され
た２本のワイヤを保持するＶ字状の切欠きを有す
るワイヤ受け部と、該切欠きに対応した三角形状
のくさびとを有することを特徴とするものであ
る。 Further, the wire support mechanism of the wire bonding apparatus of the present invention includes a wire receiving part having a V-shaped notch for holding two wires with the tips of the twin wires split in advance, and a triangular shape corresponding to the notch. It is characterized by having a wedge.
ツインワイヤの先端を予め分割した２本のワイ
ヤをＶ字状に拡げて保持することにより、各ワイ
ヤの位置決めが容易となるため自動化が可能とな
る。
By holding the two wires with the tips of the twin wires divided in advance in a V-shape, the positioning of each wire becomes easy and automation becomes possible.
以下添付図面に基づいて本発明の実施例を詳細
に説明する。
Embodiments of the present invention will be described in detail below based on the accompanying drawings.
第２図に本発明の実施例を用いたワイヤボンデ
イング装置の概略説明図を示す。図について説明
すると、符号３はＸ−Ｙテーブル、４はその上に
載置したプリント配線板、５はそのパツド、６は
ボンデイングチツプ、７は本発明のワイヤ支持機
構である。このワイヤ支持機構７はボンデイング
装置のワイヤ供給機構によりツインワイヤの先端
を分割したワイヤ８，８′の間隔を拡大し保持す
る作用を有するものである。第３図及び第４図は
ワイヤ８，８′の間隔を拡大保持する本発明の実
施例を示したものである。第３図の平面断面図に
より示す第１の実施例はワイヤ受け部材７ａにＶ
字状の切欠きが設けられ、且つその内側の両面に
それぞれ開口する真空パイプ１０，１０′が設け
られ、予めワイヤ供給機構によりツインワイヤ９
の先端が分割されたワイヤ８，８′を真空パイプ
１０，１０′により真空吸引しその間隔をＶ字状
に拡大し保持するようにしたものである。第４図
に示す第２の実施例はワイヤ受け部材７ａに設け
られたＶ字状の切欠きに対応した三角形状のくさ
び１１を設け、予めワイヤ供給機構によりツイン
ワイヤ９の先端が分割されたワイヤ８，８′の間
に三角形状のくさび１１を矢印Ｐ方向に押し入れ
てワイヤ８，８′の間隔をＶ字状に拡大し保持す
るものである。この場合ワイヤ８，８′の受け部
が剛体であつてワイヤに傷がつく恐れのある場合
には、その部分にゴム等の弾性体１２を用いると
良い。 FIG. 2 shows a schematic explanatory diagram of a wire bonding apparatus using an embodiment of the present invention. To explain the figures, numeral 3 is an X-Y table, 4 is a printed wiring board placed thereon, 5 is a pad thereof, 6 is a bonding chip, and 7 is a wire support mechanism of the present invention. This wire support mechanism 7 has the function of expanding and holding the distance between the wires 8 and 8', which are obtained by dividing the tips of the twin wires by the wire supply mechanism of the bonding apparatus. 3 and 4 show an embodiment of the present invention in which the distance between the wires 8, 8' is increased and maintained. The first embodiment shown in the plan sectional view of FIG.
A letter-shaped cutout is provided, and vacuum pipes 10 and 10' are provided that open on both sides of the cutout.
The wires 8, 8' whose tips are divided are vacuum-suctioned by vacuum pipes 10, 10', and the interval between them is expanded into a V-shape and held. In the second embodiment shown in FIG. 4, a triangular wedge 11 corresponding to the V-shaped notch provided in the wire receiving member 7a is provided, and the tip of the twin wire 9 is divided in advance by a wire supply mechanism. A triangular wedge 11 is pushed between the wires 8, 8' in the direction of arrow P to enlarge and hold the distance between the wires 8, 8' in a V-shape. In this case, if the receiving portions of the wires 8, 8' are rigid bodies and there is a risk that the wires may be damaged, it is preferable to use an elastic body 12 such as rubber in that portion.
以上の如く構成された本発明の実施例を用いた
ワイヤボンデイング方法を説明すると、第２図に
示す如く先づプリント配線板４をＸ−Ｙテーブル
３によりＸ−X′方向及びＹ−Y′方向に移動して
パツド５をボンデイングチツプ６の直下に位置さ
せる。同時にワイヤ支持機構７を駆動してワイヤ
８又は８′の一方をボンデイングチツプの真下、
即ちパツド５の真上に位置させるのである。この
後ボンデイングチツプ６を降下せしめ加圧加熱す
ればワイヤはパツド５に接合されるのである。同
様にして他方のワイヤも接合される。なおこれら
一連の動作はマイクロコンピユータにより制御さ
れる。従つて従来の如き人手を要さずボンデイン
グ作業を行なうことができる。 To explain the wire bonding method using the embodiment of the present invention configured as described above, first, as shown in FIG. position the pad 5 directly below the bonding chip 6. At the same time, the wire support mechanism 7 is driven to move one of the wires 8 or 8' directly below the bonding chip.
That is, it is located directly above the pad 5. Thereafter, the wire is bonded to the pad 5 by lowering the bonding chip 6 and applying pressure and heat. The other wire is also joined in the same way. Note that these series of operations are controlled by a microcomputer. Therefore, the bonding work can be carried out without requiring manual labor as in the conventional case.
以上説明した如く本発明のワイヤ支持機構はツ
インワイヤの先端の間隔を拡大して保持すること
によりワイヤボンデイングの自動化を可能とした
ものであつて、プリント配線板組立の省力化に寄
与するものである。
As explained above, the wire support mechanism of the present invention makes it possible to automate wire bonding by expanding and holding the tips of the twin wires, and contributes to labor saving in printed wiring board assembly. be.
第１図は従来のワイヤボンデイング方法を説明
するための図、第２図は本発明のワイヤ支持機構
を用いたワイヤボンデイング方法を説明するため
の図、第３図は本発明の第１の実施例を示す平面
断面斜視図、第４図は本発明の第２の実施例の斜
視図である。
同図において、７はワイヤ支持機構、７ａはワ
イヤ受け部材、８，８′はツインワイヤを分割し
た単線ワイヤ、９はツインワイヤ、１０，１０′
は真空パイプ、１１はくさび、１２は弾性体を示
す。
FIG. 1 is a diagram for explaining a conventional wire bonding method, FIG. 2 is a diagram for explaining a wire bonding method using the wire support mechanism of the present invention, and FIG. 3 is a diagram for explaining a first embodiment of the present invention. FIG. 4 is a perspective plan view showing an example of a second embodiment of the present invention. In the figure, 7 is a wire support mechanism, 7a is a wire receiving member, 8 and 8' are single wires obtained by dividing twin wires, 9 is a twin wire, and 10 and 10'
11 is a vacuum pipe, 11 is a wedge, and 12 is an elastic body.
Claims (1)
ワイヤをそれぞれ反対方向に真空吸引してＶ字状
に保持する案内溝をワイヤ受け部材に設けたこと
を特徴とするワイヤボンデイング装置のワイヤ支
持機構。 ２ ツインワイヤの先端が予め分割された２本の
ワイヤを保持するＶ字状の切欠きを有するワイヤ
受け部と、該切欠きに対応した三角形状のくさび
とを有することを特徴とするワイヤボンデイング
装置のワイヤ支持機構。 ３ 請求項２記載のワイヤボンデイング装置のワ
イヤ支持機構において、受け部のＶ字状切り欠き
部にワイヤの背後を受ける弾性体を設けたワイヤ
ボンデイング装置のワイヤ支持機構。[Scope of Claims] 1. A wire characterized in that a wire receiving member is provided with a guide groove for vacuum suctioning two wires whose ends are split in advance in opposite directions and holding them in a V-shape. Wire support mechanism for bonding equipment. 2. Wire bonding characterized by having a wire receiving part having a V-shaped notch for holding two wires whose ends are pre-divided twin wires, and a triangular wedge corresponding to the notch. Wire support mechanism of the device. 3. The wire support mechanism for a wire bonding apparatus according to claim 2, wherein an elastic body for receiving the back of the wire is provided in the V-shaped notch of the receiving part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56037892A JPS57153493A (en) | 1981-03-18 | 1981-03-18 | Method of positioning wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56037892A JPS57153493A (en) | 1981-03-18 | 1981-03-18 | Method of positioning wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57153493A JPS57153493A (en) | 1982-09-22 |
| JPH0119280B2 true JPH0119280B2 (en) | 1989-04-11 |
Family
ID=12510187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56037892A Granted JPS57153493A (en) | 1981-03-18 | 1981-03-18 | Method of positioning wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57153493A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01303392A (en) * | 1989-03-22 | 1989-12-07 | Kitamura Gokin Seisakusho:Kk | Structure of unit pipe coupling in clean water piping |
| JPH06252531A (en) * | 1992-07-31 | 1994-09-09 | Fujitsu Ltd | Wire wiring method and device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5032056A (en) * | 1973-07-25 | 1975-03-28 | ||
| JPS5140762A (en) * | 1974-07-31 | 1976-04-05 | Ibm | |
| JPS5553482A (en) * | 1978-10-16 | 1980-04-18 | Fujitsu Ltd | Automatically twin wiring device |
-
1981
- 1981-03-18 JP JP56037892A patent/JPS57153493A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5032056A (en) * | 1973-07-25 | 1975-03-28 | ||
| JPS5140762A (en) * | 1974-07-31 | 1976-04-05 | Ibm | |
| JPS5553482A (en) * | 1978-10-16 | 1980-04-18 | Fujitsu Ltd | Automatically twin wiring device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57153493A (en) | 1982-09-22 |
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